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Singapore

Malaysia Singapore Vietnam SEMI x MSIA Members' Networking Night EventTile Business Executive
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Hotel Rates

G Hotel Gurney

Room Type

Size (m²)

Room Only

Room + Breakfast (Single)

Room + Breakfast (Double)

Deluxe

38

550

580

610

Executive Rooms & Suites

Executive Room

38

 

710

710

Duplex Suite

88

 

780

780

L Suite

67

 

900

900

Executive Suite

78

 

1,050

1,050

XL Suite (2 Bedrooms)

113

 

1,550

1,550

G Suite

187

 

2,420

2,420

 

 

 

 


All rates are in MYR.

Guests wishing to book a room at G Hotel Gurney are required to contact the hotel representative, Pei Leng, at +60 17-466 8032 or via email at [email protected].

 

Eastern & Oriental Hotel | SOLD OUT

Victory Annexe Wing

Studio Suite

580++

Corner Suite

1,580++

Heritage Wing

Deluxe Suite | Georgetown Suite | Superior Suite

780++

Premier Suite

850++

Straits Suite

1,130++

Writer Suite

2,080++

Pinang Suite

2,980++

 

 

 


All rates are in MYR.

All Eastern & Oriental Hotel rates include breakfast for two. (Single occupancy rates are not available.)

Guests wishing to book a room at Eastern & Oriental Hotel are required to contact the hotel representative, Vanessa Chin, at +60 16-419 8363 or via email at [email protected].

 

Hotel Parking

Hotel parking is now cashless with payment using Touch & Go or credit cards. 

For functions, hotel parking is available at a flat rate of RM 8.00 nett per entry for all guests. 

To enjoy this rate, please validate the cards at the car park validating machine outside the function rooms.

Photo Gallery

Browse our 2025 SEMI x MSIA Members' Networking Night Photo Gallery

Eastern & Oriental Hotel, Penang | Grand Ballroom
10, Lebuh Farquhar, George Town, 10200 George Town
Pulau Pinang
Malaysia

6:15 pm

Registration & Cocktail Reception

6:45 pm
LindaProfilePhoto_Circle
Ms. Linda Tan

Welcome Speech

Ms. Linda Tan | President, SEMI Southeast Asia

6:50 pm
Dato Seri Siew Hai Wong
Dato' Seri Siew Hai Wong

Welcome Speech

Dato' Seri Wong Siew Hai | President, Malaysia Semiconductor Industry Association (MSIA)

6:55 pm
YAB Tuan Chow Kon Yeow
YAB Tuan Chow Kon Yeow

Opening Speech

YAB Tuan Chow Kon Yeow | Chief Minister of Penang

7:05 pm

Announcement

Global Semiconductor Collaboration between SEMI SEA and MSIA
Witnessed by YAB Tuan Chow Kon Yeow, Chief Minister of Penang, and Mr. KC Ang, Chairman of the SEMI Southeast Asia Regional Advisory Board.

7:10 pm

Networking Buffet & Drinks

8:00 pm

Live Performance

10:00 pm

End of Networking Night

Program subject to change

Join SEMI Southeast Asia and MSIA for a night of networking and celebration at our exclusive SEMI X MSIA Members' Networking Night. Get a chance to connect with industry leaders, exchange valuable insights, and unlock a myriad of business opportunities.

 

Members: Free (restricted to 2 representatives per member company)

For additional participants and non-members, please contact [email protected] to discuss applicable fees and arrangements.

Off Add to Calendar 2025-02-27 00:00:00 2025-02-27 00:00:00 SEMI x MSIA Members' Networking Night Join SEMI Southeast Asia and MSIA for a night of networking and celebration at our exclusive SEMI X MSIA Members' Networking Night. Get a chance to connect with industry leaders, exchange valuable insights, and unlock a myriad of business opportunities. Members: Free (restricted to 2 representatives per member company)For additional participants and non-members, please contact [email protected] to discuss applicable fees and arrangements. Eastern & Oriental Hotel, Penang | Grand Ballroom 10, Lebuh Farquhar, George Town, 10200 George Town Pulau Pinang Malaysia SEMI.org [email protected] Asia/Singapore public Asia/Singapore

Innovative plug-and-play device helps conduct comprehensive equipment compliance tests for automatic carrier delivery in automated fabs

SEMICON Europa, Munich, Germany, November 12, 2024 – Agileo Automation, a leading provider of control and connectivity solutions for global semiconductor equipment manufacturers, today launches the E84 PIO Box at Booth #C2848. This handheld device offers a new lightweight interface for fab staff to test semiconductor equipment software for compliance with SEMI’s E84 and GEM300 standards suite for automatic carrier delivery. It improves the readability, identification, and validation of E84 signal exchanges and functional aspects in cleanrooms or workshops. Integrated with Agileo Automation’s Speech Scenario software that emulates the fab host and validates the SECS/GEM interface with predefined test scenarios, the E84 PIO Box can easily emulate automated carrier delivery systems such as overhead hoist transport or automated guided vehicles. It is able to detect non-compliance and other functional issues thanks to its close alignment with SEMI’s E84 standard. The device features a DB25 connector for easy integration with E84 passive systems such as a load port and connects directly to a PC via a single USB cable for both data and power supply.

“In highly automated fabs, even minor carrier delivery issues can lead to costly downtime. Our E84 PIO Box is designed to rigorously validate nominal and error cases, ensuring seamless operations and fast recovery, benefiting both equipment manufacturers and facilities alike,” explains Marc Engel, CEO of Agileo Automation. “Early adopters have seen significant improvements in overall equipment software quality and now approach each software update with greater confidence, backed by consistent testing results.”

About Agileo Automation
Since its inception in 2010 in Poitiers, France, Agileo Automation has empowered global semiconductor equipment manufacturers to optimize their production machines with control, communication, data acquisition, and testing solutions, enabling their deployment in large-scale fabs worldwide. At the heart of Industry 4.0, Agileo’s A²ECF-SEMI framework provides a robust foundation for developing equipment controller software, leveraging the SEMI SECS/GEM and GEM300 standard suites. As a member of SEMI and the OPC Foundation, Agileo is a key contributor to the development and integration of industry standards such as SEMI standards and OPC Unified Architecture (OPC-UA). For more information, please visit our web site or follow us on LinkedIn.

PDF Solutions, Inc. (Nasdaq: PDFS), a leading provider of comprehensive data solutions for the semiconductor ecosystem, today announces the list of industry leaders speaking at its AI Executive Conference to be held on December 12th, 2024, in San Francisco, CA.

This event features keynotes, presentations, panels and demonstrations offering insights into the power of AI to transform semiconductor design and manufacturing. It includes talks on the state of art and best practices to design, deploy, scale and manage AI/ML solutions across the global semiconductor industry from PDF Solutions executives, other industry thought leaders, solutions experts and partners and users.

Three keynote presentations will look at how AI is currently being deployed in semiconductor manufacturing. Aziz Safa, Vice President and General Manager at Intel, will describe “How Analytics and AI are helping to transform a leading semiconductor company.” Smitha Mathews from ADI will discuss how semiconductor companies can “Get ready for AI” and the lessons learned from a real-life deployment. John Kibarian, PDF Solutions’ CEO will explain how AI is the next evolution of PDF Solutions portfolio.

Confirmed speakers include:

Aziz Safa Intel, VP and GM Analytics and Automation
Smitha Mathews Analog Devices, Senior Manager, Data & Analytics Strategy
Mike Campbell Qualcomm, Senior VP Engineering
Shyam Gooty Microsoft, Senior Director Product Engineering
Jean Philippe Fricker Cerebras, Founder and Chief System Architect
Anton Devilliers TEL, VP RnD
Jayant D’Souza Siemens, Principal Technical Product Manager
Marc Hunter Siemens, Director Product Management
Ken Butler Advantest, Senior Director Applications Marketing
Eli Roth Teradyne, Product Manager
Sunil Gandhi SAP, Sr Director Industry Executive, High Tech
Jason Schnitzer Yurts, CTO
Steve Mahoney Yurts, VP Product Management
Handel Jones International Business Strategies (IBS), founder and CEO.

PDF Solutions AI Executive Conference
Agenda and Registration:
https://go.pdf.com/AI-Conference-2024

Date: December 1‌2, 2‌0‌2‌4
Following the 70th Annual IEEE International Electron Devices Meeting.
Location: St. Regis Hotel 125 3rd St San Francisco, CA 94103

About PDF Solutions
PDF Solutions (NASDAQ: PDFS) provides comprehensive data solutions designed to empower organizations across the semiconductor ecosystem to improve the yield and quality of their products and operational efficiency for increased profitability. The Company’s products and services are used by Fortune 500 companies across the semiconductor ecosystem to achieve smart manufacturing goals by connecting and controlling equipment, collecting data generated during manufacturing and test operations, and performing advanced analytics and machine learning to enable profitable, high-volume manufacturing.

Founded in 1991, PDF Solutions is headquartered in Santa Clara, California, with operations across North America, Europe, and Asia. The Company (directly or through one or more subsidiaries) is an active member of SEMI, INEMI, TPCA, IPC, the OPC Foundation, and DMDII. For the latest news and information about PDF Solutions or to find office locations, visit https://www.pdf.com/.

Registration Details

$39 for SEMI Members (sign into your account with your work email to be recognized)

$59 for non-SEMI Members

Belgium China France Germany Ireland Italy Japan Malaysia Singapore South Korea Taiwan United States Vietnam Register for the 9:00-10:00 AM PT Session Register for the 4:00-5:00 PM PT Session SSI Webinar Series tile 360x317 - Cloned Business Executive
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Abstract

Companies across the semiconductor value chain must respond to a dynamic horizon as the ISSB Standards are adopted by securities regulators, standard-setters and stock exchanges around the world. At the same time, investors are asking companies to voluntarily transition from the TCFD recommendations to the ISSB Standards to meet their information needs.

To clarify what the ISSB Standards mean for the semiconductor value chain, SEMI is pleased to collaborate with the IFRS Foundation, which is the organizational seat of the ISSB. Our webinar, ISSB Standards Adoption and Reporting for the Semiconductor Value Chain, outlines the stakes for companies, demonstrates the business value of the Standards (IFRS S1 and IFRS S2), answers audience questions, and provides a venue for information exchange. There will be a deep dive into implications for climate reporting under IFRS S2 after a high-level look at the background and workplan of the ISSB.

Our distinguished speakers from IFRS Foundation are Neil Stewart, Director of Corporate Outreach, and Jing Zhang, Head of Climate Research.

This event is part of the SEMI webinar series, “Global State of Play: Sustainability Regulations, Reporting, & Incentives.” This series offers semiconductor industry professionals the chance to interact with top-tier experts on the most pressing challenges in compliance, disclosure, and strategy for sustainable business.

Speakers

Neil Stewart

Neil Stewart, Director of Corporate Outreach, IFRS Foundation

Neil Stewart is the International Sustainability Standards Board’s New York-based Director of Corporate Outreach, working with preparers, industry associations, the accounting profession and consultants to build awareness and understanding of the ISSB Standards and SASB Standards. Neil joined SASB in 2020 from Citigroup.

 

 

 

 

Jing Zhang

Jing Zhang, Head of Climate Research, IFRS Foundation

Jing Zhang is Head of Climate Research on the International Sustainability Standards Board’s technical staff. Previously he was the Global Head of Quantitative Research at Moody’s Analytics. Jing has numerous published books and research papers on financial risk, including the Risk Publications book “Climate Change: Managing the Financial Risk and Funding the Transition.” Jing has a PhD from the Wharton School of the University of Pennsylvania.

United States

Sustainability

Worldwide, companies in the semiconductor value chain are undergoing paradigm shifts in how they report sustainability-related risks and opportunities to stakeholders in government and capital markets.

Semiconductor manufacturing and design firms, together with their business partners, face heightened pressure to report on their performance related to climate transition, human capital management, supply chain management, and a host of other environmental, social, and governance issues.

On one hand, companies face a patchwork of reporting rules conditioned on where they do business. On the other hand,  a global baseline of sustainability-related disclosures ushered in by the IFRS Foundation’s International Sustainability Standards Board (ISSB) is gathering momentum.

Times

Multiple sessions available!
EMEA: Thursday, January 23, 2025 6:00-7:00 pm Central European Time (AM Session - 9:00-10:00 am Pacific)
America:  Thursday, January 23, 2025, 9:00-10:00 am or 4:00-5:00 pm Pacific Time
Asia Pacific: Friday, January 24, 2025 9-10 am Japan Standard Time (PM Session) 4-5 pm Pacific) 
Off Add to Calendar Disabled America/Los_Angeles
Event format

PDF Solutions, Inc. (Nasdaq: PDFS), a leading provider of comprehensive data solutions for the semiconductor and electronics ecosystems, today announced it will host an Executive Conference on the power of AI to transform semiconductor design and manufacturing. This event will take place on December 12, 2024, in downtown San Francisco, CA, following the 70th Annual IEEE International Electron Devices Meeting.

This one-day Executive Conference will feature presentations from PDF Solutions executives, industry thought leaders, solutions partners and customers on the state of art and best practices to design, deploy, scale, and manage trusted AI/ML solutions across the global semiconductor industry.

Additional information including agenda, logistics, and registration, will be available in the coming weeks.

About PDF Solutions
PDF Solutions (Nasdaq: PDFS) provides comprehensive data solutions designed to empower organizations across the semiconductor and electronics ecosystems to improve the yield and quality of their products and operational efficiency for increased profitability. The Company’s products and services are used by Fortune 500 companies across the semiconductor ecosystem to achieve smart manufacturing goals by connecting and controlling equipment, collecting data generated during manufacturing and test operations, and performing advanced analytics and machine learning to enable profitable, high-volume manufacturing.

Registration

For questions or inquiries, please contact: 

Elle Liang

[email protected]

+
Belgium China France Germany India Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam 360x317_Event_Calendar_Ad_DAI_Analyzing AI_Driven_v1@2x Business Executive
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The wide adoption of Artificial Intelligence is profoundly impacting many industries, perhaps none more so than the semiconductor industry. Beyond serving as a growth driver for chips across a diverse range of applications, AI and semiconductors are beginning a virtuous cycle where AI is helping to design more powerful chips that in turn enable more advanced AI. The semiconductor industry’s path to $1 trillion in annual revenue by the end of the decade is promising, thanks in large part to AI, but what will that journey actually look like?

This webinar will examine the industry’s AI-driven growth opportunities in depth, while looking at the technological innovation needed to fuel the market expansion. Dr. Handel Jones, CEO of IBS, and author of When AI Rules the World, will share his analysis of how AI will shape the outlook for semiconductor end-markets and segments – along with the race to achieve 1.0nm technology nodes and accelerate the virtuous AI-semiconductor development cycle. He will also cover the future of semiconductor market growth in the AI era as well as areas of opportunities.

About IBS

United States

10:00 am - 10:05 am
Ajit Manocha, SEMI
Ajit Manocha
CEO
SEMI

Welcome Remarks

10:05 am - 10:10 am
Pushkar Apte
Pushkar Apte
Strategic Technology Advisor, Smart Data-AI
SEMI

SEMI Smart Data-AI Initiative and Future of Computing Update

10:10 am - 11:00 am
Handel Jones
Dr. Handel Jones
CEO
IBS

Why AI Will Propel the Semiconductor Market to $1 Trillion and Achieve 1.0nm by 2030

11:00 am - 11:15 am

Q&A

Explore how Artificial Intelligence will impact the semiconductor market through the end of the decade with a deep-dive analysis of the fast-shifting industry landscape focusing in on growth across end markets and segments.

10:00 am - 11:15 am Off Add to Calendar 2024-11-20 10:00:00 2024-11-20 11:15:00 Analyzing AI-Driven Growth: $1T and Beyond Explore how Artificial Intelligence will impact the semiconductor market through the end of the decade with a deep-dive analysis of the fast-shifting industry landscape focusing in on growth across end markets and segments. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles On-demand
Event format
Belgium France Germany India Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam Register Now (8-9am PT) Register Now (5-6pm PT) [email protected] Business Executive Featured Speakers
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In today’s fast-paced and interconnected world, the electronics industry faces unprecedented challenges from global disruptions, geopolitical uncertainties, and supply chain vulnerabilities. To remain competitive and resilient, organizations must adopt robust risk management frameworks that proactively identify and mitigate risks.


This webinar is brought to you by the Resiliency Working Group, part of the SEMI Supply Chain Management Initiative. We will explore the creation and implementation of an industry-standard risk management framework tailored to the unique complexities of the electronics supply chain. Attendees will learn how to assess potential risks, develop mitigation strategies, and leverage cutting-edge tools to improve visibility and responsiveness across their supply networks.

Key topics include:


•     The critical risks impacting electronics supply chains and how to address them.
•     Best practices for building a resilient and adaptable risk management framework.
•     Strategies for real-time risk monitoring, supplier risk assessments, and scenario planning.
•     How to align your supply chain with industry standards for business continuity and operational stability.

Who should attend:


•    Supply chain managers
•    Risk officers
•    Operations executives
•    Anyone involved in supply chain planning and resilience in the electronics sector

Join us to discover actionable insights and practical approaches to future-proof your electronics supply chain, ensuring it remains resilient, efficient, and prepared for any disruption.
 

Speaker bio:

Austin Evans is the Director of Supply Chain Risk Management at Intel.  He is responsible for overseeing risk management for Intel’s supply chain as well as Intel’s Contingent Workforce Program Office.  His organization is responsible for business continuity, governance, resilience, supply chain security and compliance. 

United States

Austin Evans.jpg
Austin Evans
Director of Supply Chain Risk Management
Intel
Standards

Join us for a deep dive into the new industry-standard risk management framework tailored to the unique complexities of the electronics supply chain. Hosted by the SEMI Resiliency Working Group, this webinar will equip supply chain professionals with actionable insights on assessing critical risks, developing robust mitigation strategies, and leveraging advanced tools for real-time monitoring.

Off Add to Calendar 2024-10-24 00:00:00 2024-10-24 00:00:00 Building Resilient Supply Chains Join us for a deep dive into the new industry-standard risk management framework tailored to the unique complexities of the electronics supply chain. Hosted by the SEMI Resiliency Working Group, this webinar will equip supply chain professionals with actionable insights on assessing critical risks, developing robust mitigation strategies, and leveraging advanced tools for real-time monitoring. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
Event format
Belgium China France Germany India Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam EMG webinar HI Technical
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Heterogeneous Integration (HI) has come a long way in 50 years. The world of multi-chip modules (MCMs) has given way to a vast ecosystem of chiplets, 3D stacked die, and co-packaging of antenna, high-bandwidth memory (HBM), and optics. HI is at the center of “More than Moore” development activities, as innovative engineers look for creative ways to overcome the slower scaling of silicon technology. The promise of HI is new devices with superior power, performance, area, and cost (PPAC). All these promises come with new challenges. Managing different process nodes, physical characteristics, mechanical stresses, and other system-level challenges not found in monolithic system-on-chip (SoC) devices, creates a great opportunity for design and manufacturing companies to reshape our industry. 

 

In this webinar, we’ll explore this enabling technology from both the device maker and material supplier perspectives. We will learn about demands placed on devices by new applications and what new tools are needed to meet these demands. We will also hear about the challenges placed on materials and equipment suppliers to develop processes capable of manufacturing the individual components and integrating them into final products. Join us as our panel of experts address the issues and opportunities involved with heterogeneous integration. 
 

United States

Arsalam Alam
Arsalan Alam, PhD
Member of Technical Staff (MTS), 3D Stacking Technology Group
AMD Packaging

2nd Generation 3D V-Cache™ Enablement

Andrea Chacko
Andrea Chacko, PhD
Director of Packaging Solutions
Brewer Science
Dong Shun Bai
Dongshun Bai, PhD
Business Development Director and Senior Technologist of Packaging Solutions
Brewer Science

Enabling Heterogeneous Integration through Material Design

The realization of Heterogeneous Integration (HI) has been key in driving advancements in semiconductor technology. The complexities of integrating dissimilar materials continue to be a challenge for HI. All advanced packaging technologies rely on advanced materials to address the many challenges in achieving continued shrinking and improved performance of devices. Novel materials capable of managing mechanical stresses and increased thermal budgets with strict cleanliness requirements are required for processes such as wafer thinning, fan-out wafer-level packaging, and hybrid bonding. This presentation will highlight how advanced materials can address the growing challenges in the industry.

Andrea Maret
Andrea Maret
Senior Knowledge Manager
Entegris

Webinar Moderator

APHI CAST EHS NBMC Smart MFG SMG Sustainability EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT SOI

Dive into the dynamic world of semiconductor materials and discover the future landscape as the industry experts provide a glimpse into the future of the semiconductor ecosystem in the era of heterogenous integration.

10:00 am - 11:00 am Off Add to Calendar 2024-10-16 10:00:00 2024-10-16 11:00:00 Heterogeneous Integration finds its place Dive into the dynamic world of semiconductor materials and discover the future landscape as the industry experts provide a glimpse into the future of the semiconductor ecosystem in the era of heterogenous integration. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles REGISTER NOW
Event format

Chip Integration Technology Center (CITC) today announced the appointment of Toni Versluijs as the new chairman of its Supervisory Board. Versluijs will serve as the incoming chairman from September through December. Effective January 1, 2025, he will take over the responsibilities from chairman Roel Fonville who is retiring.

Versluijs has an extensive background of more than 25 years in the semiconductor industry, of which more than 15 years in general and executive management roles. Prior to this appointment, he worked for NXP, where he led the In-Vehicle Networking product line and was NXP Nijmegen site director and statutory director of NXP Netherlands. Most recently, he led the Business Group MOS at Nexperia, served as statutory director for Nexperia in the UK and was part of the company’s global executive leadership team.

He explains his choice for CITC: “I look forward to using my many years of experience in the semiconductor industry to contribute to the success of CITC in Nijmegen. Nijmegen is a location with a long heritage in semiconductor packages that have changed the world. CITC is a unique venture and has a unique position between private parties, the academic world and knowledge institutes.”

CITC is a smaller and different kind of organization than his previous employers, but Versluijs sees the potential: “CITC has attracted quite some talent in recent years, built partnerships and initiated new developments. In short: it has laid the foundation for growth, and it will flourish in the coming years. I am convinced that it has the potential to change the world of semiconductor packaging again.”

The current chairman of the CITC Supervisory Board, Roel Fonville, adds: “The Supervisory Board is very pleased to welcome Toni Versluijs to our midst. His personality and broad experience in the industry and in the Nijmegen region will help the Board to fulfill its role in securing the continued development of the organization.”

About CITC
Chip Integration Technology Center (CITC) is a non-profit, joint innovation center specializing in heterogeneous integration and advanced chip packaging technology. CITC has created an effective ecosystem in which companies, research and educational institutes work on bridging the gap between academics and industry. CITC's contribution to the ecosystem is to provide access to innovation, infrastructure, and education. CITC was founded in 2019 with strategic partners TNO and Delft University of Technology and is supported by local and regional governments.
www.citc.org

Singapore SLS SG Event Tile Img Business Executive

Delegate Fees: Complimentary when you register for the event*

*Subject to SEMI's discretion

Who Should Attend:

  • Industry Professionals from MNCs and SMEs
  • Agencies & Policy Makers
  • R&D and Academia

 

The approved presentation slides from the Semiconductor Leadership Summit (sls) 2024 can be found here!

Photo Gallery

Browse our 2024 Semiconductor Leadership Summit (SLS) Photo Gallery

Meeting Room 300 - 301, Suntec Singapore Convention & Exhibition Centre
1 Raffles Boulevard
Singapore 039593
Singapore

12:30 pm

Registration & Networking

With coffee & tea

1:30 pm
LindaTan_2023
Ms. Linda Tan

Welcome Speech

Ms. Linda Tan | President, SEMI Southeast Asia

1:40 pm

Announcement of Collaboration with Sustainable Energy Association of Singapore

Sustainable Energy Association of Singapore (SEAS)​ and SEMI Southeast Asia

1:50 pm
In the 25 years as a Semiconductor technologist, Ms. Bhat’s main thrust has been driving innovation and creativity.
Dr. Mousumi Bhat

Opening Speech

Dr. Mousumi Bhat | Vice President, Global Sustainability Programs, SEMI

2:10 pm
Ricardo Reina
Mr. Ricardo Reina

SEMI Energy Collaborative Position Paper for Singapore

Mr. Ricardo Reina | Associate Partner, McKinsey & Company

2:30 pm
Dan Steele
Mr. Dan Steele

GF Sustainability – Leadership Where it Counts

Mr. Dan Steele | Senior Director, Facilities, GlobalFoundries

2:50 pm

Networking Break

Coffee & tea break

3:10 pm
Mr. Gregory Thomassin
Mr. Gregory Thomassin

Challenges and Projects in APAC

Mr. Gregory Thomassin | Head of Business Development Renewables - APAC, TotalEnergies

3:30 pm
Suji Kang ACEC
Ms. Suji Kang

Driving Corporate Renewable Electricity Procurement in Asia

Ms. Suji Kang | Program Director, Asia Clean Energy Coalition

3:50 pm
Edoardo Auteri
Mr. Edoardo Auteri

Sustainable Semiconductor Design: Low carbon solutions

Mr. Edoardo Auteri | Head of Sustainability, APeC Region, STMicroelectronics

4:10 pm
Zhiquan
Dr. Yeo Zhiquan

Equipping for the Sustainability Journey through Awareness, Assessment and Action

Dr. Yeo Zhiquan | Acting R&D Division Director, Sustainability & Life Cycle Management Division, SIMTech & ARTC

4:30 pm

Panel Discussion: Navigating Barriers - Industry Challenges on the Adoption of Low Carbon Energy

Moderator : Dr. Mousumi Bhat (SEMI)​
Panelists: Mr. Tan Teong Wei (Infineon Technologies), Mr. Edoardo Auteri (STMicroelectronics), Mr. Gregory Thomassin (TotalEnergies)

5:15 pm - 5:30 pm

Photo-taking Session and Proceed to Members' Night

Program is subject to change

Sustainability

Sustainability Transition: Collaboration - Innovation - Transition

The summit will focus on the semiconductor industry's transition to renewable energy, bringing together leaders, policymakers, and experts to discuss its role in sustainable growth. Key topics include reducing carbon footprints, collaboration across the supply chain, and innovative solutions for achieving net-zero emissions. This initiative aims to strengthen the region's commitment to sustainability and position its semiconductor industry as a leader in green innovation and decarbonization.

1:30 pm - 5:30 pm Off Add to Calendar 2024-10-10 13:30:00 2024-10-10 17:30:00 SLS - SG Edition 2024 Sustainability Transition: Collaboration - Innovation - TransitionThe summit will focus on the semiconductor industry's transition to renewable energy, bringing together leaders, policymakers, and experts to discuss its role in sustainable growth. Key topics include reducing carbon footprints, collaboration across the supply chain, and innovative solutions for achieving net-zero emissions. This initiative aims to strengthen the region's commitment to sustainability and position its semiconductor industry as a leader in green innovation and decarbonization. Meeting Room 300 - 301, Suntec Singapore Convention & Exhibition Centre 1 Raffles Boulevard Singapore 039593 Singapore SEMI.org [email protected] Asia/Singapore public Asia/Singapore Register Now