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FREMONT, Calif. - YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that it has set up Engineering Centers of Excellence at two locations in India: Coimbatore and Bangalore. A sales office will also be located in the Bangalore area.

“It is no secret that high-caliber engineering expertise is in high demand in Silicon Valley,” said Ramakanth Alapati, Chairman and CEO of YES. “Our company’s rapid growth has inspired us to widen our technical recruitment efforts to include global engineering talent powerhouses like India. In addition, we feel there is a strong market for reliable, cost-effective YES systems within India’s domestic semiconductor industry.”

Leading YES’s efforts in India will be Dr. Ankineedu Velaga, a high-tech engineering executive with more than 35 years of experience spanning engineering and fab operations, customer interaction and retention, and business development support in the US and Asia.

“Ankineedu’s experience in driving teams to improve processes will be a great resource for YES as we scale to meet the challenges of worldwide growth. We will be looking to him to draw upon his impressive track record of building organizations to develop complex semiconductor capital equipment as well as leading organizations to achieve better process development, yields, process control, cycle time, cost, and product quality,” said Rezwan Lateef, President of YES.

Dr. Velaga has held leadership roles with BRIDG, imec, SilTerra, Applied Materials, Avago, and Lucent (among others), and his global management experience extends from the US and the European Union to Malaysia and Singapore. His educational background includes a Ph.D. in Chemical Engineering from the University of Arkansas, an M.S. in Chemical Engineering from the Indian Institute of Technology in Madras, and a B.S in Chemical Engineering from the Regional Engineering College in Warangal, India.

“I am pleased and honored to be embarking on this exciting endeavor with YES,” commented Velaga. “We expect to build our India team quickly, and I look forward to talking with high-potential candidates. To see our current job postings for YES India, please visit Careers at yieldengineering.com and scroll down to the ‘YES India’ heading. If you don’t see a job there at the moment that aligns with your skills and interests, but you are a qualified candidate with a technical background and semiconductor experience, I encourage you to submit your resumé to [email protected] and include ‘YES India’ in the subject line.”

About YES
YES (Yield Engineering Systems, Inc.) is a preferred provider of high-tech, cost-effective equipment for transforming surfaces, materials, and interfaces. The company’s product lines include thermal processing systems, chemical vapor deposition (CVD) systems, plasma etching tools, and wet process equipment used for the precise surface modification of semiconductor substrates, semiconductor and MEMS devices, and biodevices. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit www.yieldengineering.com.

Heidelberg/Würzburg – "1 - 10 - 100 - 1000" – Achievable component heights of over 1 cm, surfaces with roughness in the order of 10 nm, structure sizes of less than 100 nm, and writing speeds over 1000 mm/s: At the SPIE Photonics West in San Francisco, from January 25th to 27th, Heidelberg Instruments will be presenting, for the first time, the new two-photon polymerization MPO 100, a multi-user tool that combines both the requirements of 3D lithography with resolutions in the 100 nm range and 3D microprinting with structure heights of over one centimeter, all in one device.

"The MPO 100 is a unique tool for microfabrication and achieves the highest resolution among additive manufacturing processes at 100 nanometers. Furthermore, the 1-10-100-1000 capability of the MPO 100 will enable users at universities, R&D institutions, as well as the industry and offer significant advantages for new developments in areas such as micro-optics, microfluidics, and biomedicine," says Dr. Benedikt Stender of Multiphoton Optics GmbH, the subsidiary of Heidelberg Instruments where the development of the MPO 100 was carried out.

The MPO 100 works with a laser wavelength in the green spectral range, which is ideally suited for the 3D structuring of typical photoresists. Furthermore, MPO 100 is optimized to use the hybrid polymers (ORMOCER®s), particularly important for various applications. In addition to sophisticated algorithms to maximize structure quality, the synchronized scanning system offers the possibility of stitching-free patterning. In addition, the MPO 100 is currently the only tool in the market equipped with a flowbox that guarantees temperature stability of up to 0.1°C and thus provides the necessary stability for large-scale exposures. Application-specific writing modes enable customer-specific printing requirements and distinguish the MPO 100 as a multi-user tool.

"With the MPO 100, we have combined the strengths of both companies in one system: Multiphoton Optics' sophisticated exposure unit for two-photon polymerization and Heidelberg Instruments' industrial platform, which guarantees the required stability and meets the necessary industry standards. The capabilities of the MPO 100 are already very popular with our customers, who benefit from the worldwide support from our service organization and ISO-certified production," says Steffen Diez, COO of Heidelberg Instruments.

Contact for further questions:
Veronika Loose, Marketing and Communications
[email protected]
+49 931 90879288

More information:
https://heidelberg-instruments.com/
https://multiphoton.de

About Heidelberg Instruments Mikrotechnik GmbH
With over 35 years of experience and more than 1,000 installed systems, Heidelberg Instruments is one of the leading international players in the development and production of high-precision photolithography systems and nanofabrication tools. Heidelberg Instruments systems are installed in industrial and scientific facilities around the world. They are used for efficient direct writing, as well as for photomask fabrication for a wide range of industries - including semiconductors, quantum computing, photonics, 2D materials, IoT, and many related application fields.

About Multiphoton Optics
Multiphoton Optics GmbH, a wholly owned subsidiary of Heidelberg Instruments Mikrotechnik GmbH, is a global solution provider for 3D lithography via two-photon polymerization (TPP). This disruptive technology enables the production of complex functional structures in micro-optics and microsystems technology, optical interconnect technology, micromechanics, and biomedical technology. The modular 3D printing platform enables the high-precision fabrication of structures in the submicrometer to millimeter range with very high throughput.

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Moore’s Law continues to evolve - dramatically changing the Field Effect Transistor (FET).  As FinFETs reach their performance limits, attention is turning to Gate All Around (GAA) architectures based on Horizontal Nanosheet technology. Such a fundamental shift in transistor architecture will create new challenges to processes and materials, presenting opportunities for companies well-positioned for this shift.

In this webinar, SEMI EMG brings experts to explain the technology trends driving the industry adoption of Gate All Around, how the major players are approaching this transition, and the implications this will have on the material supply chain

10:00 am - 11:00 am Off Add to Calendar Disabled America/Los_Angeles
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SEMI Japan Office
九段南4-7-15
千代田区
Tokyo
1020074
Japan

Standards

FPD Materials & Components and FPD Metrology 
Japan Joint TC Chapter Meeting

Date: Friday, June ,10 2022

Time: 14:30-17:00[JST]

via OVTCCM, SEMI Japan Office (Hybrid)

 

AGENDA

Standards Contact Information:

Keigo Nakajima

Coordinator, SEMI Japan

Email: [email protected] 

Phone: 81.3.3222.5863

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

2:30 pm - 5:00 pm Off Add to Calendar 2022-06-10 14:30:00 2022-06-10 17:00:00 FPD M&C and FPD Metrology Japan Joint TC Chapter FPD Materials & Components and FPD Metrology  Japan Joint TC Chapter Meeting Date: Friday, June ,10 2022 Time: 14:30-17:00[JST] via OVTCCM, SEMI Japan Office (Hybrid)   AGENDA Standards Contact Information: Keigo Nakajima Coordinator, SEMI Japan Email: [email protected]  Phone: 81.3.3222.5863   NOTE: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! Questions? Contact your local staff coordinator: Click here SEMI Japan Office 九段南4-7-15 千代田区 Tokyo 1020074 Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo

ESPOO, Finland, 3rd of February 2022 – Picosun Group and Shincron Co., Ltd. have joined forces for development and commercialization of Atomic Layer Deposition (ALD) for optical coatings. ALD technology provides uniform and conformal coatings to the even most challenging structures and is therefore well suited for high-end optical applications.

The R&D teams from both companies have worked together to tailor existing ALD processes optimizing them for the use in optical applications. In addition to standard ALD optical films, ALD magnesium fluoride (MgF2) has been researched and is now available for commercial use for the first time. So far, ALD MgF2 processes have been only presented in academic research by universities and science institutes. MgF2 is a desired material in optical applications due to its low refractive index at visible light and high transmittance in FUV optical region. It can be used as a single layer or as part of an optical stack combining low and high refractive index materials. It has also other features, such as barrier properties and high chemical stability, which bring big advantages in some applications.

The collaboration agreement was first signed in 2019 including the appointment of Shincron as Picosun’s sales representative and ALD product distributor in Japan. The collaboration was extended with Joint Development Agreement (JDA) in 2020 with the aim to develop novel and advanced ALD coatings for optical applications.

“We are very excited about the collaboration. The teamwork has been fruitful, and the results obtained now are excellent. We see optical coatings as one of the emerging ALD applications and believe in strong growth in this market”, says Jussi Rautee, CEO of Picosun.

“We are happy to add ALD technology to our offering. This way we can increase our services for our customers. We have set up a demo capability for ALD optical coatings and Japanese optical companies have shown high interest for this process”, says Masaya Narita, CEO of Shincron.

Read more: picosun.com/optics/magnesiumfluoride

More information:
Jussi Rautee
CEO, Picosun Group
Tel: +358 50 345 4457
Email: [email protected]
www.picosun.com

Masaya Narita
CEO, Shincron Co., Ltd.
Tel: +81 45 650 2411
Email: [email protected]
www.shincron.co.jp/en/

About Picosun
Picosun provides the most advanced ALD (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

About Shincron
Shincron is a leading global supplier of innovative vacuum thin film deposition equipment. Visit www.shincron.co.jp/en/ for more information.

Japan Standards

SEMI Japan Office
千代田区
九段南4-7-15
Tokyo
1020074
Japan

Standards

Silicon Wafer  Japan TC Chapter Meeting 

Date: Wednesday, May 25, 2022

Time: 10:00-12:00[JST]

via Virtual Conference

 

AGENDA

 

Standards Contact Information:

Mami Nakajo

Coordinator, SEMI Japan

Email: [email protected] 

Phone: 81.3.3222.5949

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

10:00 am - 12:00 pm Off Add to Calendar 2022-05-25 10:00:00 2022-05-25 12:00:00 Silicon Wafer Japan TC Chapter Meeting Silicon Wafer  Japan TC Chapter Meeting  Date: Wednesday, May 25, 2022 Time: 10:00-12:00[JST] via Virtual Conference   AGENDA   Standards Contact Information: Mami Nakajo Coordinator, SEMI Japan Email: [email protected]  Phone: 81.3.3222.5949   NOTE: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! Questions? Contact your local staff coordinator: Click here SEMI Japan Office 千代田区 九段南4-7-15 Tokyo 1020074 Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo
Japan standards
Highlighted content

SEMI Japan Office
市ヶ谷 1-17
1-17
千代田区九段南, Tokyo
1020074
Japan

Standards

Automation Technology Japan TC Chapter Meeting

Date: June 24, 2022

Time: 13:30-17:30 [JST]

via OVTCCM

 

AGENDA

 

Standards Contact Information:

Keigo Nakajima

SEMI Japan

Email: [email protected] 

Phone: 81.3.3222.5863

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

1:30 pm - 5:30 pm Off Add to Calendar 2022-06-24 13:30:00 2022-06-24 17:30:00 Automation Technology Japan TC Chapter Meeting Automation Technology Japan TC Chapter Meeting Date: June 24, 2022 Time: 13:30-17:30 [JST] via OVTCCM   AGENDA   Standards Contact Information: Keigo Nakajima SEMI Japan Email: [email protected]  Phone: 81.3.3222.5863   NOTE: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! Questions? Contact your local staff coordinator: Click here SEMI Japan Office 市ヶ谷 1-17 1-17 千代田区九段南, Tokyo 1020074 Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo
Japan Standards

SEMI Japan Office
千代田区
九段南4-7-15
Tokyo
1020074
Japan

Standards

EH&S  Japan TC Chapter Meeting 

Date: Thursday, May 26, 2022

Time: 10:00-13:00[JST]

via Virtual Meeting

 

AGENDA

 

Standards Contact Information:

Mami Nakajo

Coordinator, SEMI Japan

Email: [email protected] 

Phone: 81.3.3222.5949

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

10:00 am - 1:00 pm Off Add to Calendar 2022-05-26 10:00:00 2022-05-26 13:00:00 EH&S Japan TC Chapter Meeting EH&S  Japan TC Chapter Meeting  Date: Thursday, May 26, 2022 Time: 10:00-13:00[JST] via Virtual Meeting   AGENDA   Standards Contact Information: Mami Nakajo Coordinator, SEMI Japan Email: [email protected]  Phone: 81.3.3222.5949   NOTE: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! Questions? Contact your local staff coordinator: Click here SEMI Japan Office 千代田区 九段南4-7-15 Tokyo 1020074 Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo
Japan Standards

SEMI Japan Office
千代田区
九段南4-7-15
Tokyo
1020074
Japan

Standards

3D Packaging & Integration  Japan TC Chapter Meeting 

Date: Monday, May 16, 2022

Time: 14:00-17:00[JST]

via OVTCCM

 

AGENDA

 

Standards Contact Information:

Mami Nakajo

Coordinator, SEMI Japan

Email: [email protected] 

Phone: 81.3.3222.5949

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

2:00 pm - 5:00 pm Off Add to Calendar 2022-05-16 14:00:00 2022-05-16 17:00:00 3D Packaging & Integration Japan TC Chapter Meeting 3D Packaging & Integration  Japan TC Chapter Meeting  Date: Monday, May 16, 2022 Time: 14:00-17:00[JST] via OVTCCM   AGENDA   Standards Contact Information: Mami Nakajo Coordinator, SEMI Japan Email: [email protected]  Phone: 81.3.3222.5949   NOTE: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! Questions? Contact your local staff coordinator: Click here SEMI Japan Office 千代田区 九段南4-7-15 Tokyo 1020074 Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo

Samco, a leading manufacturer of etching, deposition and surface treatment processing equipment for the semiconductor and related industries and academic facilities, is proud to introduce the new plasma etching cluster tool “Cluster H ™”.

“With our cutting-edge plasma etching technology, Cluster H™ provides the full-scale production capabilities for compound semiconductor devices such as high-frequency filters, SiC/GaN power devices, GaAs VCSELs, micro-OLED/LED, CMOS image sensors, and advanced packaging,” explains Tsukasa Kawabe, President and COO of Samco.

“We created Cluster H ™ to meet the strong demand from our valued customers for high throughput equipment. Cluster H™ with etching processes available only at Samco enables the combination of optimal materials and process technologies in advanced electronic device fabrication.” Continues Tsukasa.

■Features
Cluster H ™ is a cluster tool for etching and ashing that supports direct transfer of ø6” and ø8” diameter wafers. Centered on a hexagonal vacuum transfer platform, it is equipped with two vacuum cassette chambers and one vacuum aligner as part of the standard equipment configuration, and up to three process modules that can be attached. The ICP etching process module uses the reaction chamber of the high-end ICP etching model RIE-800iP and is backed by our extensive process library and best-known methods. In addition, the frog-leg dual-blade robot enables high wafer throughput, compact transfer chamber, and system footprint.
In addition, the revamped software incorporates useful functions with improved reliability. The standard system is equipped with a user-friendly GUI and equipment management functions such as equipment performance tracking, wafer transfer history for each module and packages, and simulation functions for higher-level communication, and supports the manufacturing execution system (MES) used at customers’ factories.

Samco announces the release of the production-worthy cluster tool, Cluster H ™. The system is ideally suited for high volume manufacturing leveraging our experience and expertise in manufacturing production-proven systems and our broad process know-how. With the advanced hardware and software features on the Cluster H ™, we are certain that it will contribute to the success in manufacturing of electronic devices for our valued customers. As a pioneer in thin film technology, Samco looks forward to continuing to provide cutting-edge solutions to the industry

About Samco Inc.
Samco Inc. (TSE: 6387) stands for Semiconductor And Materials Company, and is a leading manufacturer of processing equipment for the semiconductor and related industries founded by Mr. Osamu Tsuji in Kyoto, Japan in 1979. Over the past forty-three years, more than 4,300 Samco systems have been installed and used in 35 different countries. Its equipment and thin film technology are widely adopted in the fabrication of semiconductor devices, including high-frequency filters, SiC/GaN power devices, GaAs VCSELs, micro-OLED/LED, CMOS image sensors, MEMS, TSVs, advanced packaging, and so on. Learn more at https://www.samco.co.jp/en/

Company Contacts:
TSUCHIHASHI, Atsushi
Public Relations
Phone: 81-75-621-7841
E-mail: [email protected]