January 27, 2021
Enhancing Yield by Minimizing Contamination
9:00 am - 10:00 am
Online, Central European Time
Semiconductor manufacturing involves corrosive gases in multiple processes. As we transition to each new technology node, e.g. from 10nm to 7nm and to 5nm, there are even more stringent fab requirements against metal and particle contamination. This poses challenges for existing coating methods such as anodization or plasma spray, which may not provide complete protection especially on critical chamber components with complex geometry.
This webinar is particularly helpful for process engineers, equipment engineers and others, who are responsible for contamination control and equipment yield.
Learn more about
- Common issues of metal or particle contamination on critical chamber components
- Common coating methods against corrosion, and how they compare
- What properties to look for e.g. purity, uniformity, when evaluating the optimal protective coating solution
- Unique benefits of ALD coatings with Al2O3 and Y2O3
- Working with your OEM partner to design, test and implement an ALD coating solution for your equipment
Welcome remarks by SEMI
Presentation by Beneq
Mr. Sneck, Business Executive at Beneq, joined Beneq in 2005. Since then he has held various professional and management positions at Beneq, including Product Manager, Application Manager, Director of ALD group, Head of Sales and Head of Asia, in which position he spent 2 years in Shanghai, China. He received his MSc degree in Chemical Engineering in 2001 from Helsinki University of Technology. Mr. Sneck has special expertise in Atomic Layer Deposition technology and business development. He has played a vital role in introducing various ALD production concepts and solutions to several industries ranging from jewelry to photovoltaics, electronics and semiconductor industry. Currently Mr. Sneck is responsible of Beneq’s semiconductor part coating business.
Semiconductor manufacturing involves corrosive gases in multiple processes. As we transition to each new technology node, e.g. from 10nm to 7nm and to 5nm, there are even more stringent fab requirements against metal and particle contamination. This poses increasing challenges for existing coating methods such as anodization or plasma spray.
Q&A and Conclusions
This webinar is free of charge.
Not able to attend? Register anyway. We'll send you a link to the webinar archive so you can view it at your own convenience.
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