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Syed F. Alam, Partner & Managing Director, Accenture


The presentation will cover our expectations for technology in 2030s and beyond when technology is fully immersed and invisible in our daily lives. The presentation will discuss the human behavior changes due to technology development, and discuss technologies that are key to enable the development of our society.

Syed is responsible for Accenture’s semiconductor business across the semiconductor ecosystem including IDMs, fabless, equipment manufacturers, foundries and IP companies. Syed brings 20+ years of high tech and semiconductor experience in advising major semiconductor companies globally on growth strategy, M&A opportunities, go-to-market strategy, JVs & partnerships and service revenue models. Syed worked at Motorola Semiconductor Products Sector and Freescale Semiconductor before joining Accenture. Syed holds Masters of Science degree in Manufacturing Systems Engineering from The University of Texas at Austin.



Laith Altimime, President, SEMI Europe


As President of SEMI Europe, Laith Altimime leads SEMI’s activities in Europe and Middle East and North Africa (MENA). He has overall responsibility for regional events, programs, membership, advocacy, and collaborative forums. Additionally, he manages and nurtures relationships with SEMI members in the region, as well as with local associations and constituents in industry, government, and academia. He provides support and services to SEMI members worldwide that have supply chain interests in Europe. Altimime has more than 25 years of experience in the industry, mostly in Europe. He has held leadership positions at Altis, Infineon, Qimonda, KLA-Tencor, Communicant Semiconductor AG, NEC Semiconductors, and imec. Altimime holds a BS from Heriot-Watt University, Scotland.



Caroline Bedran, Director General, AENEAS


Starting from the huge challenges that Europe is facing in 2020, the speaker will explain the strategic value of the AENEAS Industrial Association in gathering and representing the entire community of Electronics Components and Systems. Being the voice of Industry is a real cornerstone for tailoring the future RD&I collaborative programmes to the needs of industry, while engaging with a wider ecosystem and adapting to market changes to ensure European leadership in existing and new markets.

Caroline Bedran has been active in the electronics and semiconductors industry for most of her career, primarily at Philips and NXP. She also has experience in the telecommunications and 5G industry, both at European and global level. After graduating as an engineer in Electronics, she was involved in RD&I activities, then further moved into collaborative projects and partnership management. She held different managerial positions in France and Belgium, enlarging her responsibilities to Public Relations and External Affairs. In her current position as the Director General of AENEAS industrial association, she supports the European electronic components and systems industry in dealing with the European Commission and national Public Authorities. AENEAS has a special focus on strategic investment and Research & Innovation funding programmes, at a time when European leadership is being challenged in a global environment. In particular, AENEAS plays an active role as part of the Private Members Board of the ECSEL Joint Undertaking under Horizon 2020. In addition, AENEAS is active in the operation of EUREKA funding instruments through managing the PENTA Cluster programme. PENTA was created to catalyse collaborative RD&I in micro and nanoelectronics enabled system and applications, in close partnership with national funding authorities.



Jean-Luc Beylat, Vice President Global Innovation Ecosystem Partnership, Nokia Bell Labs

Nokia bell labs


Jean-Luc Beylat is Vice President Global Innovation Ecosystem Partnership at Nokia Bell Labs, President of Nokia Bell Labs France, he is member of the Senior Leadership Team of Bell Labs.  He is also Chairman of the Business Cluster “Systematic Paris–Region” which boasts +900 members and more than €3.6 billion invested in research and development. Jean-Luc Beylat was also elected as president of the French Association for Competitiveness Clusters (AFPC) and Chairman of the Association Bernard Gregory (ABG), an association devoted to PhDs in France.

Jean-Luc first joined Alcatel in 1984, working on semiconductor lasers for seven years at Alcatel’s research Centre in Marcoussis (France). In 1992 he launched various projects concerning WDM transmission which led to an increase in Internet speed by a factor 100, and in 1996 he was appointed Director of the Department of Systems and Optical Networking Research Center, responsible globally for research in terrestrial and submarine transmission. In 2000, he rejoined Alcatel Optic as Program Director then as Vice President for Network Solutions, before finally in 2003 being named as VP in Charge of Partnership Programs at the Alcatel corporate CTO office.

Jean-Luc holds a doctorate in physics on semi-conductor lasers and their applications, awarded by the University of Pierre Marie Curie (France), now named Sorbonne University. He is a member of the Board of IRT SystemX, the Board of Administrators of the Paris-Region Enterprise, the board of the PPP Photonic 21. Finally, he co-founded and chaired the organizing committee of Prix Jean Jerphagnon. He co-chaired, with Pierre Tambourin, the report "L‘innovation, un enjeu majeur pour la France" delivered to the French government in April 2013 and 2 other reports for the French government delivered in 2017, one about IP done by public research and the other one about proposals for the Revision of the Allègre law (proposals were introduced in the PACTE law in 2019). 



Jeremie BouchaudDirector, Automotive E/E & Semiconductor, IHS Markit


Jeremie Bouchaud is the director for the automotive E/E & Semiconductor service at IHS Markit. In 2019 Mr. Bouchaud took on the responsibility for the new automotive E/E and Semi service at IHS Markit that oversees electronics/electric architectures and their implementation down at the semiconductor level. In both 2014 and 2015, he was recognized for his excellence as an analyst by awards from the MEMS & Sensor Industry Group, part of the SEMI Association. Since joining IHS Markit in 2010 he developed and led the automotive electronics and semiconductor practice for the technology team. When IHS Markit (now IHS Markit) acquired iSuppli in 2010, he held responsibility for the processing team and the automotive semiconductor practice. With the "NEXUS Market Analysis for MEMS and Microsystems" published in 2005, he pioneered market research for automotive sensors. In 2000, he had co-founded Wicht Technologie Consulting (WTC) in 2000, where he was heading market research for MEMS & Sensors until its acquisition by iSuppli in 2008. His career in technology transfer for sensor technology began at the German office of CEA-LETI. Mr. Bouchaud is a graduate of the Munich University of Applied Sciences and of Ecole Supérieure de Commerce of Grenoble. He speaks German, English and French fluently.



Peter Connock, Chairman, Memsstar Ltd.


Peter Connock has been working in the semiconductor industry for 40 years with a wide range of responsibilities in development, customer service, marketing and management. He has held long-term positions at Edwards, Applied Materials and memsstar in locations around the world. In his latest role, PENTA Director at AENEAS, he is responsible for the management of the EUREKA cluster PENTA – focussed on catalysing activity in the micro and nanoelectronics enabled systems and applications sector in Europe. PENTA will operate for 5 years, and launched its first call in January 2016. This complements his Board Chairmanship of memsstar, Europe's premier semiconductor equipment remanufacturer and services provider. It also serves the global MEMS marketplace, offering etch and deposition expertise, experience, proprietary and remanufactured systems and know-how to deliver innovative products and services for research, commercial R&D and production. He has further augmented his operational activities by establishing a long-term relationship with industry representative bodies such as SEMI serving on SEMICON, ISS and now the Secondary Equipment committees in Europe for many years. These activities are complemented by his appointment to the nmi Board in the UK – representing the UK microelectronics industry . Peter also specialises in working with SME's at Board level in strategic marketing and business development.



Bert De Colvenaer, Executive Director, ECSEL Joint Undertaking


Bert De Colvenaer was appointed Executive Director of the ECSEL Joint Undertaking as of January 1st 2016. ECSEL is a public-private partnership on nanoelectronics, embedded software and smart system integration established as an autonomous European Union body through the merger of ENIAC and ARTEMIS JUs. As Executive Director, he is the legal representative of the ECSEL JU and is the chief executive responsible for its day-to-day management. Prior to his appointment he was Executive Director of the Fuel Cells and Hydrogen Joint Undertaking (FCH JU) mandated to bring the FCH technology to the point of market readiness. Bert De Colvenaer has been involved in the automotive industry for
more than 20 years, in the field of power-train production engineering and advanced research. He has been working on fuel cell research from the early 90's and was involved in
high level group activities and major EU research projects. In 2002 he established and led the Advanced Technology Division of Toyota Europe, focusing on breakthrough research in
the field of fuel cell and hydrogen, robotics and new automotive production technologies. Prior to Toyota, he worked for Volvo. His academic background is in mechanical engineering
and in industrial management.



Nitin Dahad, European Correspondent, EE Times

EE Times Logo


Nitin Dahad is a correspondent for EE Times, with a background in the semiconductor and electronics industry, as well as a period doing government advisory work related to the technology industry.

In the 1990s, Nitin was part of the startup team that took 32-bit configurable RISC microprocessor company ARC International to Silicon Valley, USA, and to its IPO on the London Stock Exchange; he was also involved in selling photonics company CIP to Huawei. Prior to this, Nitin started his career in 1985 as an apprentice technical support engineer at National Semiconductor, but then switched to journalism, marketing and PR after graduating during one of the industry’s down cycles. That took him first to a position as editor of Silicon Design magazine, followed by internal roles at Marconi Instruments and GEC Plessey Semiconductor; in addition he also supported Dialog Semiconductor, Frontier Silicon, Coresonic, IDENT Technology and Coresonic in various advisory, marketing and PR functions.

In 2002, he also co-founded one of the first practical magazines for tech entrepreneurs and investors, The Chilli. Outside of electronics, Nitin was an advisor to British government from 2009-14, as an ambassador for UK technology in the US, Brazil, India, Middle East and Africa; he also has held various advisory and non-executive positions, including at the University of Hertfordshire, University of Essex, East of England Economic Development Agency, the Hertfordshire Local Enterprise Partnership, and is currently also a mentor at London Business School in its Entrepreneurship Summer School.

Nitin gained a BSc Electronic Engineering from City University, London, in 1986, and is a Member of the Institution of Engineering & Technology (MIET), and was previously a Charter Member of TiE (global entrepreneur network).



Emir Demircan, Director, Advocacy and Public Policy, SEMI Europe


Emir Demircan, Director of Advocacy and Public Policy, SEMI Europe. He is a professional in public policy and government affairs in engineering technologies. At SEMI, he is responsible for leading pan-European advocacy actions on technology, talent, regulatory and government incentives. He previously worked in the 3D printing, chemical and digital sectors. He studied international political economy at King's College London.



Sabine Herlitschka, CEO & CTO, Infineon Technologies Austria AG


Sabine Herlitschka is Chief Executive Officer and Chief Technology Officer of Infineon Technologies Austria AG. Her professional career includes industrial biotechnology research, international cooperation and financing in research technology and innovation, Internships at leading organizations in the USA, Fulbright Scholar at George Washington University and Johns Hopkins University/School of Advanced International Studies, as well as founding Vice-Rector for Research Management and International Cooperation at the Medical University of Graz/Austria. Until 2011 she headed the European and International Programmes of the Austrian Research Promotion Agency (FFG) and was responsible for the operational implementation of the European Research and Technology Programmes in Austria, in particular the 7th EU Research Framework Programme.  In 2011 Herlitschka was appointed to the Management Board of Infineon Technologies Austria, in 2012 to the Management Board for Technology and Innovation and in April 2014 to the position of CEO. For more than 20 years she has been frequently involved in European Research as advisor, project coordinator & proposal evaluator, as well as participant and Chairperson in various European & international expert groups, in particular member of the Austrian Council for Research and Technology Development, University Councilor at the Vienna University of Technology, member of the Senate of the German Fraunhofer Society, as well as other research & innovation institutions. Since February 2018 she is Chairwoman of the Governing Board of the European Public Private Partnership ECSEL-Electronic Components and Systems for Electronic Leadership. Herlitschka holds a Ph.D. in Food- and Biotechnology with Postdoc specialization in molecular biology and genetic engineering and an Master of Business Administration.



Andraž Frelih, Control System Engineer, Technical University of Munich

Technical University of Munich

TUM Hyperloop is a student initiative part of the student club NEXT Prototypes e.V. from the Technical University of Munich that develops and builds prototypes of the futuristic transport system called Hyperloop. With these prototypes the team has participated in the SpaceX Hyperloop Pod Competition – an international student contest initiated by Elon Musk to encourage students to contribute to the development of the Hyperloop system. After winning all four former competitions, TUM Hyperloop has decided to push the idea of the Hyperloop transportation system further by developing a working Hyperloop system in full scale.

Andraž Frelih is a master student of electrical engineering, subfield of robotics and automation, at Technical university of Munich. He has been active in the development of hyperloop in the student club NEXT Prototypes e.V. with contributions in the field of control. He is currently working in the levitation subteam, his main task including design, implementation and testing of the levitation control system.


Pascal Haazen, Associate Partner, McKinsey




Jolie LeBlanc, Senior Manager CMT Strategy, Accenture


As a Senior Manager in Accenture’s CMT Strategy practice, with a discipline in semiconductors, Jolie advises companies in Sales & Marketing, Supply Chain & Operations. Jolie holds a B.S. in Business Administration from the University of Southern California. Prior to Accenture, Jolie’s career started at Intel followed by >10 years at Qualcomm in roles within Business Operations, Demand Planning, Supply Chain.



Ajit Manocha, President, SEMI


Ajit Manocha is the president and CEO of SEMI. Headquartered in Milpitas, California, SEMI is the global industry association serving the electronics manufacturing supply chain. Manocha, an industry leader has over 35 years of global experience in the semiconductor industry. Manocha was formerly CEO at GLOBALFOUNDRIES, during which he also served as vice chairman and chairman of the Semiconductor Industry Association (SIA).  Earlier, Manocha served as EVP of worldwide operations at Spansion.  Prior to Spansion, Manocha was EVP and chief manufacturing officer at Philips/NXP Semiconductors.  He began his career at AT&T Bell Laboratories as a research scientist where he was granted several patents related to microelectronics manufacturing. Today, there is a much broader scope for SEMI to help foster collaboration and fuel growth than we could have ever imagined at SEMI’s inception in 1970.  This has to be accomplished without compromising the strong foundation of SEMI, the Equipment Suppliers and Materials makers.  Given that our ecosystem is rapidly expanding due to the massive explosion of applications on the Internet and mobile devices, biomedical devices, defense, social media, artificial intelligence/machine learning, autonomous vehicles e-commerce, the Internet of Things, etc., Manocha feels it is the right time for us to evolve as the space around us evolves. Manocha is active on global advocacy issues and has served on the President’s committees for “Advanced Manufacturing Partnerships” and the President’s Council of Advisors on Science & Technology (PCAST).



Cassandra Melvin, Director of Operations, SEMI Europe


Cassandra Melvin received her BS in Business Management and Neuropsychology at Rensselaer Polytechnic Institute and is Director of Operations at SEMI Europe. For the nine years prior to joining SEMI, she held the position Global Product Manager at Atotech Deutschland GmbH, where she was responsible for managing several hundred electroplating chemistry products in its Semiconductor and Functional Electronic Coatings division. She began her career at the SUNY Polytechnic Institute (formerly the College of Nanoscale Science and Engineering) as a Business Manager focused on strategic and technical programs for semiconductor chemistry and equipment manufacturers. She also held various project and program management roles in clean room operations and IT at SUNY. Cassandra's written work has been published in leading technical magazines and presented at key conferences globally. As an advocate for diversity and inclusion, she is actively involved in SEMI's efforts to promote diversity within the semiconductor industry.



Carijn Mulder, Team Manager, Solar Team Eindhoven

Solar Team Endhoven

Solar Team Eindhoven believes that by getting the maximum out of the Sun, mobility can be more than a problem in climate change; it can be part of the solution. We build solar-powered family cars that take the next step towards sustainable mobility. Stella Era is the latest addition to the Stella Family and stands out with her capacity to get the maximum out of the Sun.  Stella Era is a comfortable, self-driving family car that maximizes the use of solar energy by efficient energy-use and by sharing it with others. This advanced car is a charging station on wheels. By continuously chasing sunlight she creates an abundance of clean energy, which can power not only the solar car itself but can be shared with other forms of electric mobility. Stella Era takes the next step. We enter an era in which cars are more than just a means of transportation. Stella Era unlocks the potential of solar cars as power plants on wheels.

As Team Manager of Solar Team Eindhoven, Carijn Mulder has worked on the development of solar car Stella Era. Together with a team of 26 students from the Eindhoven University of Technology (TU/e) she won the World Solar Challenge in October 2019 in Australia. In order to be part of the team for more than over a year full time she took a break from her Bachelor in Biomedical Engineering at the TU/e. Since the team is back from their journey, she has now continued her studies.  



Sohail Nadim, MSc Student, University of Freiburg

University of Freiberg


  • Born 01.01.1997 in Freiburg, Germany
  • Finished High-School in July 2015
  • Finished his Bachelor in Embedded Systems Engineering in 09.2018 at the University of Freiburg
  • Currently doing his Master in Embedded Systems Engineering at the University of Freiburg



Luis Neves, CEO, Global e-Sustainability Initiative (GeSI)


The Global Enabling Sustainability Initiative (GeSI) is an inclusive and open multi-sectoral, multi-stakeholder organization embracing a challenging agenda, driven by leading visionary and committed global corporations. GeSI holds the firm belief that responsible business, with digital sustainability at its core, will make for the most successful companies in the years to come. 

GeSI is comprised of diverse and international members and partnerships, representing around 40 of the world’s leading ICT companies, 12 global business and multiple international organisations, such as the International Telecommunications Union (ITU), the United Nations Framework Convention on Climate Change (UNFCCC), the United Nations Environment Program (UNEP), the International Chamber of Commerce (ICC), the World Business Council for Sustainable Development (WBCSD), the Carbon Disclosure Project (CDP), global asset management firm Arabesque, and the World Resources Forum Association (WRFA).

GeSI works with a range of international stakeholders committed to ICT sustainability and supports member initiatives in developed and developing nations which tackle: climate change, energy/resource efficiency, privacy and security, digital literacy and digital divide, people's rights, as well as foster collaborative and innovative approaches, ideas and joint initiatives. With these partnerships, GeSI is able to work towards its global vision of a greater evolution of the ICT sector to best meet the challenges of sustainable development. For more information, see

Luis Neves is CEO of the Global Enabling Sustainability Initiative (GeSI) since 2017. Prior to that, from 2008-2017, Luis held the position of GeSI Chairman. Under Luis' leadership, GeSI has become a globally recognized “thought industry leader” organisation in the field of ICT- sustainability with strong focus on the enabling role and positive contribution of digital technologies to climate protection.

Prior to GeSI, Luis worked at Deutsche Telekom for over 15 years holding positions such as Head of Sustainable Development and Environment, VP of Corporate Responsibility and Chief Sustainability and Climate Protection Officer. Luis has also held positions and played relevant roles at European and international levels in organisations, such as the UN Global Compact Lead Group, Econsense -the German Sustainability Association, World Resources Forum Association and UNFCCC Momentum for Change Initiative.

Luis was born in Portugal and obtained a degree in History from the University of Lisbon.



Clara Otero Perez, Senior Director of System Innovation, NXP Semiconductors

NXP logo

Clara will share some insights on the NXP vision on mobility of the future: NXP is advancing intelligent transport systems and electrification in order to shape a future in which zero emissions, zero road fatalities and maximum convenience will become reality. ADAS – Advanced Driver Assistance Systems – will come within everyone's reach and provide the safe and increasingly autonomous experiences that will reshape our relationship to transport. The technologies of the Automated Driving Domain will soon allow passengers to experience the ultimate in personalized and connected convenience as vehicles seamlessly Sense, Think, and Act on real-time road situations.

Clara Otero Pérez is Director Systems Innovations for Automotive at NXP Semiconductor in Eindhoven (NL). She is responsible for scouting new systems and applications where NXP’s products would play a role and build proof of concepts and demonstrators for those new applications such as cooperative connected car, autonomous driving and UAV.

After graduating in Physics by the University of Santiago de Compostela in Spain, she started to work for Philips Research in Eindhoven (NL) as a research scientist in the field of real-time systems and multimedia processors. In 2006 she moved to NXP and started working on automotive and secure connectivity related projects. In 2008 she became department manager driving innovation activities both internal as well as with partners in subsidy projects in the areas of IoT, connected car and cooperative mobility.



Calista Redmond, CEO, RISC-V Foundation

RISC-V Foundation

Calista Redmond is the CEO of the RISC-V Foundation with a mission to expand and engage RISC-V stakeholders, compel industry adoption, and increase visibility and opportunity for RISC-V within and beyond the Foundation. Prior to the RISC-V Foundation, Calista held a variety of roles at IBM, including Vice President of IBM Z Ecosystem where she led strategic relationships across software vendors, system integrators, business partners, developer communities, and broader engagement across the industry. Focus areas included execution of commercialization strategies, technical and business support for partners, and matchmaker to opportunities across the IBM Z and LinuxOne community. Calista’s background includes building and leading strategic business models within IBM’s Systems Group through open source initiatives including OpenPOWER, OpenDaylight, and Open Mainframe Project. For OpenPOWER, Calista was a leader in drafting the strategy, cultivating the foundation of partners, and nurturing strategic relationships to grow the org from zero to 300+ members. While at IBM, she also drove numerous acquisition and divestiture missions, and several strategic alliances. Prior to IBM, she was an entrepreneur in four successful start-ups in the IT industry. Calista holds degrees from the University of Michigan and Northwestern University.



Thomas Rosteck, Division President-Chip Card & Security, Infineon Technologies


IT-Security in Europe in this decade can be viewed in three dimensions:
a) security, making security level visible, e.g. by certification
b) trust, with focus on value chain
c) technology, which can be used for new attacks, like AI and QC
Security: The EU Cybersecurity Act (EU/2019/881) promises minimum security for consumer, industries and government bodies as well as new certification schemes for all IoT-sectors. We know it has to work. Trust: secure value chain and trusted microelectronic are needed for the Single European Market to foster digital sovereignty and strengthen European Industry. Technology: artificial intelligence and quantum computer are example for new technologies that can be use for new attacks but also for new defense mechanisms.

Since 2017 Thomas Rosteck is at Infineon Technologies AG as Division President of the division Digital Security Solutions responsible for Infineon’s security solutions which include products for smart cards and government ID documents, like electronic passports and ID cards, as well as security ICs amongst others for the applications mobile security, information & communication equipment, industry, internet of things and automotive security.
After graduating in Business Management and Computer Science at the Technical University of Darmstadt, Germany, in 1992 Thomas Rosteck started at Siemens AG as process consultant before he joined Siemens Management Consulting (SMC) as project leader in consulting projects for strategy development, business plan creation, innovation processes and production processes. After joining Infineon in 1998 Thomas Rosteck has been responsible in different management positions in the area of security including head of the business lines Secure Mobile & Transaction and Embedded Security Solutions.
In 2011 Thomas Rosteck participated in the six-months seminar for Security Policy at the Federal Academy for Security Policy in Berlin, which is strategically coordinated by the German Chancellery.



Lucilla Sioli, Director for Artificial Intelligence and Digital Industry, DG CONNECT


Ms Lucilla Sioli is the Director for "Artificial Intelligence and Digital Industry" within Directorate-General CONNECT at the European Commission.  The mission of the Directorate is to strengthen Europe's competiveness ensuring that any industry in any sector in Europe can make the best use of digital innovations to grow, compete on a global scale, and create jobs. She is responsible for the coordination of the European digitisation of industry strategy and for policy development in the area of artificial intelligence (AI). The directorate also supports R&D&I in key digital industrial technologies including microelectronics, embedded software, photonics, robotics and AI. Previously, she was Head of Unit for "Digital Economy and Skills" at DG Connect, responsible for the publication of the Digital Economy and Society Index and of the annual Europe's Digital Progress Report as well as for the management of digital skills policy through the Digital Skills and Jobs Coalition.  Lucilla holds a PhD in economics from the University of Southampton (UK) and one from the Catholic University of Milan (Italy) and has been a civil servant with the European Commission since 1997.



Peter van Staa, IPCEI


Peter van Staa studied Physics at the Universities of Göttingen and Münster, and holds a diploma and Dr. rer. nat. in Physics with a thesis on semiconductor physics. He started his career in Robert Bosch GmbH in Reutlingen. After different management functions in EDA, IC qualification, and Test he headed the cross-functional department which has to provide the enabling technologies for the ASIC-design, namely new tools and methods for automated IC design, EDA-support as well as technology assessment, library development, and IC packaging. In 2016 he was one of the initiators of the IPCEI on Microelectronics; currently he is the speaker of the IPCEI Facilitation Group which steers the project.  Furthermore he is member in Industrial Associations for research programs, namely ECSEL and PENTA.

Microelectronics is the Key Enabling Technology for the digital era. In the past important Semiconductor fabs have left Europe. But some S/C technologies which are essential for key European Application areas are furthermore developed and manufactured in Europe. Beginning in 2016 29 S/C companies committed to invest about 9 B€ in new S/C technologies including first production lines in European facilities. Based on the extension of the state aid rules by the EC under the umbrella of an ‘Important Project of Common European Interest (IPCEI)’, DE, FR, IT, and UK support this investment to assure a strong and independent S/C industry in Europe for the benefit of the European economies and societies.

The presentation will introduce the project, present current achievements, and show how non-participating industry and academia will benefit from the results. An outlook will be given on ongoing activities to assure a strong and independent ‘Digital Europe’.  


Miriam Saphira StadlerMiriam Stadler, BA Student, University of Freiburg

University of Freiberg


  • Born 30.08.1997 in Rottweil, Germany
  • Finished High-School in July 2016
  • Currently doing her Bachelor in China Studies and Business Administration at the University of Freiburg



Slawomir Tokarski, Director for Industrial Policy and Innovation, Directorate-General for Internal Market, Industry, Entrepreneurship and SME`s


Slawomir Tokarski obtained PhD degree at the European University Institute in Florence in 1995. He joined the Polish administration and headed a team co-ordinating the preparations for the accession negotiations and preparing policy analysis for the Chief Negotiator. In 2004 he joined the Commission as a Cabinet member of the Commissioner responsible for the regional policy. In 2009 he was nominated Head of Unit dealing with economic policy and co-ordination of EU funding in DG MARE. In March 2012 he became a Head of Defence, Aeronautics and Maritime industries in DG Enterprise. Since 2016, Mr Slawomir Tokarski became Director in Directorate F for Industrial Policy and Innovation (DG GROW).



Maud Vinet, Quantum Computing Program Manager, CEA-Leti

CEA Leti

Quantum computing is expected to extend the high performance computing roadmap at the condition of being able to operate a large number of qubits. Si-based QC appears as a promising approach to build a quantum processor; thanks to the size of the qubits, the quality of the quantum gates and the VLSI ability to fabricate billions of closely identical objects. The quality of Si spin qubits has improved very fast with the introduction of isotopically purified 28Si, as observed by multiple research groups.

We have put a multidisciplinary and multi institutions team which gathers quantum physicists, integration and devices engineers, circuit designers and quantum information engineers. We want to build a quantum processor. We are aiming at delivering prototypes with a 100 qubits within 6 years and at having identified the key scientific and roadblocks for scaling up.

In this presentation, we will discuss the architectures to design a large scale quantum computer based on Si spin qubits and we will review the hardware integration choices and the consequences on low level software.

M. Vinet1*, B. Bertrand1, N. Rambal1, L. Hutin1, J.-M. Hartmann1, V. Mazzocchi1, H. Jacquinot1, Y. Thonnart1, G. Billiot1, G. Pillonnet1, A. Amisse1,2,J Li2, A. Crippa2, X. Jehl2, R. Maurand2, Y.-M. Niquet2, M. Sanquer2, B. Venitucci2, B. Jadot3, E. Chanrion3, C. Spence3, D.J. Niegemann3, B. Klemt3, M. Nurrizo3, C. Scarato3, P.-A. Mortemousque3, M. Urdampilleta3, S. De Franceschi2 and T. Meunier3

Université Grenoble Alpes, France

 1 CEA, LETI, Minatec Campus, F-38054 Grenoble,2 CEA, INAC, F-38054 Grenoble,

3 CNRS, Institut Néel, F-38042 Grenoble


Maud Vinet (CEA-Leti, University Grenoble Alpes, France) is currently leading the quantum computing program in Leti. Together with Tristan Meunier (CNRS) and Silvano de Franceschi (Fundamental research division from CEA), they received an ERC Synergy grant in 2018 to develop silicon based quantum computer.

She defended a PhD of Physics from University of Grenoble Alps and was hired Leti in 2001 as a CMOS integration and device engineer. From 2009 to 2013, she spent 4 years with IBM to develop Fully Depleted SOI with IBM and STMicroelectronics. In 2015, she spent 6 month with Globalfounries in Malta, NY to launch 22FDX program.

From 2013 to 2018, she managed the Advanced CMOS integration team activities in Leti (~50 people). In 2019, she was appointed project leader for the quantum computing program in Leti.

Maud Vinet authored or co-authored about 200 papers, she owns more than 70 patents related to nanotechnology and her Google h-index is 42.



Ruud de Wit, EIMEA SU Head Semiconductors, Henkel Electronic Materials


Smart Electronics’ trends like Big Data, Artificial Intelligence, Autonomous Driving and 5G continue to drive advanced semiconductor innovation towards higher functionality with smaller form factors and reduced power consumption. To meet these future demands, semiconductor package designs continue to evolve towards WAFER scale assembly using 3D Stacking and System-in-Package (SiP) type of architectures. Through Silicon Via (TSV) is enabling 3D die stacking for High Bandwidth Memory (HBM) allowing for finer pitch. Wafer Level Packaging (WLP) for both Fan-In and Fan-Out are also gaining momentum rapidly and same for Panel Level Packaging (PLP) showing significant progress. With this move towards SiP, increasing data demands, faster processing speeds and the emergence of 5G, traditional wafer fabrication companies are getting more in the driver's seat of Semiconductor Packaging. New finer pitch interconnect and low warpage encapsulation developments are essential for such highdensity and challenging 2.5/3D device manufacturing processes, stress management for larger devices and increasing long-term reliability requirements. Next to this, increasing heat generation and dissipation, Fan-In and Fan-Out process compatibility (adhesion, die shift) and further need for miniaturization (Keep-out-Zone) are key challenges for Semiconductor Packaging material suppliers. < div >This presentation will give a technical overview of the advanced wafer level packaging material developments to enable next gen 2.5D and 3D chip designs : < div >- “Wafer Applied Underfill Films” for 3D Stacking of thin TSV wafers with increasing thermal performance and faster processing - Low shrinkage and ultra-low warpage wafer encapsulants and coatings for Fan-In and Fan-Out applications These developments are aimed to meet the market's sustainability, miniaturization and high reliability requirements with providing reliable, scalable and environmental-friendly adhesive and encapsulation solutions.

Ruud de Wit is responsible for managing Henkel's Semiconductor, Sensor & Consumer Electronics Assembly Materials business development within EMEA region. Ruud has a BSc degree in Mechanical Engineering followed by several polymer, sales and marketing courses. Ruud is working for Henkel since 1990 in multiple positions including technical customer service, quality assurance and engineering, and global semiconductor account and product management.




Industry Strategy Symposium Europe 2020 - STEERING COMMITTEE MEMBERS

  • Xavier Buch, JSR Micro N.V.
  • Rene Claessen, ASML
  • Peter Connock, memsstar® Technology
  • Maurice Geraets, NXP Semiconductors
  • Eric Gerondeau, STMicroelectronics
  • Leonard Hobbs, MIDAS Ireland
  • Angelika Iberl, Infineon
  • Ari Komeran, Intel
  • Lode Lauwers, imec
  • Didier Louis, CEA-Leti
  • Thomas Piliszczuk, Soitec
  • Thomas Richter, Robert Bosch
  • Hans Richter, GFWW
  • Frank Schulte, AIXTRON SE
  • Gerd Teepe, T3-Technologies
  • Dominik Thron, GLOBALFOUNDRIES
  • Jim Trayner, Tokyo Electron


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