November 25, 2025
Time
9:00 am - 10:00 am CEST
Location
Germany
Unlocking Next-Gen Part Coating Opportunities with Atomic Layer Deposition (ALD)
Join us for an engaging webinar exploring part coating technologies with atomic layer deposition (ALD).
As semiconductor architectures evolve toward 3D logic and memory, part coatings face new demands from aggressive plasma etching, increased corrosion risk, and stricter particle control. For logic devices, smaller chip designs and advanced gate-all-around (GAA) structures make manufacturing yields more vulnerable to defects caused by particles and process inconsistencies. In 3D NAND, stacking more layers and packing more data per cell, such as QLC, increases chip sensitivity to defects, requiring tighter contamination control.
In this webinar, the expert will share how atomic layer deposition (ALD) enables new coating capabilities for critical chamber and component parts. The session will highlight market trends, material strategies, and practical approaches for adapting to the 3D transition.
Register now to secure your spot and engage in the conversation shaping the future of our industry. Even if you cannot attend the live session, don’t worry—by registering, you will gain access to the on-demand recording to watch the webinar at your convenience.
Why Attend?
This session will attract a diverse audience of professionals, business and technology leaders, researchers, academics, and industry analysts from across the electronics supply chain globally.
In this webinar, participants will gain practical insights on:
- See how 3D architectures like GAA, CFET, 3D NAND and DRAM are changing part coating requirements
- Learn how ALD complements anodization and plasma spray, creating new business opportunities
- Get timelines, material options and integration strategies for ALD-based coatings
- Review market forecasts and positioning strategies for sub-10nm readiness
- Discover ways to extend part lifetime, reduce contamination and boost yield
Who Should Attend?
- Part manufacturers navigating 3D logic and memory demands
- Coating providers exploring ALD as a complementary offering
- Fabs and OEMs focused on advanced node performance and yield
- R&D and engineering teams qualifying coatings for reliability and yield in advanced nodes
- Unlock new opportunities in part coating for the 3D era. Register now to secure your place.
Register today to access exclusive content during an interactive session.
You will be able to apply innovative techniques and best practices to solve your unique challenges.
Live Q&A will follow.
Agenda
Welcome Remarks
Presentation
Biography
Dr. Alexander Perros leads business development for Beneq’s Advanced ALD Business Unit. With over 15 years in semiconductor R&D, manufacturing and materials, he brings deep expertise in ALD, process integration and thin films, built through roles at Beneq, Summa Semiconductor, and as co-founder of cleanroom services firm Nanovate.
Q&A
Conclusion