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Deventer, September 28, 2023 – RoodMicrotec N.V., a leading independent company for semiconductor supply and quality services, and Angst+Pfister Sensors and Power AG, an independently operating company of the Angst+Pfister Group, today announce their cooperation for testing semiconductor-based temperature sensors. These highly accurate sensors are able to measure extremely fine temperature differences down to +/-0.1 °C in wide temperature ranges from -45 °C to 130 °C.

Such sensitive and particularly accurate sensors will subsequently be used in industrial applications, in medical technology, and in the automotive sector and thus have to be tested with the greatest precision. In addition, these sensors have a very small drift, a repetition accuracy of 0.01 °C and a extremely fast reaction speed. Another advantage is that the sensor can be customized. The housing, the sensor technology, or the cables can be specially adapted to customer requirements.

"For this project, it was important for us to have a reliable partner who works with the utmost care. As our high-quality components are often used in very sensitive areas, they need to be tested at the highest level," says Robin Ellinger, Product Manager Temperature Sensors of Angst+Pfister Sensors and Power.

For RoodMicrotec, this collaboration means a great appreciation of its capabilities, as the company specializes in the precise testing of highly sensitive components.

"We are really pleased that the quality of our work and our capabilities are so highly appreciated in the semiconductor business. For us, the most fundamental basis of a strong cooperation is mutual trust," says Martin Sallenhag, CEO of RoodMicrotec.
About Angst+Pfister Sensors and Power AG

About Angst+Pfister
Angst+Pfister Sensors and Power AG belongs to the Angst+Pfister Group. The Group´s headquarter is located in Switzerland. It has been a leading developer and manufacturer of technical components and engineering solutions for more than 100 years. With local sales and technical support units as well as logistics centers all over the world, the company serves more than 20,000 customers of numerous industries in over 50 countries. Angst+Pfister operates state-of-the-art research and development centers in Switzerland, Turkey, and Italy. Furthermore, the company runs its own production facilities for elastomer and rubber-metal parts and compounds in Switzerland, Turkey, Italy, Denmark, China, and Vietnam. To complement the capabilities, Angst+Pfister has production partners in over 15 countries, thus enabling the Group to always be at the cutting edge of technology.

Angst+Pfister attaches the utmost importance to reliability and flexibility as well as the respectful and fair treatment of all people who are somehow correlated with them. In proactively implementing the principles of the "United Nations Global Compact", Angst+Pfister pursues the goal of sustainability in all its activities in order to have a positive impact on our planet and society through pragmatic, meaningful, and measurable initiatives.

For more information please visit www.sensorsandpower.angst-pfister.com

About RoodMicrotec
With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is a leading independent company for semiconductor supply and quality services. RoodMicrotec is a highly valued partner for many companies worldwide and offers specifically tailored turnkey solutions for each single customer's requirements. The turnkey services include project management, wafer test, assembly, final test, qualification, failure analysis, and logistics. All services provided by RoodMicrotec meet the high quality standards of the automotive, industrial, healthcare, and high reliability aerospace sectors. RoodMicrotec is headquartered in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.
For more information, please visit https://www.roodmicrotec.com

This press release is available in English and German. In case of conflict between these versions, the English version shall prevail.

Industry survey finds 83% of respondents would be more inclined to buy used equipment with money-back guarantee.

Moov, the largest and fastest growing global marketplace for used semiconductor equipment, today announced changes to its industry-first “Money Back Guarantee” (‘MBG’) program that will expand access to buyers by eliminating the premium previously associated with this warranty. Moov will now offer its no-questions-asked, money-back guarantee free of charge for end users (semiconductor manufacturers) who purchase semiconductor equipment and parts through Moov’s global marketplace, valid on over 90% of inventory. This announcement comes as Moov’s marketplace surpasses another milestone, exceeding $4bn FMV in active listings for pre-owned semiconductor manufacturing equipment.

Historically, reliability has been a significant barrier for semiconductor manufacturers looking to incorporate secondhand equipment in their procurement strategies. In fact, this problem has been so pervasive that 81% of industry respondents surveyed by Moov “strongly agree” or “agree” that reliability is a top barrier to purchasing secondhand semiconductor manufacturing equipment.

“Reliability is arguably the biggest barrier to the growth of the global secondary equipment market, and the growth of used equipment as a percentage of fabs’ overall equipment spend,” said Steven Zhou, CEO and cofounder of Moov Technologies. “In growing Moov to become the world’s largest marketplace for used equipment, solving the reliability challenge is at the core of just about everything we’ve built – from verified listings to digital inspections, white-glove logistics, and most importantly our no-questions-asked money-back guarantee.”

A money-back guarantee fundamentally shifts risk away from buyers and significantly impacts manufacturers’ willingness to purchase used equipment. Indeed, 83% of industry respondents agreed that they would be more inclined to purchase secondhand equipment if offered a 100% no-questions asked money-back guarantee.

Moov’s decision to offer its MBG free to all buyers reflects its commitment to quality.

“We eliminated the small premium on this program because Moov stands by the quality of our service and inventory on our marketplace,” said Raymond Mahon, Head of Customer Success at Moov. “All eligible purchases on Moov will now include our no-questions-asked, money-back guarantee so that buyers can fully leverage the secondary market as an integral part of their procurement strategy – without the risk historically associated with purchasing secondhand equipment.”

To learn more about Moov’s Money Back Guarantee program visit www.moov.co/services.

About Moov Technologies Inc.
Headquartered in Tempe, Arizona, and Austin, Texas, Moov is a technology-driven marketplace and asset management platform that matches buyers and sellers of pre-owned semiconductor manufacturing equipment. Built by a team with more than 50 years of experience in the manufacturing equipment brokerage industry, Moov's platform ensures accurate listings and faster transactions. CEO Steven Zhou and Managing Director Maxam Yeung co-founded the company in 2017. To learn more, please visit Moov.co.

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PFAS is prevalent in our world and very much in our current conversation. But what is it? (or more correctly, what are they?), why are they under great scrutiny? are they all hazardous? and how would the semiconductor industry be impacted by their removal? With so much at stake, it is imperative that we have clarity in the discussion to ensure we successfully address this issue.

This webinar will address the what, why, and how of PFAS in the semiconductor industry. Laurie Beu, noted semiconductor EHS consultant and leader of SIA’s Semiconductor PFAS Consortium, will provide an overview of PFAS materials, concerns about health effects, and the current state of regulatory response. Laurie’s talk will be followed by Ralph Dammel, Technology Fellow at EMD Electronics, who will provide insights from a materials manufacturer’s perspective on the use of PFAS in the multiple markets addressed by EMD. He will discuss the importance of PFAS in lithography chemicals, the impact of potential new regulations, and options to reduce or eliminate the use of PFAS in semiconductor applications.

Virtual, Online
United States

Laurie Beu
Laurie S. Beu, P.E.
Consultant
Laurie S. Beu Consulting
Ralph R. Dammel
Ralph R. Dammel
Technology Fellow, CTO Office
EMD Electronics
James Amano
Moderator
James Amano
Sr. Director, EHS
SEMI
EMG FOA Standards

PFAS is prevalent in our world and very much in our current conversation. But what is it? (or more correctly, what are they?), why are they under great scrutiny? are they all hazardous? and how would the semiconductor industry be impacted by their removal? With so much at stake, it is imperative that we have clarity in the discussion to ensure we successfully address this issue.

Join the SEMI Electronic Materials Group (EMG) for a open conversation about the impact on the materials sector. 

 

10:00 am - 11:00 am Off Add to Calendar 2023-10-18 10:00:00 2023-10-18 11:00:00 Spelling semiconductors without “F” (luorine) PFAS is prevalent in our world and very much in our current conversation. But what is it? (or more correctly, what are they?), why are they under great scrutiny? are they all hazardous? and how would the semiconductor industry be impacted by their removal? With so much at stake, it is imperative that we have clarity in the discussion to ensure we successfully address this issue. Join the SEMI Electronic Materials Group (EMG) for a open conversation about the impact on the materials sector.    Virtual, Online United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles

SANTA BARBARA, CA – September 1, 2023 – Sikama International Inc., in collaboration with AirProducts Inc.™, is proud to announce the full commercial launch of its acid-free Electron Attachment (EA) Fluxless Reflow Soldering System, a revolutionary step for the Advanced Packaging Semiconductor sector.

The innovative technology behind this system is based on the Electron Attachment (EA) principle for activating hydrogen, a method that AirProducts has been refining for the past 15 years to efficiently reduce surface oxides. The EA technology is engineered to break down H₂ molecules into hydrogen anions, which are then targeted towards the soldering surfaces to effectively clean and reduce oxides before the reflow process. Additionally, this technology operates at ambient pressure and temperatures well within the window of traditional reflow processes.

The key advantages of this technology include:
• Truly Residue-Free: Enhanced reflow quality without flux-induced solder voids and wafer contamination. No post-reflow cleaning equipment is required and significantly less oven cleaning.
• In-line Process: Easily integrated into existing manufacturing lines without batch processing. The EA process occurs immediately before the reflow process.
• Environmental Impact: The EA flux-free process is entirely residue-free and environmentally benign with no organic vapors, hazardous residues, or CO2 emission.
• Ambient Pressure and sub-reflow temperatures: No vacuum requirements and safely processes substrates.

Sikama, as the exclusive global integrator of this technology and partner with AirProducts, views the technology and equipment commercialization as “a game-changer for this industry, as the need for advanced solutions to packaging evolutions in the semiconductor industry continue to evolve”, according to Herb Weigel, President and CEO of Sikama International.

The Sikama EA1200 Solder reflow oven is certified to EN 600204-1, SEMI S2/S8/S22/S23/F47/E6, is CE certified, and is verified to be compliant with NFPA79 in installed applications. Nearly 50 Worldwide Patents have been issued on this technology. The technology is well suited to provide significant benefits to small geometries in wafer bumping, copper pillar, and flip chip applications.

Established in 1982, Sikama International, Inc. designs and produces its products in Santa Barbara, California. Their reflow system offerings provide exceptional performance, with the fluxless systems set to redefine industry standards.

Reliable. Repeatable. Responsible. Reflow.

About Sikama
For over 40 years, Sikama International has offered highly reliable equipment and is the trusted option of manufacturers worldwide.

SEMI Members:  $49

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $99

Students:  Free

Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code.

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Highlighted content

Abstract:

For many generations of technology nodes, Moore’s Law has reliably delivered the doubling of transistor density every 1.5-2 years while bringing down the cost per transistor. However, in recent advanced nodes, Moore’s Law has slowed down and the cost of advanced node chips has increased.

To keep up with performance demands, manufacturers have continued to increase chip size to have large System on Chip (SoCs), and we have seen chip sizes reach the lithographic reticle limits. Moreover, increasing chip size beyond reticle limits also decreases chip yields and contributes to increasing the cost of manufacturing. Thus, increasing chip sizes beyond reticle limits is not a solution.

The semiconductor industry needs to be on the path of delivering more performance and functionality at reasonable prices despite the slowing of Moore’s Law.

One popular approach the industry is adopting to deliver improved performance is focusing on advanced packaging, including the use of chiplets, hybrid bonding and state of the art 3D stacked systems. This course will discuss the meaning and the need for advanced packaging and dive deeper into each one of these advanced packaging approaches. 

Outline

  1. Need to Advanced Packaging
  2. Types of Advanced Packaging
  3. 3D bonding and Intro to Hybrid Bonding for Advanced Packaging
  4. Types of Hybrid Bonding, Current Status and Challenges
  5. Future opportunities in Hybrid Bonding
  6. Summary

Featured Speaker Biography:

Arsalan Alam is a Sr. Packaging Engineer at AMD’s Advanced Packaging Group in Austin, Texas. He completed his PhD in Electrical and Computer Engineering with the Center for Heterogeneous Integration and Performance Scaling (CHIPS) group at the University of California, Los Angeles, in 2021. He received his Master’s degree in Microelectronics and VLSI from IIT Roorkee, India and his Bachelor’s degree in Electronics and Communication Engineering from the Zakir Hussain College of Engineering and Technology, India. His research interest is in advanced packaging, including FOWLP, 2.5D, and 3D. He holds about 20 publications and two patents with multiple patents pending. He was the winner of the IEEE EPS Packaging Vision Award, 2020 and recipient of the Broadcom Foundation Fellowship, 2017-2018.

Virtual
United States

Arsalam Alam
Arsalan Alam, PhD
Senior Packaging Engineer
AMD
Gity Samadi
Moderator
Gity Samadi, PhD
Senior Director, R&D Programs
SEMI
FlexTech

This course will discuss the meaning and the need for advanced packaging such as chiplets, and 3D stacked systems, with a deep dive into hybrid bonding.

Our speaker will be a young, but distinguished engineer from AMD's Advanced packaging Group in Austin, Texas, Dr. Arsalan Alam. Come up to speed quickly and efficiently on the latest thinking on how the semiconductor industry will be delivering more performance and functionality despite the physical limitations of the atom.

10:00 am - 12:00 pm Off Add to Calendar Disabled America/Los_Angeles
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Micro-electromechanical systems (MEMS) are revolutionizing how humans interact with the world. Atomic layer deposition (ALD) can be an enabling technology to improve performance of existing MEMS architectures and developing future devices.

Due to their digital growth nature, ALD processes provide a discrete and reproducible amount of film in each cycle. Multilayered films can be deposited to tune physical properties of the films, including dielectric properties, such as dielectric constant, leakage current, and breakdown voltage.  These “nanolaminate” barrier films can be produced by adding discrete layers of a 2nd metal oxide, like Al2O3 or ZrO2, to a primary dielectric, like HfO2. The multilayer technique can also be exploited to drastically improve moisture and oxygen barrier properties of ALD films over a bulk film and to tune the internal film stresses.

Whether using a single-wafer system or multi-wafer batch system, extremely low ALD deposition rates have made it difficult to implement ALD into high volume manufacturing. Another barrier to adoption of ALD in MEMS applications is the inefficiency of precursor usage, which leads to unacceptable operating costs.

In this webinar, Nano Forge will present how to use ALD to tune a few different thin film properties such as electrical barrier performance, gas diffusion barrier behavior, and internal film stress. A brief description of the differentiating features and product offerings in the ALDx toolset will also be discussed.

Forge Nano’s ALDx toolset offers the fastest and most efficient single-wafer system on the market, enabling ALD to be integrated earlier in the product development cycle.

Online, Virtual
United States

Paul Carey, SEMI
Moderator
Paul Carety
Director, MSIG
SEMI MSIG
Matt Weimer
Matt Weimer
Principal R&D Scientist
Forge Nano
MSIG

In this webinar, Forge Nano will present how to use Atomic Layer Deposition (ALD) to tune a few different thin film properties such as electrical barrier performance, gas diffusion barrier behavior, and internal film stress. This approach overcomes the perception of ALD as a barrier to high-volume manufacturing and as a material intensive process.  Join Paul Carey and Matt Weimer of Forge Nano to explore a new approach.

8:00 am - 9:00 am Off Add to Calendar Disabled America/Los_Angeles

SEMI Members:  $49

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $99

Students:  Free

Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code.

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Abstract: 

Recognition methodologies for electrochemical sensing of specific analytes have been developing over many years. Creating specificity over similar analytes has been a goal, as often similar shaped molecules can bind to the sensor alongside the targeted analyte.  

One of the cutting-edge ways to enable targeted electrochemical sensing is to use single strand DNA or RNA molecules, also known as aptamers, as the biorecognition elements (BRE).

This seminar will provide insights into: 

  • Overview of strategies for Biomolecular Sensing
  • Electrochemical based sensing
    • Optical based methods
      • Plasmonic resonance energy transfer (PRET)
      • Nanoparticle surface energy transfer (NEST)
      • Surface plasmon resonance (SERS) biosensors
  • Aptameric based sensing – key design elements to target analytes displayed in recent literature
    • Surface binding/functionalization approaches
    • Reporter/redox molecules to facilitate signal generation
    • BRE molecular structure dynamics

The seminar will be useful for the many researchers reviewing methods for effectively and reliably identifying science-based biomarkers for a wide range of diagnoses and reporting requirements for integration into products with a wide range of consumer and healthcare uses.

 

About the Featured Speaker

Jack Ly is a Program Manager and Research Scientist at UES, Inc. He received his PhD in Polymer Science and Engineering from the University of Massachusetts Amherst in 2018. At UES, Inc, he supports the Air Force Research Lab in designing, fabricating, and validating specialty polymers and analyte sensing chromophores for optical sensors. Most recent relevant published work involves fabrication of implantable, degradable phosphorescent O2 sensors.

Online
United States

Jack Ly UES
Jack Ly
Program Manager & Research Scientist
UES
Gity Samadi
Gity Samadi, PhD
Sr. Director R&D Programs
SEMI
FlexTech MSIG 10:00 am - 12:00 pm Off Add to Calendar 2023-11-02 10:00:00 2023-11-02 12:00:00 FE15-Fundamentals of Electrochemical Aptamer-based Sensing Online United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles

Sikama International, a trusted provider of state-of-the-art reflow systems is proud to announce their new partnership with CMT, a global leader specializing in back-end semiconductor solutions.

CMT was formed in August 2010 by Mr. CW Kwak, who has over 30 years experience in the semiconductor industry. CMT offers both material and equipment solutions in the back-end semiconductor assembly market.

CMT is a unique global marketing and sales company. CMT focuses on a micro-level marketing working directly with clients and customers through offering specific projects, right beta sites, and global project management. CMT focuses on short-term projects to deliver sales on client’s current products, then offers mid-term projects for next 2-3 years, and long-term programs 5-10 years out to deliver continuous long-term growth and sustainability.

Sikama’s new partnership with CMT will enable both companies to expand their reach to provide customers with an expansive range of solutions on a global platform.

About Sikama
For over 40 years, Sikama International has offered highly reliable equipment and is the trusted option of manufacturers worldwide.

Wooptix SL, a company based in Tenerife, Madrid and San Francisco, has announced the signing of a 10-million-dollar Series B financing round. The round includes participation by: Bullnet Capital, CDTI (Centre for the Development of Technology and Innovation), Danobatgroup, European Innovation Council Fund (EIC), Fagor Automation, Intel Capital, Mondragón Promotion and Tel Ventures.

The company is focused on commercializing semiconductor metrology equipment incorporating wavefront phase imaging. “Phemet®, the system developed by Wooptix, measures the silicon wafer warpage, and its accuracy is a “significant advance in the industry,” affirms José Manuel Ramos, Founder and CEO of the company.

Wooptix's patented technology enables blank and patterned wafer-shape measurement in less time and with higher resolution than current systems being used in the industry. "Wooptix's wavefront sensor and its semiconductor applications are generating interest from key players in the semiconductor industry as evidenced by the Series B financing round,” explains Javier Elizalde, Co-founder and COO.

The company has been recognized as well by the EIC Accelerator Program through a 2.5M€ grant in addition to the equity investment. The grant and investment support Wooptix's product introduction and future technological innovation including the manufacture, delivery, and installation of three semiconductor metrology tools in Japan, the USA and the Netherlands this year.

"Keeping in mind that each Phemet® is only a metric ton weight, together with the sensitivity of the instrument components that enable measurements at the nanometer scale, Wooptix demonstrates a world-class engineering and operations capability,” continues Elizalde.

Next steps
Wooptix has a well defined roadmap for each product line to meet the needs of lab and fab customers. In the case of the semiconductor metrology business unit, the next step is to automate Phemet®. Enhanced automation will reduce risk of contamination of wafers under measurement and provide consistent reproducibility to the system. Due to the flexibility of Wooptix’s design, another step is to integrate Phemet® into existing semiconductor equipment platforms from tool vendors.

Phemet® and the Series B financing round demonstrate Wooptix’s growth and maturity as it begins initial tool deliveries to customers. "It is really valuable for us to transition now from an R&D company to become a product and manufacturing company. With this objective in mind, we are building the necessary infrastructure, including procedures and certifications to protocols and management teamwork, to support customers as we enter the market," explains José Manuel Ramos.

Semiconductor Equipment Industry in Numbers
According with SEMI (the global semiconductor industry association) the semiconductor equipment sales forecast for 2023 is $87 billion. "The semiconductor equipment market will see a strong rebound in 2024,” said Ajit Manocha, SEMI President and CEO. "Projections for robust long-term growth driven by high-performance computing and ubiquitous connectivity remain intact.”

As reported by SEMI, the wafer fab equipment segment is projected to account for the bulk of the recovery to $100 billion in 2024, generating $87.8 billion in sales, a 14.8% increase.

About Wooptix
Wooptix is a leader in semiconductor metrology through wavefront phase imaging, a technique derived from adaptive optics research in astronomy. With a multidisciplinary team, Wooptix aims to disrupt the semiconductor metrology industry with the highest lateral resolution and fastest measurement technique for inline fab measurements.

The company has developed Phemet®, a wafer shape lab tool for blank and patterned wafers, ahead of the upcoming fully automated fab tool, expected in 2024. Wooptix has already deployed Phemet® at several customer sites worldwide.

Wooptix is based at Tenerife, Madrid (Spain) and San Francisco (USA).

RoodMicrotec N.V. publishes the Interim Report for 2023

• Total income grew by 18.5% to EUR 8.7 million (HY1 2022: EUR 7.3 million)
• EBITDA increased to EUR 1.8 million (HY1 2022: EUR 1.4 million)
• Net profit rose to EUR 0.9 million (HY1 2022: EUR 0.6 million)

Deventer, July 20, 2023 – RoodMicrotec N.V., a leading independent company for semiconductor supply and quality services, today publishes the Interim Report for the six-month period ended June 30, 2023.
RoodMicrotec reports a total income of EUR 8.7 million for the first half-year of 2023, which is 18.5% higher than the total income reported for the first half-year of 2022 and 6% lower than for the second half-year of 2022. The increase in total income is driven by a continued strong delivery level, especially by the Test Operations unit. The slight reduction between the second half-year of 2022 and the first half-year of 2023 is predominantly due to the normal cyclical business in the semiconductor industry, where the second half of the year typically can be characterized by stronger demand.

Operational Unit (x EUR 1,000) HY1 2023 HY1 2022 Change
Test Operations 5,845 4,496 30.0%
Supply Chain Management 1,466 1,398 4.9%
Qualification & Failure Analysis 1,356 1,423 -4.7%
Total 8,667 7,317 18.5%

Total operating expenses for the first half-year of 2023 amounted to EUR 6.8 million against EUR 5.9 million for the first half-year of 2022, while cost for raw materials and consumables remained stable at EUR 1.1 million. Personnel expenses increased to EUR 4.0 million (HY1 2022: EUR 3.6 million) due to bonus expenses and an increase in the number of employees. Other operating expenses increased to EUR 1.7 million (HY1 2022: EUR 1.2 million), predominantly due to the costs incurred for financial and legal advice and support in relation to the Public Offering process in the amount of EUR 0.5 million for the first half-year of 2023.

EBITDA increased from EUR 1.4 million for the first half-year of 2022 to EUR 1.8 million for the first half-year of 2023. Through excellent cost control we have succeeded in further reducing the overall costs as a percentage of total income by 1.4% in the first half-year of 2023. The cost of raw materials stayed at EUR 1.1 million in the first half-year of 2023, but as percentage of total income came down by 2%-points to 13% compared to first half-year of 2022.

Depreciation charges of EUR 0.8 million were higher in the first half-year of 2023 (HY1 2022: EUR 0.7 million) due to capital expenditure during the second half-year of 2022 and the first half-year of 2023. Total financial expenses maintained at the same level of EUR 0.1 million for the first half-year of 2023 and 2022.

Net profit for the first half-year of 2023 increased by 35% to EUR 0.9 million compared to the first half-year of 2022.

Adjusting for non-recurring costs incurred for financial and legal advice and support in relation to the Public Offering process in the amount of EUR 0.5 million in the first half-year of 2023, the adjusted EBITDA would have been EUR 2.3 million (HY1 2022: EUR 1.4 million) and the adjusted net profit would have been EUR 1.4 million (HY1 2022: EUR 0.6 million).

Financial data (x EUR 1,000) Note HY1 2023 HY1 2022
Total Income 8,667 7,317
EBITDA 1,825 1,440
Adjusted EBITDA 1 2,286 1,440
Net profit 869 644
Adjusted net profit 1 1,330 644

Note 1: after excluding non-recurring costs incurred for financial and legal advice and support in relation to the Public Offering process in the amount of EUR 0.5 million in the first half-year 2023

Net cash flow from operating activities for the first half-year of 2023 was positive with EUR 1.8 million (HY1 2022: EUR 0.3 million). The increase results from higher net profit and reduced working capital compared to the first half-year of 2022. Cash flow from investing activities was EUR 0.5 million negative (HY1 2022: EUR 0.4 million negative). Cash flow from financing activities for the first half-year of 2023 amounted to EUR 1.2 million negative (HY1 2022: EUR 0.5 million negative), including EUR 1.1 million for redemption of the non-controlling interest (HY1 2022: EUR 0.4 million negative). Total net cash flow for the first half-year of 2023 amounted to EUR 0.1 million positive (HY1 2022: EUR 0.6 million negative). Cash and cash equivalents at the end of the half-year of 2023 amounted to EUR 3.7 million (December 31, 2022: EUR 3.6 million; June 30, 2022: EUR 1.9 million).

“The first six months of 2023 have continued to run at the same level as the second half-year of 2022 which meant a good start for the whole year. We still see some supply challenges in the world, but we have been able to continue our Test Operations at a high utilization level. The load situation at the end of the second quarter, in combination with our current order book level provide a solid base for the second half-year of 2023.”, says Martin Sallenhag, CEO of RoodMicrotec.

Interim Report 2023 (reviewed by KPMG Accountants N.V. due to Public Offering process)
You will find the complete Interim Report 2023, which is available in English only, on our corporate website: www.roodmicrotec.com/en/investor-relations-en/financial-publications.
The Interim Report 2023 has been reviewed by KPMG Accountants N.V. pursuant to the provisions of Appendix B, Paragraph 2 sub 2.4 of the Dutch Decree on Public Takeover Bids (Besluit openbare biedingen Wft). The review opinion issued by KPMG Accountants N.V. is attached to the Interim Report 2023.

Outlook
RoodMicrotec expects the total income for 2023 to be in the range of EUR 17.0 million to EUR 17.5 million, with a profit before tax of 5-10%. The geopolitical situation in the world and the current energy crisis throughout Europe could have an impact on the Company’s business. RoodMicrotec is keeping a close eye on the situation and is doing everything possible to mitigate any potential negative impact.

Financial calendar
July 20, 2023 Conference call for media, analysts and shareholders
October 19, 2023 Trading update for the third quarter of 2023
[Date to be determined] Extraordinary General Meeting of Shareholders (in relation to the Public Offer by Microtest)
Conference call
CEO Martin Sallenhag and CFO Arvid Ladega will present the Interim Report 2023 and hold a Q&A session. You are invited to join RoodMicrotec’s conference call for media, analysts and shareholders (a Microsoft TEAMS event) on
Thursday, July 20, 2023 at 9:30 CEST

Login-information:
Join with your computer or mobile app Click here to join the meeting
Or call in (audio only)
+49 69 509544247 Germany, Frankfurt am Main
+31 20 399 9804 The Netherlands, Amsterdam
+32 2 895 09 68 Belgium, Bruxelles
+41 43 217 23 02 Switzerland, Zurich
+39 02 3206 8489 Italy, Milano
Find a local number – in case you are in another country
Phone Conference ID: 236 111 572#

Forward-looking statements
This press release contains a number of forward-looking statements. These statements are based on current expectations, estimates and prognoses by the Board of Management as well as on the information currently available to the Company. The statements are subject to certain risks and uncertainties, which are hard to evaluate, such as the general economic conditions, interest rates, exchange rates and amendments to statutory laws and regulations. The Board of Management of RoodMicrotec cannot guarantee that its expectations will materialize. Furthermore, RoodMicrotec does not accept any obligation to update the statements made in this press release.

About RoodMicrotec
With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is a leading independent company for semiconductor supply and quality services. RoodMicrotec is a highly valued partner for many companies worldwide and offers specifically tailored turnkey solutions for each single customer's requirements. The turnkey services include project management, wafer test, assembly, final test, qualification, failure analysis, and logistics. All services provided by RoodMicrotec meet the high quality standards of the automotive, industrial, healthcare, and high reliability aerospace sectors. RoodMicrotec is headquartered in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.
For more information, please visit https://www.roodmicrotec.com

Further information
Martin Sallenhag, CEO or Arvid Ladega, CFO
Phone +31 570 745623, E-mail [email protected]

This press release is published in English only. This communication contains information that qualifies as inside information within the meaning of Article 7(1) of the EU Market Abuse Regulation. The company’s managing director and CEO Martin Sallenhag, is responsible for arranging the release of this document on behalf of RoodMicrotec.