October 28, 2024
EU Digital Future Forum
Time
3:00 pm - 5:00 pm
Location
Online, Central European Time (CET)
Germany
The European microelectronics industry faces significant challenges, particularly in addressing severe skills and talent shortages. To remain competitive and contribute to the EU’s digital and green transitions, these gaps must be overcome.
This webinar will highlight two pivotal initiatives working towards these goals:
•The European Chips Diversity Alliance (ECDA): This dynamic partnership between academia and industry is dedicated to enhancing diversity, equity, and inclusion in the microelectronics sector. By lowering barriers to participation for under-represented groups, the ECDA aims to tap into the MISSING TALENT crucial for the sector's growth and competitiveness.
•The European Chips Skills Academy (ECSA): This EU-funded project is designed to meet the increasing demand for skills in the rapidly evolving microelectronics labor market. The Academy offers a range of training opportunities for those seeking to advance their careers in this field.
Agenda
Introduction
Biography
Since joining SEMI Europe in 2023, Victoria Cummings works to drive programs that support workforce development and raise awareness of the different career paths in the semiconductor sector. She acts as the Coordinator of the European Chips Skills Academy (ECSA) project and is involved in several projects related to skills.
ECSA - Intro and Activities
Biography
Bernd Deutschmann received his M.Sc. degree and the Ph.D. degree in telecommunication engineering from the Graz University of Technology/Austria in 1999 and 2002, respectively. After his studies, he worked in the semiconductor industry from 2000 to 2014 on improving the electromagnetic compatibility (EMC) of integrated circuits. In 2014, he returned to academia and moved to the Technical University of Graz/Austria as a full professor for "Electronics" and since then heads the Institute of Electronics. His research area is the design of electronic systems and integrated circuits with a special focus on their electromagnetic compatibility. As part of his research activities, he has filed several patents and authored and co-authored numerous papers and technical articles.
Biography
Dominik Zupan holds a Bachelor's and Master's degree in Information and Computer Engineering from Graz University of Technology, Austria. He is working at Graz University of Technology as a university assistant at the Institute of Electronics (IFE) on his doctoral thesis on EMI-robust microelectronics. Within the European Chips Skills Academy he leads the work package responsible for the development of this academy.
ECSA – First Actions in Developing Specialized Training
Biography
Dr. Olivér Krammer received his M.Sc. degree and his PhD in electrical engineering from the University of Technology and Economics in 2005 and 2010, respectively. His research as a Department of Electronics Technology member has included coordinating several industrial projects related to surface mount assembly technologies, especially in lead-free soldering technologies. He also participated in the LEADOUT, FLEX-NO-LEAD projects funded by the EC under FP6 and in Elect2Eat project funded by Leonardo da Vinci Lifelong Learning Programme. He focuses on research into novel soldering technologies, structural analyses of electrical joints, and failure and lifetime analyses of electronic circuits. In 2010, he became a member of the (IEEE) SIITME Conference Steering Committee and the Secretary of the (IEEE) ISSE Conference Steering Committee in 2012. In 2022, he became the general chair of the ISSE (International Spring Seminar on Electronics Technology) conference series, the IEEE flagship conference for young scientists in electronics technology.
Biography
Attila Géczy finished his MSc studies in 2009 at the Budapest University of Technology and Economics (BME). His PhD was defended in 2014 at BME, Dept. of Electronics Technology. His dissertation investigated vapour phase soldering from heat transfer and novel sensor fusion approaches. He has participated in several industrial and academic projects. Between 2012 and 2013, he researched the shrinkage of printed circuits and subsequent soldering failures. He is investigating the applicability of biodegradable substrates as possible substitute materials in printed circuit technology. He also works on various simulation methods in Surface Mount Technology (heat transfer during reflow, current routes in the solder joints of miniature chip-size components). In 2015, he became a member of the (IEEE) ISSE Conference Steering Committee. In 2022, he became a habilitated professor at the department focusing on the transport processes in reflow soldering technologies and advanced design and structural considerations of biodegradable electronics substrates.
Fascinating Electronics for a Cool World : A summer school to inspire university students
Biography
After starting his career in the French Ministry of Industry, Dr. Patrick Cogez joined STMicroelectronics in 1988, where he designed and implemented the Information Systems of the Crolles R&D and Manufacturing site, and was later appointed Director for Innovation and External Research. He is currently Technical Director of AENEAS, a not-for-profit Industrial Association fostering Research and Innovation and creating an effective funding landscape for its members in the Electronic Components and Systems (ECS) value chain. He is the current Chair of the ECS Strategic Research and Innovation Agenda, and involved in several European collaborative projects on international cooperation and skills development for the microelectronics industry, in particular initiating the ECS summer school.
Patrick graduated from Ecole Polytechnique and Ecole des Ponts et Chaussées in France, and holds a M.Sc. degree in Operations Research and a PhD in Industrial Engineering, both from the University of California at Berkeley. He completed an Executive MBA programme at NEOMA Business School, Paris. He co-managed three PhD theses and co-authored several articles on the management of breakthrough innovation.
ECDA: Fostering DEI in Semiconductors
Biography
Reviliani Gani joined SEMI Europe in 2019. In her current role as Senior Manager of Diversity and Workforce Development at SEMI Europe, she coordinates the implementation of the EU Erasmus+ project, European Chips Diversity Alliance, with a mission to lower barriers for under-represented groups in the European semiconductor industry through data, training, and engagement programs. She has over 10 years of experience managing various projects across public and private sectors in Jakarta, Paris, and Berlin. Reviliani holds a Master's Degree in Tourism Project from Lille University.
The Role of Data in Attracting and Retaining Talent in the Chips Sector
Biography
Nessa is the CEO of EudaOrg. EudaOrg was established in 2021 by psychologists and experts in organisational change, to provide technology and advisory services in workforce development and diversity, equity, and inclusion to commercial companies and sectoral bodies. Nessa holds a Masters in Applied Positive Psychology and Coaching Psychology, and has published research in building inclusive cultures. Nessa has fifteen years international experience advising private companies and government bodies in supporting diverse needs across education and the private sector.
Build, test & validate: Creating viable DEI Training for the European Chips Diversity Alliance
Biography
Stephan teaches in the liberal arts and the field of diversity & inclusion at ESCP Berlin Campus. He worked across different programs on graduate and executive level and has developed Europe’s first LGBT+ Leadership program.
Stephan areas of expertise are strategic diversity implementation, inclusive leadership and economic history.
He has worked abroad in the academic institutions in Ireland and the UK and advised companies such as HSBC, EY, S&P and PwC.
Currently, he is the project lead for the development of diversity measures for talent acquisition and retention in the ECDA consortium. His current research interests focuses on diversity, equity and inclusion in organization, cultures of collaboration and LGBT+ leadership.
Advancing Diversity in the European Semiconductor Sector: Comet's role in ECDA and commitment to DEI
Biography
Isabella Drolz is the Vice President Marketing & Product Strategy at Comet Yxlon, which is the industrial X-ray & CT inspection system division of Comet. Comet Yxlon provides X-ray & CT inspection solutions for R&D labs & production environments, especially for Semiconductor customers to enhance their productivity. In her role, she is responsible for product management, business development, global application solution centers, and marketing at Comet Yxlon. Isabella has next to her industrial engineering education, a Bachelor of Science in International Business Administration, and an MBA degree from Southern Nazarene University in Oklahoma City, USA. She has held several management positions in the mechanical and plant engineering industry driving market-oriented product development.
Q&A
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FInd out more about EU Projects
European Chips Skills Academy
The European Chips Skills Academy is a consortium of 18 partners from 12 countries aimed at aimed at addressing the growing skills and talent shortages in Europe’s microelectronics sector. Funded under the Erasmus+ Program, the Academy focuses on developing and delivering a range of training programs in fields like semiconductor technology, cybersecurity, and green skills. ECSA also focuses on building networks through the strategic creation of partnerships between stakeholders in the industry. Through skills quantification, the academy will measure and evaluate the development of skills in the sector.
European Chips Diversity Alliance
The European Chips Diversity Alliance is a collaborative initiative aimed at promoting diversity, equity, and inclusion (DEI) within the European semiconductor industry. The alliance brings together various stakeholders, including industry leaders, academic institutions, and government organizations, to address the missing talent and DEI challenges prevalent in the sector. By providing trainings, tools, and engagement programs, the alliance seeks to bring together industry and the world of education, enhance innovation, and to improve workplace diversity and inclusion.
Learn more
SEMI Europe is an active participant in EU-funded projects, given its global member base and its position as the voice of the microelectronics industry.
Learn more about ongoing projects in which SEMI Europe takes part.