MSIG Webinar - MEMS Substrate Evolution: Standards to Drive Efficiency & Cost Reduction

The worldwide expansion of MEMS and photonic devices in Consumer, Automotive, and IoT applications is driving new requirements to the supply chain. Advanced substrates are needed to meet these requirements. Applying standardization to advanced substrates will aid efficient use of material, reduce cycle time and provide product cost reduction. SEMI’s MEMS & Sensors Industry Group (MSIG) aims to enable such standards.

Recently, MSIG’s multi-company, industry-collaborative Manufacturing Working Group published the SEMI MS12 standard- Specification for Silicon Substrates Used in Fabrication of MEMS Devices.  The SEMI MS12 document provides information on 150 mm and 200 mm diameter customized silicon substrates to be used for MEMS device fabrication, including physical dimensions, surface conditions, and basic electrical properties. Utilizing this guidance will allow the stocking of standard material, lowering the time to purchase, simplifying front-end operations, reducing time to market and lowering unit costs significantly.

This webinar will showcase three case studies demonstrating how the cost of ownership can be enhanced through various MEMS substrate platforms. Substrate manufacturers can apply the MEMS standardization and bring added value to their customers.

1. Cost savings with better integration and elimination of front-end process steps at customer site

2. Cost-savings through better flatness capabilities enabling significant die shrink and new capabilities for the customer.

3. Advantages of patterned SOI – i.e.) Silicon interposer on C-SOI® platform