At the end of 2022, there were 167 semiconductor fabs processing 300mm wafers for the fabrication of ICs, including CMOS image sensors, and non-IC products such as power discretes.

While the semiconductor market downturn persists, 13 new 300mm wafer fabs are still being brought online in 2023. These new fabs are mostly for the production of power transistors, advanced logic, and foundry services.

Based on construction schedules as of late 2022, 15 300mm fabs will be brought online in 2024, 13 of them for production of ICs. A record number of fabs are expected to open in 2025 with 17 scheduled to begin production. With cutbacks in spending during 2023, some fabs previously scheduled to open in 2024 could be delayed to 2025. By 2027, the number of 300mm fabs in operation should exceed 230. These are projections made in Knometa’s Global Wafer Capacity 2023 report.

An increasing number of 300mm fabs are being built to fabricate non-IC devices, and power transistors in particular. The manufacturing cost benefits of processing chips on the large wafers come into play for device types characterized by large die sizes and high volumes. Examples of integrated circuits with these characteristics include DRAMs, flash memory, image sensors, complex logic and microcomponent ICs, PMICs, baseband processors, audio CODECs, and display drivers. While large-size power transistors are still small compared to the die sizes of these ICs, they ship in high volumes and are big enough to keep a 300mm fab loaded at a cost-effective production level.

Of the 13 300mm wafer fabs opening in 2023, five are focused on the production of non-IC products, with three of them located in China and two in Japan.

Two-thirds of the new 300mm fabs opening this year are for foundry services, with four of them wholly dedicated to the service of fabricating semiconductors for other companies on a foundry basis.

ST formed two separate partnerships to add new 300mm fab capacity at existing sites in Crolles, France, and Agrate, Italy. In Crolles, ST is working with GlobalFoundries to add new capacity for advanced logic and foundry services. In Agrate, ST and Tower Semiconductor are adding capacity for mixed-signal, power, RF, and foundry services.

Much of the pain from the current market contraction is being felt in the memory chip arena. Not surprisingly, there are no new 300mm fabs for memory opening in 2023.

About Global Wafer Capacity 2023
Global Wafer Capacity provides a detailed examination of existing fab capacity along with a five-year forecast to 2027. The report has been published on an annual basis since 2007, initially by IC Insights. In December 2021, IC Insights transferred business associated with Global Wafer Capacity to co-founder Trevor Yancey. Mr. Yancey became an independent contractor in 2014 but continued as the principal analyst and project manager for Global Wafer Capacity. Published in January 2023, Global Wafer Capacity 2023 is sold by Mr. Yancey’s company Knometa Research. For more information, visit https://knometa.com/gwc.

About Knometa Research
Knometa Research is a semiconductor technology and market analysis firm led by former IC Insights executive, Trevor Yancey. Mr. Yancey co-founded IC Insights in 1997 with Bill McClean and Brian Matas. In 2014, Mr. Yancey established Knometa Research to serve as an independent contractor for IC Insights and TechSearch International. For more information, visit https://knometa.com.

• Read more about Despite market weakness, new 300mm fabs still opening in 2023, many for power discretes

Effective July 1st, Photodigm is reducing the retail price of its Distributed Bragg Reflector (DBR) semiconductor laser diodes by 25% and showcasing a new product strategy to deliver savings and simplicity to its global customer base.

JUNE 26, 2023 (RICHARDSON, TX) –– Photodigm is thrilled to announce that as of July 1st, its entire product portfolio of Distributed Bragg Reflector (DBR) laser diodes will receive a historic 25% price reduction and new strategic approach to deliver savings and simplicity to its global customer base.

The semiconductor manufacturer announced a progressive tiered pricing strategy earlier this year to provide discounts on higher-volume orders of 100 units or more. As customer demand continued to increase, Photodigm intentionally invested in R&D projects partnering with the Office of Naval Research (ONR) to raise yields and overall volume of their fab, evolving from the company’s early years of on-demand production where it operated much like a university research lab.

“As we continue our journey to ever-improving laser lifetimes with better quality, higher yields, and gains in our overall production process, we are intentionally leveraging every opportunity to drive value to our customers,” said Bill Stuart, President and CEO of Photodigm.

Photodigm’s product portfolio now boasts thirty-two wavelengths of DBR laser diodes including Spectroscopy Certified devices tuned to unique elements like Rubidium which is often used in biomedical sensing applications or atomic clocks in GPS-denied environments for military applications.

To empower its customers, Photodigm restructured its product line around four simple decisions –– application (wavelength), functionality (chip architecture), added customization, and device packaging all with transparent pricing to provide a clear understanding of the added value in each selection.

“We’re putting our customers in the driver's seat by providing them with greater insight into our product capabilities and pricing than ever before,” says Mandy Eaton, VP of Sales & Marketing at Photodigm. “One of our core tenets at Photodigm is to foster innovation through collaboration and our new strategic approach to our product [portfolio] invites customers to shop, but also prompts them to ask themselves what they really need our technology to provide, which helps us evolve together.”

Photodigm, Inc. is the only 100% U.S.-based commercial manufacturer of semiconductor DBR laser diodes 730–1090nm with a global clientele of corporations, government entities, space programs, research labs, and universities. View the new catalog offering and updated pricing at www.photodigm.com/DBR.

About Photodigm, Inc.
For over 20 years Photodigm, Inc. has been the only 100% U.S.-based semiconductor manufacturer of single spatial and longitudinal mode Distributed Bragg Reflector (DBR) laser diodes. DBR lasers are essential to quantum sensing and atomic clock manufacturers, optical metrology and sensing, and laser spectroscopy. Headquartered in Richardson, Texas, they design and produce fixed wavelength diode lasers best known for their accuracy and reliability. Learn more at Photodigm.com.

• Read more about PHOTODIGM UNVEILS A STRATEGIC PRODUCT RESTRUCTURING PAIRED WITH A 25% PRICE REDUCTION AS CUSTOMER DEMAND CONTINUES TO DRIVE INCREASED PRODUCTION

Dresden, 21 June 2023. On 19 June, Masao Hodai, Chief Operating Officer of EBARA Precision Machinery Company Tokyo, visited EBARA’s German site in Dresden-Weixdorf. After a welcome by Dr Reinhart Richter, Managing Director of EBARA Precision Machinery Europe, an informative tour followed, during which Masao Hodai inspected the Overhaul Centre for vacuum pumps, built in 2021, the warehouse, the training facilities currently being built, and representatives from the most important product divisions. A joint lunch with members of Dresden’s staff rounded off his visit.

Strong signal for the Dresden location
“The visit of COO Masao Hodai reinforces our location within the Silicon Saxony region and shows the significant status of the semiconductor industry in Dresden for EBARA’s headquarters in Japan. Our progress in terms of safety, quality, CO2 reduction and market acquisition has made a deep impression. All EBARA employees in Dresden feel very honoured by this visit from Japan”, said Dr Reinhart Richter, happily. In the afternoon, in-depth client meetings were on the agenda at the Dresden site before Masao Hodai returned home to Tokyo.

About EBARA
EBARA Precision Machinery Europe (EPME) GmbH, headquartered in Sauerlach near Munich, is the European sales and service company of EBARA Corporation Tokyo. EBARA is a leading global manufacturer of vacuum and semiconductor systems used to produce wafers, liquid crystals, solar cells and other high-tech products. EBARA Corporation was founded in 1912 by Issey Hatakeyama and employs over 19,000 people worldwide. With an annual turnover of 4.7 billion euros, EBARA is one of the largest companies in the industry. EBARA supplies 16 of the top 20 manufacturers in the chip industry.

About EBARA Precision Machinery Europe
The EPME portfolio includes dry and turbomolecular vacuum pumps as well as modern gas abatement systems for the chemical industry, for example. In addition, EPME distributes state-of-the-art CMP tools, wafer bevel polishing and substrate coating systems for chip manufacturing. In 2021 EBARA opened its second modern overhaul centre for vacuum pumps in Dresden. EPME has been operating a vacuum pump overhaul centre in Livingston (UK) since 1993. EPME employs over 250 people in Europe and Israel.
Photo: EBARA / Tommy Halfter

• Read more about Important visitor from Japan – from parent company EBARA Corporation Tokyo

Virginia Beach, Virginia - Busch Vacuum Solutions, a leading provider of reliable solutions for SubFab Management, is proud to exhibit at this year's SEMICON West show and conference. As a reliable partner for vacuum pumps, gas abatement systems, leak detection and more, Busch provides the semiconductor industry with the highest quality solutions and services.

At SEMICON West, Busch is showcasing their comprehensive subfab management services. Critical SubFab systems are monitored and predictively maintained by Busch. Their SubFab management minimizes production downtime and enables energy-efficient operation and cost savings. Continuous monitoring extends maintenance intervals and the entire product life cycle. All Busch on-site service teams are certified to ISO9001:2016, ISO14001:2016 and ISO45001:2018 standards.

"We are proud of our comprehensive solutions for the semiconductor industry," said Mark Magill, Vice President of Medium High Vacuum at Busch Vacuum Solutions. "SubFab service capabilities and innovative products provide customers with reliable performance and maximum process safety to achieve optimal yields."

Magill also said they are featuring a new patented redundancy vacuum system at the show, “It uses an optimized combination of two pumps plus one booster to minimize changes in chamber pressure in case of pump failure.” This vacuum system eliminates wafer scrap and process excursion.

Visit Busch Vacuum Solutions at SEMICON WEST from July 11-15 in San Francisco, CA. Meet their experienced vacuum experts, exchange ideas and get valuable advice at booth #541.

About Busch
For more than 50 years, Busch has been an integral part of the global semiconductor industry by providing reliable solutions that enable manufacturers to produce advanced microchips. Their commitment to quality is in every product they offer and service provided. Continuous advancements ensure that Busch solutions are always state-of-the-art and used by hundreds of subfabs worldwide. www.buschusa.com | [email protected]

• Read more about Busch Vacuum Solutions Exhibiting at SEMICON West 2023

PEER Group® has announced an upcoming webinar designed to help semiconductor equipment manufacturers prepare for the increasing demand from backend factories for automation capabilities and SEMI® Standards compliance in assembly and test processes.

Taking place on June 22, 2023, at 1:00 p.m. ET/11:00 a.m. MT, the webinar, Standardizing the Assembly and Test Process, will feature an in-depth discussion between Jason Cicero, Micron Technology’s Senior IT Domain Architect, and PEER Group’s Director of Marketing, Doug Suerich.

Topics covered will include: why the backend, including assembly and test, needs more automation and standardization, how this will impact equipment design and integration, common issues faced by factories when integrating new tools, and how equipment suppliers can help solve these issues. There will also be a live Q&A for attendees to ask questions during the webinar.

“The SEMI Standards Program has been around for more than 40 years,” says Suerich. “During that time, these standards have evolved into the guiding principles which ensure compatibility and interoperability across suppliers and factories, improving manufacturing productivity, quality, and reliability, and reducing the cost and pain of integrating new equipment onto the factory floor. Universally adopted in the frontend, we are starting to notice increasing demand from factories to implement standards in the backend, including assembly and test processes.”

Evidence of this shift is seen as major players in the frontend enter the assembly and test market while established facilities announce major capital investments into their operations. This expansion introduces new, high-value processes to assembly and test and closer integration with the frontend – both of which are enabled through the application of standards. Meanwhile, the SEMI Advanced Backend Factory Integration task force continues to investigate and promote the adoption of SEMI Standards for assembly and test.

The webinar is scheduled to last 30 minutes followed by a 15-minute Q&A. All registrants will have the opportunity to access a recording of the webinar. For more information, including how to register, visit: https://bit.ly/3mq2yf3

About PEER Group
PEER Group® is the largest supplier of innovative factory automation software products for the semiconductor industry. Since 1992, our solutions have helped the world’s most advanced OEMs and factories reduce time to market and lower costs by solving their equipment automation, data management, and process control problems. A multi-award winning company, PEER Group has been named a Best Workplace by Great Place to Work Canada 11 times, and most recently was one of six recipients of Intel’s 2022 EPIC Outstanding Supplier Award, which recognizes the absolute top performers in the Intel supply chain. Follow PEER Group on LinkedIn and Twitter at @PEERgroup_Inc..

• Read more about PEER Group presenting webinar on the adoption of SEMI Standards for assembly and test processes

Deventer, May 11, 2023 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, and Svenska Grindmatriser AB (SGA), a well-established fabless IDM for the development and supply of customized mixed-signal ASICs, today announce that the companies have started a cooperation for high-volume production testing of SGA’s ASIC products.

The cooperation with RoodMicrotec as European partner enables SGA to meet the rapidly growing market demand. Furthermore, RoodMicrotec as a supplier will help SGA to strengthen its supply chain by providing flexible testing capacities as well as other quality assessment services.

“This collaboration offers us the opportunity to grow faster. In addition, both companies benefit from each other's knowledge, which is of tremendous value! Therefore, I am expecting this cooperation to be growing to a strategic level”, says Henrik Sjöberg, CEO of SGA.

Being a leading European service provider in the semiconductor industry, this partnership matches well with RoodMicrotec’s portfolio of capabilities.

Martin Sallenhag, CEO of RoodMicrotec, says, “This cooperation shows that we are a reliable partner for test and quality services in Europe. It is always nice to see that such strong companies as SGA rely on our expertise and test capabilities. In addition, this project helps us to strengthen our position as a service provider for the Swedish semiconductor industry.”

About SGA
SGA is a fabless manufacturer of analog and mixed-signal ASICs. SGA works closely with customers throughout the entire product lifecycle, from development to high-volume production. SGA's deep technical expertise and continuous quality focus has led to long-lasting partnerships in a broad set of industries. The company was founded in 1986 and is located in the city of Linköping, Sweden.
For more information please visit www.sga.se.
Further information
Henrik Sjöberg, CEO or Andreas Marinus, Sales
Phone +46 13 36 46 60, E-mail [email protected]

About RoodMicrotec
With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is a leading independent company for semiconductor supply and quality services. RoodMicrotec is a highly valued partner for many companies worldwide and offers specifically tailored turnkey solutions for each single customer's requirements. The turnkey services include project management, wafer test, assembly, final test, qualification, failure analysis, and logistics. All services provided by RoodMicrotec meet the high quality standards of the automotive, industrial, healthcare, and high reliability aerospace sectors. RoodMicrotec is headquartered in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.
For more information please visit https://www.roodmicrotec.com
Further information
Martin Sallenhag, CEO or Arvid Ladega, CFO
Phone +31 570 745623, E-mail [email protected]

This press release is available in English and German. In case of conflict between these versions, the English version shall prevail.

• Read more about RoodMicrotec and SGA enter into cooperation for ASIC testing

Heidelberg, Germany – Heidelberg Instruments, a global player in direct write technology and solution provider for the advanced packaging market, is transforming the semiconductor industry with its maskless laser lithography system, the MLA 300. Continuous and repeat orders of MLA 300 systems confirm Heidelberg Instruments' capabilities and customer satisfaction.

MLA 300 is increasing production capacity for wafer-level packaging providers.

Flexible designs, high throughput, uniformity, and yield are the basic requirements in the semiconductor industry. The MLA 300 Maskless Aligner meets all of these requirements and more, with its capability to expose a tailor-made design on each substrate to match the actual die locations. Unlike a fixed mask, the design data can be tailored and augmented before exposure, enabling yield improvements by compensating for line width bias due to processing or loading re-mapped designs that include die shift. In addition, serial number labeling and other dynamically generated, unique patterns can be added to each exposure.

The MLA 300 is optimized for industrial volume production and features distinct benefits such as full automation. The flexibility of maskless lithography allows rapid design customizations, even unique designs on each substrate, which can be updated automatically. This is particularly useful for chip packaging where mounted die shift due to the curing of a reconstituted wafer or panel. The MLA 300 system seamlessly integrates into wafer-level packaging production lines, fully automating production with a resolution down to 2 µm lines and spaces. Customers benefit from reduced production costs and efforts by eliminating mask procurement, verification, and management requirements. Operating costs are reduced by utilizing a long-lifetime exposure laser and fewer consumables. The modularity enables fast maintenance, replacement, or repair. Real-time autofocus compensates substrate warp or corrugations for flawless patterning.

“We are thrilled to witness this cutting-edge technology’s impact on the industry, and we’re excited that many important companies and groups are taking this journey with us. The MLA 300 is a game-changer in maskless lithography,” states Alexander Forozan, Head of Global Sales and Marketing at Heidelberg Instruments Group. “Its revolutionary features transform the production process, delivering unmatched precision and high throughput. So, whether you want to enhance productivity or streamline your operations, the MLA 300 is designed to exceed your expectations.”

Introduced into the market at the end of 2019, the MLA 300 Maskless Aligner is the first direct exposure system specially designed for industrial applications in advanced packaging, wafer-level packaging, electronics components, sensors, MEMS, and many more.

With continuous order intakes from leading wafer-level packaging providers in Asia, the Heidelberg Instruments MLA 300 Maskless Aligner has proven capabilities and customer satisfaction, making the company poised for growth in the demanding and fast-growing high-technology market.

Contact:
Sonja Pfeuffer
Head of Global Marketing
[email protected]

Further information:
https://heidelberg-instruments.com/

About Heidelberg Instruments Mikrotechnik GmbH
With over 35 years of experience and over 1,300 systems installed worldwide, Heidelberg Instruments is a world leader in designing, developing, and manufacturing high-precision laser lithography systems, maskless aligners, and nanofabrication tools. Industry stakeholders and working groups of renowned universities and research institutes worldwide use Heidelberg Instruments systems for advanced micro- and nanofabrication. Fields of applications include micro-optics and microsystems technology, photonics, electronics, semiconductors/ advanced packaging, quantum computing, MEMS/NEMS, micro-mechanics, biomedical engineering, 2D materials, IoT, and many more. Heidelberg Instruments provides lithography solutions tailored to meet our global customers' micro- and nanofabrication requirements – no matter how challenging.

• Read more about Redefining Wafer-Level Packaging Production with Heidelberg Instruments Flexible Direct Writing Technology

RoodMicrotec shows strong financial performance for the year 2022.
• Total income of EUR 16.5 million with an EBITDA of EUR 3.9 million
• Net profit of EUR 2.4 million
• Cash flow from operating activities of EUR 3.6 million

Deventer, April 20, 2023 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, today publishes the Company’s Annual Report for the financial year 2022 including the audited consolidated and company financial statements. The 2022 Annual Report is available for download on the corporate website: www.roodmicrotec.com/en/investor-relations-en/financial-publications.

The total income for 2022 amounted to EUR 16.5 million, which is 14% higher than in 2021 (EUR 14.5 million) resulting in a second consecutive year with double-digit growth. Notably, this is the highest total income since 2000, and it shows that RoodMicrotec is focusing on the right fast-growing future-oriented markets.

“Once again, we managed to exceed the outlook and deliver a higher total income as well as a higher profit. In the first and second quarter of 2022, we generated a total income that was similar to the fourth quarter of 2021, which was a very good start of the year,” says Martin Sallenhag, CEO of RoodMicrotec. “In the third and fourth quarter of 2022, we saw a steady increase in total income making the full year the best in over 20 years. The profit before tax for the year as well as the overall liquidity put us in a good position for future investments in machinery and services. This allows us to focus on growing the business with new customer engagements.”

Throughout the year, the Test Operations department continued to deliver outstanding results. The total income increased from EUR 7.9 million in 2021 to EUR 10.0 million in 2022, which is a growth of 26%. Our long term customers are increasing their demand and we are able to support them with additional capacity. In 2022, we have added both manpower and new machines to support the expanding business.

The Supply Chain Management unit is growing thanks to long-term projects. The total income increased from EUR 3.4 million in 2021 to EUR 3.5 million in 2022, a growth of 5% year-over-year. This is also driving turnover in the other units, especially in the Test Operations department.

In the Qualification & Failure Analysis department we have seen a big increase in request for counterfeit analysis. Due to the shortage of components, it is becoming more important to analyze the used components before going into mass production. RoodMicrotec is the first and only company in Germany to offer the counterfeit electronic parts standard SAE AS6081 as an accredited method according to DIN EN ISO/IEC 17025:2018.

2022 HIGHLIGHTS / MAIN DEVELOPMENTS

Financials
• Total income: EUR 16.5 million (2021: EUR 14.5 million).
• EBITDA: EUR 3.9 million (2021: EUR 2.8 million).
• Balance sheet total: EUR 17.2 million (2021: EUR 15.0 million).
• Net result: EUR 2.4 million profit (2021: EUR 1.4 million profit).
• Net cash flow from operating activities: EUR 3.6 million (2021: EUR 2.0 million).

Commercial/operational
• RoodMicrotec has continued to expand its services in the areas defined in the Company’s technology roadmap. High frequency test solutions are being developed for our demanding customers based on this new technology and their demand for production test.
• The first projects to qualify high power electronics according AQG 324 have been started in the Qualification & Failure Analysis department. These new services have been added to handle high power devices aimed for battery management and control.
• RoodMicrotec and Rohde & Schwarz have been working together for over 10 years and in this period RoodMicrotec has carried out the test development for various high frequency ASICs used by Rohde & Schwarz in their products. RoodMicrotec performs wafer and component level tests as well as qualifications prior to product launch. For the coming years, further projects of this kind are already scheduled.
• The world leader in UWB (Ultra-Wideband) sensing solutions, Novelda, and RoodMicrotec have reached an agreement on qualification, test, and supply of a new generation of UWB devices. The Ultra-Wideband Sensor can detect the tiniest movements, even breathing and heartbeat. The cooperation with RoodMicrotec as European partner enables Novelda to manage faster qualification and industrialization of new products. Effective collaboration, both on engineering and management level, and combining each partner’s expertise is allowing ‘first time right’ development of test solutions, qualification processes, and the rapid launch of production testing and supply.
• The order book is at a higher level than in the beginning of the year, even though the total income was higher than budgeted. This means that the book-to-bill ratio was above 1 for the year.
• During 2022, we have continued to progress the booked SCM projects towards production through test program development as well as qualification work. Some projects have been released for production and we start to see the first volumes for these customers. The turn-key project for a Swiss customer, which includes the design of an ASIC by a design house partner, packaging of the device in Asia, qualification, and in-house test development, is progressing well. The volume production for this device will be launched early in 2023 in the RoodMicrotec facility in Nördlingen.
• The nationally and internationally funded APPLAUSE project “Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe,” fosters the European semiconductor value chain by building new tools, methods and processes for high volume manufacturing. RoodMicrotec has taken over the leadership of the work package “testing, reliability, failure analysis and metrology”. The project has delivered exceptional results with significant immediate or potential impact. The progress over the last period was convincing.
• As a full and final settlement of the 2012 perpetual bond, RoodMicrotec GmbH has paid Robus a total settlement amount of EUR 400k nominal, i.e. without any interest, in two equal nominal installments of EUR 200k on February 28, 2022 and June 30, 2022. This final settlement has been reached before and confirmed by the Regional Court of Hamburg in February 2022.
 
Events after balance sheet date
• RoodMicrotec GmbH has entered into an agreement for a full and final settlement with Prime Capital Debt SCS, SICAV-FIS – Robus Recovery Sub-Fund (“Robus”) regarding the perpetual bond that RoodMicrotec GmbH issued in 2010 and which is held by Robus.

Following an oral hearing held on March 7, 2023, both parties have reached agreement on a full and final settlement that was reached before and confirmed by the Regional Court of Frankfurt am Main. Pursuant to the settlement, RoodMicrotec GmbH shall pay a total amount of EUR 2,194k (110% of the nominal value of the perpetual bond issued in 2010), in four equal installments of EUR 548k, by March 31, June 30, September 30, and December 31, 2023.
 
Key figures
(x EUR 1,000 unless stated otherwise) 2022 2021

Results & Cash
Total income 16,548 14,532
EBITDA 3,898 2,786
EBITDA as % of total income 23.6% 19.2%
EBIT (operating result) 2,451 1,227
EBIT as % of total income 14.8% 8.4%
Profit (loss) before tax 2,271 1,038
PBT as % of total income 13.7% 7.1%
Net result 2,380 1,435
Net cash position (year-end) 3,682 2,558
Net cash flow from operating activities 3,553 2,049

Capital, Debt & Liquidity Ratios (at year-end)
Total assets 17,197 15,014
Equity 7,850 5,583
Net debt -805 374
Invested capital (net debt + equity) 7,045 5,957
Gearing ratio (net debt / invested capital) -11% 6%
Solvency (equity / total assets) 46% 37%
Debt ratio (net debt / EBITDA) -0.2 0.1
Net working capital (working capital - net cash position) 211 317
Net working capital ratio (net working capital / total income) 1.3% 2.2%
ROCE (EBIT / average invested capital) 37.7% 21.0%

Assets (at year-end)
Tangible and intangible fixed assets 8,765 8,295
Investments in (in)tangible fixed assets 1,743 681
Depreciation of (in)tangible fixed assets 1,447 1,559

Data per share (x EUR 1)
Equity 0.105 0.074
Operating result 0.033 0.016
Net cash flow from operating activities 0.047 0.027
Net result 0.032 0.019
Share price: year end 0.205 0.201
Share price: highest in the year 0.215 0.267
Share price: lowest in the year 0.171 0.176

Other information
Number of issued shares at year end (in millions of shares) 75.1 75.1
Average number of employees (FTE) 94 89
Total income / average FTE 176 163
Market capitalization (in EUR millions) 15.4 15.1

 
Total income and result
In 2022, RoodMicrotec’s total income of EUR 16.5 million was 14% higher than in 2021 (2021: EUR 14.5 million), with 92% of its total sales effected in the European countries.
Total income from the Automotive sector increased by 18% to EUR 8.1 million in 2022 (2021: EUR 6.9 million) and represents 49% of the total income. Total income in the Industrial / Medical sector increased by 7% to EUR 6.7 million in 2022 (2021: EUR 6.3 million) and represents 40% of the total income. The HiRel / Aerospace segment declined by 8% to EUR 0.8 million (2021: EUR 0.9 million) and with 5% only represents a small percentage of the total income. The income in this sector mainly consists of failure analysis and qualification work and this is very much depending on our customers’ design cycles. Total income in other sectors increased by 105% to EUR 0.9 million (2021: EUR 0.5 million).
Total income by market sector:
(x EUR 1,000) 2022 2021 change

Automotive 8,094 6,886 17.5%
Industrial / Medical 6,683 6,270 6.6%
HiRel / Aerospace 849 926 -8.3%
Others 922 450 104.9%

Total 16,548 14,532 13.9%

Throughout 2022, the Test Operations unit showed a strong increase, which was related to the superior services and the excellent position RoodMicrotec has with its existing and new customers. The Supply Chain Management unit showed a limited increase compared to last year. The sharp increase in the second half of 2022 compared to the first half of 2022 was due to a higher demand for existing products as well as the production ramp-up in the context of new long-term contracts. In 2022, the Qualification & Failure Analysis unit saw a decrease compared to 2021. However, the total income for the second half of 2022 was 9% higher than for the first half of 2022, which shows that new customer projects are now starting.
Total income results per operational unit:
(x EUR 1,000) 2022 2021 change

Supply Chain Management 3,533 3,364 5.0%
Test Operations 10,035 7,938 26.4%
Qualification & Failure Analysis 2,980 3,230 -7.7%

Total 16,548 14,532 13.9%

Operating result
The Company recorded an operating result for 2022 of EUR 2.5 million compared to EUR 1.2 million in 2021, and thus an increase of 99.8%. The increase in total income only led to a modest rise of expenses for raw materials and consumables (in 2021, expenditures for raw materials and consumables were exceptionally high due to a high level of wafer deliveries). Combined with a lower increase in operating expenses than in total income, this led to an increase in the operating margin from 8.4% in 2021 to 14.8% in 2022.

Net result
The Company recorded a net result of EUR 2.4 million profit for 2022, which is an increase of 65.9% compared to 2021. 

Personnel and organization
During 2022, RoodMicrotec continued to optimize the organization to keep track with the changing demands from customers and markets. Furthermore, highly experienced personnel has been recruited for support of the Company’s future plans. The average number of full time employees (FTE) in 2022 was 94. Total income per average full-time employee increased to EUR 176,000 from EUR 163,000 in 2021. RoodMicrotec’s policy is to strive for growth of sales per FTE.
Looking back, RoodMicrotec got through the COVID-19 period very well and without any material impact on staffing levels. The measures taken with facial masks, distance between the working places, home offices, and general care, offered a safe environment for all employees.

Outlook
RoodMicrotec expects the total income for 2023 to be in the range of EUR 17.0 million to EUR 17.5 million, with a profit before tax of 5-10% and thus in line with the financial targets. The geopolitical situation in the world and the current energy crisis throughout Europe could have an impact on the Company’s business. The Management is keeping a close eye on the situation and is doing everything possible to mitigate any potentially negative impact.

Conference call
You are invited to take part in RoodMicrotec’s conference call for shareholders, financial press, and analysts via Microsoft TEAMS on
Thursday, April 20, 2023 at 9:30 CEST.
The Board of Management, Martin Sallenhag and Arvid Ladega, will comment on the Annual Report 2022 in detail and will answer your questions.
To join the event please follow these login instructions:
Join with your computer or mobile app Click here to join the meeting
Or call in (audio only)
+49 69 509544247 Germany, Frankfurt am Main
+31 20 399 9804 The Netherlands, Amsterdam
+32 2 895 09 68 Belgium, Bruxelles
+41 43 217 23 02 Switzerland, Zurich

Find a local number – in case you are in another country
Phone Conference ID: 124 673 558#
Annual General Meeting of Shareholders
The Annual General Meeting of Shareholders of the Company will be held on Tuesday, June 6, 2023 at 15:00 CEST at the Amsterdam Stock Exchange (EURONEXT), Beursplein 5, 1012 JW Amsterdam, the Netherlands.
The convening notice (including registration and voting instructions) and the agenda with explanatory notes, as well as all other meeting documents for the AGM, including the 2022 Annual Report and the 2023 Remuneration Policy are available for download on our corporate website:
www.roodmicrotec.com/en/investor-relations-en/annual-general-meeting.
 
Financial calendar
June 6, 2023 Annual general meeting of shareholders
July 20, 2023 Publication interim report 2023
July 20, 2023 Conference call for media, analysts and shareholders
October 19, 2023 Trading update quarter 3-2023

Forward-looking statements
This press release contains a number of forward-looking statements. These statements are based on current expectations, estimates and prognoses of the Board of Management, and on the information currently available to the Company. The statements are subject to certain risks and uncertainties which are hard to evaluate, such as the general economic conditions, interest rates, exchange rates, and amendments to statutory laws and regulations. The Board of Management of RoodMicrotec cannot guarantee that its expectations will materialize. Furthermore, RoodMicrotec does not accept any obligation to update the statements made in this press release.

About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well-established as a highly valued partner for many companies worldwide. The Company provides full-turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis, and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare, and industrial sectors. RoodMicrotec’s headquarter is located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.
For more information visit https://www.roodmicrotec.com

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