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HiCONNECTS – An Introduction by NXP, Andrea Sanfilippo, Senior Manager Public Funding, NXP Semiconductors Germany GmbH

HiCONNECTS - Photonics Heterogeneous Integration Pilot Line, Dimitrios Velenis, R&D Manager 3D and Silicon Photonics Devices and Components group, imec

3D-RDL & TPV-based Advanced Wafer-Level Packaging Pilot Line for RF applications, Ayad Ghannam, CEO and Founder, 3DiS Technologies

HiCONNECTS - Enhanced Chip manufacturing developments, Daniele Pagano, Project Manager, STMicroelectronics

Digital Twin Software for Finite Element Analysis., Rahul Tomar, Managing Director, DigitalTwin Technology GmbH

The Pack4EU Project - Booster Electronics Packaging, Assembly and Test in Europe, Steffen Kroehnert, SEMI Europe

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