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Espoo, Finland, July 14, 2025 – Beneq, a global leader in Atomic Layer Deposition (ALD) technology, is proud to announce significant progress in the microLED display market, underscored by repeat orders from industry-leading technology innovators. MicroLED technology is revolutionizing the future of displays across sectors including consumer electronics, augmented and virtual reality (AR/VR), and the automotive industry. With unparalleled brightness, contrast, energy efficiency, and durability, microLED represents a paradigm shift in how displays are designed and manufactured – enabling ultra-fine pixel resolution, seamless scalability, and longer device lifetimes. As demand for next-generation display solutions accelerates, microLED is poised to become the backbone of future visual interfaces.

According to Yole Group, global microLED display shipments are projected to grow at a compound annual growth rate (CAGR) of 180.6% from 2022, reaching 42.4 million units by 2029. Despite its promise, microLED development presents formidable challenges, particularly in scaling down pixel sizes to below 10 micrometers while maintaining uniformity, stability, and manufacturability. As pixels shrink, precise material control and surface passivation become critical to device performance. Atomic Layer Deposition offers a unique solution, enabling ultra-thin, conformal coatings with atomic-level precision. ALD addresses key barriers in microLED production, such as surface defect passivation, sidewall protection, transparent conductive oxides and final passivation, thereby improving both device efficiency and long-term reliability.

“Our top-tier customers rely on ALD technology to advance monolithic integration of microLEDs and driver electronics on a single chip. This integration paves the way for a new class of smaller, more powerful display products – delivering faster data transfer, lower power consumption, and a significantly more compact footprint,” says Mikko Söderlund, Head of Semiconductor ALD Sales.

“These repeat orders validate Beneq’s solution and demonstrate the company’s commitment to support customers through both the demanding development phase and the critical transition to volume manufacturing.”

Beneq’s Transform® ALD cluster platform stands at the forefront of this technological evolution. Designed for high-throughput production and advanced technology development, the Beneq Transform combines modularity, flexibility, and productivity, making it an ideal tool for microLED manufacturers. Its multi-chamber architecture supports a wide range of materials and processes, enabling customers to fine-tune optical and electrical properties while seamlessly scaling from lab to fab. By equipping microLED pioneers with the tools needed to overcome manufacturing barriers, the Beneq Transform is helping accelerate the commercialization of microLED displays – paving the way for brighter, smarter, and more sustainable electronic experiences.

About Beneq

Beneq pioneered industrial Atomic Layer Deposition (ALD) with the introduction of the first commercial ALD equipment in 1984. Today, Beneq advances ALD technology adoption and validation with a portfolio that includes Transform®, Transform® 300, and Prodigy™ for specialty semiconductor device fabrication; TFS 200 and TFS 500 for R&D; innovative spatial ALD platforms such as the C2R™, and Genesis for roll-to-roll processing. Beneq’s products support process innovation from lab to fab, enabling integration of ALD in high volume manufacturing. Headquartered in Espoo, Finland, Beneq operates globally to help customers scale ALD solutions for the future of semiconductors, optics, and functional coatings.

Press Contact

Charlotte Bärlund
Event and Communications Lead
[email protected]

Lie Luo
Head of Marketing
[email protected]

Martinez, CA—EUV Tech (EUVT), a global leader in designing and manufacturing at-wavelength EUV metrology equipment, is excited to announce the release of the FALCON Photoresist Flood Exposure Tool. As our next-generation EUV resist characterization and diagnostics tool, FALCON allows photoresist manufacturers to rapidly and accurately test EUV resist sensitivity, as well as providing patterning materials developers critical insights into exposure mechanisms.

Built upon EUV Tech’s proven resist tool technology, FALCON is a fully automated tool that supports high-throughput contrast curves on EUV-patterning materials and radiation chemistry diagnostics by integrating a wide variety of optional add-on analysis and processing modules.

Enhancing FALCON’s platform is an array of in-situ analysis and process modules, including Fourier Transform Infrared (FTIR) Spectroscopy, Atomic Mass Spectrometry, Total Electron Yield (TEY), Photo-Electron Spectroscopy (PES), environmental and vacuum bake module with additional diagnostics, and a scanner-environment exposure module.

Key to FALCON’s effectiveness is its highly uniform exposure spot size of 6 mm, supporting high-sensitivity chemical analysis and over 1,000 exposures for a 300 mm wafer in a single recipe run. Built-in data visualization tools make it possible to analyze this rich data. Combining uniformity, high configurability, and deep data collection and analysis makes FALCON a highly efficient, cost-effective tool for advanced photoresist development.

For more information on the enhanced FALCON Flood Exposure Tool or any of EUV Tech’s at-wavelength metrology tools, please visit euvtech.com.

About EUV Tech
EUV Tech enables technology advancement in the frontiers of semiconductor manufacturing and material science through the development of world-leading EUV and soft-x-ray instrumentation and techniques.

For further information, contact:
EUV Tech, Inc.
[email protected]
+1 (925) 229-4388

Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. For details about this solution developed in late 2024 and 2025, download the case study here: Customer Success: Powertech Technology Inc. (PTI) Advances Panel Level Packaging with Nordson.

PTI, one of the world’s top OSAT (Outsourced Semiconductor Assembly and Test) companies, worked with the Nordson applications team to set up a comprehensive PLP demonstration that achieved high-quality, void-free underfill results at scale, using the industry-leading ASYMTEK Vantage® Series fluid dispensing system, equipped with the ASYMTEK IntelliJet® Jetting system. Nordson’s precision technology mitigated warpage and optimized fluid flow while decreasing cycle time by almost 30%.

PLP offers a path to managing the complexity of larger die sizes and higher-density designs while maintaining manufacturability and cost efficiency as the semiconductor industry transitions from 300-mm wafers to panels. PTI is enabling PLP applications that are designed to meet the semiconductor industry’s growing demands to serve AI, high-performance computing (HPC), and chiplet-based architectures.

Underfill has been pivotal in semiconductor packaging since the adoption of flip-chips in the 1990s. As applications have become more demanding, particularly in high-performance CPUs, GPUs, and advanced architectures like flip-chip and 2.5D/3D ICs, the importance of underfilling to enhance mechanical reliability and thermal performance has grown. Since the beginning, Nordson developed innovations for underfill processes as the industry evolved from PC board, substrate, wafer, and now panel applications.

Nordson’s distributor, Jetinn Global Equipment Ltd., supported the advancements discussed in this case study by investing in demonstration equipment and providing expert technical support.

Penang, Malaysia – June 2025 – ViTrox aims to be the World’s Most Trusted Technology Company, proudly shares that our Co-Founder, Mr. Steven Siaw, was honoured with the SEMI Southeast Asia Industry Tribute Award on May 20, 2025, in conjunction with the 30th anniversary of SEMI Southeast Asia.

This award honours 30 distinguished leaders from the region’s semiconductor and microelectronics sectors who have made significant contributions to the industry’s growth and development. Mr. Steven was recognised for his exceptional leadership, integrity, and consistent business growth over the years, along with his passion for mentoring young talents and driving positive impact in areas such as innovation, sustainability, and community building.

"Receiving this award is truly an honour. It represents not just my journey, but the collective efforts of our amazing ViTrox team and partners who have believed in our mission. I’m truly humbled and grateful to be part of such a dynamic industry. I look forward to continuing my journey — serving, growing, and giving back to the semiconductor community.” — Mr. Steven Siaw.

This milestone stands as a testament to his enduring impact and aligns with ViTrox’s broader purpose of contributing to the advancement of society and the well-being of humankind through compassionate innovations. With cutting-edge technologies, a bold vision, and a passion for excellence, ViTrox is poised to redefine industry standards and drive transformative change on a global scale.

About ViTrox Technologies
ViTrox is committed to being the World’s Most Trusted Technology Company and the leading solutions provider by integrating ViTrox's technologies, people, and strategic alliances to provide its customers with the most innovative, advanced, and cost-effective machine vision solutions of excellent quality.

ViTrox offers a full spectrum of solutions, ranging from Middle & Back-end Semiconductor Vision Solutions, SMT PCB Assembly Inspection Solutions, Integrated Industrial Embedded Solutions, and Manufacturing Intelligence Solutions Toward Industry 5.0. ViTrox is headquartered in Penang, Malaysia, with offices in Asia, Germany, and the United States and sales and support sites worldwide.

For more information about ViTrox’s products and services, please visit www.vitrox.com.

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M Merck

Are We There Yet? Metrology and Inspection for Angstrom-Level Manufacturing ​

In the semiconductor industry where we routinely pattern sub-wavelength structures and require atomic-layer precision in our manufacturing processes, it’s easy to assume that we can simply measure everything we’re doing and all the structures we create. In reality, though, metrology and inspection have the challenging task of not just keeping up with device technology but staying far enough ahead that we can actually “see” our results and confirm the progress we’re making.

In this webinar, co-hosted with the Electronics business of Merck KGaA, Darmstadt, Germany; we will explore the metrology and inspection space to learn more about technological advances driving this vital segment of semiconductor manufacturing.

The webinar will feature presentations by Eric Beyne, PhD, Senior Fellow, VP R&D and Director of 3D System Integration Program for imec, and Dario Alliata, PhD, Senior Application Director for Metrology & Inspection at the Electronics business of Merck KGaA, Darmstadt, Germany.

Following the presentations, an interactive Q&A segment will allow attendees a chance to deepen their understanding of how materials innovation and advanced metrology intersect at the leading edge of manufacturing.

Join us to engage with peers and pioneers working at the forefront of materials science and semiconductor innovation!

 

United States

Dario Alliata
Dario Alliata, PhD
Senior Director of Applications
The Electronics business of Merck KGaA, Darmstadt, Germany

The Role & the Challenge of Metrology and Inspection in Advanced Packaging of AI Chips

The massive adoption of social networking and artificial intelligence has pushed the semiconductor industry to develop devices capable of supporting the required infrastructures. Increasingly powerful computer process units (CPU) are used to allow data centers to process trillions of information exchanges, while faster graphic process units (GPU) enable virtual and assisted reality.
Cost leveraging is now reachable with the integration of multiple dies in the same package, each one fabricated to handle specific functionalities with the most cost-effective technology node, which is a form of heterogeneous integration. This session highlights some examples of metrology and inspection solutions aimed at securing the manufacturability of devices for High Computing Power fundamental for AI applications. More in detail, it explores the challenge of the fabrication of chip-to-chip interconnections that are key for the heterogeneous integration of active components with vertical stacking like DRAM for High Bandwidth memories, where process tolerances are increasingly narrow and conditions to measure more and more extremes.

Biography
Dr. Dario Alliata joined Unity-SC, now part of the Electronics business of Merck KGaA, Darmstadt, Germany in the U.S. and Canada. In 2016 as product manager and is now Sr. Director of Applications with focus on Advanced packaging and Specialty substrates & devices.
He worked in the semiconductor industry for more than 25 years, initially in R&D centers and later in equipment makers. He spent his entire career developing process control solutions for securing the manufacturing chain in the semiconductor industry.
He received a MD in Physics from the University of Milan (Italy) and hold a Ph.D. in Physics & Chemistry from the University of Berne (Switzerland).

EB
Eric Beyne, PhD
VP R&D / Program Director 3D System Integration Program / Senior Fellow
imec

Sub-Micron Pitch Scaling of Hybrid Bond Interconnects: Metrology Challenges

Advanced 3D integration technology will increasingly rely on hybrid bonding technology for both wafer-to-wafer and die-to-wafer bonding. This allows for micrometer and sub-micrometer pitch interconnects, resulting in very high 3D interconnect densities, compatible with the back-end-of -line interconnect layers of active logic and memory die. The results are “seamlessly” interconnected die. Off-chip interconnects become equivalent (or better) than on-chip interconnects.
These great system-level benefits however come at some challenges. Small overlay errors or surface imperfections can prevent defects, resulting in yield loss. Critical process, steps, such as CMP, wafer dicing and surface cleaning steps, need to be monitored with higher accuracy to maintain a good process. New parameters, such as wafer shape, distortion, surface profile slopes, and copper pad recess levels need to be measured and continuously monitored. This poses significant challenges to metrology related to hybrid bonding. The presentation will highlight these needs and show some practical solutions.

Biography
Eric Beyne obtained a degree in electrical engineering in 1983 and the Ph.D. in Applied Sciences in 1990, both from the Katholieke Universiteit Leuven, Belgium. Since 1986 he has been with IMEC in Leuven, Belgium where he has worked on advanced packaging and interconnect technologies. Currently, he is imec senior fellow, VP R&D and program director of imec’s 3D System Integration program.

Michael Weigand
Michael Weigand
Senior Application Manager
Brewer Science

Moderator

Biography
I'm a seasoned Senior Application Manager at Brewer Science with over two decades of experience in Semiconductor industry. I lead application teams at Brewer Science Inc, focusing on advanced materials for the semiconductor industry. With a background in Material Science, I enjoy tackling technical challenges, from optimizing critical processes to finding creative ways to characterize materials.

EMG

Sponsored by the Electronics business of Merck KGaA, Darmstadt, Germany 

10:00 am - 11:00 am Off Add to Calendar 2025-09-17 10:00:00 2025-09-17 11:00:00 Are We There Yet? Metrology and Inspection for Angstrom-Level Manufacturing ​ Sponsored by the Electronics business of Merck KGaA, Darmstadt, Germany  United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles WATCH NOW
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As world leaders act to secure access to these minerals, companies come under pressure to follow due diligence guidelines to promote ethical sourcing of these materials for their supply chains.  Regulations such as the US Dodd-Frank Wall Street Reform and Consumer Protection Act (Section 1502), EU Regulation 2017/821 and the EU Corporate Sustainability Due Diligence Directive require companies to trace materials through their supply chains and report to the public about their use of conflict minerals. 

Several industry associations, including the Responsible Business Alliance’s Responsible Minerals Initiative, were created to help companies with their due diligence efforts. Reports such as those issued by the US Government Accountability Office on Conflict Minerals offer insights into the efficacy of these regulations and suggest improved approaches for industry engagement. 

The SEMI Responsible Supply Chain (RSC) working group was recently formed to host discussions on these topics. This webinar will provide insights from speakers Jennifer Peyser, Responsible Business Alliance Senior Vice President of Responsible Sourcing, and Kimberly Gianopoulos, Managing Director for the International Affairs and Trade team at the U.S. Government Accountability Office (GAO).

United States

8:00 am - 8:05 am
Kim Harrison
Dr. Kimberly Harrison, Ph.D
Senior MEMS Engineer
AMFitzgerald & Associates

Welcome and Introductions of RSC working group

Dr. Harrison is a MEMS Engineer with AMFitzgerald & Associates, a design firm located in the Bay Area California. She has a doctoral degree in mechanical engineering from Stanford University, and has worked as a designer and process engineer in the semiconductor industry for 10 years. She was nominated as a 2022 MEMS & Sensors Industry Group Emerging Leader. As a founding member and leader of the SEMI Responsible Supply Chain Working Group, she hopes to bring SEMI members together to discuss solutions to human rights issues in the semiconductor supply chain.

Conflict Minerals Supply Chain Overview

8:05 am - 8:35 am
Kimberly Gianopoulos
Kimberly Gianopoulos
Managing Director for the International Affairs and Trade
U.S. Government Accountability Office (GAO)

Report Review

Director Gianopoulos oversees a 140-person team that reviews a wide variety of federal government oversight issues, including International Security Assistance, Bilateral and Multilateral Foreign Assistance, International Trade and Finance, and U.S. Diplomatic Presence and Management. She serves as a facilitator in GAO’s Learning Center and participates in recruiting activities. Ms. Gianopoulos has received several awards, including a Distinguished Service Award, a Meritorious Service Award, a Client Service Award, and several Results Through Teamwork awards. Ms. Gianopoulos earned a Bachelor’s degree in Mathematics and a Master’s degree in Public Analysis and Administration from the State University of New York at Binghamton. She is a Certified Government Financial Manager and a member of Pi Alpha Alpha, the Global Honor Society for Public Affairs and Administration.

Jen Peyser
Jennifer Peyser
Executive Director
Responsible Minerals Initiative

RMI Activity Overview

“The RMI supports over 500 downstream, midstream, and upstream member companies with a suite of due diligence standards and tools, data, guidance, training, and other resources for global responsible sourcing and regulatory compliance. Our facility and supply chain due diligence standards are rooted in longstanding international norms while reflecting emerging corporate and stakeholder priorities for regulatory compliance, managing sustainability risks and impacts, and fostering responsible mineral supply chains.”

8:35 am - 8:55 am

Q&A

8:55 am - 9:00 am

Summary and Closing Remarks

SCM 8:00 am - 9:00 am Off Add to Calendar 2025-07-09 08:00:00 2025-07-09 09:00:00 Critical Minerals, Due Diligence and the Semiconductor Supply Chain United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register for On-demand
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For questions, please contact [email protected]

Register for US/EU session (8:00-8:30am PT) Register for Asia session (5:00-5:30pm PT)
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Leverage SEMI U learning offerings to wrap up your 2025 professional development journey! Our pledge remains unwavering: providing comprehensive, technical education to equip you with the skills needed for a prosperous journey in the semiconductor sector.

Are you ready to take your semiconductor industry knowledge to the next level? We're thrilled to invite you to our upcoming webinar titled "SEMI University - 2025 and beyond." This webinar promises to be an informative session where you'll gain insights into the latest updates, exciting live trainings at SEMICON West and virtually the remainder of this year and beyond. 

During this webinar, you can expect to:  

  • Discover the latest updates and enhancements to SEMI U's course catalog.  
  • Learn about the exciting live, in-person training courses scheduled for SEMICON West.
  • Review upcoming virtual instructor-led trainings.
  • Gain access to a special 10% discount on ALL on-demand courses.  

 

United States

Headshot of Naresh Naik
Naresh Naik
Director, SEMI University
SEMI
SEMI U Workforce Development

Join us to discover our current course offerings, upcoming in-person and virtual trainings, and more. Engage in a Q&A session. Plus, by attending this free webinar, you'll receive a 10% discount code for all on-demand courses and will be entered into a raffle to win a FREE course bundle ($100 value). 

Choose your session:

8:00 am - 8:30 am Off Add to Calendar 2025-09-25 08:00:00 2025-09-25 08:30:00 SEMI University - 2025 & Beyond Join us to discover our current course offerings, upcoming in-person and virtual trainings, and more. Engage in a Q&A session. Plus, by attending this free webinar, you'll receive a 10% discount code for all on-demand courses and will be entered into a raffle to win a FREE course bundle ($100 value). Choose your session:US/EU: 8:00 AM – 8:30 AM PT [Register Now]Asia/US: 5:00 PM – 5:30 PM PT [Register Now] United States SEMI.org [email protected] America/Los_Angeles public Register Now
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SEMI Members:  $75

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $149

Students:  Free

Contact Andreia Smith-Moritz ([email protected]) with a picture of your student ID to receive your discount code.

Register Now
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Graphenea: Graphene Device Manufacturing

Graphene, a two-dimensional material with extraordinary electrical, mechanical, and biocompatible properties, is emerging as a key enabler for the next generation of medical devices. In this presentation, we will explore how Graphenea, through its advanced Graphene Foundry services, is driving the integration of graphene into scalable device manufacturing for biomedical applications. Attendees will gain insight into our end-to-end fabrication capabilities, from graphene synthesis, wafer-scale CVD graphene growth to cleanroom device prototyping and packaging. We will showcase examples of graphene-based biosensors, flexible electronics, and neural interfaces developed through our foundry platform, emphasizing their potential impact in diagnostics, monitoring, and therapeutic applications. The session will also address the challenges of material integration, process scalability, and regulatory pathways for graphene in medical technologies, providing a practical roadmap for researchers and companies looking to bring graphene-enabled devices from lab to market.

INBRAIN: Pioneering Precision Neuroelectronics: From Materials to Scalable Therapies

The convergence of materials science, artificial intelligence, and neuromodulation is transforming the future of neuroscience. This talk explores how high-density graphene-based brain-computer interfaces are enabling real-time decoding and precision modulation of neural circuits. Carolina Aguilar, CEO and Co-Founder of INBRAIN Neuroelectronics, will present the technological and clinical journey behind the world’s first graphene neural interface in humans, and how this platform is designed to deliver adaptive, patient-specific therapies for neurological disorders such as Parkinson’s disease. The session will highlight the translational path from research to regulated medical devices, and the role of Europe in leading responsible innovation in neurotechnology

ABOUT THE SPEAKERS:

Jesús de la Fuente

Jesús de la Fuente is the founder and CEO of Graphenea, a leading graphene production company established in 2010. Before founding Graphenea, he served as a Manager at Arthur Andersen, Director at PricewaterhouseCoopers in advisory professional services, and Managing Director at an industrial materials distribution company. He holds a Bachelor of Science in Engineering from Deusto University and an Executive MBA from IESE Business School. Under his leadership, Graphenea has become a world-leading graphene producer, contributing to the development of graphene applications across various sectors in over 60 countries.

Carolina Aguilar

Carolina Aguilar is the CEO and Co-Founder of INBRAIN Neuroelectronics, a neurotechnology company pioneering the use of graphene-based brain-computer interfaces for precision neuromodulation. With over 20 years of experience in healthcare, including 13 years at Medtronic where she led global businesses in brain modulation and diabetes, she has built a career at the intersection of innovation, neuroscience, and impact. Under her leadership, INBRAIN achieved the first-in-human implantation of a graphene neural interface and received FDA Breakthrough Device Designation. Carolina is also a 2025 World Economic Forum Technology Pioneer and a strong advocate for responsible, human-centric deep tech in Europe for the world.

United States

Jesús de la Fuente
Jesús de la Fuente
CEO
Graphenea
Carolina Aguilar
Carolina Aguilar
CEO and Co-Founder
INBRAIN
Gity Samadi
MODERATOR
Gity Samadi
Sr. Director, R&D Programs
SEMI
NBMC Smart MedTech FlexTech

Join us for this exciting Master Class with Jesús de la Fuente, Founder and CEO of Graphenea, and Carolina Aguilar, CEO and Co-Founder of INBRAIN, as they showcase their pioneering efforts of integrating graphene into scalable medical devices highlighting advancements in various medtech applications including biosensors and neural interfaces.

9:00 am - 11:00 am Off Add to Calendar 2025-09-10 09:00:00 2025-09-10 11:00:00 FEMC#25 Enabling Next-Generation Medical Devices: Graphene Device Manufacturing Join us for this exciting Master Class with Jesús de la Fuente, Founder and CEO of Graphenea, and Carolina Aguilar, CEO and Co-Founder of INBRAIN, as they showcase their pioneering efforts of integrating graphene into scalable medical devices highlighting advancements in various medtech applications including biosensors and neural interfaces. United States SEMI.org [email protected] America/Los_Angeles public Watch Now!
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Nijmegen, The Netherlands, 14 May 2025 — Trymax Semiconductor Equipment (Trymax), a leading provider of plasma- and UV-based solutions for semiconductor manufacturing, announces the installation of its 500th process chamber in Asia. This milestone reflects continued momentum across key regional markets—including China, Taiwan, South Korea, Malaysia, and the Philippines—and signals strong progress toward the company’s goal of 1,000 global installations by the end of 2025.

“Reaching 500 installations in Asia is a significant milestone for Trymax,” said Peter Dijkstra, Chief Commercial Officer at Trymax Semiconductor Equipment. “It reflects our team’s dedication to delivering practical, high-performance solutions with the speed and reliability that our customers need in order to stay competitive.”

Responsiveness as a Competitive Edge

In an industry where uptime, productivity, and reliability are critical, Trymax has earned a reputation for being highly responsive—from the inquiry stage to post-installation support. The company’s nimble structure allows it to take action quickly and decisively, enabling customers to manufacture with confidence. Many partners have cited the ease of communication with Trymax, and the timely support received, as reasons for early and continued engagement.

Supporting Asia’s Semiconductor Surge

Asia continues to lead global semiconductor growth, driven by accelerated adoption in high-demand sectors. Customers across the region are pushing forward with innovation and scale, particularly in:

• Automotive: The transition from internal combustion engine (ICE) vehicles to electric vehicles (EVs) is reshaping the industry. EVs require significantly more semiconductors—often up to 3,000 chips per vehicle—due to greater electrification, power management, and onboard computing systems. This shift is fueling demand for reliable, high-throughput semiconductor processing solutions.

• Artificial Intelligence (AI): The rise of AI and machine learning applications—from data centers to edge devices—is creating a surge in demand for advanced microprocessors and high-density memory. Backend processes play a critical role in ensuring the performance and yield of these complex chips, making equipment reliability and process control essential.

• 5G & Connectivity: Asia’s rapid deployment of 5G networks, combined with its mobile-first population and high-volume data consumption, is pushing the limits of semiconductor performance. This growth requires advanced packaging technologies, faster interconnects, and increased wafer-level precision—all of which depend on stable, repeatable backend processing steps.

Trymax’s plasma and UV curing technologies are designed to meet these demands, delivering proven results in ashing, descum, surface cleaning and activation, and isotropic etching. With a strong footprint across the region, the company continues to support customers at the forefront of innovation.

Forward Plans and Strategic Vision

To support its continued growth in Asia and globally, Trymax is advancing several strategic initiatives. The company is exploring plans to establish local manufacturing in China, a move aimed at strengthening supply chain resilience and improving responsiveness to regional customer needs.

As part of its 2025–2030 roadmap, Trymax is also deepening its collaborations with leading semiconductor manufacturers. By taking on selective, non-core process steps—particularly those related to backend wafer processing—Trymax helps larger players free up internal resources and maintain operational focus where it matters most.

In parallel, Trymax is expanding its role in advanced packaging. As integrated circuit (IC) designs evolve toward increasingly complex multi-layered stacks—sometimes comprising up to 16 layers—ensuring pristine, activated surfaces between each layer is critical. Trymax’s plasma solutions are engineered to meet these exacting standards, enabling customers to maintain high yield and reliability in next-generation device architectures.

Meet Trymax at SEMICON Southeast Asia 2025

Trymax will be showcasing its latest plasma-based innovations at SEMICON Southeast Asia 2025, from 20–22 May at the Sands Expo and Convention Centre, Marina Bay Sands, Singapore. Attendees are invited to meet the Trymax team at Booth #B1633 to learn more about the company’s technology roadmap and expansion plans.

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About Trymax Semiconductor Equipment

Trymax’s core business is to support semiconductor manufacturers through the world with innovative plasma-based solutions for photoresist removal, surface cleaning, isotropic etch, as well as UV curing and charge erase applications, that are used in the fabrication of integrated circuits and other semiconductor devices. Trymax is a privately held company headquartered in Nijmegen, The Netherlands. Trymax operates regional sales and service offices in Europe, UA, China, Southeast Asia, Taiwan, and Japan.

Learn more at www.trymax-semiconductor.com.

Test Research, Inc. (TWSE: 3030), the leading test and inspection systems provider for the electronics manufacturing industry, is proud to announce its successful partnership with Bosch in the development of an AI visual check solution for MEMS packaging.

Bosch has recognized TRI's valuable contribution to their success in MEMS packaging in 2025 with a Certificate of Appreciation. The certificate acknowledges the successful completion of the AI visual check for MEMS packaging, highlighting the strong cooperation and partnership between the two companies.

This collaboration demonstrates TRI's expertise in AI-driven inspection solutions and its commitment to providing valuable solutions for the electronics manufacturing industry. TRI's AI-powered solutions include the AI Defect Detection, AI Smart Programming, AI Verify Host, AI training tool, AI Station, and more.

Please visit the following link to learn more about TRI's AI Solutions:
https://www.tri.com.tw/en/about/about-107-2-2.html

Learn more about the Bosch Group by following the link below:
https://www.bosch-presse.de/pressportal/de/en/company-page.html

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About Test Research, Inc. (TRI)

TRI (TWSE: 3030), offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. Learn more at http://www.tri.com.tw. For sales and service information, please write to us at [email protected] or call +886-2-2832 8918.

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