Innovation Showcase

Increased Use of Chemical Process Control Taking as a Path to Increased Sustainability, Irene Popova, Nova Ltd

Study of Diamond Coated Wire (DCW) Slicing Technique Process Parameters Impacting High Grade Semiconductor Wafer quality, Mainly for Warp, Total Thickness Variation (TTV) and Nanotopology (NT), Carlo Zavattari, GlobalWafers

Adding Automation (SECS/GEM) Capabilities on Legacy Equipment, Nirav Thakkar, Einnosys Technologies

Key ingredients for Developing Superconducting Quantum Processing Units at Scale, Thorsten Last, Director, Orange Quantum Systems B.V.

Energy-Efficienct Compute For A Sustainable Future, Gaurav Gupta, VP Analyst, Gartner

Ai-Based Defect Classification: an Accuracy and Efficiency Boost, Bart Van Poucke, Robovision

Manufacturing Next Generation Power Devices – How Temporary Bonding Allows Wide Bandgap Power Devices to Go Vertical., Elisabeth Brandl, EVG

Enabling Smart Manufacturing and New Processes for Fab Automation – Equipment Control Tools for Longer Machine Lifetime and Material Rescue, Natalie Schulze, Product Manager Equipment Control and Integration, Kontron AIS GmbH

Enabling Smart Manufacturing in Semiconductor Fabs Using Predictive Design and Process Insights, Srividya Jayaram, Siemens Digital Industries Software

Cost-Efficient Wafer-level SOI Process for Thermal Stability and Area Shrinkage in 3D NAND Peripheral Circuit, Seungmin Lee, Sungkyunkwan University

Building A More Sustainable CuCMP Process: Selective Copper Removal & Recovery, Cameron Lippert, ElectraMet

Future of Computing: Silicon-based Quantum Computing Processors, Himadri Majumdar, Chief Executive Officer and co-Founder, SemiQon

Mapping the Innovation Paths of the Semiconductor Industry, Pierre Cambou, Principal Analyst, YOLE Intelligence

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