MILPITAS, Calif. — October 6, 2020 — Aiming to accelerate the adoption of smart manufacturing across the worldwide microelectronics supply chain, the first SEMI Global Smart Manufacturing Conference will gather Industry 4.0 experts October 20-23 to share best known methods (BKMs) for improving data capture and analysis in microelectronics manufacturing. Registration for the virtual conference featuring keynotes, case studies and tutorials is open.

Smart manufacturing practices could increase productivity by as much as 12% through line efficiency gains, quality improvements, and reductions in energy and direct labor costs, according to Deloitte. Industry 4.0 is also a significant driver of IC devices, accounting for $49 billion in sales in 2020, according to Gartner.

Smart manufacturing is the science of digitizing manufacturing data to maximize microelectronics yield and production efficiencies while increasing return on investment in equipment, processes and people. Members of the SEMI SMART Manufacturing initiative collaborate to drive advances and a higher return on investment faster.

The SEMI Global Smart Manufacturing Conference will feature six sessions on three topics – sensing, connecting and predicting – and experts from companies including BisTEL, Bosch, Broadcom, Deloitte, Doople, Micron, Schneider Electric, Texas Instruments, TDK and Yamaha. With two live sessions each day, the virtual conference will be easy to access during working hours in the major microelectronics manufacturing regions.

“There is a growing need across the world for more insights on effective smart manufacturing strategies and tools that lead to high ROI,” said Dr. Bobby Mitra, IEEE Fellow, worldwide director of Smart Manufacturing at Texas Instruments, and chair of the SEMI Smart Manufacturing Americas Chapter. “The first SEMI Global Smart Manufacturing Conference will bring together global experts with real-world experience who will outline the critical concepts in each smart manufacturing domain with best practices and returns.”

“The microelectronics industry’s urgency to drive greater manufacturing efficiencies has never been greater as foundational production technologies remain key enablers of advances in artificial intelligence (AI), 5G, machine learning and other smart technologies that promise to help the world overcome some of its greatest challenges including the current COVID-19 pandemic,” said Tom Salmon, vice president of Collaborative Technology Platforms and lead of the Smart Manufacturing Initiative at SEMI. “With the sharp reductions in worldwide air travel, SEMI is taking the lead with a virtual conference that will connect microelectronics manufacturing customers with solution providers via a new AI engine to provide a novel method of information sharing and networking that could be more effective than a face-to-face event.”

The global SEMI Smart Manufacturing Technology Community, which includes Smart Manufacturing committees in the Americas, China, Europe, Japan, Korea, Southeast Asia and Taiwan, identified the industry experts who will present as speakers and instructors at the conference.  

The SEMI Global Smart Manufacturing Conference programs committee consists of representatives from Applied Materials, Arizona State University, Inficon/FPS, IBM, Lam Research, Veracity Protocol, Rockwell Automation, Sapphire Automation, TEL, and Texas Instruments.

SEMI launched its Smart Manufacturing Initiative in 2016 to explore strategies and share best implementation practices among its members while meeting the needs of SEMI International Standards committees for data sharing.

For more information on the SEMI Global Smart Manufacturing Conference, please visit its website.

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI Virtual Conference Aims to Speed Smart Manufacturing Adoption Across Global Microelectronics Supply Chain

Industry Reports 12.6% Revenue Growth Overall; Most Categories Log Double-Digit Increases

MILPITAS, Calif. — October 5, 2020 — Electronic Design Automation (EDA) industry revenue increased 12.6% in Q2 2020 to $2,783.9 million, compared to $2,472.1 million in Q2 2019, with most categories logging double-digit increases, the Electronic System Design (ESD) Alliance Market Statistics Service (MSS) announced today. The four-quarter moving average, which compares the most recent four quarters to the prior four quarters, increased by 6.7%. The ESD Alliance is a SEMI Technology Community.

“The EDA industry reported a double-digit revenue increase for Q2 2020, compared to Q2 2019,” said Walden C. Rhines, Executive Sponsor, SEMI EDA Market Statistics Service. “Individually, Computer Aided Engineering (CAE), IC Physical Design and Verification, and Semiconductor IP (SIP) reported double-digit increases in Q2. Further, all geographic regions reported revenue increases.”

The companies tracked in the MSS report employed 46,579 people in Q2 2020, a 5% increase over the Q2 2019 headcount of 44,372 and up 1.4% compared to Q1 2020.

The quarterly MSS report containing detailed revenue information with category and geographic breakdowns is available to ESD Alliance members.

Revenue by Product Category in Q2 2020

• CAE revenue increased 16.1% to $922 million compared to Q2 2019. The four-quarter CAE moving average increased 7.1%.
• IC Physical Design and Verification revenue increased 16.8% to $584.1 million compared to Q2 2019. The four-quarter moving average for the category rose 4.8%.
• Printed Circuit Board and Multi-Chip Module (PCB and MCM) revenue decreased 0.3% to $243.5 million compared to Q2 2019. The four-quarter moving average for PCB and MCM increased 12.4%.
• SIP revenue increased 13.6% to $948.2 million compared to Q2 2019. The four-quarter SIP moving average grew 8.5%.
• Services revenue decreased 12.8% to $86.2 million compared to Q2 2019. The four-quarter Services moving average decreased 14.3%.

Revenue by Region in Q2 2020

• The Americas, the largest reporting region by revenue, purchased $1,155.6 million of EDA products and services in Q2 2020, an 11.4% increase compared to Q2 2019. The four-quarter moving average for the Americas increased 4.6%.
• Europe, the Middle East, and Africa (EMEA) revenue increased 5.2%, to $377.5 million compared to Q2 2019. The four-quarter moving average for EMEA grew 12.2%.
• Japan revenue increased 9% to $240.4 million compared to Q2 2019.
• APAC revenue increased 18.1% to $1,010.3 million compared to Q2 2019. The four-quarter moving average for APAC increased 6.3%.

About the MSS Report
The ESD Alliance Market Statistics Service reports EDA, IP and services industry revenue data quarterly and is available to Alliance members. Both public and private companies contribute data to the report. Each quarterly report is published approximately three months after quarter close. MSS report data is segmented as follows:

• Revenue type (product licenses and maintenance, services, and SIP)
• Application (CAE, PCB/MCM Layout, and IC Physical Design & Verification)
• Region (the Americas, Europe Middle East and Africa, Japan, and Asia Pacific)

In addition, the report provides many subcategories of detail and lists total employment of the tracked companies.

About the Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community, is the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry. As an international association of companies providing goods and services throughout the semiconductor design ecosystem, it is a forum to address technical, marketing, economic and legislative issues affecting the entire industry. For more information about the ESD Alliance, visit http://esd-alliance.org.

About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

The information supplied by the ESD Alliance is believed to be accurate and reliable, but the ESD Alliance assumes no responsibility for any errors that may appear in this document. All trademarks and registered trademarks are the property of their respective owners.

Press Contacts
Paul Cohen
ESD Alliance
A SEMI Strategic Technology Community
978-769-2106

Jack Taylor
Mentor, a Siemens Business
512-560-7143

• Read more about ESD Alliance Reports Strong Electronic Design Automation Industry Revenue Growth for Q2 2020

MILPITAS, Calif. – September 23, 2020 – SEMI Nano-Bio Materials Consortium (NBMC) today released a Request for Proposals (RFP) for innovations in ambulatory monitoring, wearable technologies for cognitive assessment, and innovative power sources for wearable monitors. Proposals are also welcome for new concepts to advance mobile human monitoring and diagnostic capabilities. Projects will be awarded with cash budgets ranging from $500,000 to $2 million. The RFP is funded by the U.S. Air Force Research Laboratory (AFRL).

SEMI-NBMC focuses on innovation challenges and opportunities during research and development (R&D) to increase the technology and manufacturing readiness levels (TRL/MRL) of nanotechnologies and biotechnologies. The SEMI-NBMC program and committee encourages submission of novel technical approaches that carry significant risk as well as those that represent evolutionary improvements on existing technical capabilities, which tend to be less risky and involve shorter development and delivery times.

Industry experts on the NBMC RFP Review Committee selected the RFP topics based on an analysis of strategic market gaps and will evaluate all white paper submissions against that gap analysis. To learn more about the aeromedical mission and the status of biomarkers and sensors for telemedicine, watch the SEMI-NBMC and AFRL August MedTech Workshop Series.

After evaluating white papers, the committee will invite select organizations to submit full proposals that will be rigorously evaluated on criteria including budget, collaboration value, dual-use (commercial and military/aerospace) applicability, relevance to the digital healthcare ecosystem, relevance to advancing nano-bio materials for human monitoring, schedule and milestones, deliverables, and overall proposal quality. See the complete SEMI-NBMC 2020 Request for Proposals for more details on the evaluation process.   

The consortium strongly encourages partnerships among industrial companies, R&D organizations and university teams. SEMI-NBMC funding will be matched with funds provided by grant recipients to cover total project cost. Development partners retain ownership of intellectual property developed under a SEMI NBMC contract.

White paper responses, the first step in responding to the RFP, are due October 20, 2020. SEMI-NBMC staff will review the RFP topics and submission and review process during a live webinar on October 2, 2020 at 10:00am PDT. Registration is open to anyone considering submitting a proposal. A recording of the webinar will be available for those unable attend the live event.

About SEMI-NBMC

SEMI-NBMC was founded in 2013 to bring together scientists, engineers and business development professionals from industry, government and universities to collaboratively initiate research and development of electronic technologies to improve human performance monitoring and performance augmentation capabilities. To date, over 25 industry partners have advanced the state-of-the-art in human-performance monitoring in 26 projects. Advancements include subsystems designed for ECG, functionalized biomarker sensors, and hydration sensors.

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI-NBMC Invites White Paper Proposals for Funding of Human Monitoring Innovations

HSINCHU, Taiwan – September 22, 2020 – SEMICON Taiwan 2020 Hybrid opens tomorrow with advanced, smart and green manufacturing in the spotlight on-site and online as industry visionaries and experts gather for the latest market trends, business opportunities and innovations across the semiconductor supply chain. The first hybrid SEMICON ever, the September 23-25 exhibition at the Taipei Nangang Exhibition Center, Hall 1 (TaiNEX 1), will feature a virtual platform with an exposition hall, live streaming forums, networking opportunities and virtual reality (VR) technology offering an immersive online experience accessible around the world. SEMICON Taiwan 2020 registration is open.

Entering its 25th year, SEMICON Taiwan features 15 theme pavilions and innovation zones as well as 19 international forums as in-show experience. For the first time, Smart Manufacturing Taiwan, Compound Semiconductor Innovation Zone, Heterogeneous Integration Innovation Zone, and Smart Workforce Pavilion will go virtual.

After registering for SEMICON Taiwan 2020 Hybrid online, attendees can log in to the virtual platform and find all exhibition information on the front page for easy navigation of the event. Key online features include:

1. Virtual Exhibition Hall: See the latest technologies and solutions from key exhibitors. View a sneak peek video of the hybrid experience.
2. 1-on-1 Chat: Connect with exhibitors and visitors in real time.
3. Networking Lounge: Exchange opinions with industry experts worldwide and uncover potential business opportunities and technical solutions.
4. SEMICON Taiwan Live Tour: Explore exciting activities and behind-the-scenes highlights of SEMICON Taiwan from an exclusive online perspective.
5. Forum Live Broadcast: Get insights from industry opinion leaders firsthand via live broadcasts of international forums. Visit the SEMICON Taiwan 2020 website for the forum schedule.
6. Virtual Reality (VR) Experience: For a better, faster visual experience, enter the virtual exhibition hall using a VR device and your smartphone’s screen.

For more information, visit the SEMICON Taiwan 2020 website.

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contacts

Jo-ann Su
SEMI Taiwan
Email: [email protected]
Phone: 886.3.560.1777 ext. 202

Irene Huang
SEMI Taiwan
Email: [email protected]
Phone: 886.03.560.1777 ext. 205

• Read more about SEMICON Taiwan 2020 Hybrid Opens Tomorrow With Advanced, Smart and Green Manufacturing in Spotlight

MILPITAS, Calif. — September 17, 2020 — North America-based manufacturers of semiconductor equipment posted $2.65 billion in billings worldwide in August 2020 (three-month average basis), according to the August Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 3.0 percent higher than the final July 2020 level of $2.57 billion, and is 32.5 percent higher than the August 2019 billings level of $2.00 billion.

“August billings of North America-based semiconductor equipment manufacturers demonstrate solid performance and strong year-over-year growth,” said Ajit Manocha, SEMI president and CEO. “Semiconductor equipment demand remains robust despite supply chain uncertainties and new regulatory constraints.”

The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.

Source: SEMI (www.semi.org), September 2020

SEMI publishes a monthly North American Billings report and issues the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases. These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide. For an overview of available SEMI market data, please visit www.semi.org/en/MarketInfo.

The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Notes

Next SEMI Billings report is October 22, 2020 at 3:00pm Pacific.

For information on SEAJ Billings Express Report, visit www.seaj.or.jp. 

• Read more about North American Semiconductor Equipment Industry Posts August 2020 Billings

HSINCHU, Taiwan – September 10, 2020 – Advanced, smart and green manufacturing will take center stage on-site and online September 23-25 as SEMICON Taiwan 2020 gathers industry visionaries and experts for the latest market trends, business opportunities and innovations across the semiconductor supply chain. Bringing together 550 exhibitors across 2,000 booths at the Taipei Nangang Exhibition Center, Hall 1 (TaiNEX 1), the hybrid event will also feature a virtual platform with an expo hall, live streaming forums and virtual reality (VR) technology for an immersive online experience accessible around the world. SEMICON Taiwan 2020 registration is now open.

The event coincides with the emergence of work from home, cloud services and telemedicine merged as drivers of semiconductor industry growth. Enabling technologies artificial intelligence (AI) and 5G are also key forces at play. The three technology areas – critical bulwarks in the world’s continuing battle against the COVID-19 pandemic – will contribute to a record US$67.7 billion in global fab equipment spending, an increase of 24%, next year, according to SEMI.  

SEMICON Taiwan 2020 Highlights

• Master Forum – High-technology thought leaders from TSMC, Foxconn, STMicroelectronics, Micron, FET, and Lam Research will explore how the semiconductor industry can leverage AI and 5G to fuel the next wave of innovation.
• Hi-Tech Corporate Growth & Innovation Forum – Taiwan Tech Arena (TTA) and Taiwania Capital will join SEMI for the first time to discuss how more corporations can make strategic investments to drive sustainable innovation. In addition, more than 10 semiconductor startups will introduce cross-discipline technologies designed to drive innovation.
• SMART Mobility Forum – Industry experts from IBM, Renesas Electronics, NXP Semiconductors, STMicroelectronics and Jaguar Land Rover will share the latest automotive technologies and market trends.
• SMART MedTech Forum – Experts from the Ministry of Science Technology (MOST), National Yang-Ming University and Powerchip Semiconductor Manufacturing will introduce cutting-edge medical technologies for the COVID-19 era and beyond.
• SMART Workforce Pavilion – To help build the electronics industry’s talent pipeline, SEMICON Taiwan 2020 will feature the Talent Cultivation Symposium, Women-in-Tech Forum and Talent Forum. In addition, talent-matching events will connect microelectronics companies with students to help them take an early step in launching their careers in high technology.
• Theme Pavilions & Innovation Zone – The event’s 15 theme pavilions and innovation zones will focus on critical areas of chip industry innovation and growth ranging from heterogeneous integration to compound and opto semiconductors, testing and materials while targeting macro issues such as circular economy and green power.
• 5 Concurrent Events – SEMICON Taiwan is co-located with FLEX Taiwan, ITC-Asia, Strategic Materials Conference Taiwan, SiP Global Summit, and SMART Manufacturing Taiwan.

Visitor Safety at SEMICON Taiwan 2020

The safety and well-being of visitors to all SEMI events is SEMI’s top priority. To help protect attendees at the on-site SEMICON Taiwan 2020, SEMI encourages all visitors to wear face masks. Attendees can also take advantage of hand sanitizers and body temperature checks at the event. In addition, contact-tracing information will be gathered.

For more event information, visit SEMICON Taiwan 2020.

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contacts
Jo-ann Su
SEMI Taiwan
Email: [email protected]
Phone: 886.3.560.1777 ext. 202

Irene Huang
SEMI Taiwan
Email: [email protected]
Phone: 886.3.560.1777 ext. 205

• Read more about SEMICON Taiwan 2020 Hybrid to Lead the Way in AI and 5G Era

MILPITAS, Calif. – September 8, 2020 – Soaring pandemic-fueled demand for chips that power everything from communications and IT infrastructures to personal computing, gaming and healthcare electronics will drive an 8% increase in global fab equipment spending in 2020 and a 13% increase in 2021, SEMI announced today in its World Fab Forecast report. Rising demand for semiconductors for datacenter infrastructures and server storage along with the buildup of safety stock as U.S.-China trade tensions intensify are also contributing to this year’s growth.   

The bullish trend for overall fab equipment investments comes as the semiconductor industry recovers from a 9% decline in fab spending in 2019 and navigates a roller-coaster 2020 with actual and projected spending drops in the first and third quarters mixed with second- and fourth-quarter increases. See figure below.

Of all chip sectors, memory will see the largest spending increase in 2020, growing US$3.7 billion, or 16% year-over-year (YoY), to US$26.4 billion, and tack on an 18% increase to reach US$31.2 billion in 2021. 3D NAND spending will log the largest percentage surge this year, expanding 39%, and register modest growth of 7% in 2021. DRAM is expected to see 4% growth after a slowdown in the second half of 2020 before jumping 39% percent next year.

Equipment spending forecasts for other semiconductor sectors:

• Foundry, the next largest sector in equipment spending for 2020, is forecast to rise US$2.5 billion, or 12% YoY, to US$23.2 billion and edge up 2% to US$23.5 billion in 2021.
• MPU equipment spending will decline US$1.2 billion, or 18%, in 2020 and rise 9% to US$6 billion in 2021.
• Analog spending will grow a robust 48% in 2020 and rise 6% in 2021, an expansion chiefly driven by equipment investments for mixed-signal/power fabs.
• Image sensors equipment spending is expected to rise 4% to US$3 billion in 2020 and jump 11% to US$3.4 billion in 2021.

The SEMI World Fab Forecast report covers more than 1,300 fabs and lines and includes capacity and technology by fab and construction investments. The report shows 21 new construction projects – ranging from R&D to volume and including high- and low-probability parameters – starting in 2020. China accounts for the most (nine) of the new projects; followed by Taiwan at five; Southeast Asia and the Americas at two each; and Japan, Korea, and Europe/Mideast at one each. The report also tracks 18 new construction projects planned to begin next year – 10 in China, four in the Americas, three in Taiwan, and one in Europe/Mideast.

About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contacts
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Christian G. Dieseldorff/SEMI
Phone: 1.408.943.7940
Email: [email protected]  

• Read more about COVID-19 Drives Rise in Global Fab Equipment Spending, SEMI Reports

MILPITAS, Calif. – September 8, 2020 – Second quarter 2020 global billings for semiconductor manufacturing equipment jumped 26% year-over-year and 8%, to US$16.8 billion, from the first quarter of the year, SEMI announced today in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.

SEMI, the global industry association representing the electronics design and manufacturing supply chain, and the Semiconductor Equipment Association of Japan (SEAJ) gathered the data from more than 80 global equipment companies that report billings figures monthly. Following are quarterly billings data in billions of U.S. dollars quarter-over-quarter and year-over-year change by region:

Source: SEMI (www.semi.org) and SEAJ (www.seaj.or.jp), September 2020

The SEMI Equipment Market Data Subscription (EMDS) provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports:

• Monthly SEMI Billings Report, a perspective on equipment market trends
• Monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and 24 market segments
• SEMI Semiconductor Equipment Forecast, an outlook for the semiconductor equipment market

For more information or to subscribe, please contact the SEMI Industry Research and Statistics Group at [email protected]. More information is also available online.

About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Second Quarter 2020 Global Semiconductor Equipment Billings Up 26% Year-Over-Year, SEMI Reports

MILPITAS, Calif. – August 31, 2020 – Staged for the first time in virtual format, MEMS and Sensors Executive Conference (MSEC 2020) will gather industry visionaries and experts October 6-15 for the latest trends and innovations in sensorization for growth markets including medical, entertainment, augmented and virtual reality, the environment, food production, smart cities, ultrasonics and wearables.

Themed The Next Wave of Sensorization: Solving our Shared Challenges, the event will focus on solving technology challenges in vital areas such as health and safety while fueling the experience economy with advances in virtual and augmented reality. Components, software, and systems critical to MEMS and sensors innovations will come into sharp focus at the conference. Registration is open.

MSEC Keynotes

	Michael Tschanz, Director, Engineering Technology and Analysis Disney’s extensive use of sensors including for rides, animatronics and sensorization of the world’s largest micro transportation system
	Jens Fabrowsky, executive vice president, Automotive Electronics MEMS market opportunities and technology challenges over the next 10 years
	Dale Zimmerman, director for Photonics Devices MEMS-enabled display for Hololens augmented reality, including applications and market progress

MSEC 2020 will also feature sessions on key industry topics including the following:

• MedTech Considerations for Resolving the Trouble with Innovative Sensing Applications – Ian Chen, executive director for Medical New Business Development, Maxim Integrated,
• Opportunities in Biotech and Related Markets Due to COVID-19 –Ross Bundy, co-founder, Cardea
• MEMS Tug-of-war: COVID-19 vs Emerging Trends – Dimitrios Damianos, technology and market analyst for Imaging and MEMS, Yole Développement,
• A Wearable Social Distancing Solution Based on Ultrasonic Time-of-Flight Sensors – David Horsley, co-founder, TDK-Chirp Microsystems,
• tinyML: Massive Opportunity When Machine Intelligence Meets the Real World of Billions of Sensors – Evgeni Gousev, senior director, Qualcomm AI Research
• AI for Ultrasound Medical Imaging – Janusz Bryzek, executive chairman and CTO, eXo Systems,
• Future Mobility Enabled by Sensorization – Andreas Breitner, Partner, McKinsey & Company

Premier Sponsors

• Platinum Sponsor: EV Group, SPTS Technologies, a KLA Company
• Gold Sponsors: Applied Materials, Infineon, LAM Research, Okmetic, TEL

Event sponsors include Microtech Ventures. 

MSEC 2020 is hosted by MEMS & Sensors Industry Group (MSIG), a SEMI technology community. Learn more at Virtual MSEC 2020.

About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association contact

Scott Stevens, Cardinal Communications for SEMI Americas
Phone: 1.512.288.4050
Email: [email protected]

• Read more about Virtual MSEC 2020 to Spotlight MEMS and Sensors Innovations for Medical, Smart Cities, Other Growth Markets

MILPITAS, Calif. – August 24, 2020 – SEMI, the industry association serving the global electronics design and manufacturing supply chain, today released the following statement in response to the new export control rule changes announced by the United States Commerce Department.

SEMI recognizes the role of export control measures to address threats to U.S. national security. However, we are very concerned the new export control regulations issued on August 17, 2020, by the U.S. Department of Commerce will ultimately undermine U.S. national security interests by harming the semiconductor industry in the U.S. and creating substantial uncertainty and disruption in the semiconductor supply chain. On July 14, in public comments on the May 15 regulations, SEMI cautioned that those relatively narrow actions created unique disincentives to purchase U.S.-origin semiconductor equipment and design software and had already resulted in $17 million lost sales of U.S-origin items to firms unrelated to Huawei.

Commerce’s decision to significantly expand these unilateral restrictions will likely lead to more lost sales, eroding the customer base for U.S-origin items. The new restrictions will also fuel a perception that the supply of U.S. technology is unreliable and lead non-U.S. customers to call for the design-out of U.S. technology. Meanwhile, these actions further incentivize efforts to supplant these U.S. technologies.

SEMI respectfully requests Commerce immediately extend to 120 days the savings clause for items in production before August 17, ensure predictable and timely license decisions for all items and significant flexibility for licenses unrelated to 5G items. We also urge the administration to pursue policies with fewer unintended consequences and damage to U.S. technology leadership. Revenue from global sales is a major source of U.S. research and development (R&D) funding in these technologies; lost global revenue will lead to a decrease in R&D, undermining U.S. semiconductor innovation and thereby harming national security.

About SEMI

SEMI^® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

SEMI Contact

Samer Bahou/SEMI
Phone: 1.408.943.7870
Email: [email protected]

• Read more about SEMI Statement on New U.S. Export Control Regulations