PRESS RELEASE | Nijmegen, the Netherlands | January 16, 2023

Chip Integration Technology Center (CITC) today announced the appointment of Mark Luke Farrugia as its new general manager. As of March 1, Farrugia will take over the responsibilities from general manager Jeroen van den Brand, who fulfilled the role ad interim.

Farrugia has an extensive background in the semiconductor backend industry. Prior to this appointment, he worked for almost sixteen years at NXP Semiconductors and most recently as technical director at Nexperia Semiconductors.

He explains why he is now switching to CITC: “Innovation work within semiconductor packaging has been my greatest professional passion for the past 27 years. Breakthrough innovation requires a dedicated organization having the right focus, knowledge and passion and determination, and I see this in CITC.”

In his position as general manager, Farrugia will be responsible for the further development of CITC as an internationally distinctive and well-recognized center of semiconductor and photonic chip packaging technology. “CITC is a young organization, and therefore needs to put itself on the semiconductor packaging map. This should be done by understanding the needs and expectations of the industry, building and enhancing the right competences, and by collaborating with other organizations. I look forward to working with the CITC team, as well as scouting and mentoring the next generation, dealing with the highly complex puzzle of understanding what the various industry stakeholders would like to achieve, and ultimately, to delivering results that have a meaningful impact on the industry.”

Roel Fonville, chair of the CITC Supervisory Board, expresses that this is what qualified Farrugia for the position at CITC: “The Supervisory Board is enthusiastic about the appointment of Mark Luke Farrugia as general manager of CITC. Mark Luke has substantive expertise, an up-to-date business network, entrepreneurial thinking and a strong drive to further internationalize CITC as an innovation center in the field of packaging.”

The position of general manager became vacant following the sad passing of CITC founder and first general manager Barry Peet in July 2022.

About CITC
Chip Integration Technology Center (CITC) is a non-profit joint innovation center specializing in heterogeneous integration and advanced chip packaging technology. CITC has created an effective ecosystem in which companies, research and educational institutes work on bridging the gap between academics and industry. CITC’s contribution to the ecosystem is to provide access to innovation, infrastructure and education. CITC was founded in 2019 with strategic partners TNO and Delft University of Technology and powered by Holland Semiconductors. It is also supported by local and regional governments.
www.citc.org

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Roger Wood to retire as CEO effective July 7, 2023; Robert Blanding named as successor and has been appointed President of Tosoh Quartz, Inc. (TQI) effective January 1, 2023.

Tosoh Corporation announced today that Mr. Roger E. Wood, Chief Executive Officer, and President of Tosoh Quartz Inc. will retire as CEO effective July 7, 2023. Mr. Wood will step down from his duties as President as of January 1, 2023, and remain CEO until July 7, 2023, at which time he will retire from the company. Robert Blanding, currently Chief Financial Officer, will take on the role of President and successor as of January 1, 2023.

Mr. Wood possesses more than 45 years of management experience in the semiconductorrelated quartz industry with Tosoh Quartz, Inc., and has been CEO & President since 2006. Mr. Wood joined the organization in 1978 as the sixth employee when it was known by its former name, Weiss Scientific Glassblowing Company, and has held many roles across the company as it has grown. Weiss was acquired by Japan-based Tosoh Corporation in 1994, and was renamed Tosoh Quartz, Inc. in 2000. Tosoh Quartz Inc., headquartered in Portland, OR also has operations in Durham, England.

“I am grateful to have spent 45 years with this great company, and very honored to have had the opportunity to lead it for the last sixteen years. I consider myself fortunate to have witnessed the innovation and creativity that enabled us to support the Semiconductor industries growth from its infancy to its current status. I believe the future holds even greater opportunities and I
am confident that Robert Blanding, as our new President, is the right choice to lead us on this path.”

Mr. Blanding joined TQI in 2019 as Chief Financial Officer and has a wealth of manufacturing and technology industries experience, along with a proven record of leadership in global businesses. Prior to TQI, Mr. Blanding spent three years at HP Inc. as a Senior Director within the ink and toner businesses; three years at ESCO Corporation (now part of the Weir Group) as the Vice President of Finance for the Products and Mining Divisions; and eighteen years at Intel Corporation in a variety of operational finance roles including eight years directly supporting manufacturing organizations as well as a role in Intel Capital, supporting mergers and acquisitions and an international role supporting the Europe, Middle East, and Africa sales region. Mr. Blanding holds a BA in Business Administration from the Foster School of Business at the University of Washington, and an MBA from the Kelley School of Business at Indiana University.

About Tosoh Quartz Inc.
Tosoh Quartz Inc. and Tosoh Quartz Japan, lead the industry in the production of quartz glass products for use by the semiconductor industry in the manufacture of integrated circuits. Tosoh Quartz Inc. has been operating in the Portland area since 1970 and in Durham, England since 1993, and is a member of Tosoh Corporation’s Advanced Materials Division along with sister
companies Tosoh Quartz Corporation (Japan), Tosoh Quartz Co., Ltd. (Taiwan), Tosoh SGM Corp. (Japan), Tosoh TSC (China), Tosoh SMD and Tosoh SMC.

Tosoh Corporation is the parent company of a Japanese chemical and specialty products and materials group that comprises over 100 companies worldwide and a multiethnic workforce of more than 12,000 people. 

Tosoh’s principal markets include the chemical and petrochemical, construction, automotive, consumer electronics, information technology, bioscience, and environmental markets. 

Tosoh is a global chemical company that supplies manufacturers with the materials they need to produce the things that make modern life all that it is and everything it can be.

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January 12th, 2023 – Tempe, AZ: Moov, a data-fueled marketplace for used semiconductor equipment, today announced David Duke as Head of Enterprise Partnerships. A 27-year semiconductor industry veteran, Duke has led over $1bn in strategic fab level sales and exclusive remarketing of semiconductor equipment, including developing and running the largest equipment resale operations in the world at GlobalFoundries and GE Capital.

“We are excited to welcome equipment remarketing pioneer and semiconductor industry veteran, David Duke, to Moov,” said Moov CEO and co-founder Steven Zhou. “David’s expertise stems from decades of experience devoted to semiconductor equipment, first as an exec at top equipment manufacturers focusing on their service offerings, and then building the largest remarketing programs in the world at GE Capital and GlobalFoundries. This is the type of world-class talent we know will continue to make Moov successful as we deepen our global partnerships with semiconductor manufacturers in 2023 and beyond.”

Duke has held executive positions at semiconductor equipment behemoths AMAT, KLA, and Cymer (ASML), with focus on equipment services. At GE Capital, Duke served as VP of Sales, leading US and European sales of semiconductor and test equipment. At GlobalFoundries, Duke was responsible for acquisitions, valuations, and recovery of surplus assets, building GlobalFoundries’ remarketing process to world-class standards. Most recently, Duke served as President of US and Korea for precision deposition equipment manufacturer Kateeva.

“I was initially drawn to Moov because Moov’s approach is highly ethical, transparent, and truly has customers' best interests in mind,” said David Duke, Head of Enterprise Partnerships at Moov. “With the technology, marketplace data, and full aftermarket service suite Moov offers, manufacturers can more robustly incorporate used equipment into their enterprise procurement strategy and recoup capital on pre-owned assets at a scale never before possible.”

Duke will be responsible for establishing and growing Moov’s newly minted Enterprise Partnerships division. In this role, he will oversee strategic enterprise partnerships with semiconductor manufacturers to leverage surplus equipment in a way that moves the needle strategically beyond individual tool sales. Moov offers chipmakers a compelling solution to resell idle assets. Moov’s global marketplace and wealth of secondary capital equipment market data offers sellers immediate access to global demand and data-driven valuation solutions to make more intelligent decisions. Moov’s global team offers expertise in equipment sales including compliance with trade and financial regulations. The new Enterprise Partnerships division will focus on complex, multi-asset sales including supporting manufacturers’ equipment needs during fab acquisition or divestiture. For more information on Moov’s strategic equipment remarketing services contact [email protected].

About Moov Technologies Inc.
Headquartered in Tempe, Arizona, and Austin, Texas, Moov is a technology-driven marketplace and asset management platform that matches buyers and sellers of pre-owned semiconductor manufacturing equipment. Built by a team with more than 50 years of experience in the manufacturing equipment brokerage industry, Moov’s platform ensures accurate listings and faster transactions. CEO Steven Zhou and Managing Director Maxam Yeung co-founded the company in 2017. To learn more, please visit Moov.co.

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HATFIELD, Pa. (USA) January 5, 2023 — Brooks Instrument, a leader in precision fluid measurement and control technology, has earned a Supplier Excellence Award from Applied Materials, Inc., the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world.

Applied’s Supplier Excellence Awards recognize the company’s top performing suppliers for outstanding technical and operational achievements in areas including quality, service, lead time, delivery, cost and responsiveness. Brooks Instrument received the award for Best in Class Performance.

“Applied Materials congratulates our Supplier Excellence Award recipients for achieving outstanding performance over the past year,” said Dr. Paul Chhabra, Corporate Vice President of Global Supply Chain at Applied Materials. “Having strategic relationships throughout the supply chain is more important than ever, and we thank our suppliers for their strong support and collaboration.”

About Brooks Instrument
Since 1946, Brooks Instrument has been a leader in precision fluid measurement and control technology. Providing instrumentation for flow, pressure and vapor delivery, the company serves customers in semiconductor manufacturing, fiber optics, thin film manufacturing, solar cells, LED, pharmaceutical, biopharmaceuticals, alternative energy, oil and gas, chemical and petrochemical.

With manufacturing, sales and service locations in the Americas, Europe and Asia, Brooks Instrument has the world’s largest installed base of mass flow controllers. Its broad family of products includes the brands UNIT Instruments, Tylan and Celerity.

For more information, please visit www.BrooksInstrument.com. The company is also on LinkedIn (www.linkedin.com/company/Brooks-Instrument) and YouTube (www.youtube.com/user/Brooks407).

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Heidelberg, Germany – We are happy to announce that one hundred and fifty MLA 150 Maskless Aligners have been successfully installed worldwide at our customers facilities. First launched to the market in 2015, the revolutionary maskless technology of the MLA 150 has become firmly established within the advanced microfabrication community.

The MLA 150 was the first and only tool that has become a true alternative to mask-based aligners, offering extremely high exposure speed, high frontside and backside alignment accuracies, warpage compensation, high resolution and high accuracy, and the ability to expose on any substrate size from pieces that are a few square millimeters up to full 8” wafers. Further adding to the flexibility, the non-contact exposure technique for the MLA150 in addition to the simple ease of use makes this the ideal tool in rapid prototyping environments, for low to mid-volume production, and for research and development. Common application areas include MEMS, electronics, micro-optics, micro-fluidics, sensors, and many more.

École Polytechnique Fédérale de Lausanne (EPFL) – Pioneer in maskless technology
The beta-version of the MLA 150 was installed in August 2014 at the Center of MicroNanoTechnology (CMi) of the renowned École Polytechnique Fédérale de Lausanne (EPFL) located in Switzerland, being one of Europe’s most vibrant and cosmopolitan science and technology centres. The CMi is a complex of clean rooms and processing equipment devoted to microtechnology made accessible to trained academic and industrial users. The CMi is at the same time one of the pioneers in maskless lithography.

In 2022, the CMi purchased their second MLA 150 Maskless Aligner, which was installed most recently. “The MLA 150 is today one of the most important equipment in our facility, and there are many users that daily use the machine for printing. So, we wanted to have two of them”, emphasizes Julien Dorsaz, the manager of the photolithography division of the CMi. To get insights into the work at the CMi, and to learn about the MLA 150 experience of the users, we conducted a 30-minute interview with Julien Dorsaz. Get the full interview on our YouTube channel.

Today, the MLA 150 serves as a trusted, indispensable workhorse in many multi-user facilities, microfabrication labs, and research institutes. Since its market introduction, the MLA 150 has developed into one of our most important technologies in our company’s product portfolio. Setting the bar for state-of-the-art maskless lithography, the MLA 150 promises continuous market growth in the coming years.

For further information please visit: www.heidelberg-instruments.com

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Deventer, December 15, 2022 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, and NOVELDA, the world leader in UWB (Ultra-Wideband) sensing solutions, today announce that the companies have reached agreement on the qualification, test and supply of NOVELDA’s new generation of UWB devices. The Ultra-Wideband Sensor can detect the tiniest movements, even breathing and heartbeat. This ability enables NOVELDA to offer the most reliable human presence sensor in the world. It will automatically activate a device like a laptop, an LCD screen or a ceiling lamp, when you need it, and turn the device off when you leave. This is useful in a variety of indoor applications in consumer electronics, building automation and in smart building systems. NOVELDA UWB Sensor enables new levels of user experience, increases safety, and reduces energy consumption.

The cooperation with RoodMicrotec as European partner enables NOVELDA to manage faster qualification and industrialization of new products. Effective collaboration, both on engineering and management level, and combining each partner’s expertise is allowing ‘first time right’ development of test solutions, qualification processes and rapid launch of production testing and supply. Furthermore, being a long-term partner, RoodMicrotec will support NOVELDA in continuously optimizing testing procedures to drive cost down over time.

RoodMicrotec will be partnering with NOVELDA in serving the global UWB market, which is forecasted by TSR (Techno System Research) to reach from 300 million units shipped in 2022 towards more than 1.8 billion units shipped by 2030.
“This collaboration provides us with faster time-to-market of our innovative UWB solutions, continuity of supply and constant focus on improvements both in quality and cost”, says Jan-Bjørnar Lund, NOVELDA’s CEO.
For RoodMicrotec, this partnership matches well within its portfolio of capabilities and services, as European leading test house.

Martin Sallenhag, CEO of RoodMicrotec, says: “This partnership is right within the sweet spot of our business proposition; combining our expertise with our customers' interests. We support our customers with state-of-the art RF test development and equipment in 24/7 highly flexible production test environment, complying with world class quality standards.”
 
About NOVELDA
NOVELDA, the world leader in UWB sensing solutions, provides the world’s most accurate, intelligent and reliable sensor solution for human presence detection. NOVELDA Ultra-Wideband (UWB) short-range impulse radar sensors help save energy and achieve new levels of user experience and interactivity in a variety of indoor applications, including consumer electronic devices and smart building systems. NOVELDA technology complies with worldwide UWB regulations and is protected by several design patents.

Further information
Tove Elisabeth Lutdal – VP Marketing
Phone: +47 90 73 49 49 Email: [email protected] Web: www.novelda.com

About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well-established as a highly valued partner for many companies worldwide. The company provides full-turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors. RoodMicrotec’s headquarter is located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.
For more information visit https://www.roodmicrotec.com

Further information
Martin Sallenhag - CEO, Arvid Ladega – CFO
Phone: +31 570 745623 Email: [email protected] Web: www.roodmcirotec.com

This press release is published in English and German. In case of conflict between these versions the English version shall prevail.

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MILPITAS, CALIF. –– November 15, 2022 –– The 2022 Phil Kaufman Award ceremony and banquet honoring Dr. Giovanni De Micheli will be held Thursday, February 23, 2023, from 6:30 p.m. until 9:30 p.m. at The GlassHouse, 2 South Market Street in San Jose, Calif.

The evening will be hosted by the Electronic System Design Alliance (ESD Alliance) and the IEEE Council on Electronic Design Automation (CEDA). Early bird ticket pricing is available through Friday, January 13, 2023, at $175 per individual from member companies and $225 each for non-members. After January 13, member tickets are $225 each and $275 per non-member. Member pricing is offered for individuals or companies that are active SEMI or IEEE members.

Corporate sponsorship opportunities are available. Contact Bob Smith, executive director of the ESD Alliance, at [email protected] for more information.

Dr. De Micheli is Professor and Director of the Institute of Electrical Engineering (IEL) and of the Integrated Systems Centre at the École Polytechnique Fédérale de Lausanne (EPFL) in Lausanne, Switzerland. He is being recognized for his contributions to electronic design automation (EDA). His research on EDA tools and methodologies has helped drive significant advances in the academic field of design automation and made a lasting impact on the industry through their incorporation into commercial EDA solutions.

About the Phil Kaufman Award
The Phil Kaufman Award, co-sponsored by the ESD Alliance and CEDA, honors individuals who have had a demonstrable impact on the field of electronic system design through technology innovations, education/mentoring, or business or industry leadership. The annual award was established in 1994 as a tribute to Phil Kaufman, the late industry pioneer who turned innovative technologies into commercial businesses that have benefited electronic designers. The 2021 recipient was Dr. Anirudh Devgan, President and CEO of Cadence Design Systems. Visit the Phil Kaufman Award webpage for more details and a list of previous recipients.

About the IEEE Council on Electronic Design Automation (CEDA)
The IEEE Council on Electronic Design Automation (CEDA) provides a focal point for EDA activities spread across seven IEEE societies (Antennas and Propagation, Circuits and Systems, Computer, Electron Devices, Electronics Packaging, Microwave Theory and Techniques, and Solid-State Circuits). The Council sponsors or co-sponsors over a dozen key EDA conferences including: the Design Automation Conference (DAC), Asia and South Pacific Design Automation Conference (ASP-DAC), International Conference on Computer-Aided Design (ICCAD), Design Automation and Test in Europe (DATE), and events at Embedded Systems Week (ESWEEK). The Council also publishes IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems (TCAD), IEEE Design & Test (D&T), and IEEE Embedded Systems Letters (ESL). The Council boasts a prestigious awards program in order to promote the recognition of leading EDA professionals, which includes the A. Richard Newton, Phil Kaufman, and Ernest S. Kuh Early Career Awards. The Council welcomes new volunteers and local chapters.

Stay in touch with IEEE CEDA:
Website: www.ieee-ceda.org
LinkedIn: https://www.linkedin.com/groups/8343531
Facebook: https://www.facebook.com/ieeeceda/
Twitter: https://twitter.com/IEEECEDA

About the SEMI Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community representing members in the electronic system and semiconductor design ecosystem, is a community that addresses technical, marketing, economic and legislative issues affecting the entire industry. It acts as the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry.

Follow SEMI ESD Alliance
www.esd-alliance.org
ESD Alliance Bridging the Frontier blog
Twitter: @ESDAlliance
LinkedIn
Facebook

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microMIRA™ provides highly uniform, force-free lift-off of material layers at high speeds;
more than ten 3D-Micromac laser systems sold for microLED applications to date

Chemnitz, Germany, November 7, 2022—3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, glass and display markets, today announced that a leading optical solutions provider has purchased multiple microMIRA™ Laser Lift-Off (LLO) systems from 3D-Micromac for use in the production of microLED devices. The customer will install the new microMIRA systems in pilot- and production lines at its state-of-the-art LED chip factory in Asia.

Laser Lift-Off an Enabling Process for microLEDs
MicroLEDs have the potential to revolutionize the display industry, promising a variety of advantages such as superior viewing angle, high dynamic range with perfect black luminance and high brightness, wide color gamut, fast refresh rates, long lifetime, and low power consumption. Potential applications include very large displays for indoor and outdoor use, as well as high-resolution displays for augmented reality (AR) and virtual reality (VR) wearable devices.

However, the microLED fabrication process is vastly more complex than LCD and OLED manufacturing, and faces several technical challenges that must be overcome before microLEDs can be readily available in the mass market. Among these challenges is detaching and transferring the processed microLED chips from the donor or growth substrate (e.g., sapphire) to an intermediate substrate for subsequent testing without damaging the expensive growth substrate, allowing it to be repurposed for future use. The microMIRA system from 3D-Micromac precisely addresses this task with superior performance.

3D-Micromac’s microMIRA system provides highly uniform, force-free lift-off of different layers on large-area substrates at high processing speeds without the need for costly and polluting wet chemical processes. The unique line beam system is built on a highly customizable platform that can incorporate different laser sources, wavelengths and beam paths to meet each customer’s unique requirements. The system is capable of processing different substrate materials and sizes, and can achieve processing speeds (including handling) of up to 60 eight-inch wafers per hour.

According to Uwe Wagner, CEO of 3D-Micromac, “This multiple system order is a testament to our ability to provide innovative and enabling laser micromachining solutions for industrial applications serving both mature and emerging markets. It also represents an important milestone for 3D-Micromac as we continue to expand our product offerings and services into the display industry, addressing the production needs for exciting new display technologies, including microLEDs. To date, 3D-Micromac has sold more than 10 laser processing systems for microLED applications, including our industry-benchmark microMIRA laser-lift-off system as well as our recently introduced microCETI™ micromachining platform.”

The microMIRA LLO system has been used successfully in mass production by electronics manufacturers globally for years. In addition to gallium nitride (GaN) lift-off from glass and sapphire substrates in microLED display manufacturing, the microMIRA system can also be used for layer separation in semiconductor and sensor manufacturing, as well as for laser annealing and crystallization for surface modification.

More information on microMIRA, including our latest white paper “Laser technologies for microLED production,” can be found at https://3d-micromac.com/laser-lift-off/micromira/.

About 3D-Micromac
Founded in 2002, 3D-Micromac AG is the industry leader in laser micromachining, delivering powerful, user-friendly and leading-edge processes with superior production efficiency. We develop processes, machines and turnkey solutions at the highest technical and technological level. 3D-Micromac systems and services have been successfully implemented in various high-tech industries worldwide including photovoltaic, semiconductor, glass and display industries, micro diagnostics, and medical technology. For more information, visit the company’s website at http://www.3d-micromac.com.

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