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SEMI Press Release

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MILPITAS, Calif. – July 20, 2020 – SEMI and Semiconductor Digest today announced finalists for the Best of West award to be presented at the virtual SEMICON West 2020. Presented annually, the Best of West award recognizes innovative new products or services that significantly advance the electronics manufacturing supply chain or a particular manufacturing capability.

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The following Best of West 2020 finalists will showcase their judged products in their booths at SEMICON West 2020, being held virtually this year for the first time:

Advanced Energy: eVoS™LE
A unigue technology that enables tightly targeted ion energy control, essential for precise processing of advanced etch and deposition applications used to create leading-edge device features at 5nm and below. Providing an alternative to conventional sinusoidal RF bias plasma power, that uses complex multi-frequency systems, eVoS produces customized narrow ion energy distributions in a singular solution.

Edwards Vaccum: ESV-X
The ESV-X automated mobile robot (AMR) is a future-focused product that utilizes inventive lifting and transport mechanisms to create a safe and efficient operating environment and is the first step toward the future vision of an automated sub-fab. Edwards’ versatile payload delivery platform lays the foundation for an interconnected sub-fab maintenance system that can be expanded upon to include field service assistance and smart storage.

Flexciton: Wafer Fab Scheduling Software
The scheduling software provides near-optimal fab plans with fast solution times and seeks to bridge the gap between heuristic and pure-optimization approaches. A hybrid-optimization model based on mixed-integer linear programming (MILP) employs advanced exact and approximate decomposition techniques and is able to significantly reduce the problem complexity, yet retain near-optimality.

SPTS Technologies Limited: Ascent™
This end-point detection technology is a novel method to monitor the progress of a SiC via etch to a GaN base layer. Launched earlier this year, it has been well received by the leading RF device manufacturers looking to implement process control, increase throughput, and maximize yields in volume production.

The Best of West award-winner will be announced during SEMICON West on Thursday, July 23, 2020. Learn more at www.semiconwest.org.

About Semiconductor Digest
Through a mix of news, contributed articles and staff-written articles, Semiconductor Digest (www.semiconductor-digest.com), is dedicated to providing global information about the design, manufacturing, packaging and testing of semiconductors and other types of electronic devices, including MEMs, LEDs, displays, power electronics, optoelectronics/photonics, biomedical devices, solar cells, thin film batteries and flexible electronics. Semiconductor Digest consists of a website, magazine and topic-focused newsletters.

About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.
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Association contact
Scott Stevens, Cardinal Communications for SEMI Americas
Phone: 1.512.288.4050
Email: [email protected]

Semiconductor Digest contact
Pete Singer, Editor-in-Chief
Phone: 1.978.470.1806
Email: [email protected]

 

MILPITAS, Calif. — July 21, 2020 — Global sales of semiconductor manufacturing equipment by original equipment manufacturers are projected to increase six percent to $63.2 billion in 2020 compared to $59.6 billion in 2019 before logging record high revenue of $70 billion in 2021 on the strength of double-digit growth, SEMI announced today in releasing its Mid-Year Total Semiconductor Equipment Forecast – OEM Perspective at the annual SEMICON West exposition.

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Growth across a number of semiconductor segments is expected to power the expansion. The wafer fab equipment segment – which includes wafer processing, fab facilities, and mask/reticle equipment – is expected to rise five percent in 2020 followed by 13 percent growth in 2021 driven by a memory spending recovery and investments in leading-edge and China. Foundry and logic spending, accounting for about half of total wafer fab equipment sales, will see single-digit increases in 2020 and 2021. Both DRAM and NAND spending in 2020 will surpass 2019 levels and are projected to grow over 20 percent, respectively, in 2021.

The assembly and packaging equipment segment is forecast to grow 10 percent to $3.2 billion in 2020 and 8 percent to $3.4 billion in 2021 driven by advanced packaging capacity buildup. The semiconductor test equipment market is expected to increase 13 percent, reaching $5.7 billion in 2020, and continue the growth momentum in 2021 on the back of 5G demand.

Regionally, China, Taiwan and Korea are expected to lead the pack in spending in 2020. Robust spending in China in the foundry and memory sectors is expected to vault the region to the top in total semiconductor equipment spending in 2020 and 2021. Taiwan equipment spending, after seeing 68 percent growth in 2019, is forecast to contract this year but bounce back with 10 percent growth in 2021, with the region maintaining the second spot in equipment investments. Korea is expected to rank third in semiconductor equipment investments in 2020 by outstripping its 2019 levels, making it the third top spender in 2020. Korea equipment spending is projected to grow 30 percent in 2021 powered by the memory investment recovery. Most other regions tracked will also see growth in 2020 or 2021.

The following results are in terms of market size in billions of U.S. dollars:

Source: SEMI July 2020, Equipment Market Data Subscription
New equipment includes wafer fab, test, and assembly and packaging. Total Equipment does not include wafer manufacturing equipment.
Totals may not add due to rounding.

The current SEMI forecast is based on collective input from top equipment suppliers, SEMI's industry-recognized World Fab Forecast database, and SEMI’s Worldwide Semiconductor Equipment Market Statistics (WWSEMS) data collection program.

The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports:

  • Monthly SEMI Billings Report, an early perspective of equipment market trends
  • Monthly Worldwide Semiconductor Equipment Market Statistics (SEMS), a detailed report of semiconductor equipment bookings and billings for seven regions and more than 22 market segments
  • Bi-annual Total Semiconductor Equipment Forecast – OEM Perspective, an outlook for the semiconductor equipment market.

For more information online, please visit the EMDS page.

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall
SEMI
Email: [email protected]
Phone: 1.408.943.7988

MILPITAS, Calif. – July 20, 2020 – SEMICON West 2020 opens today in virtual format for the first time with more than 200 industry leaders, visionaries and technology experts gathered for four days of insights into the latest trends, innovations and developments across the microelectronics supply chain. Themed Managing Disruption Though Collaboration, SEMICON West showcases cutting-edge technologies such as artificial intelligence (AI) and opportunities critical to the next wave of industry growth across areas including advanced manufacturing, packaging, materials, test and silicon photonics. Registration is open.

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With smart technologies transforming businesses and lives around the world, SEMICON West themed pavilions highlight the latest in SMART Mobility, SMART Manufacturing and SMART MedTech while featuring leading-edge electric cars from Pony.ai and AutoX. The all-virtual event also addresses key trends in talent, diversity and inclusion as the microelectronics industry works to build the workforce of the future.

Keynotes by former U.S. Vice President Al Gore, Applied Materials CEO Gary Dickerson and legendary IBM executive John Kelly III will highlight the vital importance of AI in a sustainable future. Visit the SEMICON West 2020 website for the complete list of keynotes and executive panels and the full agenda of speakers and panel discussions.

Virtual SEMICON West 2020 Gets Real

Virtual SEMICON West 2020 replicates the physical event with an interactive exhibit hall and opportunities to attend presentations, join technical sessions, participate in one-on-one or group meetings and network. Recorded sessions and exhibitor booth content will remain available on demand 24/7 for 60 days after the close of the virtual event. With an all-in pass, registrants will also receive session slides, industry updates and a post-show report.

Platinum Sponsors for SEMICON West are Applied Materials, Deloitte, KLA, Lam Research, TEL and Thermo Fisher Scientific. Other top sponsors include Advantest, ASE Group and Edwards.

Celebrating its 50th year as the flagship event for the semiconductor industry, SEMICON West is organized by SEMI Americas to advance the technology and business of electronics manufacturing. Follow SEMICON West on Twitter at #SEMICONWest and on LinkedIn.

About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association contact

Scott Stevens, Cardinal Communications for SEMI Americas
Phone: 1.512.288.4050
Email: [email protected]

 

MILPITAS, Calif. — July 20, 2020 — SEMI today announced at SEMICON West 2020 the election of Jinrong Zhao, Chairman of the Board, NAURA Technology Group, as a new member of the SEMI International Board. In addition, SEMI confirmed the re-election of seven current members to the SEMI International Board of Directors in accordance with the association's by-laws.

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The following seven Board members were re-elected for two-year terms:

  • Kevin Crofton, CEO, Comet Group AG
  • Mitsunobu Koshiba, Director, Chairman of the Board, JSR Corporation
  • Yong Han (YH) Lee, Chairman, Wonik
  • Sue Lin, Vice Chairman, Hermes Epitek
  • Jon Kemp, President, Electronics and Imaging, DuPont
  • Tetsuo (Tom) Tsuneishi, Executive Chairman of the Board, Representative Director, TEL
  • Tien Wu, CEO, ASE; CEO, USI

The SEMI Executive Committee confirmed Bertrand Loy, president and CEO of Entegris, as chairman of the SEMI Executive Committee. SEMI also confirmed Kevin Crofton, CEO of Comet Group AG, as vice-chairman. 

The leadership appointments and the elected board members’ tenure become effective at the annual SEMI membership meeting on July 20 during SEMICON West 2020.    

“The SEMI Board of Directors is comprised of global business leaders who represent SEMI members and the industry, ensuring that SEMI develops and delivers member value in all regions,” said SEMI president and CEO Ajit Manocha. “We congratulate the newly elected and re-elected members and greatly appreciate all of our board members’ contributions to the industry.”

SEMI’s 17 voting directors and 10 emeritus directors represent companies from Europe, China, Japan, Korea, North America, and Taiwan, reflecting the global scope of the association’s activities. SEMI directors are elected by the general membership as voting members of the board and can serve a total of five two-year terms.

 

About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

 

Association Contact
Michael Hall
SEMI
Email: [email protected]
Phone: 1.408.943.7988

MILPITAS, Calif. – July 20, 2020 – ASML, an innovation leader in the semiconductor industry that supplies chipmakers with key lithographic tools for imaging patterns on wafers, has won the 2020 SEMI Americas Award. SEMI honored the Netherlands-based firm for assembling the industry consortium that led the commercialization of Extreme Ultra-violet (EUV) lithography.  The award was presented today at Virtual SEMICON West 2020, July 20-23. The SEMI Americas Award recognizes technology developments with a major impact on the semiconductor industry and the world.

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Efforts to extend optical lithography to wavelengths significantly shorter than ultra-violet began in the 1980s. Since then, integrated circuit feature sizes decreased from several microns to less than 10 nanometers (nm) today, making the shift to EUV light essential.

 

Moving to 13.5 nm wavelengths represented a paradigm shift, extending to all aspects of light generation, reflective optics, mask technologies, vacuum environment management, wafer stage alignment and a host of other fields. ASML assembled the EUV Consortium to collaborate in meeting these challenges and developed EUV production equipment and processes. The first production system was shipped in 2013 and a total of 57 systems are currently installed in customer fabs.

“After more than 20 years of sustained R&D by ASML and its partners, EUV is now being used in high-volume chip manufacturing,” said Martin van den Brink, ASML President and Chief Technology Officer, who accepted the award on behalf of the company. “Long-term collaboration across this technology’s value chain, from academic partners to governments and industry players, has been absolutely crucial to its success.”

ASML, founded in 1984, employs more than 25,000 people representing more than 120 nationalities in 60 worldwide locations. It has large R&D and manufacturing facilities in San Diego, Calif.; San Jose, Calif.; and Wilton, Conn.

“Outstanding engineering and industry achievements should be recognized and honored when they prompt new and emerging technologies to enhance the semiconductor industry,” said SEMI Americas president Dave Anderson. “Limitations of UV and immersion-UV lithography presented a barrier for chipmakers and halted temporarily the downsizing of microelectronics. ASML’s years-long efforts drew supply chain support as well as customer buy-in, demonstrating that the industry can tackle major problems when it comes together.”

“ASML led the effort to develop EUV lithography capability, enabling a continuation of scaling,” said Bill Bottoms, chair of the SEMI Americas Awards Advisory Committee. “The effort involved collaboration with customers and vendors and other interested parties and would not have happened without their leadership.” The highest honor conferred by the SEMI Americas region, the SEMI Americas Award was established in 1979 to recognize outstanding technical achievement and meritorious contributions by individuals and teams in the areas of Semiconductor Materials, Wafer Fabrication, Assembly and Packaging, Process Control, Test and Inspection, Robotics and Automation, Quality Enhancement, and Process Integration. Criteria were expanded in 2009 to include outstanding achievements in developing new and emerging technologies expected to add significant future value to the semiconductor industry. Nominations are open to individuals or teams from industry and academia whose accomplishments have a broad commercial impact and technical significance for the semiconductor industry. Nomination guidelines for 2021 are accepted from individuals or teams with North American-based SEMI member companies. ​A list of past award recipients is available online.

Learn more at Virtual SEMICON West 2020. Follow SEMICON West on Twitter: #SEMICONWest

About SEMI SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Scott Stevens, Cardinal Communications for SEMI Americas
Phone: 1.512.288.4050
Email: [email protected]

 

Semiconductor Industry Takes Aim at Accelerating Global Economy Recovery

HSINCHU, Taiwan – July 14, 2020 – Current and emerging smart applications in 5G, medtech and artificial intelligence (AI) that are transforming the way we work and live and have helped the world battle the COVID-19 pandemic will take center stage at SEMICON Taiwan 2020. September 23 to 25, 2020, at the Taipei Nangang Exhibition Center, Hall 1 (TaiNEX 1), SEMICON Taiwan 2020 is the industry’s first comprehensive physical-virtual event to gather industry leaders and visionaries for the latest developments, market trends and innovations in smart technologies as Taiwan begins to normalize business operations.

SEMICON Taiwan Logo

Registration is open for SEMICON Taiwan 2020 and FLEX Taiwan, the Flexible Hybrid Electronics International Exhibition and Forum. Co-located with SEMICON on September 24, Flex Taiwan will showcase cutting-edge innovations in flexible electronics.

Themed Leading the Smart Future, SEMICON Taiwan 2020 will also showcase innovations in smart manufacturing, advanced process technology and green manufacturing as the industry drives towards a more sustainable future with technologies such as AI, 5G and machine learning leading the way. SEMICON Taiwan 2020 is Taiwan’s largest annual semiconductor exhibition for showcasing the latest products and technologies.

With the COVID-19 outbreak in Taiwan well-contained, SEMICON Taiwan 2020 will take place on schedule under the social distancing and other protective guidelines of the Taiwan government’s Central Epidemic Command Center (CECC) to ensure exhibitor and visitor safety. The center has relaxed bans on entry by foreign business travelers to help clear the way for full international business activity once the pandemic has been brought to heel globally.

“Taiwan’s effective response to the coronavirus outbreak has been hailed by the international community,” said Terry Tsao, SEMI Chief Marketing Officer and president of SEMI Taiwan. “The concerted efforts of the government, businesses and citizens have helped minimize disruptions to all industries in Taiwan including the semiconductor sector.” 

Wafer fab, packaging and testing companies that plan to send buyers and other visitors to SEMICON Taiwan have also eased COVID-19 restrictions on business trips. These segments are cornerstones of the global semiconductor industry and their vibrancy is key to fueling the global economic recovery.

Leading global manufacturers of semiconductor such as TEL, Hermes Epitek, Disco, ASM, Lintec and K&S have committed to participating at SEMICON Taiwan. Whether online or at the physical event, exhibitors and visitors will be able to stay abreast of critical industry trends and insights, pursue new business opportunities, form new partnerships and promote technology innovation – all keys to powering industry growth.

About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Jo-ann Su
SEMI Taiwan
Email: [email protected]
Phone: 886.3.560.1777 ext. 202

Irene Huang
SEMI Taiwan
Email: [email protected]
Phone: 886.3.560.1777 ext. 205

MILPITAS, Calif. — July 14, 2020 — The SEMI Foundation has announced the appointment of Katy Crist, Director of Marketing and Communications at Tokyo Electron Limited (TEL), a leading global provider of semiconductors and flat panel display equipment, to the SEMI Foundation Board of Trustees. Crist currently co-chairs the SEMI Workforce Development/Diversity & Inclusion Council.

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“Katy’s passion for influencing and supporting diversity in the semiconductor and microelectronics industry will help the foundation fulfill its vision to spur growth of the industry talent pipeline and promote greater gender diversity and women’s leadership,” said Shari Liss, Executive Director of the SEMI Foundation.

TEL supports the SEMI Foundation’s diversity and inclusion initiatives. Crist and TEL partner with the SEMI Foundation to offer an internal mentoring program and are sharing best practices to grow a veteran training and industry exposure program to support soldiers transitioning back to civilian life. 

TEL also sponsors several other SEMI Foundation key initiatives, including the High Tech U (HTU) program. The three-day SEMI Foundation hands-on exploration program connects students to the microelectronics industry and encourages them to pursue an education in science, technology, engineering and math (STEM). The program includes career insights from industry professionals and visits to universities for a glimpse of college life.

“It has been an extraordinary privilege to partner with the SEMI Foundation Board,” Crist said. “Over the past several years, I've had an intimate look at the SEMI Foundation’s work to tackle the most substantial challenges facing our industry – talent crisis, industry image, and D&I. As a member of the Board of Trustees, I look forward to working more closely with the Foundation to strengthen our industry across these and other critical issues.”

See the complete listing of SEMI Foundation Board members.

About the SEMI Foundation

The SEMI Foundation is a 501(c)(3) nonprofit charitable organization founded in 2001 to help sustain the growth of the microelectronics industry by attracting, developing, and retaining a well-trained and innovative workforce through educational programs, diversity initiatives and member engagement. The Foundation’s longest-running and flagship programs are SEMI High Tech U, aimed at inspiring high-school students to pursue STEM college educations and careers, and SEMI High Tech U Teacher Edition. Since 2002, High Tech U programs in Austria, France, Japan, Korea, Netherlands, Singapore, Taiwan and the United States have directly influenced and inspired more than 8,200 students and teachers.

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

PCB and Semiconductor IP Log Double-Digit Growth

MILPITAS, Calif. — July 13, 2020 —The Electronic System Design (ESD) Alliance Market Statistics Service (MSS) today announced that the Electronic Design Automation (EDA) industry revenue increased 3.5 percent in Q1 2020 to $2,698 million, compared to $2,606.4 million in Q1 2019. The four-quarter moving average, which compares the most recent four quarters to the prior four quarters, increased by 5.2 percent. ESD Alliance is a SEMI Technology Community.

SEMI & ESDA

“The EDA industry reported increased revenue in Q1 compared to Q1 2019, in part due to strong growth in the largest product category, Semiconductor Intellectual Property (SIP),” said Walden C. Rhines, CEO Emeritus of Mentor, a Siemens Business. “The Printed Circuit Board and Multi-Chip Module (PCB and MCM) category also reported double-digit gains in Q1. The four-quarter moving average continued to increase for the PCB and MCM, Computer Aided Engineering (CAE), IC Physical Design and Verification, and SIP categories, and in the Americas, EMEA, and Asia Pacific (APAC).”

The companies tracked in the MSS report employed 45,938 in Q1 2020, a 5.6 percent increase over the Q1 2019 headcount of 43,500 and up 1.1 percent compared to Q4 2019.

The quarterly MSS report containing detailed revenue information with category and geographic breakdowns is available to ESD Alliance members.

Revenue by Product Category

  • CAE generated revenue of $854.9 million in Q1 2020, a 1.7 percent increase compared to Q1 2019. The four-quarter CAE moving average increased 2.4 percent.
  • IC Physical Design and Verification revenue reached $507.9 million in Q1 2020, an 8.9 percent decrease compared to Q1 2019. The four-quarter moving average for the category increased 2.4 percent.
  • PCB and MCM revenue of $250.9 million for Q1 2020 represents an increase of 12 percent compared to Q1 2019. The four-quarter moving average for PCB and MCM increased 14.1 percent.
  • SIP revenue totaled $985.6 million in Q1 2020, a 12.5 percent increase compared to Q1 2019. The four-quarter SIP moving average increased 9.6 percent.
  • Services revenue totaled $98.7 million in Q1 2020, an 8.6 percent decrease compared to Q1 2019. The four-quarter Services moving average decreased 12.1 percent.

Revenue by Region

  • The Americas, the largest reporting region by revenue, purchased $1,118.1 million of EDA products and services in Q1 2020, a 0.5 percent increase compared to Q1 2019. The four-quarter moving average for the Americas increased 0.5 percent.
  • Revenue in Europe, the Middle East, and Africa (EMEA) increased 13.4 percent, to $392.3 million, in Q1 2020 compared to Q1 2019. The EMEA four-quarter moving average increased 11.1 percent.
  • First-quarter 2020 revenue for Japan increased 9.8 percent to $268.6 million compared to Q1 2019. The four-quarter moving average for Japan decreased 3.9 percent.
  • APAC revenue increased to $918.9 million in Q1 2020, an increase of 1.8 percent compared to the first quarter of 2019. The four-quarter moving average increased 6.9 percent.

About the MSS Report
The ESD Alliance Market Statistics Service reports EDA, IP and services industry revenue data quarterly and is available to Alliance members. Both public and private companies contribute data to the report. Each quarterly report is published approximately three months after quarter close. MSS report data is segmented as follows: revenue type (product licenses and maintenance, services, and SIP), application (CAE, PCB/MCM Layout, and IC Physical Design & Verification), and region (the Americas, Europe Middle East and Africa, Japan, and Asia Pacific), with many subcategories of detail provided. The report also lists total employment of the tracked companies.

About the Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community, is the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry. As an international association of companies providing goods and services throughout the semiconductor design ecosystem, it is a forum to address technical, marketing, economic and legislative issues affecting the entire industry. For more information about the ESD Alliance, visit http://esd-alliance.org.

About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

The information supplied by the ESD Alliance is believed to be accurate and reliable, but the ESD Alliance assumes no responsibility for any errors that may appear in this document. All trademarks and registered trademarks are the property of their respective owners.

Press Contacts
Paul Cohen
ESD Alliance
A SEMI Strategic Technology Community
978-769-2106

Jack Taylor
Mentor, a Siemens Business
512-560-7143

More than 150 industry and government leaders join visionaries to present keynotes, fireside chats, executive panels and news conferences

MILPITAS, Calif. – July 8, 2020 – Better readiness for future global disruptions through technology innovation will come into sharp focus at the Virtual SEMICON West 2020, July 20-23, as more than 150 semiconductor industry visionaries and government leaders gather for keynotes, fireside chats and executive panels on opportunities for improving responses to worldwide challenges. Registration for the conference is open.

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Former U.S. Vice President Al Gore, Applied Materials CEO Gary Dickerson and legendary IBM executive John Kelly III will kick off the conference by highlighting the vital importance of AI in a sustainable future.

West Featured Speaker Photo


SEMICON West 2020 speakers will also include:

Bill Davidow Photo

Bill Davidow, high-tech industry executive, venture investor and author, will speak about The Autonomous Revolution: Reclaiming the Lives We’ve Sold to Machines.

Gayle Jennings O’Bryne photo

Gayle Jennings O’Bryne, The WOCstar Fund (Women of Color) co-founder and general partner, and Bob Pearson, chairman of The Next Practices Group and author, will examine How Technology, Innovation and Smart Investing is a Pathway Forward in Times of Racial and Economic Injustice.

Ivy Ross Photo

Ivy Ross, Google hardware vice president of design, and Dr. Josh Makower, NEA Healthcare general partner and lead for its Medtech/Healthtech practice, will discuss Where the Inspiration for Google’s Hardware Design Comes From.

Abby Snay Photo

Abby Snay, deputy secretary for the future of work, California Labor and Workforce Development Agency, and Dave Toole, CEO, The Gig Economy Group, will discuss How Tech Talent Will Manage the New Norm.

Gary Bolles Photo

Gary Bolles, chair for The Future of Work, Singularity University, will lead a panel that lays out disruptive global workplace changes in The Great Work Reset.

SEMICON West 2020 Virtual SMART Pavilions

  • Smart Manufacturing Pavilion – Featuring livestreamed and on-demand talks with ON Semiconductor, GLOBALFOUNDRIES, Lam Research, Applied Materials and other industry leaders, presentations will focus in on integrating cognitive learning technologies into microelectronics manufacturing. Attendees will be able to explore the latest technologies, talk with speakers and network with peers and customers at the pavilion’s networking lounge.
  • Smart Mobility Pavilion – Leading all new application spaces for chip growth, the transportation and mobility markets promise to drive growth in segments such as flexible hybrid electronics (FHE) and MEMS and sensors. The pavilion will showcase robotaxis from Pony.ai and AutoX, and their unique Al technology and hardware/software integrated stack for Level 4 autonomous driving.
  • Smart MedTech Pavilion – COVID-19 has put a spotlight on the value of enhanced remote connected healthcare applications. Presentations will address how MEMS and sensors are the technology of choice for integration in medical wearables and point-of-care instruments, with forecast growth of 9.2 percent year-over-year over the next five years.
  • Smart Workforce Pavilion – Sustaining the microelectronics industry’s pace of innovation and growth through workforce development programs has become a top priority for many companies. Targeting job seekers, the pavilion will highlight entry-level opportunities, job searching during uncertain times, and why microelectronics is a smart career choice.

Learn more at Virtual SEMICON West 2020. Follow SEMICON West on Twitter: #SEMICONWest

About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association contact

Scott Stevens, Cardinal Communications for SEMI Americas
Phone: 1.512.288.4050
Email: [email protected]

MILPITAS, Calif.  — June 29, 2020 — Industry leaders and visionaries will gather in virtual format August 24-26, 2020, for the SEMI Advanced Semiconductor Manufacturing Conference (ASMC) to provide the latest insights and developments across a wide range of critical industry topics from yield management to metrology in the era of artificial intelligence (AI). The conference will feature more than 35 hours of technical content – presented live and available on-demand – on leading-edge semiconductor manufacturing strategies and methodologies. Registration is now open.

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The live panel discussion Exascalers, Hyperscalers: Computing at the Edge – Different Modes, Different Nodes will highlight the conference. Panelists will include experts from industry leaders including Applied Materials, Binghamton University, Corning, IBM Global Think Labs and Tercero Technologies. In addition, a tutorial presented by Intel and Entegris will focus on Contamination Control: Enabling High-Yield Manufacturing.

Now entering its fourth decade, ASMC is the premier event for industry professionals to network and share best practices for semiconductor manufacturing. The conference is co-chaired by Fred Bouchard of SpareTech and Armando Anaya of Northrop Grumman. 

ASMC 2020 Keynotes 

Thomas Sonderman Photo

Thomas Sonderman, President, SkyWater Technology

Sonderman will highlight requirements for manufacturing leadership in the AI era.

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Jesus del Alamo Photo

Jesus del Alamo, PhD, Donner Professor,

Professor of Electrical Engineering, MIT

del Alamo will discuss nanoscale III-V for sustained CMOS innovation.

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Robert Maire Logo

Robert Maire, Semiconductor Advisors

Maire will explore future market trends.

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ASMC 2020 technical tracks include:

  • Advanced Equipment Processes and Materials
  • Advanced Metal Structures
  • Advanced Process Control
  • Contamination-Free Manufacturing
  • Defect Inspection
  • Factory Optimization
  • Novel Metrology Techniques
  • Optical Metrology and Machine Learning
  • Patterning and 3D Metrology
  • Smart Manufacturing
  • Yield Enhancement/Yield Methodologies

For more conference details, contact Margaret Kindling at [email protected] or 1.202.393.5552. The media should contact Scott Stevens (for SEMI Americas communications) at [email protected] for registration information.

SEMI Golden Anniversary

SEMI 50 Logo

2020 marks SEMI’s golden anniversary. For half a century, SEMI has brought the industry together to connect, collaborate, innovate, and help transform the world with new technologies. 

Join us at SEMICON events around the world as we celebrate 50 years of growth in global electronics manufacturing and kick off the next 50 years by highlighting the latest developments, trends and innovations in smart technologies.

About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Scott Stevens, Cardinal Communications for SEMI Americas
Phone: 1.512.288.4050
Email: [email protected]