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While silicon carbide (SiC) has long been known for its superior properties for power device manufacturing, economical high-volume production has been hard to achieve. Small substrates, high cost, and challenging manufacturing infrastructure have limited the reach of this enabling technology. With the advent of larger substrates, however, the outlook for SiC is ever brighter and, shall we say, more powerful?
From the building of these larger substrates to the development of equipment designed for SiC processing, the semiconductor industry has challenges ahead. In this webinar, we will explore these aspects of growing and maturing the SiC supply chain from the materials and equipment perspective.

United States

Rob circle
Robert Rhoades
President and CTO, X-trinsic;
Sr. Technology Analyst, TECHCET

Market Trends Perspective

David circle
David Kirsch
Vice President & General Manager, North America
EV Group

Implementation Perspective

EMG 10:00 am - 11:00 am Off Add to Calendar 2024-04-03 10:00:00 2024-04-03 11:00:00 Ready for Prime Time - the SiC Value Chain Prepares for Mass Adoption United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register Now
Event format

WILMINGTON, Del., Feb. 29, 2024 — DuPont (NYSE: DD) today announced that Jon Kemp, President, DuPont Electronics & Industrial, has been named Chair of the Board of Industry Leaders of SEMI, a global industry association serving the electronics design and manufacturing supply chain.

The Board of Industry Leaders provides strategic guidance and direction for key global SEMI initiatives and programs – including sustainability, workforce development, supply chain management, and global advocacy – to address semiconductor industry challenges and advance its growth. The Board comprises executive-level thought leaders representing the diversity of SEMI membership. As Chair, Kemp will lead the Board in its work, which also includes identifying emerging technology and business issues where SEMI can build impactful member value for the future.

“Jon is already a valued contributor to the SEMI International Board of Directors in its fiduciary role, and we are pleased to have him stepping up to chair our Board of Industry Leaders to make sure our members’ voices and needs are reflected across the diverse range of our programs and initiatives,” said SEMI President and CEO Ajit Manocha. “We look forward to working with Jon to address some of the global semiconductor industry’s toughest challenges, such as our talent gap, and empowering the industry’s continued growth and innovation.”

As President of DuPont’s Electronics & Industrial business, Kemp leads the organization in serving the semiconductor, circuit board, display, digital and flexographic printing, healthcare, aerospace, defense, industrial and transportation industries. Kemp has more than 20 years of experience in the electronics industry and strategic leadership, including his service on the SEMI International Board of Directors since 2016.

“I’m honored to be part of this group of industry leaders who are tackling some of the most critical issues facing the semiconductor industry that no single company or organization can solve alone, like sustainability, government advocacy, workforce development, and supply chain management,” said Kemp. “There’s tremendous value in collaborating across industries and I look forward to what we’ll achieve together across the semiconductor ecosystem.”

About SEMI
SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

About DuPont Electronics & Industrial
DuPont Electronics & Industrial is a global supplier of new technologies and performance materials serving the semiconductor, circuit board, display, digital and flexographic printing, healthcare, aerospace, industrial, and transportation industries. From advanced technology centers worldwide, teams of talented research scientists and application experts work closely with customers, providing solutions, products and technical service to enable next-generation technologies. http://electronics.dupont.com

About DuPont
DuPont (NYSE: DD) is a global innovation leader with technology-based materials and solutions that help transform industries and everyday life. Our employees apply diverse science and expertise to help customers advance their best ideas and deliver essential innovations in key markets including electronics, transportation, construction, water, healthcare and worker safety. More information about the company, its businesses and solutions can be found at www.dupont.com/. Investors can access information included on the Investor Relations section of the website at investors.dupont.com.

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SEMI University celebrates its first anniversary! Our pledge remains unwavering: providing comprehensive, technical education to equip you with the skills needed for a prosperous journey in the semiconductor sector.

Are you ready to take your semiconductor industry knowledge to the next level? We're thrilled to invite you to our upcoming webinar titled "SEMI University - Introduction and 2024 Roadmap." This webinar promises to be an informative session where you'll gain insights into the latest updates, exciting live trainings, new certifications, and courses offered by SEMI U in 2024.  

During this webinar, you can expect to:  

  • Discover the latest updates and enhancements to SEMI U's course catalog.  
  • Learn about the exciting live, in-person training courses scheduled for spring of 2024.  
  • Get insights into new certifications and courses designed to keep you ahead in the industry.  
  • Gain access to a special 10% discount on ALL courses.  

Choose your session:

United States

Naresh Naik
Naresh Naik
Director, SEMI University
SEMI
Workforce Development

Join us to discover our current course offerings, upcoming additions, new certifications, and more! Engage in a Q&A session. Plus, by attending this free webinar, you'll receive a 10% discount code for all our courses.

Off Add to Calendar 2024-03-19 00:00:00 2024-03-19 00:00:00 SEMI University - Introduction and 2024 Roadmap Join us to discover our current course offerings, upcoming additions, new certifications, and more! Engage in a Q&A session. Plus, by attending this free webinar, you'll receive a 10% discount code for all our courses. United States SEMI.org [email protected] America/Los_Angeles public
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WILMINGTON, Del., Jan. 22, 2024 — DuPont (NYSE: DD) today announced that Drew Chambers has been named global business director, Lithography Technologies business in DuPont Electronics & Industrial, effective Jan. 1. Chambers succeeds George Barclay, Ph.D., who has elected to retire after more than 25 years of service.

“George Barclay’s significant contributions to our lithography business and portfolio have been tremendous and we are grateful for the lasting legacy he leaves with our organization,” said Sang Ho Kang, VP & General Manager, Semiconductor Technologies, DuPont Electronics & Industrial. “A true technical expert, George is a prolific innovator and visionary leader.”

“Drew Chambers has demonstrated outstanding leadership across multiple technology segments in electronics and is a strong proponent of delivering results to meet the needs of our customers,” said Kang. “In his new role as the leader of our lithography materials portfolio, Drew will play a pivotal role in furthering our offerings for extreme ultraviolet lithography and other advanced patterning solutions.”

Chambers brings a diversity of experiences both at DuPont and elsewhere in the electronics industry. He joined DuPont in 2019 as global marketing director for chemical mechanical planarization (CMP) pads in CMP Technologies and most recently served as acting business director. Prior to DuPont, he led the Electronics & Surface Technologies segment for Ferro Corporation, led regional sales and marketing for ESL ElectroScience (now part of Ferro Corporation), and worked in new business development for Lutron Electronics. Earlier in his career, Chambers held several roles in engineering, product management and account management in the semiconductor materials segment with Rohm and Haas Electronic Materials (now part of DuPont). Chambers holds an MBA from Duke University’s Fuqua School of Business and a BS in chemical engineering from Lafayette College.

DuPont Lithography Technologies is a global leader in materials for microlithography, with offerings enabling advanced patterning at the most advanced technology nodes; and bringing quality, yield and defectivity improvements to existing lithography processes. DuPont’s portfolio includes ArF photoresists, KrF photoresists, i/g line photoresists, extreme ultraviolet (EUV) photoresists, advanced overcoats, EUV underlayers and anti-reflective coating materials. Lithography Technologies is part of Semiconductor Technologies in DuPont Electronics & Industrial.

About DuPont Electronics & Industrial
DuPont Electronics & Industrial is a global supplier of new technologies and performance materials serving the semiconductor, circuit board, display, digital and flexographic printing, healthcare, aerospace, industrial, and transportation industries. From advanced technology centers worldwide, teams of talented research scientists and application experts work closely with customers, providing solutions, products and technical service to enable next-generation technologies. http://electronics.dupont.com

About DuPont
DuPont (NYSE: DD) is a global innovation leader with technology-based materials and solutions that help transform industries and everyday life. Our employees apply diverse science and expertise to help customers advance their best ideas and deliver essential innovations in key markets including electronics, transportation, construction, water, healthcare and worker safety. More information about the company, its businesses and solutions can be found at www.dupont.com. Investors can access information included on the Investor Relations section of the website at investors.dupont.com.

Lansdale, PA – Greene Tweed, a leading global manufacturer of high-performance sealing solutions and engineered components, announces the introduction of Fusion® F07, a performance-enhanced fluoroelastomer. Developed by Greene Tweed material scientists and application engineers, Fusion® F07 is specifically crafted to withstand common Etch and CVD oxygen/fluorine based gases in semiconductor processing subfab lines, at temperatures up to 355°F (180°C).

With an expected lifetime of at least 6 months, Fusion® F07 lasts longer than standard FKM in subfab vacuum system lines. As a result, the new performance enhanced FKM extends the time between planned maintenance activities. Notably, it provides a better total cost of ownership where applications do not require an FFKM compound.

“At Greene Tweed, we enable customers to operate efficiently and safely in the world’s most demanding environments. We understand that the semiconductor industry needs reliability and longevity. Fusion® F07 is a result of meticulous research and development, aimed at not only extending the life of their system but also improve operational efficiency,” says Magen Buterbaugh, President and CEO, Greene Tweed.

Fusion® F07 can be purchased as a seal assembly or as an individual O-Ring. Customers can effortlessly upgrade to Fusion® F07 and experience the benefits of extended lifetime and the resultant reduced operating costs as the seals are form-fit replaceable with other industry standard (KF/ISO flange fittings) seals. A blue outer ring allows for easier identification upon installation and replacement. Fusion® F07 seals are available in most typical sizes, including KF16, KF25, KF40, KF50, ISO63, ISO80, ISO100, ISO160, and ISO200.

About Greene Tweed
As a leading global provider of sealing solutions to the semiconductor industry for over four decades, Greene Tweed engineers advanced elastomer seals and thermoplastic components that are found in a broad range of mission-critical equipment in key process areas of the world’s semiconductor fabs, including etch, deposition, aqueous, and electro-chemical (electroplating). The company is now investing in Korea with its upcoming state-of-the-art manufacturing facility expected to commence production this year. “Greene Tweed has a history of investing to meet the demands of our global customers and the Korea expansion offers the organization an opportunity to support the continued growth of the semiconductor industry in the region. The multi-million-dollar investment represents a significant increase in the company’s global manufacturing capacity while enabling supply chain resiliency,” said Magen Buterbaugh.

Reaffirms Full Year 2023 Revenue Expectations Above $1.1 billion

BEVERLY, Mass., Jan. 16, 2024 -- Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, today increased financial guidance for the fourth quarter of 2023 and reaffirmed its expectations for the full year. Based on preliminary fourth quarter financial results, the Company expects revenue for the fourth quarter of 2023 to be greater than $300 million, above the approximately $295 million prior guidance, and reaffirmed its expectation for full year 2023 revenue above $1.1 billion. Earnings per diluted share for the fourth quarter of 2023 are now forecasted to be greater than $2.05, above prior guidance of approximately $2.00.

President and CEO Russell Low commented, “Our excellent financial performance in the fourth quarter and for the full year 2023 resulted from strong execution by Axcelis employees, combined with our leadership position in the growing power device market.” Low continued, “Based on our strong yearend backlog and fourth quarter bookings, especially in power devices, we expect the power device market to remain healthy in 2024. We also believe that the mature process technology and memory segments, two markets in which Axcelis is well-positioned, will recover in the second half of the year, enabling strong growth in 2025.”

James Coogan, executive vice president and chief financial officer said, “We look forward to discussing our results for 2023 and expectations for 2024 on our upcoming fourth quarter and full year earnings call. We believe we are still on track to achieve our $1.3 billion revenue model in 2025. This expectation is based on continued demand for the Purion product family, continued bookings strength, and a backlog stretching into 2025.” Coogan continued, “Additionally, we continue to manage spending to improve our earnings power and to invest in R&D to strengthen our market position.”

Fourth Quarter and Full Year 2023 Conference Call
The Company will release financial results for the fourth quarter and full year 2023 on Wednesday, February 7, 2024, at 4:00 p.m. Eastern Time (ET). The Company will host a call to discuss the results for the fourth quarter and full year 2023 on Thursday, February 8, 2024, at 8:30 a.m. ET. The call will be available to interested listeners via an audio webcast that can be accessed through the Investors page of Axcelis' website at www.axcelis.com, or by registering as a Participant here https://edge.media-server.com/mmc/p/su3u4oev. Webcast replays will be available for 30 days following the call.

Safe Harbor Statement
This press release contains forward-looking statements under the SEC safe harbor provisions. These statements, which include our guidance for future financial performance, are based on management’s current expectations and should be viewed with caution. They are subject to various risks and uncertainties, many of which are outside the control of the Company, including the timing of orders and shipments, the conversion of orders to revenue in any particular quarter, or at all, the continuing demand for semiconductor equipment, relative market growth, continuity of business relationships with and purchases by major customers, competitive pressure on sales and pricing, increases in material and other production costs that cannot be recouped in product pricing and global economic, political and financial conditions. These risks and other risk factors relating to Axcelis are described more fully in the most recent Form 10-K filed by Axcelis and in other documents filed from time to time with the Securities and Exchange Commission.

About Axcelis
Axcelis (Nasdaq: ACLS), headquartered in Beverly, Mass., has been providing innovative, high-productivity solutions for the semiconductor industry for over 40 years. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation systems, one of the most critical and enabling steps in the IC manufacturing process. Learn more about Axcelis at www.axcelis.com.

Kitchener, ON, January 11, 2024 – PEER Group®, the largest supplier of innovative factory automation software products for the semiconductor industry, is highlighting its lineup of SEMI Standards compliance test products at booth A434 during SEMICON Korea 2024.
“We are excited to return SEMICON Korea and look forward to connecting with our partners and customers at the show,” says Bob Kane, PEER Group’s Director of Factory Sales, Asia. “SEMI Standards compliance testing is critical for passing the factory acceptance test. OEMs that validate their tools using PEER Group’s test applications before shipping increase their chances of a successful factory integration and securing repeat business from factories.”
PEER Group’s test products include SECSIM Pro®+, which has been trusted by equipment manufacturers for more than 20 years to test and validate SECS/GEM communications. Also highlighted during the show are PFAT™, a workflow-based scenario test designer used by factories and OEMs to ensure equipment meets factory requirements, and CCS Envoy™, a factory automation standards compliance tester.
Visitors to booth A434 will have the opportunity to meet with representatives from PEER Group’s global sales team, as well as members from Toward Future, PEER Group’s exclusive sales partner serving South Korea. SEMICON Korea, which is happening January 31 - February 2, is the country’s leading semiconductor industry event.
To learn more, and to schedule a meeting during SEMICON Korea, visit PEER Group’s event page.

About PEER Group
PEER Group® is the largest supplier of innovative factory automation software products for the semiconductor industry. Since 1992, our solutions have helped the world’s most advanced OEMs and factories reduce time to market and lower costs by solving their equipment automation, data management, and process control problems. An award-winning company, PEER Group’s commitment to quality has been recognized by Intel’s EPIC Supplier Program, naming PEER Group a Distinguished Supplier in 2023 and an Outstanding Supplier in 2022. Follow PEER Group on LinkedIn.

Malaysia Singapore Vietnam Members' Networking Night Mar 2024 Business Executive

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SEMI Southeast Asia's Members' Night | Penang, Malaysia

Join SEMI Southeast Asia for a night of networking and celebration at our Members' Night. Get a chance to connect with other industry leaders, exchange valuable insight on the sector, and unlock a myriad of business opportunities with our Members' Networking Night. 


BROWSE OUR PHOTO GALLERY

https://prod8.semi.org/en/event/membersnight-mar2024/photo-gallery

Over & Above
3, Pengkalan Weld, George Town
10300 Penang
Pulau Pinang
Malaysia

6:00 pm

Registration

6:30 pm
LindaTan_200px_round
Ms. Linda Tan

Welcome Speech

Ms. Linda Tan | President, SEMI Southeast Asia

6:45 pm

Semiconductor Market Trend and OSAT Outlook

Inviting

6:55 pm

Presentation of Certificate

For New SEMI Southeast Asia Members

7:00 pm

Dinner

Standing Buffet

8:00 pm

Lucky Draw

9:00 pm

Grand Draw

9:30 pm

End of Networking Night and Collection of Welcome Gift

Note: Program is subject to changes.

Connect, collaborate, and celebrate the new year with SEMI Southeast Asia Members' Networking Night over at Penang, Malaysia! This networking night is designed to elevate your professional connections.

 

Non-member fee: SGD 800 (limited tickets available)

Members: Free (restricted to 2 pax per member company)

 

Contact us for enquiries!

For the Event: 

Mr. Glenn Tan | [email protected] | +65.8228.0662

For Registration: 

Ms. Gillian Lim | [email protected] | +65.9048.1123

6:00 pm - 9:30 pm Off Add to Calendar 2024-03-07 18:00:00 2024-03-07 21:30:00 Penang Business Summit Members' Night Connect, collaborate, and celebrate the new year with SEMI Southeast Asia Members' Networking Night over at Penang, Malaysia! This networking night is designed to elevate your professional connections. Non-member fee: SGD 800 (limited tickets available)Members: Free (restricted to 2 pax per member company) Contact us for enquiries!For the Event: Mr. Glenn Tan | [email protected] | +65.8228.0662For Registration: Ms. Gillian Lim | [email protected] | +65.9048.1123 Over & Above 3, Pengkalan Weld, George Town 10300 Penang Pulau Pinang Malaysia SEMI.org [email protected] Asia/Kuala_Lumpur public Asia/Kuala_Lumpur Register Today
Malaysia Singapore Vietnam Seminar 2: Revolutionizing Manufacturing Business Executive

Supporting Partners

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Who should attend

This seminar is designed to offer a platform where executives, managers, and engineers who specialize in process development, equipment maintenance,  factory automation, and manufacturing can come together to discuss ways to improve production output,  increase yield and work efficiency through implementing some of AI solutions presented in this seminar.

 


BROWSE OUR PHOTO GALLERY

PBS Seminar 2 2024 Photo Gallery Web banner

Royale Chulan Penang
No 1 & 2, Pengkalan Weld, Georgetown
10300 Penang
Pulau Pinang
Malaysia

1:00 pm

Registration & Lunch

2:00 pm
LindaTan_2023
Ms. Linda Tan

Welcome Speech

Ms. Linda Tan | President, SEMI Southeast Asia

semi-logo
2:05 pm
KCAng_2022
Mr. KC Ang

Opening Speech: Unleashing the Power of AI in Wafer Fab Manufacturing

Mr. KC Ang | Chairman, SEMI Southeast Asia Regional Advisory Board | Chief Manufacturing Officer, GlobalFoundries

Global Foundries
2:20 pm
Mr Amarjit Singh Sandhu
Mr. Amarjit Sandhu

Keynote Speech: Memory at the heart of future technologies

Mr. Amarjit Sandhu | Corporate Vice President, Assembly and Test NAND Operations, Micron Technology

MICRON
2:55 pm
Mr. Jan Thomas Nicholas
Mr. Jan Thomas Nicholas

The Impact of Gen AI on the Semiconductor Value Chain

Mr. Jan Thomas Nicholas | Executive Director, Tech Sector Leader, Southeast Asia, Semiconductor Consulting Leader, Southeast Asia, Deloitte Consulting (SEA) Sdn. Bhd.

Deloitte
3:20 pm
George Ng
Mr. George Ng

Reimagining factory of the future for growth and resilience

Mr. George Ng | Vice President and Head of Backend Ops Industry 4.0, Infineon Technologies

infineon
3:45 pm

Break

4:00 pm
Mr. Gary Leong
Mr. Gary Leong

From Cliffs to Cloud: The adventurous climb of digitalization and AI in manufacturing

Mr. Gary Leong | Business Development Senior Director, ViTrox Technologies, Malaysia

Vitrox
4:25 pm
Joseph Ervin
Dr. Joseph Ervin

A Single Digital Twin for Semiconductor Manufacturing? Semiverse™ Solutions and Building the Digital Family

Dr. Joseph Ervin | Senior Director of Semiverse™ Solutions, Lam Research

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4:50 pm

Break

4:55 pm

Panel Discussion

Moderator: Mr. Jan Thomas Nicholas

Panelists:
Mr. Amarjit Singh Sandhu, Mr. Gary Leong, Mr. George Ng, and Dr. Joseph Ervin

5:35 pm

Q&A Session

5:45 pm

Appreciation and Closing Remarks

6:00 pm

End of Seminar

Note: Program is subject to changes.

Seminar 2 and Seminar 1 timing will overlap on 7 Mar.

Smart MFG

The role of AI in Future Factories

The landscape of Semiconductor manufacturing is undergoing a profound transformation, with Artificial Intelligence (AI) emerging as a driving force behind the evolution of future factories.

This theme invites participants to delve into the intricate interplay between advanced AI technologies and the manufacturing sector, showcasing the pivotal role AI plays in reshaping the entire manufacturing ecosystem.

This conference aims to provide a comprehensive platform for industry leaders, researchers, and innovators to exchange ideas, share success stories, and envision the future trajectory of manufacturing under the influence of AI.

*Note: Seminar 2 and Seminar 1 timing will overlap on 7 Mar 

 

Participating Fee:

Usual Member Rate: SGD 152
Usual Non-member Rate: SGD 227

*The above rates are inclusive of coffee/tea breaks and luncheon

30% Early Bird Rate extended until 1 March 2024!

 

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*Malaysian Companies - HRDC Claimable for Penang Business Summit Seminar 2: Revolutionizing Manufacturing (The role of AI in Future Factories) (subject to T&C, please contact HRDC for more information).
For HRDC claims, please refer to the following links on the claiming matrix and guidelines:

 

Contact us for enquiries!

For Program: 

Mr. Glenn Tan | [email protected] | +65.8228.0662

For Registration / HRDC Claims: 

Ms. Gillian Lim | [email protected] | +65.9048.1123

 

Presentation slides can be found HERE!

1:00 pm - 6:00 pm Off Add to Calendar 2024-03-07 13:00:00 2024-03-07 18:00:00 Penang Business Summit Seminar 2: Revolutionizing Manufacturing The role of AI in Future FactoriesThe landscape of Semiconductor manufacturing is undergoing a profound transformation, with Artificial Intelligence (AI) emerging as a driving force behind the evolution of future factories.This theme invites participants to delve into the intricate interplay between advanced AI technologies and the manufacturing sector, showcasing the pivotal role AI plays in reshaping the entire manufacturing ecosystem.This conference aims to provide a comprehensive platform for industry leaders, researchers, and innovators to exchange ideas, share success stories, and envision the future trajectory of manufacturing under the influence of AI.*Note: Seminar 2 and Seminar 1 timing will overlap on 7 Mar  Participating Fee:Usual Member Rate: SGD 152Usual Non-member Rate: SGD 227*The above rates are inclusive of coffee/tea breaks and luncheon30% Early Bird Rate extended until 1 March 2024!  *Malaysian Companies - HRDC Claimable for Penang Business Summit Seminar 2: Revolutionizing Manufacturing (The role of AI in Future Factories) (subject to T&C, please contact HRDC for more information).For HRDC claims, please refer to the following links on the claiming matrix and guidelines:HRDC Approval Letter for Penang Business SummitAllowable Cost MatrixHRDC SBL Grant HelperHRDC SBL Claim Helper Contact us for enquiries!For Program: Mr. Glenn Tan | [email protected] | +65.8228.0662For Registration / HRDC Claims: Ms. Gillian Lim | [email protected] | +65.9048.1123 Presentation slides can be found HERE! Royale Chulan Penang No 1 & 2, Pengkalan Weld, Georgetown 10300 Penang Pulau Pinang Malaysia SEMI.org [email protected] Asia/Kuala_Lumpur public Asia/Kuala_Lumpur Register Today
Malaysia Singapore APS Workshop Mar 2024 Executive Technical

Supporting Partners

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Featured Speakers
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This course will cover:

  • Evolution of IC Packaging – Fan-in, Fan-out WLP, Embedded Packaging technology, System on Chip (SOC), System in Package (SiP), 3D IC, WLP, TSV etc.
  • Principles of Interconnects ranging from TAB, Wirebond to various Flip Chip bonding such as thermocompression bonding with NCP, C4, ACF for manufacturing and R&D development
  • Board level assembly and its soldering materials and failure mechanisms for 2nd level interconnect
  • Overview of interposer of lead frame, ceramic, flex to BT substrates for Microelectronics Packaging
  • Assembly flow and new assembly techniques such as stealth dicing, compression molding, underfill molding etc., and its assembly materials for Microelectronics packaging
  • Material characterization from bulk to interfaces for Microelectronics packaging

Why should I attend?

  • Gain technical knowledge for industry professionals
  • Enhance knowledge in manufacturing and R&D know-how in IC packaging
  • Apply Key Technical Concepts in Problem Solving through Real Case Studies
  • Networking opportunities with industry peers

Who should attend?

  • Beneficial for directors, managers, process & equipment engineers, R&D engineers and Quality & Reliability engineers working in the areas of microelectronics packaging
  • Useful for sale or application engineers who supply packaging materials and tools to the industry

BROWSE OUR PHOTO GALLERY

Penang Business Summit Seminar 1: Advanced Packaging

Royale Chulan Penang
No 1 & 2, Pengkalan Weld, Georgetown
10300 Penang
Pulau Pinang
Malaysia

Image of Dr Lee Teck Kheng
MEET OUR SPEAKER
Dr. Lee Teck Kheng
Director, Technology Development Centre, Institute of Technical Education Singapore,
SEMI SEA Advance Packaging Technical Committee Member
9:00 am

Introduction to IC Packaging & Interconnects

Introduction to IC Packaging
• Functions of Packaging – Mechanical, Material, Electrical and Chemical
• Review of Packaging Trend – BGA, CSP, Fan-in & Fan-out WLP, 3D Packaging, SoC vs SiP etc
• Challenges in Assembly and Packaging

Interconnects
• Overview
• TAB Bonding
• Wirebonding – Ultrasonic, Thermocompression, Thermosonic mechanisms
• Flip Chip Bondings – Thermocompression, C4, Re-cap reflow, solid-state, ACF, Conductive paste bonding

12:00 pm

Lunch

1:00 pm

Board Assembly and Soldering & PCB and IC Carriers

Board Assembly and Soldering
• Through Hole & SMT – Stencil Print Process, Reflow Profile
• Solder Materials – Alloy, Flux, Solvents, self-alignment effect
• Pb Free Solder – Ternary phase diagram, SnAgCu
• Intermetallics and Growth – Diffusion mechanism, Arrhenius equation
• Testing and Reliability – Ball shear & pull failure strength and modes, Fatigue, Weibull distribution

PCB and IC Carriers
• PCB Technology – Material properties, PCB fabrication process, drilling, patterning, plating, solder resist, laminating
• IC Carriers – Design rule, Leadframe, LTCC, Flex and BT substrates
• Substrate Development

4:00 pm

Q&A | Case Studies

5:00 pm

End of Day 1

9:00 am

Assembly Process

• Thickness Reduction – Grinding, Lapping, Polishing, CMP
• Dicing/Singulation – Blade, Laser, Stealth dicing, Dicing after grind
• Die Attach – Eutectic bonding, DA materials, Collets
• Plasma – Argon, Oxygen plasma, Surface tension
• Encapsulation – Mold constitutes and properties, Transfer, Film and compression molding, Dam and fill
• Plating – Solder plating, NiPd finish, PPF
• Trim & Form – ESD, Lead formation, Spring back mechanism

12:00 pm

Lunch

1:00 pm

Material Characterization Techniques

• Introduction
• Bulk Material Characterization – Stress strain, Bending, Impact toughness, TGA, DSC, TMA, DMA
• Interfaces Characterization – Failure mode and strength, Wire pull, Ball pull, Double cantilever bending, Die shear, Mold button shear, Ball shear

2:30 pm

Q&A | Case Studies

3:30 pm

Lucky Draw

3:35 pm

End of Workshop

Note: Program is subject to changes.

Seminar 1 and Seminar 2 timing will overlap on 7 Mar .

- APHI Workforce Development

Advanced Packaging and Material Characterization

*Note: Seminar 1 and Seminar 2 timing will overlap on 7 Mar

 

Participating Fee:

Usual Member Rate: SGD 750 
Usual Non-member Rate: SGD 935 

*The above rates are inclusive of coffee/tea breaks and luncheon for both days

Register before 23 February 2024 to enjoy Early Bird rate of 15% off the above rates.

 

A certificate of completion will be awarded at the end of the seminar.

 

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*Malaysian Companies - HRDC Claimable for Penang Business Summit Seminar 1: Advanced Packaging (Advanced Packaging and Material Characterization) (subject to T&C, please contact HRDC for more information).
For HRDC claims, please refer to the following links on the claiming matrix and guidelines:

 

Contact us for enquiries!

For Program: 

Ms. Cecelia Fong | [email protected] | +65.9750.2382 

For Registration / HRDC Claims: 

Ms. Gillian Lim | [email protected] | +65.9048.1123

 

Off Add to Calendar 2024-03-06 00:00:00 2024-03-07 00:00:00 Penang Business Summit Seminar 1: Advanced Packaging Advanced Packaging and Material Characterization*Note: Seminar 1 and Seminar 2 timing will overlap on 7 Mar Participating Fee:Usual Member Rate: SGD 750 Usual Non-member Rate: SGD 935 *The above rates are inclusive of coffee/tea breaks and luncheon for both daysRegister before 23 February 2024 to enjoy Early Bird rate of 15% off the above rates. A certificate of completion will be awarded at the end of the seminar.  *Malaysian Companies - HRDC Claimable for Penang Business Summit Seminar 1: Advanced Packaging (Advanced Packaging and Material Characterization) (subject to T&C, please contact HRDC for more information).For HRDC claims, please refer to the following links on the claiming matrix and guidelines:HRDC Approval Letter for Penang Business SummitAllowable Cost MatrixHRDC SBL Grant HelperHRDC SBL Claim Helper Contact us for enquiries!For Program: Ms. Cecelia Fong | [email protected] | +65.9750.2382 For Registration / HRDC Claims: Ms. Gillian Lim | [email protected] | +65.9048.1123  Royale Chulan Penang No 1 & 2, Pengkalan Weld, Georgetown 10300 Penang Pulau Pinang Malaysia SEMI.org [email protected] Asia/Kuala_Lumpur public Asia/Kuala_Lumpur SOLD OUT