RENA Technologies Secures European Order for Advanced Cleaning Application for Specialized Semiconductor Substrates
RENA Technologies GmbH, a long-standing and experienced manufacturer of wet processing solutions for the semiconductor, advanced packaging, and solar industries, has been awarded a multi-million Euro order by a leading European semiconductor manufacturer for a specialized cleaning application designed for advanced substrates.
The solution is based on a high-performance batch wet processing platform and has been specifically engineered to deliver ultra-clean and highly efficient processing of demanding substrates. By combining advanced process control with a scalable batch architecture, the system ensures outstanding process stability, repeatability, and optimized throughput.
The customer’s decision underscores the technological strength and competitiveness of RENA’s wet processing solutions. Particularly when handling complex substrate materials, the application provides significant advantages in quality assurance, process control, and overall production efficiency. The mature cleanroom capabilities, excellent process control, and high- volume automation solutions of RENA add up to the perfect fit for the customer’s needs.
With this order, RENA further strengthens its position in the European semiconductor market and reinforces its commitment to delivering innovative, locally supported solutions to key industry players.
“Our success in securing this project highlights the growing demand for advanced wet processing technologies in Europe,” said Peter Schneidewind, CEO of RENA Technologies GmbH. “With more than 80 glass treatment tools in production worldwide - including cutting etch TGV/advanced packaging applications - RENA´s sophisticated technological solutions prove again in this new application for specialized semiconductor substrates.”
This course provides a comprehensive introduction to semiconductor manufacturing, guiding participants through the complete journey from silicon fundamentals to chip fabrication and packaging. Designed for professionals new to the semiconductor industry, the course explains key concepts, terminology, devices, and manufacturing processes used in modern fabs.
Who Should Attend
Anyone interested in understanding semiconductor manufacturing, including new employees, professionals in related industries, and those seeking to broaden their knowledge of the field.
Learning Objectives
Upon completion of the course, participants should be able to:
Explain fundamental semiconductor concepts, including silicon materials, doping, PN junctions, and basic device behavior.
Identify and correctly use common semiconductor manufacturing terminology.
Outline the key steps involved in front-end wafer fabrication, from bare silicon to patterned wafers.
Summarize back-end manufacturing processes, including assembly, packaging, and testing.
Topics Included
Basic Electronics and Microelectronics
Process Nodes
Device Physics and Transistor Operation
Crystal Growth and Wafer Preparation
Advanced Transistor Technologies
Circuit Design and Layout
Wafer Processing
Important Information
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge.
Can't find the training link on the day of the training? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders 24 hours in advance and 1 hour before, with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
Strengthen your knowledge and skills by learning about the journey from silicon fundamentals to chip fabrication and packaging.
Singapore: 3:00pm - 7:00pm
India: 12:30pm - 4:30pm
London: 8:00am - 12:00pm
Pricing
Members: $399
Non-Members: $449
* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]
Inside the Fab: An Introduction to Semiconductor Manufacturing
Virtual Training - Asia
3:00 pm - 7:00 pm
Off
Add to Calendar2026-10-27 15:00:002026-10-30 19:00:00Inside the Fab: An Introduction to Semiconductor Manufacturing (Asia) 10/27Strengthen your knowledge and skills by learning about the journey from silicon fundamentals to chip fabrication and packaging. Singapore: 3:00pm - 7:00pmIndia: 12:30pm - 4:30pmLondon: 8:00am - 12:00pm Pricing Members: $399Non-Members: $449* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]SingaporeSEMI.org[email protected]Asia/Singaporepublic
Asia/Singapore
Register Now
This course offers a solid foundation in semiconductor manufacturing, from basic concepts to advanced techniques, providing practical insights into the tools, processes, and technologies driving the industry.
Learning Objectives
Gain a comprehensive understanding of the semiconductor industry and manufacturing process, design, and eco-system of the semiconductor industry
Understand the jargon, tools, and materials used in the design and fabrication of an integrated chip
Effectively be able to communicate semiconductor manufacturing concepts with other associates and industry professionals
Course Topics
Basic Electronics and Microelectronics: Definitions of essential electronic terms/concepts and introduction to microelectronics and integrated circuits
Process Nodes: Process nodes and their impact on device performance and cost
Device Physics and Transistor Operation: Principles of device operation and transistor functionality
Crystal Growth and Wafer Preparation: Crystal growth techniques and wafer preparation processes
Advanced Transistor Technologies: FDSOI, FinFETs, and Gate-All-Around (GAA) transistors and their impact on device performance
Circuit Design and Layout: Introduction to circuit design, layout techniques, and tools
Wafer Processing: Mask Making and Lithography: Techniques and materials used in mask making and various lithographic methods (DUV, Immersion, EUV)
Clean Room Environments: Importance of clean rooms in semiconductor manufacturing and contamination issues
Etching and Cleaning Processes: Plasma and wet etching processes
Ion Implantation and Diffusion Techniques: Methods for doping and controlling diffusion in semiconductor fabrication
Deposition Techniques: RTP, CVD, ALD, and ALE techniques and their effect on device performance
Electroplating and Sputtering: Metal deposition techniques used in manufacturing
Packaging and Testing: Techniques such as wire bonding, die stacking, flip chip, and chiplets packaging, semiconductor testing processes
Metrology and Measurement Tools: Tools and methods used for precision measurement in semiconductor manufacturing
Semiconductor Industry Ecosystem: The major players in the industry
Who Should Attend
Anyone interested in understanding semiconductor manufacturing, including new employees, professionals in related industries, and those seeking to broaden their knowledge of the field.
See what course participants had to say about this course!
"The expansive width of coverage with sufficient depth; well curated, relevant information with live references, and the open style of delivery which made the course more of a sharing than a lecture, was enjoyable."
"Denny's knowledge and ability to explain things in simplified ways was awesome!"
"I really enjoyed going over the topics and watching the in-depth videos. I also liked how we received the slide information prior to the class."
"The range of topics was perfect for an intro course."
"Denny did a great job explaining complex topics. The opportunity to ask questions directly was beneficial for the entire class. If a question couldn't be answered immediately, it was addressed by the next break at the latest."
"Thank you very much for the informative course. I appreciate the in-depth and in-detail insight in all aspects of Semiconductor Manufacturing!"
Important Information
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge.
Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
Gain a comprehensive understanding of the semiconductor industry and the integrated circuit (IC) manufacturing process. This course is designed for new personnel in the field or anyone seeking a well-rounded knowledge of the tools, materials, and terminology used in semiconductor manufacturing.
Pricing
Early Bird Special - $100 off
Members:$995 $895
Non-Members: $1095 $995
* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]
Overview of Semiconductor Manufacturing
Virtual Training - Europe
8:00 am - 5:00 pm
Off
Add to Calendar2026-09-15 08:00:002026-09-16 17:00:00Overview of Semiconductor Manufacturing (Europe) Gain a comprehensive understanding of the semiconductor industry and the integrated circuit (IC) manufacturing process. This course is designed for new personnel in the field or anyone seeking a well-rounded knowledge of the tools, materials, and terminology used in semiconductor manufacturing.PricingEarly Bird Special - $100 off Members: $995 $895Non-Members: $1095 $995* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]GermanySEMI.org[email protected]Europe/Berlinpublic
Europe/Berlin
Register Now
The first part of the course provides a brief overview of semiconductor design and fabrication steps, encompassing IC design techniques, all wafer processing steps, assembly, and packaging. It delves into semiconductor jargon in laypeople terms, and various substrate types such as Si, SiGe, FDSOI, GaAs, SiC, GaN. Additionally, it discusses different types of transistors like pMOS, nMOS, Bipolar, BiCMOS, CMOS, FinFets, and GAA and their evolution and what applications they are used in.
The second part of the course focuses on semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies. Addresses the fastest-growing semiconductor markets based on geographic locations and applications, identifies semiconductor competitors/customers, and discusses major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Digital TV, Radio, Automotive, MEMS, and Emerging Technology & Impact on Industry.
Learning Objectives
Understand the fundamental principles and theories semiconductor technology.
Communicate with other associates and understand wafer processing steps.
Understand semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies.
Review the semiconductor eco-system as it relates to design and fabrication of a semiconductor device.
Gain knowledge of major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Automotive, MEMS, and Emerging Technology & Impact on Industry.
Demonstrate effective communication skills through written reports, presentations, and discussions related to semiconductor subjects.
Collaborate effectively with peers in group projects or discussions regarding semiconductor subjects.
Analyze and evaluate research literature in semiconductor technology.
Develop critical thinking and problem-solving skills applicable to semiconductor technology.
Who Should Attend
This course is suitable for anyone seeking a better understanding of the semiconductor industry, market leaders, terminology, business, and the semiconductor ecosystem.
See what course participants had to say about this course!
"Denny Frye knows so much about the history of the semiconductor industry that he was able to tie together many different industries and technologies that I have heard about but never knew how they were connected."
"Great overview of the semiconductor industry & market."
"This was a very detailed course on many facets of the industry, would recommend!"
"It was a great mix of technical and overview of the key players in the market!"
"Good blend on technical and commercial topics."
"Excellent introduction to the semiconductor world."
"Great session on the understanding of the semiconductor industry in a nutshell."
Important Information
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge.
Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
Embark on a journey through semiconductor design, manufacturing, and business in this illuminating course. Explore IC design techniques, transistor evolution, and market dynamics. Delve into substrate types and industry economics, discovering the fastest-growing markets and key players shaping the semiconductor landscape.
Pricing
Early Bird Special - $100 off
Members:$845 $745
Non-Members: $945 $845
* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]
Understanding Semiconductor Technology and Business
Virtual Training - Europe
8:00 am - 5:00 pm
Off
Add to Calendar2026-09-14 08:00:002026-09-14 17:00:00Understanding Semiconductor Technology and Business (Europe) Embark on a journey through semiconductor design, manufacturing, and business in this illuminating course. Explore IC design techniques, transistor evolution, and market dynamics. Delve into substrate types and industry economics, discovering the fastest-growing markets and key players shaping the semiconductor landscape.PricingEarly Bird Special - $100 off Members: $845 $745Non-Members: $945 $845* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]GermanySEMI.org[email protected]Europe/Brusselspublic
Europe/Brussels
Register Now
The instructor discusses the applied aspects of plasma-assisted etching from a general point of view. The emphasis is on mechanistic understanding. The etching of Si and its compounds is covered in detail. The chemistries used in the etching of other technology-related materials such as Al, organics, and III-V compounds are summarized. Other topics presented include selectivity, loading, ARDE and feature scale problems, damage, and issues associated with high-density plasma RIE. A section on plasma diagnostics and ion-beam based etching methods is briefly discussed.
Learning Objectives
Understand the fundamentals of dry etching and the basic concepts of plasma etching
Understand the physics of rf glow discharges (both high and low density)
Understand the surface science aspects of RIE including the role of energetic ions
Recognize the factors which influence etching anisotropy
Define the steps of plasma-surface chemistry leading to etching
Topics Covered
Fluorocarbon plasma etching of Si and its compounds
Selectivity, loading effects, and aspect ratio dependent etching
Uniformity of etching, damage, feature charging issues, and particles
Etching of other materials (Al, organics, III-V compounds, etc)
Plasma diagnostics such as optical emission spectroscopy with actinometry, mass spectrometry and laser-induced fluorescence
Issues in high density plasma etching, wall effects, and ion beam-based methods
Deep Reactive Ion Etching (DRIE)
Applications and processing etching using ALE
End point detection
Who Should Attend
This course is intended for scientists, technicians and others working with or interested in the dry etching of materials in reactive gas glow discharges, particularly those who do not have extensive experience in the field.
See what previous course participants had to say about this training!
"Instructors' Process and Hardware knowledge were impressive."
"I finally gained a clear understanding of the RIE process."
"The instructor had a very good knowledge of the content."
"I had a great time to learn fundamental concepts of plasma etching course from SEMI."
"The aspect of the course that I found most beneficial was the Bosch processing parameter discussions on profile management. This subject was clearly the expertise of the presenter who skillfully addressed my questions regarding the subject."
Important Information
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge.
Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
This course discusses the fundamentals of plasma assisted phenomena and reactive ion etching (RIE) processes. The emphasis is on the physical and chemical processes that determine the consequences of a reactive gas plasma/surface interaction. The role of energetic ions as encountered in RIE systems is discussed in detail and the factors which influence anisotropy of etching are highlighted. Plasma-assisted etching equipment is described including capacitively coupled, inductively coupled and wave-generated plasmas sources.
Pricing
Members: $745
Non-Members: $845
* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]
Plasma Etching, ALE, & RIE
Virtual Training - Americas & EU
8:00 am - 12:00 pm
Off
Add to Calendar2026-08-25 08:00:002026-08-26 12:00:00Plasma Etching, ALE, & RIE (Americas/EU) This course discusses the fundamentals of plasma assisted phenomena and reactive ion etching (RIE) processes. The emphasis is on the physical and chemical processes that determine the consequences of a reactive gas plasma/surface interaction. The role of energetic ions as encountered in RIE systems is discussed in detail and the factors which influence anisotropy of etching are highlighted. Plasma-assisted etching equipment is described including capacitively coupled, inductively coupled and wave-generated plasmas sources. PricingMembers: $745Non-Members: $845* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
Register Now
Setting the Stage: Industry Drivers & SCC Initiative Context
• Semiconductor Industry Decarbonization Challenges
• The Need for Quantified Business Cases
• SCC Initiative Background & Development Journey
• Vision for Industry Adoption & Collaboration
• Tool Architecture & Methodology
• Key Inputs & Assumptions
• Understanding the Outputs & Metrics
• Live Demonstration & Example Scenario
• Current Limitations & Future Development Opportunities
9:36 am
-
9:50 am
Jeff Rudnik
Director of Environmental Sustainability & Net Zero
ASM
Industry Use Cases & Practical Applications
• Evaluating Decarbonization Projects
• Comparing Alternative Mitigation Strategies
• Supporting Internal Investment Decisions
• Lessons Learned from Early Applications
• Opportunities for Industry Collaboration
The semiconductor industry is under increasing pressure to decarbonize its operations, particularly with regard to Scope 1 emissions — direct greenhouse gas emissions (GHG) from owned or controlled sources. Yet many companies face a persistent challenge: how to make a clear, consistent, and financially credible case for emissions reduction investments. To help address this need, the Semiconductor Climate Consortium (SCC) has developed a Cost-Benefit Calculator — a simplified and flexible tool that offers a structured starting point for evaluating carbon emissions reduction projects. The calculator enables users to estimate the Net Present Cost (NPC) per ton of CO₂ equivalent emissions reduction, helping to translate environmental impact into business-relevant terms.
Join SEMI's Semiconductor Climate Consortium (SCC) Scope 1 Working Group and document authors for a webinar discussing their journey creating the Cost-Benefit Calculator and outlining the use cases for this tool. The Cost-Benefit Calculator is a functional spreadsheet with built in report creation tools. For business managers who need to calculate emissions for Scope 1.
Building the business case for emission reductions
9:00 am - 10:00 am
Off
Add to Calendar2026-06-16 09:00:002026-06-16 10:00:00SCC: Cost Benefit Calculator WebinarThe semiconductor industry is under increasing pressure to decarbonize its operations, particularly with regard to Scope 1 emissions — direct greenhouse gas emissions (GHG) from owned or controlled sources. Yet many companies face a persistent challenge: how to make a clear, consistent, and financially credible case for emissions reduction investments. To help address this need, the Semiconductor Climate Consortium (SCC) has developed a Cost-Benefit Calculator — a simplified and flexible tool that offers a structured starting point for evaluating carbon emissions reduction projects. The calculator enables users to estimate the Net Present Cost (NPC) per ton of CO₂ equivalent emissions reduction, helping to translate environmental impact into business-relevant terms.Join SEMI's Semiconductor Climate Consortium (SCC) Scope 1 Working Group and document authors for a webinar discussing their journey creating the Cost-Benefit Calculator and outlining the use cases for this tool. The Cost-Benefit Calculator is a functional spreadsheet with built in report creation tools. For business managers who need to calculate emissions for Scope 1.SCC members can download the Cost Benefit Calculator Report here.SEMI United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
Register Today!
esmo group Launches X-change Cart for Single-Operator Load Board Handling
ROSENHEIM, Germany / KUALA LUMPUR, 5 May 2026 — esmo group (esmo), a leading global full-service systems integrator, developer, and supplier of advanced automation solutions for the semiconductor test industry, today announces the debut of its X-change Cart. A dedicated, semi-automated Device Interface Board (DIB) exchange system that enables a complete load board changeover by a single operator in under one minute, the X-change Cart addresses the safety, efficiency, and reliability challenges associated with manual board handling on the semiconductor test floor.
In high-mix semiconductor test environments, load board changeovers are a frequent and operationally significant activity. The reliance on manual handling has long presented challenges around changeover time, operator safety, and the risk of damage to high-value boards.
“Across test floors, we kept seeing the same pattern,” said Josef Weinberger, Head of Business Unit, esmo semicon. “Board changeovers were slow, physically demanding, and too dependent on individual technique. In tight spaces, that's where mistakes happen and time is lost. That observation drove us to build a dedicated solution that makes changeovers fast, repeatable, and manageable by a single operator in under a minute.”
Engineered for the Modern Test Floor
The X-change Cart removes the physical demands and variability of manual board handling from the equation entirely. Through a structured, HMI-controlled process, a single operator can lock, rotate, and transfer a board to the tester within a minute. The ability to carry two boards in a single trip makes that timescale achievable in practice. Thoughtful design details, including a ±180° rotation at the locking mechanism and a ±90° tower swivel, address the real-world constraints of a busy test floor.
Broad compatibility with leading ATE platforms (e.g. Teradyne, Advantest, SPEA and more) facilitates integration into existing multi-vendor environments without reconfiguration, allowing OSATs and IDMs to realise multiple benefits without disruption to their current setup.
For facilities with longer-term automation objectives, an optional configuration allows the interface tower to be mounted onto a customized AGV or AMR, providing a practical upgrade path toward autonomous test floor operations. The modular design further allows additional features to be incorporated as operational requirements evolve.
Weinberger added, “Reliability in production comes down to the details. The gripper head is engineered to perform consistently under real production conditions, with ESD-safe construction ensuring the board is protected at every point of contact. That level of engineering discipline is what makes the difference on a real production floor.”
X-change Cart Key Features
Modular DIB exchange system for reliable, error-free board loading and unloading
One-person operation — complete board change in under one minute
Transports two load boards simultaneously for rapid exchange
Full multi-axis rotation: ±180° at locking mechanism | ±180° Y-axis | ±90° Z-axis
Compatible with leading ATE platforms — Teradyne, Advantest, SPEA and more
Interfaces with test head, prober, DIB-loader, storage rack, and maintenance workbench
Tower swivels ±90° for use in narrow corridors and constrained test floor layouts
Optional: fully automated configuration mountable on AGV or AMR
The X-change Cart will be available for live demonstration at the esmo booth throughout SEMICON Southeast Asia 2026. Visit esmo at Booth 2145, Hall 8, Level 2, MITEC Kuala Lumpur from 5–7 May 2026, or contact [email protected] to arrange a meeting or request further information.
This course will stress the impace of the IC and End product requirements, i.e., smaller, better, cheaper" and their influence on the manufacturing processes. Topics include area packaging - ball grid arrays, flip chip, fanout, attaching dies and chip scale packages, and the assembly technologies - chip & wire, tape automated bonding, and flip chip, as well as emerging technologies, namely, 3-D and stacked die, and packaging reliability issues.
Who Should Attend
This course is intended for both manufacturing and R&D know-how in IC packaging professionals, including but not limited to:
Engineers
Managers
Process Engineers
R&D Engineers
Sales and Application Engineers who supply packaging materials and tools
Learning Objectives
Identify the wide variety of package types and how they align with different application uses.
Understand chip interconnection technologies (such as wirebond, flip chip, or thin film) and chip encapsulation
Identify the materials and processes used in packaging.
Summarize the current state of the art packages, such as chiplets and heterogeneous packaging.
Gain a foundational understanding of what packaging is and its importance to the microelectronics industry.
Important Information
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge.
Can't find the training link on the day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
This course provides a comprehensive introduction to semiconductor manufacturing, guiding participants through the complete journey from silicon fundamentals to chip fabrication and packaging. Designed for professionals new to the semiconductor industry, the course explains key concepts, terminology, devices, and manufacturing processes used in modern fabs.
Who Should Attend
Anyone interested in understanding semiconductor manufacturing, including new employees, professionals in related industries, and those seeking to broaden their knowledge of the field.
Learning Objectives
Upon completion of the course, participants should be able to:
Explain fundamental semiconductor concepts, including silicon materials, doping, PN junctions, and basic device behavior.
Identify and correctly use common semiconductor manufacturing terminology.
Outline the key steps involved in front-end wafer fabrication, from bare silicon to patterned wafers.
Summarize back-end manufacturing processes, including assembly, packaging, and testing.
Topics Included
Basic Electronics and Microelectronics
Process Nodes
Device Physics and Transistor Operation
Crystal Growth and Wafer Preparation
Advanced Transistor Technologies
Circuit Design and Layout
Wafer Processing
Important Information
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge.
Can't find the training link on the day of the training? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders 24 hours in advance and 1 hour before, with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
Strengthen your knowledge and skills by learning about the journey from silicon fundamentals to chip fabrication and packaging.
Singapore: 3:00pm - 7:00pm
India: 12:30pm - 4:30pm
London: 8:00am - 12:00pm
Pricing
Members: $399
Non-Members: $449
* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]
Inside the Fab: An Introduction to Semiconductor Manufacturing
Virtual Training - Asia
3:00 pm - 7:00 pm
Off
Add to Calendar2026-08-17 15:00:002026-08-20 19:00:00Inside the Fab: An Introduction to Semiconductor Manufacturing (Asia/EU)Strengthen your knowledge and skills by learning about the journey from silicon fundamentals to chip fabrication and packaging. Singapore: 3:00pm - 7:00pmIndia: 12:30pm - 4:30pmLondon: 8:00am - 12:00pm Pricing Members: $399Non-Members: $449* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]SingaporeSEMI.org[email protected]Asia/Singaporepublic
Asia/Singapore
Register Now
This course provides a comprehensive introduction to semiconductor manufacturing, guiding participants through the complete journey from silicon fundamentals to chip fabrication and packaging. Designed for professionals new to the semiconductor industry, the course explains key concepts, terminology, devices, and manufacturing processes used in modern fabs.
This course is divided into four modules, enabling a progressive learning experience that builds from fundamentals to manufacturing execution. Participants will gain a clear understanding of how chips are made, the role of transistors, and the steps involved in front-end manufacturing, followed by back-end assembly and packaging processes. The course also introduces the broader semiconductor ecosystem, including supply chain players, helping learners connect technical fundamentals with real-world manufacturing practices.
Who Should Attend
This course is designed for sales and marketing professionals, as well as new employees, students, and anyone interested in gaining a knowledge about semiconductor manufacturing.
Learning Objectives
Upon completion of the course, participants should be able to:
Explain fundamental semiconductor concepts, including silicon materials, doping, PN junctions, and basic device behavior.
Identify and correctly use common semiconductor manufacturing terminology.
Outline the key steps involved in front-end wafer fabrication, from bare silicon to patterned wafers.
Summarize back-end manufacturing processes, including assembly, packaging, and testing.
Topics Included
Module 1: Semiconductor Fundamentals
Introduces semiconductor basics, silicon materials, doping PN junctions, and core device concepts, building a foundation for understanding how electronic devices function.
Module 2: Semiconductor Terminologies and Manufacturing Context
Covers essential semiconductor terminology, cleanroom concepts, supply chain players, process nodes, and packaging to help learners navigate manufacturing discussions with confidence.
Module 3: Front-end and Back-end Semiconductor Manufacturing
Provides an overview of the key steps involved in front-end wafer fabrication and back-end assembly, packaging, and testing processes.
Module 4: Transistors and Their Operation
Explains different types of transistors and their working principles, showing how transistors function as switches and amplifiers inside integrated circuits.
Important Information
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge.
Can't find the training link on the day of the training? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders 24 hours in advance and 1 hour before, with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
