MILPITAS, Calif. — August 20, 2020 — North America-based manufacturers of semiconductor equipment posted $2.60 billion in billings worldwide in July 2020 (three-month average basis), according to the July Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 11.8 percent higher than the final June 2020 level of $2.32 billion, and is 27.6 percent higher than the July 2019 billings level of $2.03 billion.

“The second half of 2020 has started strong with double-digit billings growth for North America-based semiconductor equipment manufacturers,” said Ajit Manocha, SEMI president and CEO. "The strength reflects the semiconductor industry's criticality in today's world and the driving forces in place for long-term industry growth."

The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.

SEMI publishes a monthly North American Billings report and issues the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases. These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide. For an overview of available SEMI market data, please visit www.semi.org/en/MarketInfo.

The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.

About SEMI

SEMI^® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Notes

Next SEMI Billings report is September 17, 2020 at 3:00pm Pacific.
For information on SEAJ Billings Express Report, visit www.seaj.or.jp.

• Read more about North American Semiconductor Equipment Industry Posts July 2020 Billings

HSINCHU, Taiwan – August 18, 2020 –SEMI today announced the formation of a new standards committee that aims to develop global standards for flexible hybrid electronics (FHE) spanning design, materials, manufacturing, packaging and systems and to drive industry growth. Unanimously endorsed by members of the SEMI North America Regional Standards Committee (NARSC) and approved by the SEMI International Standards Committee (ISC), the technical committee is the world’s first to focus on flexible hybrid electronics standards. The SEMI Standards Flexible Hybrid Electronics Global Technical Committee has established its first chapter in Taiwan.

“The SEMI Standards Flexible Hybrid Electronics Global Technical Committee sets out to clear development bottlenecks facing the industry and establish unified measurement standards for flexible smart textile, automotive, Internet of Things (IoT) and related devices,” saidTerry Tsao, SEMI Chief Marketing Officer and president of SEMI Taiwan. “The Taiwan chapter looks forward to kicking off the development of international industry standards that help Taiwan's FHE sector promote industry growth by reducing costs and increasing competition.”

Initial work of the SEMI Standards Flexible Hybrid Electronics Global Technical Committeewill include establishing working groups to draft measurement standards; building industry consensus on the need for materials, equipment and manufacturing standards; and developing standards to accelerate the introduction of related FHE technologies into diverse consumer end markets.

“We are very pleased to see the establishment of the SEMI Standards Flexible Hybrid Electronics Global Technical Committee and are proud to be part of the working committee to draft the standards,” said Steve Huang, executive director of Taipei-based AiQ Smart Clothing, an innovator with a significant pool of smart textile IP. “As a pioneer in smart textile applications, we are keenly aware of the challenges posed by an absence of standards and how it stifles mass adoption of new technologies.”

The SEMI International Standards Program is in its 47^th year, with the 1,000^th SEMI Standard published last year. SEMI Standards cover fields including semiconductors, displays, photovoltaics, microelectromechanical systems (MEMS) and smart manufacturing.

For more information, visit the SEMI Standards web page.

About SEMI

SEMI^® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Irene Huang/SEMI Taiwan
Phone: 886.03.560.1777, ext. 205
Email: [email protected]

• Read more about SEMI Launches World's First Flexible Hybrid Electronics Standards Technical Committee to Promote Industry Growth

MILPITAS, Calif.– August 11, 2020 – SEMI, the industry association serving the global electronics design and manufacturing supply chain, today launched a new collaborative apprenticeship program to make it easier for companies to offer training and for more workers to pursue careers in electronics. The competency-based SEMI Industry Approved Apprenticeship Program (IAAP) is designed to identify skills gaps and deliver targeted training that efficiently meets industry employers’ hiring needs.

SEMI developed the IAAP in partnership with GLOBALFOUNDRIES^® (GF^®), the largest pure-play semiconductor foundry in the U.S. and the world’s leading specialty foundry. Designed to be scaled to meet industry demand for technicians, the program leverages SEMI’s Unified Competency Model (UCM), which was formed with industry input as a new skills standard and is endorsed by the U.S. Department of Labor Employment and Training Administration (USDOL-ETA). The UCM is posted on DOL-ETA’s Competency Model Clearinghouse.

“GLOBALFOUNDRIES has long been committed to building educational partnerships that benefit both our employees and the region, particularly in developing a highly skilled workforce to ensure our industry and the U.S. remains at the forefront of innovation for years to come," said Ron Sampson, senior vice president and general manager of U.S. Fab Operations at GF. “Through SEMI’s new Industry Approved Apprenticeship Program, we look forward to helping our employees advance their careers, while playing an important role in workforce training and boosting the semiconductor manufacturing talent pool."

“The IAAP is designed to help the microelectronics industry and advanced manufacturers overcome the talent shortage by enabling companies to fill skills gaps more effectively and at lower cost,” said Mike Russo, vice president of Industry Advancement and Government Programs at SEMI. “SEMI will continue to work to ensure the IAAP lays a path for employers to pursue government-registered apprenticeship programs and qualify for reimbursement of related training expenses.”

Hudson Valley Community College (HVCC) will offer the apprenticeship program courses, the first certified under the SEMI Certs program, online.  The course curriculum is aligned with UCM to ensure course curriculum supports the development of skills required by the electronics industry. 

“We are excited to be a partner in this pilot program that is expected to graduate approximately 50 apprentices by the end of this year and more than 100 apprentices by the end of 2021,” said Roger Ramsammy, president of Hudson Valley Community College. “Hudson Valley’s participation in the SEMI Certs program has ensured our courses are aligned with industry requirements and that participants receive college credits to help them pursue related degrees and support career laddering. In addition, we hope the program will ultimately be a New York State Registered Apprenticeship Program, providing access to tuition reimbursement for Required Technical Training.”

Along with GLOBALFOUNDRIES and HVCC, SEMI partnered with SUNY Polytechnic Institute, the Manufacturing Association of Central New York (MACNY) and the Center for Economic Growth (CEG), a nonprofit economic and business development organization that serves as the primary point of contact for businesses interested in growing in or moving to New York’s eight-county capital region, to develop the apprenticeship program. 

The apprentice program marks a milestone in the evolution of SEMI Works™, the first U.S. electronics workforce development program developed under a partnership with the National Science Foundation Advanced Technological Education (NSF-ATE) Program, the USDOL-ETA  and academic partner SUNY Polytechnic Institute in New York. 

About SEMI

SEMI^® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

SEMI Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI Partners with GLOBALFOUNDRIES to Offer Apprenticeship Program Aimed at Building the Electronics Talent Pipeline

MILPITAS, Calif. – August 5, 2020 – With advanced materials a critical enabler of semiconductor growth applications, the stage is set for Strategic Materials Conference (SMC 2020), the premier event offering the latest market insights into drivers of advanced materials in the microelectronics supply chain. A virtual event September 29-October 1, 2020, SMC will highlight opportunities and demand for key enabling materials across the electronics supply chain. SMC registration is now open.

Themed Leading Future Technology Innovations with Materials, SMC will gather top executives and leaders from every segment of semiconductor manufacturing to provide the latest developments in advanced materials including:

• Economic, Geopolitical and Market Trends
• Materials Innovation Market Drivers
• Emerging Materials and Applications
• Metrology Innovations
• Advanced Packaging Materials Integration and Challenges
• Innovative Startup Companies and Venture Capital Investors (New Panel Session)

SMC 2020 Keynotes

	Sean Ding, Chief Technology Officer of IoT Digitizing the Physical World Enables Digital Transformation
	Jun He, PhD, Head of Corporate Quality and Reliability A New Era of Supply Chain Collaboration: Driving Socially Responsible Semiconductor
	Anand Nambiar, Global Head, Semiconductor Materials How the Next Decade of Materials Innovation Will Advance Digital Living
	John Smythe, PhD, Advanced Technology Lead DMTS The Power and Limitations of Materials Solutions

Industry leaders presenting at SMC 2020 include:

• Alibaba Group
• AT&S
• Applied Ventures
• Ayar Labs
• BCA Research
• Carbon
• El Camino Capital
• Hilltop Economics
• IBM TJ Watson Research Center
• Intel Capital
• Intel Corporation
• JSR Micro
• Kebotix
• KLA
• Lyncean Technologies
• Marvell Semiconductor
• Onto Innovation
• OTI Lumionics
• Samsung Ventures
• Stanford University
• TEL
• TSMC
• VLSI Research
• Xilinx

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contacts

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Scott Stevens, Cardinal Communications for SEMI Americas
Phone: 1.512.288.4050
Email: [email protected]

• Read more about Strategic Materials Conference 2020 Goes Virtual to Highlight Materials on Cutting Edge of Technology Innovation

ESD Alliance to Lead Joint Effort with Cadence, Mentor, a Siemens Business, and Synopsys to Create Server Certification Protocol

MILPITAS, CALIF. –– August 4, 2020 –– SEMI, Cadence, Mentor, a Siemens Business, and Synopsys today announced plans to jointly develop an industry-standard protocol to combat electronic design automation (EDA) software piracy, a growing and costly problem for software vendors and their users. Under the partnership, the organizations will develop the SEMI Server Certification Protocol, a standard that will provide strong protection against piracy by defining how servers can be uniquely identified.

Currently, most software license management systems rely on a license manager that runs on a server typically earmarked by a machine identifier. The problem is that software pirates can clone the machine identifier using virtualization technologies to gain illegitimate access to additional licenses without added cost.

“This joint development effort highlights SEMI’s ability to gather industry players to solve critical problems,” said Bob Smith, the ESD Alliance’s executive director. “We look forward to working with EDA industry leaders Cadence, Mentor and Synopsys to develop this much-needed protocol that will provide protection against piracy.”

“Software piracy is a growing challenge and threatens to stifle innovation for EDA companies and customers alike,” said Nimish Modi, senior vice president of market and business development at Cadence. “We are glad to collaborate with the industry on defining this new standard to help further the efforts towards a comprehensive anti-piracy strategy.”

“New technologies and solutions have enabled other segments of the software industry to combat piracy,” said Arun Venkatachar, vice president of Synopsys central engineering. “It is time for EDA to be on par with the rest of the industry. This collaborative effort from both vendors and customers is critical for an effective anti-piracy strategy.”

“Software piracy ultimately hurts our honest customers because it provides pirates with an unfair competitive advantage,” said Joe Sawicki, executive vice president, IC EDA for Mentor, a Siemens Business. “Theft also raises the price of products sold to legitimate users. Together with our industry peers, Mentor will work to establish a new anti-piracy standard that protects against theft and provides a level playing field for all.”

The License Management/Anti-Piracy (LMA) Committee within the Electronic System Design Alliance (ESD Alliance) will manage the partnership. Cadence, Mentor and Synopsys are members of the LMA Committee. The ESD Alliance is a SEMI Technology Community representing members in the electronic system and semiconductor design ecosystem.

The LMA Committee works with the Centralized Enterprise Licensing User Group (CELUG), a community within HPC Pros comprised of IT professionals and users of system design automation software to address common software licensing issues.

“HPC Pros’ CELUG is pleased to support the ESD Alliance’s continuing efforts to provide a secure license infrastructure,” said Derek Magill, executive director of HPC Pros. “The LMA Committee has worked closely with CELUG to ensure that the certification process will be compatible with the diverse environments of tool customers. Deployment of this capability will increase our confidence that all licenses used are fairly acquired, making it harder for unethical competitors to gain competitive advantage through the theft of licenses.”

About SEMI

SEMI^® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

About the Electronic System Design Alliance

The Electronic System Design (ESD) Alliance, a SEMI Technology Community representing members in the electronic system and semiconductor design ecosystem, is a community that addresses technical, marketing, economic and legislative issues affecting the entire industry. It acts as the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry.

All trademarks and registered trademarks are the property of their respective owners.

Note: A list of relevant Siemens trademarks can be found here.

Association Contacts

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Nanette Collins/ESD Alliance
Phone: 1.617.437.1822
Email: [email protected]

• Read more about SEMI and EDA Industry Leaders Unite to Combat Software Piracy

MILPITAS, Calif. — July 28, 2020 —  The global semiconductor packaging materials market will track chip industry growth to expand from $17.6 billion in revenue logged in 2019 to $20.8 billion in 2024, a 3.4 percent Compound Annual Growth Rate (CAGR), SEMI and TechSearch International forecast in the Global Semiconductor Packaging Materials Outlook released today. A number of semiconductor industry growth drivers will power the surge including big data, high-performance computing (HPC), artificial intelligence (AI), edge computing, advanced memory, the 5G infrastructure build-out, 5G smartphone adoption, growth of electric vehicle adoption and enhanced safety features for automobiles.

Packaging materials are key to the growth of these applications, enabling advanced packaging technologies that undergird the higher performance, reliability and integration of next-generation chips.

Laminate substrates, the largest materials segment, will see a CAGR of over 5 percent, driven by demand for system-in-package (SIP) and high-performance devices. Wafer-level packaging (WLP) dielectric will register the highest growth with a 9 percent CAGR over the forecast period. The trend towards smaller, thinner packaging will dampen growth of leadframes, die attach, and encapsulant materials, though new technologies are being developed to enhance performance.

With the steady advance of semiconductor packaging technology innovation, the next several years are expected to present several areas of opportunity in the materials market including:

• New substrate designs to support narrow bump pitch with higher density
• Low D_k and D_f laminate materials for 5G mmWave applications
• Coreless structure based on a modified leadframe technology called Molded Interconnect Solution/System (MIS)
• Mold compounds to provide underfill for copper pillar flip chip
• Smaller fillers and narrower particle size distribution needed in resin materials to address narrow gaps and fine pitch flip chip
• Die attach materials with no-to-low resin bleed, no-to-low outgassing, and processed within <5 µm placement
• Dielectrics with lower dielectric loss (D_f) required for higher frequency applications such as 5G
• Void-free deposition and low-overburden deposition required for TSV plating

Other growth areas highlighted in the report’s forecast period from 2019 to 2024 include:

• The global laminate substrate market for IC packages is expected to log a 5 percent CAGR based on square meters of materials processed.
• Overall leadframe shipments are forecast to see a CAGR of just over 3 percent, with LFCSP (QFN type) registering the strongest unit growth with a CAGR of nearly 7 percent.
• Encapsulation material revenue will register a CAGR of just under 3 percent, growth driven by rising demand for smaller, thinner packaging form factors.
• Die attach material revenue will grow at a CAGR of nearly 4 percent.
• Solder ball revenue will expand at a CAGR of 3 percent.
• The WLP dielectrics market is expected to increase by, a 9 percent CAGR.
• The wafer-level plating chemical market is forecasted at a CAGR of over 7 percent.

The Global Semiconductor Packaging Materials Outlook is a comprehensive market research study on the semiconductor packaging materials market conducted by TechSearch International and SEMI or its partner TECHCET LLC. The 2020 outlook is the ninth edition of the report. Interviews were conducted with more than 100 semiconductor manufacturers, packaging subcontractors, fabless semiconductor companies, and packaging material suppliers. The report covers the following semiconductor packaging materials segments: 

• Substrates
• Leadframes
• Bonding wire
• Encapsulants
• Underfill materials
• Die attach
• Solder balls
• Wafer-level package dielectrics
• Wafer-level plating chemicals

For more information and to purchase the report, please visit the SEMI Global Semiconductor Packaging Materials Outlook web page.

About TechSearch International

TechSearch International Inc. was founded in 1987 as a technology licensing and consulting company specializing in emerging semiconductor packaging trends. Multi- and single-client services encompass technology licensing, strategic planning, and market technology analysis. Research topics include flip chip, wafer-level packaging, CSPs, BGAs, system-in-package (SiP), fan-in and FO-WLPs, and semiconductor packaging materials.

About SEMI

SEMI^® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Global Semiconductor Packaging Materials Market to Reach $20.8 Billion by 2024, SEMI and TechSearch International Report

MILPITAS, Calif. — July 27, 2020 — Worldwide silicon wafer area shipments rose 8 percent to 3,152 million square inches in the second quarter of 2020 compared to the 2,920 million square inches shipped in the first quarter of the year and surpassed second quarter 2019 shipments by 6 percent, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

"While the short-term outlook remains uncertain due to coronavirus and geopolitical challenges impacting the broader industry, global silicon wafer shipments accelerated in the second quarter,”said Neil Weaver, chairman SEMI SMG and vice president, Product Development and Applications Engineering at Shin Etsu Handotai America. “The strong first half of 2020 trended slightly higher than the first half of 2019.”

Silicon Area Shipment Trends – Semiconductor Applications Only

Source: SEMI (www.semi.org), July 2020

All data cited in this release includes polished silicon wafers such as virgin test wafers and epitaxial silicon wafers, as well as non-polished silicon wafers shipped to end users.
Silicon wafers are the fundamental building material for semiconductors, which, in turn, are vital components of virtually all electronics goods, including computers, telecommunications products, and consumer electronics. The highly engineered thin, round disks are produced in various diameters – from one inch to 12 inches – and serve as the substrate material on which most semiconductor devices, or chips, are fabricated.

The SMG is a sub-committee of the SEMI Electronic Materials Group (EMG) and is open to SEMI members involved in manufacturing polycrystalline silicon, monocrystalline silicon or silicon wafers (e.g., as cut, polished, epi). The purpose of the SMG is to facilitate collective efforts on issues related to the silicon industry including the development of market information and statistics about the silicon industry and the semiconductor market.

For more information, please visit SEMI Worldwide Silicon Wafer Shipment Statistics.

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Second Quarter 2020 Silicon Wafer Shipments Up Over First-Quarter and Year-Ago Volumes

MILPITAS, Calif. — July 23, 2020 — North America-based manufacturers of semiconductor equipment posted $2.32 billion in billings worldwide in June 2020 (three-month average basis), according to the June Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI . The billings figure is 1.1 percent lower than the final May 2020 level of $2.34 billion, and is 14.4 percent higher than the June 2019 billings level of $2.03 billion.

“June billings of North America-based semiconductor equipment manufacturers continue to show signs of resilience as the world copes with new realities posed by COVID-19,” said Ajit Manocha, SEMI president and CEO. “The year-over-year billings increase points to strong fundamentals that are enabling the semiconductor industry to effectively navigate these challenging times.”

The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.

Source: SEMI ( www.semi.org ), July 2020

SEMI publishes a monthly North American Billings report and issues the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases . These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide. For an overview of available SEMI market data, please visit www.semi.org/en/MarketInfo .

The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.

About SEMI

SEMI^® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Notes

Next SEMI Billings report is August 20, 2020 at 3:00pm Pacific.

For information on SEAJ Billings Express Report, visit www.seaj.or.jp .

• Read more about North American Semiconductor Equipment Industry Posts June 2020 Billings

Edwards Vacuum Advanced Fab Robot Wins Best of West Award at Virtual SEMICON West 2020

MILPITAS, Calif. – July 23, 2020 – The Edwards Service Vehicle X (ESV-X) concept automated mobile robot (AMR) – a reimagining of the semiconductor environment that features groundbreaking ground-up lifting and self-loading capabilities – today won the Best of West Award at the Virtual SEMICON West 2020. Edwards Vacuum, maker of the AMR, is a leading developer and manufacturer of sophisticated vacuum products, abatement solutions and related value-added services. See the ESV-X in action in this video.

Presented annually by SEMI and Semiconductor Digest, the Best of West award recognizes innovative new products or services that significantly advance the electronics manufacturing supply chain or a particular manufacturing capability. The ESV-X loads equipment without human intervention and autonomously delivers it to work locations within a semiconductor factory to minimize scheduled and unplanned downtime and the need for other transportation equipment while increasing customer safety. The ESV-X also frees technicians to focus on more strategic work.

Featuring state-of-the-art autonomous motion technology, the ESV-X uses mapping and localization to navigate semiconductor environments. Omni-directional movement and real-time rerouting allow the ESV-X to maneuver through dynamic and confined environments in ways never before possible with automated materials handlers. What’s more, onboard safety systems keep nearby chip manufacturing staff at a safe distance without interfering in their work.

“There’s a big emphasis on innovation at this year’s SEMICON West,” said Pete Singer, Editor-in-Chief of Semiconductor Digest. “The Edwards ESV-X is a great example of a supplier looking at new ways to improve factory efficiency and safety while saving time and money.”

About Semiconductor Digest
Through a mix of news, contributed articles and staff-written articles, Semiconductor Digest is dedicated to providing global information about the design, manufacturing, packaging and testing of semiconductors and other types of electronic devices, including MEMs, LEDs, displays, power electronics, optoelectronics/photonics, biomedical devices, solar cells, thin film batteries and flexible electronics. Semiconductor Digest consists of a website, magazine and topic-focused newsletters.

About SEMI

SEMI^® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association contact

Scott Stevens, Cardinal Communications for SEMI Americas
Phone: 1.512.288.4050
Email: [email protected]

Semiconductor Digest contact

Pete Singer, Editor-in-Chief
Phone: 1.978.470.1806
Email: [email protected]

• Read more about Edwards Vacuum Advanced Fab Robot Wins Best of West Award at Virtual SEMICON West 2020

Critical Role of 1,025 Standards and Emerging Cybersecurity Developments Showcased at SEMICON West

MILPITAS, Calif. – July 21, 2020​ – Focusing in on how the microelectronics industry has proved capable of proceeding apace during the COVID-19 pandemic, SEMI today highlighted the role of industry standards and emerging developments around cybersecurity at the annual West Views Media Conference at SEMICON West 2020.

Broad adoption of uniform SEMI standards is providing the foundation for factory automation and is making it possible for thousands of tech staff to keep working through shutdowns – and whatever happens next – should another pandemic hit. James Amano, senior director of International Standards for SEMI, shared lessons gleaned during the pandemic and announced candidate standards proposed for approval and release in the coming months.

“The pandemic has put a spotlight on the fact that a lot of chipmaker suppliers can use tablets and virtual reality headsets or goggles to do work that once required traveling engineers,” Amano said. “Thanks to SEMI and committees comprised of more than 5,000 Standards volunteers, there is no hodgepodge of differing remote connectivity solutions across different platforms, nor the accompanying accidental cybersecurity threats.”

Amano indicated that invaluable preparation has become readily apparent during the past few months, when fab operations hummed along despite COVID-19. For example, between February and April 2020, the use of software for remote diagnosis and management of semiconductor manufacturing tools by semiconductor suppliers more than doubled, and usage remained at record-high levels in May and June. He said that with the groundwork established by standards, a lot of technicians have continued to handle vital diagnostics and control, but from home.

Dave Anderson, SEMI Americas president and host organizer for SEMICON West, noted the opportunity to share learning on standards between industries.

“Automobiles now contain hundreds of microchips, so carmakers are big proponents and users of industry standards,” Anderson observed. “The global auto industry can teach other businesses new lessons about how standards can strengthen and advance industries. And at the same time, the auto industry can learn more about machine interface and data communications standards from the semiconductor industry.”

Meanwhile, chipmakers welcome technology that limits people within their cleanrooms.

“You want to minimize how often people come close to wafers, much less touch them – especially at leading-edge fabs where semiconductor recipe changes can occur every few months,” Anderson said.

Anderson also predicts the COVID-19 crisis will accelerate widespread interest in standards.

What’s next for cybersecurity and standards

Among takeaways surfaced during the pandemic is the need for accelerated development of standards with ever-more comprehensive cybersecurity specifications. In an increasingly competitive world, such standards will help to sustain uninterrupted progress during a next crisis, including another quarantine. Underscored by the pandemic, two draft SEMI standards are underway.

• Intel and Cimetrix are leading SEMI Draft Document 6566, Specification for Malware-Free Equipment Integration, refining it to define protocols for pre-shipment scans of equipment as well as various types of ongoing support including file transfers, maintenance patches, and component replacement. Importantly, the team’s aim is for the desired standard to introduce steps to “harden” equipment software and make it less vulnerable to cyberattacks. The measures will be evaluated against third-party frameworks, such as the National Vulnerability Database (NVD) and Common Vulnerability Scoring System (CVSS).

• TSMC and Industrial Technology Research Institute (ITRI) are leading SEMI Draft Document 6506, Specification for Cybersecurity of Fab Equipment, which defines a common, minimum set of security requirements for fab equipment. The standard will provide a baseline focusing on four major components of fab equipment: operating systems, network security, endpoint protection, and security monitoring. Once approved by the global SEMI Information and Control Committee, the goal will be to scale requirements as malware threats evolve.

About SEMI

SEMI^® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Technology Communities, defined groups within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Scott Stevens, Cardinal Communications for SEMI Americas
Phone: 1.512.288.4050
Email: ​[email protected]

• Read more about Resilience of Chip Manufacturing Facilities During COVID-19 Rooted in SEMI Standards