Future Disruptions Disruptive and Sustainable Bonding Technology Covering Various Material Combinations for Emerging Applications, Stefan Lutter, Vice President R&D, SUSS MicroTec SE How Intel is Addressing Sustainability, Jennifer McKenna, EU Programme Manager, Intel Corporation Advanced Packaging Disruptions, Mieszko Dropiński, TA to DCAI & NEX Poland General Manager at Intel, Intel - partner of Invest in Pomerania Zero defects matter | The Power of Xray in Advanced Packaging, Christian Driller, Vice President R&D, Comet Yxlon International GmbH Digitalizing Semiconductor Fab Facilities, Giuseppe Sugliano, Industry Segment Leader Manufacturing Director, AVEVA Chiplets - Accelerating System Innovation in the Era Heterogeneous Integration, Luca De Ambroggi, Segment Director Solutions Marketing, Intel Foundry Services How Cryogenic Cooling can Enable the Future of Computing – or Block It, Alexander Regnat, Managing Director, kiutra 2024 and Beyond: Existing and Possible Threats to the Electronics Supply Chain, Tyler Ayala, Director of Sales, Microchip USA By downloading this presentation/file, you agree to not use or distribute this presentation/file without permission from SEMI and the speakers.
