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MUNICH, Germany ─ May 24, 2022 ─ SEMI Europe today announced the opening of the call for abstracts for SEMICON Europa 2022, Europe’s premier event connecting the entire electronics design and manufacturing supply chain, as the event returns to Messe München 15-18 November, in Munich, Germany for a live exhibition and conferences. Selected speakers at SEMICON Europa 2022, co-located with electronica, will share their expertise to the global microelectronics industry at the Advanced Packaging Conference (APC) and Fab Management Forum (FMF).

SEMICON Europa logoSEMICON Europa 2022 will convene experts and technologists for insights into the latest technology, materials and process innovations powering digital transformation and the next wave of semiconductor industry growth. The event will spotlight cutting-edge solutions that enable chipmakers to implement a broad range of new application-specific technologies.

Advanced Packaging Conference ─ Advanced Packaging Solutions in the Era of Digital Transformation

Advanced electronics packaging are integral to the system solutions required to enable mega trends in computing and communications and leading applications in markets such as medical devices and automotive. With collaboration critical to technology advances, experts from across the semiconductor supply chain who are driving innovations, technology concepts or roadmaps are invited to submit abstracts on advancements in the areas of Packaging/Assembly, Wafer/Package Test and Modelization. The submission deadline is June 10, 2022.

Fab Management Forum ─ Industry Meets Academia

New university graduates and young innovators looking to launch careers in the semiconductor industry will present their research and early-stage products to established fab managers. Key topics of interest are the Status of AI in Microelectronics Manufacturing and Advanced Analytics and Digital Twins for Faster, More Precise Decision Making. Students with doctorate and master’s degrees and their professors, as well as postgraduate researchers, research institutes and early start-ups and spinoffs, are invited to submit abstracts by June 17, 2022.  

Pre-recorded Presentations

In addition to the in-person programs, experts are invited to submit abstracts for the pre-recorded sessions on Friday, November 18. All pre-recorded presentations will be available to SEMICON Europa attendees onsite and virtually through the event website. The submission deadline is July 31, 2022.

Presentation abstracts, biographies and headshots must be submitted on the SEMICON Europa 2022 Call for Abstracts webpage. The conference language is English. All selected presenters will be notified in July 2022.

For more details, please visit the SEMICON Europa 2022 website and connect with SEMI Europe on Twitter or LinkedIn @SEMIEurope (#SEMICONEuropa).

SEMICON Europa Premier Sponsors

  • Platinum: TEL
  • Gold: Edwards, JCET
  • Silver: Evatec, SÜSS MicroTec
  • Event sponsors: ASE Group, Atotech INFICON, Lam Research, SCREEN

 

About SEMI

SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Serena Brischetto / SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

BERLIN, Germany ─ March 15, 2022 – To strengthen cybersecurity for semiconductor manufacturing in Europe, the industry must unify behind security standards, support decision-makers in adopting new technologies, and identify new skill sets needed to deploy and manage cybersecurity hardware, SEMI, the global industry association representing the electronics manufacturing and design supply chain, announced today. The findings mark the conclusion of a joint industry project on cybersecurity led by Coventry University’s Centre for Future Transport and Cities (CFTC) Systems Security Group (SSG) to examine drivers of computer hardware security adoption among businesses and consumers. The final report is now available.

SEMI logo“With hardware security critically important to the semiconductor industry, this project is a great step toward strengthening manufacturing cybersecurity to enable a safe and secure digital life,” said Laith Altimime, president of SEMI Europe. “SEMI welcomes the findings and will address these cybersecurity issues with our members. We thank the SSG research team for its invaluable support and are pleased to have partnered with it on this strategic initiative.”

The project, approved by the U.K. government’s Economic and Social Research Council (ESRC)-funded Discribe (Digital Security by Design Social Science) Hub, sought to identify the highest business costs of deploying cybersecurity solutions and reasons businesses do not implement stronger cybersecurity measures.

Following are key findings:  

  • The secure hardware ecosystem welcomes unified standards and common needs. Compliance and standards are main drivers of the adoption of secure hardware.
  • Support decision-makers in making adoption decisions.When gauging the costs and benefits of deploying cybersecurity hardware, companies must assess effectiveness at a systemic level.
  • Identify new skills sets needed to help drive adoption. Cybersecurity developers must identify overlaps between existing and new skills in order to effectively deploy security solutions. Developers also need sufficient support to leverage new hardware features.

Discribe funded the project in its mission to promote the commercial adoption of security technologies, expand the deployment of cybersecurity and ultimately help protect global economies against cyberattacks.

About SEMI

SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter. 

Association Contact

Serena Brischetto / SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

BRUSSELS, Belgium ─ February 08, 2022 – SEMI, the global industry association representing the electronics manufacturing and design supply chain, today applauded the publication of the European Chips Act. Launched to reinvigorate semiconductor manufacturing and innovation, the act calls to quadruple Europe’s production capacity by 2030 and lays out measures to avoid future supply chain disruptions.

SEMI logoUnder the act, the European Commission is called to step up investments in Europe’s capabilities to innovate in the design, production and packaging of advanced chips. Additionally, the act aims to strengthen the European Union’s R&D leadership and to address the skills shortages in the region.

“SEMI supports the European Chips Act and similar legislation and incentives designed to strengthen the resilience of the global semiconductor industry and create a more robust supply chain,” said Ajit Manocha, SEMI president and CEO. “The current chip shortage has extended lead times for semiconductor manufacturing equipment and materials, thus delaying efforts to expand semiconductor production capacity. To maximize the effectiveness of incentives aimed at expanding capacity and addressing extended supply chain issues, they should include investments in both new and existing semiconductor manufacturing equipment and materials facilities.”

“The European Chips Act is about bolstering Europe’s strengths,” said Luc Van den hove, chairman of the Semi Europe Advisory Board and president and CEO at imec. “By building on Europe’s unique assets, such as its leading equipment and material suppliers and its top-notch R&D, and by strengthening its manufacturing capabilities, both for mature as well as advanced technologies, Europe will reinforce its position in the global semiconductor ecosystem. This will secure Europe’s access to chip supplies that are indispensable for Europe's dominant industrial markets, as well as for its flourishing deep-tech start-up scene. Advanced chip technologies will pave the way to the next generation of innovative applications in autonomous cars, AR/VR, 6G-communication networks, smart robots, health diagnostics and personalized therapies. We are excited about this bold initiative to boost the European industry and are looking forward to contribute to it”.

“SEMI and the regional electronics ecosystem see the European Chip Act as a major step forward to advance the resilience and growth of the semiconductor industry in Europe,” said Laith Altimime, president of SEMI Europe. “With the shortage of critical components impacting the growth of numerous industries globally, we applaud the introduction of this timely initiative. We look forward to work with the European Commission and SEMI members to support this proposal and strengthen the European semiconductor ecosystem.” 

The European Chips Act is a key step forward to reinforce Europe’s capacities in semiconductors as a precondition for its future competitiveness, as well as a matter of technological security. The act is designed to build on the strengths of Europe’s semiconductor ecosystem and to address its weaknesses, supporting the European Union’s aims to develop a thriving, resilient supply chain and set measures to prepare for, anticipate and respond to future disruptions.

The European Chips Act is centred around five strategic objectives for the region:

  • Strengthen its research and technology leadership
  • Build and reinforce its own capacity to innovate in the design, manufacturing, and packaging of advanced chips, and turn them into manufactured products
  • Put in place an adequate framework to substantially increase its production capacity by 2030
  • Address the acute skills shortage, attract new talent, and support the emergence of a skilled workforce
  • Develop an in-depth understanding of global semiconductor supply chains

The unveiling of the European Chips Act is in line with similar initiatives to support semiconductor industry growth around the world. For example, in the United States, current legislation under consideration calls for US$52 billion in funding to increase domestic semiconductor production. Similarly, South Korea’s National Assembly approved rules and tax incentives to support and safeguard the local semiconductor industry, while China established 15 local semiconductor funds in a bid to supply 70% of its own chips needs by 2025.

Visit SEMI Global Advocacy and SEMI Europe Advocacy to learn more about SEMI public policy efforts.
 

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.
 

Association Contact

Serena Brischetto / SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

BRUSSELS, Belgium ─ January 25, 2022 ─ SEMI announced today the return of the Industry Strategy Symposium Europe (ISS Europe) 2022 as an in-person event to Brussels, Belgium, May 30, with insights from leading analysts, economists, policymakers and technologists on major forces impacting the semiconductor industry. The annual symposium offers business leaders’ perspectives on industry growth trends and intelligence to help ensure their company business plans and forecasts are based on current market conditions. Registration is now open.

ISS Europe logoThemed Resilient Europe: Semiconductors Enabling a Sustainable Digital Life, ISS Europe 2022 will examine economic, technology, market, business, and geopolitical developments and trends influencing the global electronics manufacturing industry, along with their implications for strategic business decisions. 

“2022 is a critical year for semiconductor industry leaders to seize growth opportunities for Europe by ensuring more sustainable and resilient operations,” said Laith Altimime, president of SEMI Europe. “As digital transformation accelerates, the industry is rising in importance in Europe as a force of competitive advantage, with strong implications for our future and the climate.”

ISS Europe 2022 Highlights

SESSION 1: Making Environmental Sustainability Happen

Industry leaders will explore ways for companies to focus on sustainability, increasingly embed green practices into their business models, and target disruptive innovations to reach decarbonization and other goals now being established worldwide. 

SESSION 2: Longevity of the Semiconductor Industry through Social Responsibility

Experts will take a deep dive into organizational strategies and initiatives to address the semiconductor industry’s talent crisis and make workplaces more inclusive. The session will highlight key diversity and inclusion trends impacting societies and the importance of industry role models while offering takeaways for company leaders.

SESSION 3: Strengthening Europe by Resilience in the Supply Chain

Europe is well-positioned to expand its semiconductor manufacturing industry and foster greater supply chain resilience of its microelectronics industry to help fuel EU economic growth. This session will focus on the critical need for Europe to bolster the resilience of its semiconductor industry and improve its independence.

For more details, please visit the ISS Europe 2022 website and connect with SEMI Europe on Twitter or LinkedIn – @SEMIEurope, #ISSEurope

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Serena Brischetto / SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

BRUSSELS, Belgium – 12 January, 2022 – SEMI, the global industry association that unites the entire electronics manufacturing and design supply chain, has issued recommendations to the European Commission for growing Europe semiconductor ecosystem resilience and competitiveness. The recommendations focus on the critical need for Europe to strengthen its microelectronics ecosystem with a long-term, forward-looking semiconductor manufacturing strategy and regulations that encourage more innovation. A diversified global network of suppliers and stronger strategic partnerships are key to that strategy.  

SEMI logo“Semiconductors must remain at the core of Europe’s industrial and technological ambitions,” said Laith Altimime, president of SEMI Europe. “With the launch of the Industrial Alliance on Processors and Semiconductor Technologies and the announcement of the European CHIPS Act, Europe has taken a pivotal step in securing supply chain resilience and future competitiveness of its microelectronics ecosystem.” 

The alliance and European CHIPS Act will be central to ensuring the funding, suppliers, and networks critical to Europe’s semiconductor ecosystem. The recommendations are aimed at building on Europe’s strategic position in embedded electronics to make it a global center of technological excellence and leadership in driving disruptive innovations.

SEMI Europe outlined the following recommendations to increase the resilience and competitiveness of the semiconductor ecosystem in Europe. The recommendations were approved by Luc Van den hove, SEMI Europe Advisory Board chair and president and CEO of imec, and board members. 

Manufacturing

  • Expand semiconductor manufacturing capacities with a focus on end-sector needs to maintain global leadership and market share.
  • Advance Europe’s leadership in international standardization of smart manufacturing technologies.
  • Support the introduction of circular economy strategies in semiconductor manufacturing.

Research and Innovation

  • Create pan-European research, innovation and development roadmaps for advanced semiconductor technologies.
  • Establish a European Semiconductor Technologies Innovation Observatory.
  • Enhance protections for Europe’s collective research and development (R&D) data by safeguarding the sharing and transfer of knowledge among industry, academia and Research and Technology Organizations (RTOs).
  • Create a European Semiconductor Fund to help scale European semiconductor innovation capacity.

Supply Chains

  • Encourage the sharing of best practices and approaches to mitigate future supply chain risks.
  • Develop common strategies for better securing the semiconductor supply chain, including semiconductor equipment, materials, and raw materials.

Skills

  • Leverage Pact for Skills for microelectronics as the foundation for reskilling and upskilling Europe’s talent pool.
  • Promote workforce development and mobility for better access to international technological expertise.

The annual Industry Strategy Symposium Europe (ISS Europe), March 17, 2022, in Brussels, will gather European microelectronics industry leaders and government officials in order to enhance their dialogue and collaboration.

For more information about the initiative, please contact Marek Kysela, Senior Coordinator Advocacy at SEMI Europe, at [email protected].

Visit SEMI Global Advocacy and SEMI Europe Advocacy to learn more about public policy efforts and developments.

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Serena Brischetto / SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

MUNICH, Germany ─ October 19, 2021 ─ With leading-edge technologies such as artificial intelligence (AI), 5G and robotics at the heart of digital transformation, SEMICON Europa 2021 will convene industry visionaries and experts 16-19 November for insights into the latest innovations and smart applications powering the next wave of semiconductor industry growth. Europe’s premier event connecting the entire electronics design and manufacturing supply chain, SEMICON Europa, co-located with productronica, returns to Messe München, in Munich, Germany for a live exhibition and conferences. Registration is open.

SEMICON Europa logoSemiconductor manufacturing resiliency is growing in importance as the semiconductor supply chain works to overcome disruptions and shortages trigged by the pandemic. SEMICON Europa will explore ways the global supply chain can better withstand shocks in the future. 

“We are excited to welcome back key semiconductor industry players in person in Munich,” said Laith Altimime, president of SEMI Europe. “SEMICON Europa gathers experts across the value chain for the collaboration and innovation critical to Europe’s semiconductor industry growth. Visitors will take a deep dive into how semiconductors are making manufacturing, automotive and healthcare smarter to drive higher efficiency and productivity across a wide range of applications.”

SEMICON Europa 2021 will examine how the semiconductor industry can integrate environmental and social sustainability into its growth strategy to help transform Europe into a sustainable, connected digital hub that enables life-changing applications for current and future generations. The event will also highlight process, materials and technology innovations that make it possible for chipmakers to implement cutting-edge 3D packaging for a broad range of new application-specific technologies.

SEMICON Europa Highlights

  • Executive Forum (New!): European Ecosystems Connecting the Digital Future – 16 November. Presenting organizations: Bosch, Cariad, Edwards Vacuum, European Commission, Fraunhofer EMFT, imec, Intel, Infineon, KLA, CEA-Leti, Merck KGaA, Darmstadt, Germany, NXP Semiconductors, Philips, Samsung, TSMC
  • 25th Fab Management Forum: Expanding European Manufacturing Footprint –17 November
  • Advanced Packaging Conference: Material and Process Challenges in the Era of Digital Transformation – 18 November

Smart Technologies and EU-funded Projects

The new TechARENA in Hall B1 at SEMICON Europa 2021 will feature smart technologies and showcase how semiconductors are enabling technology innovation and solutions to global challenges. Focus topics will be manufacturing, mobility, medical, the future of computing, telecommunications, and workforce development.

The EU Digital Lounge in Hall B1 will provide updates on EU-funded semiconductor projects including the following:

  • MicroElectronics Training, Industry and Skills (METIS)
  • European Cooperation platform of Vocational Excellence in Microelectronics (ECoVEM)
  • Metrology Advances for Digitized Electronics Components and Systems Industry 4.0 (MADEin4)
  • Edge-to-Cloud Intelligence for Resilient Manufacturing (the IMOCO4.E Initiative)

Visit SEMICON Europa programs and conferences for additional details.

SEMICON Europa Premier Sponsors

  • Platinum: Samsung, Tokyo Electron Europe
  • Gold: JCET
  • Silver: Bosch, Evatec, KLA, SCREEN
  • Event sponsors: AP&S, ASE Group, Atotech, DAS Environmental Expert, DB Schenker, DISCO, EBARA, Edwards Vacuum, Flexciton, INFICON, InnoLas Photonics, Merck KGaA, Darmstadt, Germany, Pfeiffer Vacuum, Siconnex Customized Solutions, VAT, YES, ZEISS

For more details, please visit the SEMICON Europa 2021 website and connect with SEMI Europe on Twitter or LinkedIn @SEMIEurope (#SEMICONEuropa).

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Serena Brischetto / SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

United States Belgium France Germany Ireland Italy Training

Course Description

Elastomer seals are critical components in semiconductor manufacturing equipment, where they are routinely exposed to demanding conditions including aggressive process chemistries, plasma environments, vacuum, elevated temperatures, and repeated mechanical cycling. Understanding how elastomer properties, seal design, application conditions, and installation practices interact is essential for achieving reliable sealing performance. 

This webinar will explore common seal failure modes and the mechanisms that can contribute to premature failure, including chemical and plasma degradation, compression set, thermal effects, mechanical damage, and installation-related issues. Examples will be used to demonstrate how visual observations, application information, and engineering analysis can help identify potential root causes and guide corrective actions. 

The course concludes by presenting information on current or emerging technologies and the attendant challenges, that include hybrid bonding, co-packaged optics, and advanced substrate materials. The course also touches upon challenges with thermal dissipation for high-power AI products, and the bottlenecks now shaping next-generation semiconductor package roadmaps. 

Learning Objectives

  • An understanding of the fundamental properties of elastomers and how those properties influence seal performance. 

  • Types of elastomers used in semiconductor manufacturing and factors that affect the material selection process.

  • How operating conditions such as temperature, plasma, process chemistry, vacuum, and mechanical loading can affect seal life. 

  • Common seal failure modes and how to identify them. 

  • The importance of proper seal design, gland design, and installation practices. 

  • Understand how failure analysis can be used to troubleshoot sealing problems and identify opportunities for improvement. 

  • How ASNA can support customers through application evaluation, material and design recommendation, failure analysis, customer engineering, and on-site installation support. 

     

     

Who Should Attend

This course is ideal for engineers and technical professionals, including equipment, process, mechanical, applications, reliability, maintenance, and field service engineers. 

 

Instructors

 

 

 

ANSA


Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

United States

SEMI U

This two-hour webinar provides a practical introduction to elastomer sealing technology, beginning with the fundamentals of seal elastomers and the properties that influence their performance. 

Pricing
  • Members: Free
  • Non-Members: Free

 

8:00 am - 10:00 pm Off Add to Calendar 2027-03-01 08:00:00 2027-03-01 22:00:00 Why Elastomer Seals Fail in Semiconductor Equipment (America/EU) 3/1/27 This two-hour webinar provides a practical introduction to elastomer sealing technology, beginning with the fundamentals of seal elastomers and the properties that influence their performance. PricingMembers: FreeNon-Members: Free  United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
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United States Belgium France Germany Ireland Italy Packaging Quality and Reliability 3/11 Training

Course Description

Given the immense cost of AI products & platforms, an important and differentiating factor for a successful packaging technology supplier is offering stellar quality and reliability to preserve the value of the expensive silicon chiplets. This course introduces various aspects of demonstrating Quality and Reliability in semiconductor packaging. One way to guarantee stellar quality and reliability of products with new technologies is to overdesign them, but that can be very expensive. Alternatively, under-designing packages from a reliability perspective may be cheaper; however, it will likely trigger premature failures in the field, leading to higher ownership costs and frustration for customers. Optimizing this balance to deliver new technology and meet customer expectations requires drawing from experience (history), judicious use of simulations, augmenting with empirical data and, more importantly, engineering rigor to make the right technology decisions. 

This course will prepare the audience to tackle technical problems (related to failure mechanisms and product qualification) by providing a blueprint that aids in proving that the technology capabilities can meet the market demands. The participants will experience the concepts through hands-on exercises throughout the course. 

Learning Objectives

  • A brief overview of semiconductor packaging. 

  • Understand the fundamentals of quality and reliability principles. 

  • Understand the concept of the bathtub curve and its use for Q&R optimization. 

  • Introduce the philosophy, and practical elements, of product qualification. 

  • Understand use conditions based on different markets like Automotive, Data Centers, Mobile, Space, etc.

  • Understand different quality tests and reliability stress tests done for product qualification. 

  • Get insight into typical failure mechanisms and failure analysis techniques. 

  • Demonstrate how to perform life distribution analysis to characterize statistical behavior of failures.

  • Introduction to acceleration models for predicting useful life of the package. 

  • Hands-on exercises

     

Who Should Attend

This course is ideal for anyone seeking a better understanding of how quality and reliability evaluation s performed for semiconductor packaging. 

 

Instructors

Shalabh Tandon
Qurius LLC
Instructor Bio

 

Shubhada Sahasrabudhe
Qurius LLC
Instructor Bio


Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link on the day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

United States

SEMI U

This four-hour course presents a methodology to deliver an optimum approach, and quantify, figures of merit that define quality and reliability for complex, heterogeneous integrated products. 

Pricing
  • Members: $149
  • Non-Members: $199

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]

8:00 am - 12:00 pm Off Add to Calendar 2027-03-11 08:00:00 2027-03-11 12:00:00 Packaging Quality and Reliability in the Era of Chiplets 3/9/27(Americas/EU) This four-hour course presents a methodology to deliver an optimum approach, and quantify, figures of merit that define quality and reliability for complex, heterogeneous integrated products. PricingMembers: $149Non-Members: $199* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected] United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
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United States Belgium France Germany Ireland Italy Training

Course Description 

This three-day virtual workshop (4 hours a day) provides a complete overview of the semiconductor manufacturing process. The class focuses on key process steps needed to form a functioning device. Some important science and engineering ideas needed to understand device manufacturing will be discussed. The workshop is designed for non-technical personnel needing an understanding of the fab process steps.  Some technical background from attendees will improve the workshop learning. 

The first day will overview the fab process steps with a brief summary of how a transistor functions. We will discuss how multiple transistors are connected to form a logic or memory device. We will also cover how a transistor works with respect to the physical layout of Bipolar and MOSFET transistors. 

The second day will cover key fab process steps. Ion implantation, photolithography including DUV and EUV processes, plasma processes including deposition and etch, rapid thermal processing, and wet etch processing. Specific emphasis will be given to the different wet etch processes. 

The third day of the workshop will focus on the new transistor designs, including FinFET and CFET designs. We will also cover reasons for changing the transistor design and newer materials, including tantalum, hafnium, silicon germanium, and low-k dielectrics.  We will also review roadmaps of leading companies, including TSMC, Intel, and Samsung. 

After completing the workshop, the student will be able to describe all the fabrication and assembly process steps and have an understanding of how the process steps work together to form the completed integrated circuit, in addition to an understanding of future structures.

 

Who Should Attend

This course is intended for both manufacturing and R&D know-how in IC packaging professionals, including but not limited to:

  • Process Technicians
  • Material Engineers
  • Process Engineers
  • Equipment Manufactures
  • Technical Marketing Engineers

Topics Included

  • Silicon wafer manufacturing
  • Basic operating principles of transistors and semiconductor devices
  • Planar, FinFET, and GAA transistor formation and design differences
  • Fab processes needed to form a semiconductor, including the following:
    • Lithography, with a focus on DUV and EUV methods
    • Etching, including wet and plasma processes
    • Deposition, thermal, plasma, electroplating deposition
    • CMP and modern CMP processes
       

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge. 

Can't find the training link on the day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

 

Dr. Tom Dory
ITM Consulting, Inc

United States

- SEMI U

Unlock the essentials of the semiconductor manufacturing process.  We will cover science and engineering concepts needed to understand device manufacturing. 

Pricing         
  • Members:  $549
  • Non-Members:   $599

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].

8:00 am - 12:00 pm Off Add to Calendar Disabled America/Los_Angeles
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United States Belgium France Germany Ireland Italy SubFAB 101 3/17 Training

Course Description

By the end of this course, participants will understand the scope of SubFAB and its critical role within the semiconductor manufacturing ecosystem, tracing its evolution and recognizing new trends. They will be able to identify and describe the core SubFAB systems and interpret typical facility layouts and equipment installation specifics. Learners will assess the environmental, and sustainability impacts of modern SubFABs. They will map a standard SubFAB organizational chart, typical roles, and responsibilities, and simulate incident-response workflows to reinforce operational readiness. Participants will be exposed to preventive maintenance and safety best practices to ensure reliability and compliance with regulations.

Who Should Attend

This course is designed for engineers and technicians in semiconductor manufacturing, equipment suppliers/OEM on-site service personnel, IE and MEP designers. 

Course Outline

  • Introduction & Course Logistics
    • Welcome, introductions, and platform quick start
    • Learning objectives and course flow
  • Module 1: SubFAB Fundamentals
    • Definition & scope of SubFAB
    • Historical evolution (from early fabs to today)
    • Core equipment & support systems overview
    • Typical facility layouts and installation configurations
  • Module 2: Environmental & Sustainability Considerations
    • Key environmental impacts (emissions, water/chemical use)
    • Gas abatement and PFAS management fundamentals
    • Metrics & case studies in sustainable SubFAB operation
  • Module 3: Organizational & Operational Structures
    • SubFAB org charts and stakeholder roles
    • Operational workflows (from tool install to maintenance)
    • Incident-response and escalation paths (role-play)
  • Module 4: Safety, Maintenance, & Reliability
    • Preventine- maintenance best practices
    • Safety protocols and hazard identification
    • Reliability metrics and continuous improvement loops
  • Module 5: Emerging Trends & Innovations
    • Automation, digital twins, and Industry 4.0 in SubFAB
    • Advanced materials handling and process integration
    • Open discussion: Where SubFAB will go next
  • Wrap-Up & Next Steps
    • Final Q&A and feedback collection
    • Certification requirements and further resources
    • Suggested post-course readings and SEMI standard references 

 

Instructor

Ilya Zabelinksy

Instructor Bio

 

 

 

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

United States

SEMI U Standards

SubFAB 101: Foundations of Semiconductor Support Facilities is a 4-hour course that covers SubFAB basics and its critical role within the semiconductor manufacturing ecosystem, including its evolution and new trends. 

  • San Francisco: 8:00 AM - 12:00 PM
  • Jerusalem:       6:00 PM - 10:00 PM 
  • England:          4:00 PM - 8:00 PM 
  • Munich:            5:00 PM - 9:00 PM
Pricing
  • Members: $349
  • Non-Members: $399

* For group orders with 10+ attendees, and for Students/Veterans, discounted pricing, please contact [email protected]. 

8:00 am - 12:00 pm Off Add to Calendar 2027-03-17 08:00:00 2027-03-17 12:00:00 SubFAB 101: Foundations of Semiconductor Support Facilities (Americas/EU) 3/17 SubFAB 101: Foundations of Semiconductor Support Facilities is a 4-hour course that covers SubFAB basics and its critical role within the semiconductor manufacturing ecosystem, including its evolution and new trends. San Francisco: 8:00 AM - 12:00 PMJerusalem:       6:00 PM - 10:00 PM England:          4:00 PM - 8:00 PM Munich:            5:00 PM - 9:00 PMPricingMembers: $349Non-Members: $399* For group orders with 10+ attendees, and for Students/Veterans, discounted pricing, please contact [email protected].  United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
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