downloadGroupGroupnoun_press release_995423_000000 copyGroupnoun_Feed_96767_000000Group 19noun_pictures_1817522_000000Group 19Group 19noun_Photo_2085192_000000 Copynoun_presentation_2096081_000000Group 19Group Copy 7noun_webinar_692730_000000Path
Skip to main content

Publication Date:

Principal Analysts:

Dr. Dan Tracy of Techcet and E. Jan Vardaman of TechSearch International, Inc.

Format:

Adobe® PDF (.pdf)
2020 GSPMO

Global Semiconductor Packaging Materials Outlook is a comprehensive market research study that examines semiconductor packaging technology trends and their impact on the packaging materials markets. Packaging materials markets are quantified; new opportunities are highlighted for advanced technology nodes and emerging package from factors, and forecasts through 2024 are presented. 

Global Semiconductor Packaging Materials Outlook is an essential business tool for anyone interested in the plastic packaging materials arena. Packaging materials directly affect the performance, reliability, and cost of semiconductors, and offer significant improvement potential.

 

Product Information

Features

  • Technology trends
  • Regional market size
  • Five-year market forecast to 2024
  • Market size in revenue and units
  • Concise Executive Summary
  • Excel workbook file summarizing market information 
  • Supplier market share
  • Capacity and utilization trends 

Benefits

  • Gain insights to worldwide packaging material technology trends, market size, and market forecast
  • Understand key package offerings and technologies
  • Use benchmark data to validate business opportunities and assumptions
  • Improve business analysis and empower your market research with verified, validated, and credible data

 

Table of Contents

EXECUTIVE SUMMARY 
1 INTRODUCTION 
1.1 Methodology 
1.2 Assumptions 
1.3 Report Organization 

2 SEMICONDUCTOR PACKAGING AND INDUSTRY TRENDS 
2.1 Semiconductor Trends - Industry Markets 
2.2 Semiconductor Trends - Regional and Market Issues 
2.3 Packaging Materials Needs – Customer Input 
2.4 Packages and Electronic End-market Applications 

3 SUBSTRATES 
3.1 Laminate Substrates 
3.2 Build-up Substrates 
3.3 Organic Substrate Technology Trends 
3.4 Organic Substrate Material Markets and Forecasts 
3.5 Organic Substrate Pricing 
3.6 Organic Substrate Suppliers

4 LEADFRAMES 
4.1 Leadframe Market and Technology Trends 
4.2 Leadframe Markets 
4.3 Leadframe Market Forecasts 
4.4 Leadframe Suppliers 

5 BONDING WIRE 
5.1 Bonding Wire Market and Technology Trends 
5.2 Bonding Wire Markets 
5.3 Bonding Wire Pricing 
5.4 Bonding Wire Market Forecasts
5.5 Bonding Wire Suppliers 

6 Encapsulant Materials
6.1 Encapsulant Materials Technology Trends 
6.2 Encapsulant Materials Markets 
6.3 Encapsulant Materials Forecasts
6.4 Encapsulant Materials Suppliers


7 UNDERFILL MATERIALS 
7.1 Capillary Underfill (CUF) 
7.2 Molded Underfill (MUF) 
7.3 Non-conductive Paste (NCP) 
7.4 Non-conductive Film (NCF) 
7.5 Underfill Technology Trends 
7.6 Underfill Material Market 
7.7 Underfill for Packages 
7.8 Underfill Suppliers

8 DIE ATTACH MATERIALS 
8.1 Die Attach Technology Trends 
8.2 Die Attach Markets 
8.3 Die Attach Market Forecasts 
8.4 Die Attach Suppliers
 

9 SOLDER BALLS 
9.1 Solder Ball Material Technology Trends 
9.2 Solder Ball Market and Forecast 
9.3 Solder Ball Suppliers
 

10 WAFER LEVEL PACKAGE
10.1 Wafer Level Package Dielectrics Technology Trends 
10.2 Wafer Level Package Dielectrics Market and Forecast 
10.3 Wafer Level Package Dielectrics Suppliers


11 PLATING CHEMICALS
11.1 Plating Chemicals Technology Trends
11.2 Plating Chemicals Material Development
11.3 Plating Chemicals Market and Forecast
11.4 Plating Chemicals Material Suppliers
 

12 SUMMARY AND CONCLUSIONS
12.1 Acknowledgements


13 APPENDICES

In-person interview with material suppliers, packaging subcontractors and semiconductor manufacturers around the world are the sources of information for this study. Market size information is developed through primary research and modeling. Five-year market forecasts are developed based on different scenarios of new technology penetration and market growth. 

Purchase

Product Member Non-Member  
Global Semiconductor Packaging Materials Outlook (with Forecast to 2024) - Single User $5,000 $6,250 Buy Now
Global Semiconductor Packaging Materials Outlook (with Forecast to 2024) - Multi-User $14,000 $18,750 Buy Now