InP Photonics Integrated Chips for the AI / Datacenter Era
Gunnar Stolze, Chief Commercial Officer, SMART Photonics
BTO-enhanced Silicon Photonics for Next-Generation Optical Transceivers
Fabian Mohn, Reliability and Packaging Lead, Lumiphase AG
III-V Engineered Substrates, beyond classical SOI substrates
Cesar Roda Neve, R&D Program Manager, SOITEC
Strategic advances in III-V RF Technologies for energy-efficient 5G infrastructure
Gregory U'Ren, Senior Technical Expert, United Monolithic Semiconductors (UMS)
JePPIX: The joint European platform for photonic integrated components and circuits (NOT AVAILABLE)
Kevin Williams, Professor, Technical University Eindhoven
Photonic Integrated Circuits (PIC) – Unique PVD solutions helping turn cost-effective high-volume manufacturing into reality
Maurus Tschirky, Senior Manager, Strategic Marketing, VP, Evatec AG
Designing Chiplets & 3DIC for Silicon Lifecycle Management
Yervant Zorian, Technical Fellow, Synopsys, Inc.
Plasma Etch and Deposition for III-Vs: Driving Performance in Photonics, RF and Power Applications (NOT AVAILABLE)
Richard Barnett, Director of Etch Product Management in the SPTS Division, KLA Corporation