MILPITAS, Calif., and ANN ARBOR, Mich. – April 19, 2021 – SEMI, the largest global trade association for the design and manufacture of semiconductors, and the Center for Automotive Research (CAR), a 501(c)(3) nonprofit independent automotive/mobility industry think tank, today announced the signing of a Memorandum of Understanding (MOU) for joint exploration to advance increased supply chain collaboration between the semiconductor and automotive industries. Building on the SEMI Smart Mobility initiative, which fosters collaboration across the global automotive electronics supply chain, the MOU lays the foundation to connect microelectronics manufacturing and design stakeholders with the automotive and mobility ecosystems through programs and events that advance both industries.

For SEMI, the collaboration with CAR supports the mission of its Smart Mobility initiative to foster mutually beneficial interactions and broaden transparent dialogue between its global member companies and the automotive ecosystem. For CAR, as electronic systems are increasingly becoming the critical differentiators in vehicles, having automakers, suppliers, and semiconductor manufacturers work together more closely will add visibility into supply and demand trends. The result is intended to help connect larger cross-sections of the supply chains and minimize the impact and risk of future chip shortages and over-supply.

“This MOU provides vehicle OEMs with access to innovation, the ability to influence technology direction and pace, along with greater visibility into global supply chain developments,” said Dave Anderson, president of SEMI Americas. “Working with CAR will expand the cross-industry collaboration that is part and parcel to our automotive electronics and mobility activities, helping SEMI members in the global electronics design and manufacturing supply chain to better serve their automotive customers.”

“As automotive technology evolves, the industry will become more semiconductor-intensive – advanced safety features, electric vehicles, powertrain controls, automated driving, telematics, and infotainment all drive rapidly increasing auto chip demand,” said Carla Bailo, president and CEO for CAR. “In today’s market context, this MOU serves as a first step toward cultivating strategic partnerships between automotive OEMs, Tier 1 suppliers and semiconductor suppliers, and it can help to strengthen industry-wide efforts to share information and drive alignment.”

About SEMI Smart Mobility

The SEMI Smart Mobility initiative is designed to engage automotive OEMs, Tier 1s, device makers, design houses, equipment and materials companies as well as R&D institutes in SEMI’s Global Automotive Advisory Council (GAAC) to connect, collaborate and innovate across the global automotive electronics supply chain.

About SEMI

SEMI^® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

About CAR

The Center for Automotive Research is a nonprofit organization; its mission is to conduct independent research and analysis to educate, inform and advise stakeholders, policy makers, and the general public on critical issues facing the automotive industry, and the industry’s impact on the U.S. economy and society.

Media contacts:

SEMI
Samer Bahou
Phone: 1.408.943.7870
Email: [email protected]

CAR
Katie Ramsburgh
Phone: 1.734.476.1706
Email: [email protected]

• Read more about SEMI and Center for Automotive Research Announce Collaboration to Harmonize Semiconductor and Automotive Supply Chains

Industry Reports 15.4% Revenue Growth Overall; Surpasses $3 Billion for Fourth Quarter

MILPITAS, Calif. — April 13, 2021 — Electronic System Design (ESD) industry revenue increased by over $1 billion in 2020, marking a new milestone for the industry, the ESD Alliance, a SEMI Technology Community, announced today in the Q4 2020 Electronic Design Market Data report. Revenue increased 15.4% in Q4 2020 to $3,031.5 million, compared to $2,626.3 million in Q4 2019, representing only the fourth time since 2011 that year-over-year growth exceeded 15%. The four-quarter moving average, which compares the most recent four quarters to the prior four quarters, rose by 11.6%, the highest annual growth since 2011 and the second highest in the last 14 years.

“The industry reported a substantial double-digit year-over-year revenue increase for Q4 2020,” said Walden C. Rhines, Executive Sponsor, SEMI Electronic Design Market Data report. “Overall industry revenue surpassed $3 billion for Q4, with increases in all geographic regions. The Computer Aided Engineering (CAE), IC Physical Design and Verification, Semiconductor IP (SIP), and Services categories also reported fourth-quarter growth.”

The companies tracked in the EDMD report employed 48,478 people in Q4 2020, a 6.7% increase over the Q4 2019 headcount of 45,416 and up 3% compared to Q3 2020.

The quarterly EDMD report containing detailed revenue information with the following category and geographic breakdowns.

Revenue by Product and Application Category in Q4 2020

• CAE revenue increased 9.4% to $956.9 million compared to Q4 2019. The four-quarter CAE moving average also increased 9.4%.

• IC Physical Design and Verification revenue increased 36.6% to $637.1 million compared to Q4 2019. The four-quarter moving average for the category rose 12.3%.

• Printed Circuit Board and Multi-Chip Module (PCB and MCM) revenue decreased 0.8% to $292.9 million compared to Q4 2019. The four-quarter moving average for PCB and MCM increased 4.3%.

• SIP revenue increased 16.9% to $1,052.9 million compared to Q4 2019. The four-quarter SIP moving average grew 17.1%.

• Services revenue increased 2.2% to $91.6 million compared to Q4 2019. The four-quarter Services moving average decreased 2.4%.

Revenue by Region in Q4 2020

• The Americas, the largest reporting region by revenue, purchased $1,304 million of Electronic System Design products and services in Q4 2020, a 15.8% increase compared to Q4 2019. The four-quarter moving average for the Americas increased 9.9%.

• Europe, the Middle East, and Africa (EMEA) revenue increased 2.7%, to $457.2 million compared to Q4 2019. The four-quarter moving average for EMEA grew 6.3%.

• Japan revenue increased 8% to $228.2 million compared to Q4 2019. The four-quarter moving average for Japan rose 8.2%.

• Asia Pacific (APAC) revenue increased 23.4% to $1,042 million compared to Q4 2019. The four-quarter moving average for APAC increased 17.1%.

About the EDMD Report

The ESD Alliance Electronic Design Market Data (formerly the Market Statistics Service) reports EDA, IP and services industry revenue data quarterly and is available from SEMI. Both public and private companies contribute data to the report. Each quarterly report is published approximately three months after quarter close. EDMD report data is segmented as follows:

• Revenue by product category (CAE, IC Physical Design and Verification, Semiconductor IP, PCB/MCM Layout, and Services) including numerous detailed sub-categories
• Revenue by geographic region (the Americas, Europe Middle East and Africa, Japan, and Asia Pacific)
• Total employment at participating companies

For information about SEMI market research reports, visit the SEMI Market Research Reports and Databases Catalog.

About the Electronic System Design Alliance

The Electronic System Design (ESD) Alliance, a SEMI Technology Community, is the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry. As an international association of companies providing goods and services throughout the semiconductor design ecosystem, it is a forum to address technical, marketing, economic and legislative issues affecting the entire industry. For more information about the ESD Alliance, visit http://esd-alliance.org.

About SEMI

SEMI^® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

The information supplied by the ESD Alliance is believed to be accurate and reliable, but the ESD Alliance assumes no responsibility for any errors that may appear in this document. All trademarks and registered trademarks are the property of their respective owners.

Press Contacts

Paul Cohen
ESD Alliance
A SEMI Technology Community
978-769-2106

Jack Taylor
Siemens EDA
512-560-7143

• Read more about ESD Alliance Reports Strong Electronic System Design Industry Revenue Growth for Q4 2020

MILPITAS, Calif. – April 13, 2021 – Worldwide sales of semiconductor manufacturing equipment surged 19% from $59.8 billion in 2019 to a new all-time high of $71.2 billion in 2020, SEMI, the industry association representing the global electronics product design and manufacturing supply chain, reported today. The data is now available in the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.

For the first time, China claimed the largest market for new semiconductor equipment with sales growth of 39% to $18.72 billion. Sales in Taiwan, the second-largest equipment market, remained flat in 2020 with sales of $17.15 billion after showing strong growth in 2019. Korea registered 61% growth to $16.08 billion to maintain the third position.  Annual spending also increased 21% in Japan and 16% in Europe as both regions are recovering from the contraction in 2019. Receipts in North America decreased 20% in 2020 following three years of consecutive growth.

Global sales of wafer processing equipment rose 19% in 2020, while other front-end segment sales grew 4%. Assembly and packaging showed strong growth across all regions, resulting in a 34% market increase in 2020, while total test equipment sales increased 20%.

Compiled from data submitted by members of SEMI and the Semiconductor Equipment Association of Japan (SEAJ), the Worldwide SEMS Report is a summary of the monthly billings figures for the global semiconductor equipment industry. Equipment categories cover wafer processing, assembly and packaging, test, and other front-end equipment including mask/reticle manufacturing, wafer manufacturing, and fab facilities.
 

Annual Billings by Region in Billions of U.S. Dollars with Year-Over-Year Change Rates 

Source: SEMI (www.semi.org) and SEAJ (www.seaj.or.jp), April 2021

The SEMI Equipment Market Data Subscription (EMDS) provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports:

• Monthly SEMI Billings Report, a perspective on equipment market trends
• Monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and 24 market segments
• SEMI Semiconductor Equipment Forecast, an outlook for the semiconductor equipment market.

For more information or to subscribe, please contact the SEMI Industry Research and Statistics Group at [email protected]. More information is also available online.

About SEMI
SEMI^® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about 2020 Global Semiconductor Equipment Sales Surge 19% to Industry Record $71.2 Billion, SEMI Reports

MILPITAS, Calif. – April 6, 2021 – SEMI, the industry association serving the global electronics design and manufacturing supply chain, today announced that it filed comments with the U.S. Department of Commerce in response to its request for public comments regarding risks in the semiconductor manufacturing and advanced packaging supply chain. The comments SEMI submitted provide a summary of the processes, goods and technologies needed for semiconductor production and a host of policy recommendations to strengthen the U.S. semiconductor supply chain and resiliency of the industry.

“Our comments show that just as countless industries depend on semiconductors, semiconductor fabs depend on a complex, global supply chain providing the essential building blocks for semiconductor device manufacturing, from silicon through final test,” said Ajit Manocha, SEMI president and CEO. “Incentives to strengthen the industry must be available to all links within the semiconductor supply chain to minimize potential bottlenecks upstream of chip fabs that could impede the growth of the industry in the United States.”

SEMI recommendations in the comments include:

• Strong federal manufacturing and research and development incentives for the entire semiconductor supply chain
• Competitive corporate tax policies
• Trade policies that open markets and eliminate barriers to trade
• Harmonized and pragmatic environment, health, and safety regulations
• Strong workforce development and immigration policies for high-skilled workers
• Narrowly tailored and multilateral export control policies

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

SEMI Contact

Samer Bahou/SEMI
Phone: 1.408.943.7870
Email: [email protected]

• Read more about SEMI Provides U.S. Commerce Department with Analysis of Semiconductor Supply Chain Risks and Recommendations on Strengthening Industry Resiliency

BERLIN, Germany ─ April 6, 2021 ─ Leading executives, analysts, economists and technologists will gather 20-22 April, 2021, at the SEMI Industry Strategy Symposium Europe (ISS Europe), a virtual event, to highlight the technologies and the collaborations vital to meeting Europe’s most pressing strategic, social and economic challenges. Registration is open.

“ISS Europe is a key platform for promoting European partnerships vital to overcoming global challenges and strengthening Europe's digital and technological sovereignty in order to enable its leadership in the digital age,” said Laith Altimime, president of SEMI Europe. “Some of Europe’s brightest minds will gather at ISS Europe to identify collaboration opportunities in order to bolster Europe’s competitive advantage.”

The symposium will kick off with a discussion on the digital transformation and security of Europe’s economies and societies, fueled by innovations that are blurring the lines between the physical and digital worlds.

Day two will focus on environmental sustainability strategies and how the microelectronics industry can contribute to the European Commission’s €1 billion European Green Deal aimed at a climate-neutral Europe by 2050. Day three of the symposium will explore how technology is becoming increasingly integral to healthcare.  

Premium ISS Europe sponsors are SPTS, a KLA Company, and Tokyo Electron Europe. Panelist sponsor is Edwards. Event sponsors are Accenture, DB Schenker, Ebara, EV Group (EVG), imec and VAT.

Registration is complimentary. For more information about ISS Europe 2021, please see the program online. For sponsorship opportunities, contact Adi Hodorov at [email protected].

Follow #ISSEurope @SEMIEurope on LinkedIn and Twitter.
 

About SEMI

SEMI^® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.
 

Association Contact

Serena Brischetto / SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

• Read more about Industry Strategy Symposium Europe to Explore Digitalization, Security and Environmental Sustainability

MILPITAS, Calif. – April 1, 2021 – SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the inclusion of initiatives to strengthen U.S. semiconductor manufacturing and research and calls for investment in the Biden Administration’s American Jobs Plan. In addition to calling on Congress to invest $50 billion in semiconductor manufacturing and research, in line with the bipartisan CHIPS for America Act, the plan lists semiconductors as a field of focus in its call for an investment of another $50 billion in the National Science Foundation (NSF).

“Reversing the 50% decline in the U.S. share of semiconductor manufacturing capacity over the past 20 years requires bold action, and the Biden administration’s support for significant funding to bolster the industry in its American Jobs Plan is an important step forward,” said Ajit Manocha, SEMI president and CEO. “Funding the authorized CHIPS For America Act provisions and enacting an investment tax credit to support investment in the U.S. semiconductor supply chain will make the United States a globally competitive location for new semiconductor facilities. The plan’s focus on addressing workforce development in the industry is encouraging as well, as the competition for talent is intensifying to support projected growth.”

About SEMI 

SEMI^® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

SEMI Contact
Samer Bahou/SEMI
Phone: 1.408.943.7870
Email: [email protected]

• Read more about SEMI Applauds Initiatives to Bolster Semiconductor Manufacturing and Research in American Jobs Plan

BERLIN, Germany ─ March 30, 2021 ─ SEMI today announced its participation as an industry expert in a study by researchers in Coventry University’s Institute for Future Transport and Cities’ (IFTC) Systems Security Group (SSG) to examine drivers of computer hardware security adoption among businesses and consumers.

The UK government’s Economic and Social Research Council (ESRC)-funded Discribe (Digital Security by Design Social Science) Hub awarded SSG more than £100,000 last year for the project. Discribe aims to broaden the deployment of cybersecurity technology and help protect economies worldwide against cyberattacks. TechWorks, UK’s Deep Tech Hub, will also serve as an industry expert body in the project.

“With hardware security critically important to semiconductor innovation, SEMI is pleased to partner with the SSG team on this initiative,” said Laith Altimime, president of SEMI Europe. “The SSG cybersecurity project promises to arm the electronics value chain with best practices it can follow to strengthen the security of electronics.”

Professor Siraj Shaikh, Director of Research at IFTC and leader of SSG, will oversee the project with support by co-investigators Dr. Simon Parkin of TU Delft (Netherlands) and Dr. Muhammad Azmat of Aston University (UK). The project will promote commercial adoption of secure technology by identifying the greatest costs to businesses and understanding the reasons businesses choose not to implement cybersecurity. The findings promise to shed light on cybersecurity vulnerabilities for technology manufacturers, enabling them to better address security gaps in future designs.

“IFTC is committed to Discribe’s goal of mass adoption of cybersecurity by technology providers,” Shaikh said. “Digital security is vital to driving innovation in mobility and artificial intelligence (AI). We look forward to working to build public trust in these technologies to help ensure their widespread adoption.”

About Institute for Future Transport and Cities (IFTC)
The Institute for Future Transport and Cities develops pioneering mobility solutions. From accelerating the progression towards zero-carbon transport and developing inclusive design practices to ensuring the safe implementation of autonomous transport solutions, IFTC is central to solving global mobility challenges. IFTC works closely with industry to ensure that its research has real-world applications, maintaining close relationships with leading businesses within the transport sector.

About IFTC’s Systems Security Group (SSG)
The Group’s core mission is to research and engineer secure and resilient cyber-physical systems for the automotive and transport industry, working in collaboration with partners in industry, academia, and government. The SSG does this by detecting and modelling emerging threats, validating novel solutions for automotive security and resilience.

About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]
www.semi.org/eu

• Read more about SEMI Joins UK Initiative to Promote Cybersecurity Adoption

BERLIN, Germany ─ February 15, 2021 ─ The Catholic University of Leuven, Technical University of Dresden and CEA-Leti have won the 2019 European SEMI Award at the SEMI Technology Unites Global Summit for their pivotal contributions in the fields of telecommunications and nanotechnology. The award winners’ pioneering research and collaboration with academia and industry led to major advances in semiconductor technologies and their market adoption.

The European SEMI Award, established 32 years ago, recognizes key players in the global manufacturing supply chain for their leadership excellence and strategic contributions that help drive critical advances in the microelectronics industry.

2019 SEMI European Award Winners

• Willy Sansen, Professor in Engineering Science at the Catholic University of Leuven (KU Leuven) and Gerhard Fettweis, Professor in Communications Engineering and Vodafone Chair at the Technical University of Dresden (TU Dresden),made outstanding research contributions in analog design and digital design techniques for a wide variety of applications.
   
• Jean-Frédéric Clerc, Vice President, Technological Research Division of CEA-Leti, Grenoble-based French Alternative Energies and Atomic Energy Commission, received the European SEMI Special Service Award 2019 for outstanding research in nanotechnologies and contributions to the European semiconductor community throughout his career. With hundreds of patents to his name, Clerc drove research that led to innovations in liquid crystal flat screens and microsystems and is contributing to the development of biochips.

Winner Profiles

	Willy Sansen, the Catholic University of Leuven Since 1980 Sansen has served as full professor at the KU Leuven, where he has headed the ESAT-MICAS laboratory on analog design since 1984. He has supervised 63 Ph.D. theses and authored or coauthored more than 635 publications and 16 books. He is a Fellow of the IEEE, was program chair of the ISSCC-2002 conference and is a Past-President of IEEE Solid-State Circuits.
	Gerhard Fettweis, the Technical University of Dresden, and Barkhausen Institut Fettweis has coordinated the Cluster of Excellence Center for Advancing Electronics Dresden and the Deutsche Forschungsgemeinschaft (DFG, German Research Foundation) Highly Adaptive Energy Efficient Computing (HAEC) for the TU Dresden since 2012. He founded the 5G Lab Germany in 2014, and among 12 startups Systemonic AG in 1999 and Signalion in 2003.
	Jean-Frédéric Clerc, CEA-Leti Clerc was as an engineer at CEA-Leti from 1977 to 1984 and later became group leader at CEA-Leti. He worked as Research and Process Development Manager at Pixtech, a CEA-Leti startup, and served as CEA-Leti deputy Director at CEA-Leti and as Deputy Director of Division of Technological Research head of Division for Strategy and Programs.

Prior European SEMI Award recipients hailed from companies including STMicroelectronics, EV Group, Infineon, imec, Semilab, Deutsche Solar and the Fraunhofer Institute.

See the list of past SEMI European Award recipients. Nominations for the 2020 contributions are now open. To participate, please check the award guidelines online.

About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]
www.semi.org/eu

• Read more about European SEMI Award Honors KU Leuven, TU Dresden and CEA-Leti for Key Chip Industry Contributions

BERLIN, Germany – 15 February, 2021 – SEMI Technology Unites Global Summit opens today with keynotes on the power of technology to unite the world and insights on how the microelectronics industry can enable a secure and sustainable digital future. 15-19 February, the virtual event connects industry leaders and stakeholders across the entire electronics design and manufacturing value chain for the latest developments, trends, and innovations in key areas of industry growth including smart mobility, smart medtech, and MEMS and sensors. Registration is open.

At the opening day Executive Forum, international technology leaders will offer insights into the future of smart technologies as industry stakeholders gather to help shape the digital future for societal and economic prosperity.

Innovations across smart technologies such as 5G, artificial intelligence (AI) and Internet of Things (IoT) and industries including healthcare and mobility are transforming the way people work and live. The summit enables connections and partnerships while highlighting market opportunities in the digital transformation.

“While the past year brought tremendous societal and geopolitical challenges, it showcased the important contributions technology is making to improve all our lives, keeping us connected and working while accelerating the path to vaccines,” said Ajit Manocha, SEMI president and CEO. “The SEMI Technology Unites Global Summit will share insights from some of the microelectronics industry’s brightest minds on technology trends critical to advancing social and economic prosperity – and to staying ahead of the pace of digital transformation.”

Technology Unites Global Summit Highlights

• Executive Forum
  • Global thought leaders will enable connections and partnerships and illuminate market opportunities for creating a smart, sustainable future. The executive forum will feature keynotes by executives from Infineon Technologies, imec, CEA-Leti, TEL, TSMC, NXP Semiconductors, Google, Umicore, JSR Corporation, Alibaba, Comet, Edwards Vacuum, AEM and UTAC.
     
• Global Reach
  • The digital international exhibition will showcase new products and technologies while inviting interactions with a global audience.
  • Easy-to-navigate platform with opportunities for attendees to select content matching their professional interests and connect with like-minded industry experts.
     
• Programs and Hosted Sessions
  • The Technology Unites Global Summit will highlight technologies and applications across key pillars of the next wave of microelectronics industry innovation and growth including mobility, advanced packaging, medtech, fab management, manufacturing, MEMS and sensors, advocacy, and diversity and inclusion.
  • Hosted sessions will provide the latest insights in start-up best practices, heterogeneous integration, smart manufacturing processes and standards, electronic systems design (ESD), advanced technologies, hardware for next-generation computing (NGC), ALD technologies, environmental sensors, and wet-chemical surface treatments.
     
• Networking
  • Attendees will have direct access to technology leaders for answers to pressing questions.
  • Attendees will also enjoy opportunities to network with speakers, participants and customers through meet-the-expert sessions, live chats and video meetings.
     
• Workforce Development
  • Those interested in careers in microelectronics will be able to tap current job vacancies in the industry.

Registration for the Technology Unites Global Summit for on-demand viewing of all content is open until March 26, 2021. The all-in-pass provides access to the entire event including forums, pavilions and the exhibition. Students, engineers, and startups can register at a special price.

Visit www.technologyunites.org or contact [email protected] for more information.

Follow #TechnologyUnites @SEMIEurope on LinkedIn and Twitter.   

  
Technology Unites Global Summit Premium Sponsors

Platinum 
ASE Group, CyberOptics Corporation, INFICON, Infineon Technologies, MADEin4, METIS, Picosun Oy, RENA Technologies GmbH, SPTS Technologies, a KLA company

Gold
AP&S International GmbH, Beneq Oy, Edwards Vacuum, EV Group, JSR Corporation, Merck KGaA, Darmstadt, Germany, Semics Inc., SÜSS MicroTec, Tokyo Electron Limited

Silver 
Comet, Evatec AG, FUJIFILM Electronic Materials, Okmetic Oy, SPEA Automatic Test Equipment, VAT Group 

Event sponsors: Advantest, Airspace, Applied Materials, CNW, DAS Environmental Expert GmbH, DB Schenker, Fraunhofer Institute for Photonic Microsystems IPMS, imec, Infinitesima, Lam Research, Max Group, PEER Group, Pfeiffer Vacuum, Posas GmbH, TRUMPF Hüttinger, Trymax Semiconductor Equipment BV, Watlow

About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]
www.semi.org/eu

• Read more about SEMI Technology Unites Global Summit Opens with Executive Forum, Digital Transformation, Security and Sustainability in Spotlight

MILPITAS, Calif. ─ January 18, 2021 – The global economy will return to pre-pandemic growth levels in 2021 as the world begins an uneven gross domestic product rebound, marking the start of an expansion that will see the semiconductor industry grow to $1 trillion in chip sales in the early 2030s, speakers at the Virtual SEMI Industry Strategy Symposium (ISS) last week revealed. Conference content is now available to attendees on demand until February 13, 2021.

Citibank Managing Director and Global Chief Economist Catherine Mann said that global GDP is expected to return to a 5% growth rate this year and rise to more than 7% in late 2021 or 2022 on the back of the widespread availability of COVID-19 vaccines, though the 2021 net gain will be slight after the 4% contraction last year. The United States and China, together accounting for 50% of global GDP, will drive much of the recovery. China has regained its pre-pandemic GDP growth rate and the U.S. is not far behind, with projections that the world’s largest economy will normalize growth in the second quarter of 2021. The prospects reflect consensus forecasts of economists polled by Citigroup.

Europe, the world’s third largest economy, is not expected to restore economic growth to typical levels until the fourth quarter of 2022. Among emerging markets, Latin America is forecast to return to pre-COVID growth no sooner than 2023, with those in Asia riding the coattails of China to a faster recovery. Mann said that trade growth across the world’s economies will also “remain asynchronous.” Global trade was flat in 2018 and 2019 after the outbreak of trade wars and collapsed 20% in the depths of COVID-19 last year. This year, trade is forecast to return to zero growth.

Global Semiconductor Revenue to Grow in 2021

The return to economic growth is expected to spark an expansion of the semiconductor industry. Worldwide semiconductor revenue is set to rise as much as 7% in 2021, with 5G deployments and PCs for remote work and learning among the key drivers, Mario Morales, Program Vice President of Enabling Technologies and Semiconductors, Storage, and DataSphere Research at International Data Corporation (IDC), said at the Jan. 12-13 SEMI event. IDC forecasts show semiconductor revenue increasing to $450 billion this year and returning to $500 billion in market size in 2024, with steady annual growth between 4% and 6%.

Accelerating spending “across the board” on Information Communications Technology (ICT) will be a key catalyst of the expansion, Morales said. The ICT segment includes mobile, Internet of Things (IoT), cloud, big data analytics, robotics, security and artificial intelligence (AI). In sector growth, computing and mobile handsets will be standouts with a 4.5% CAGR over the next four years. In the computing segment – spanning data centers, PCs and peripherals – IDC forecasts growth to $170 billion, while the firm expects the mobile handsets segment to reach $144 billion by 2024.

5G, IT Infrastructure, Memory Capacity Buildout Among Key Drivers of Chip Industry Growth

Cloud computing will be a key force behind chip industry growth in 2021 as cloud infrastructure buildouts drive higher server demand stemming from the pandemic-inspired surge in online shopping and increasing adoption of the public cloud, said Andrea Lati, Vice President of Market Research at VLSI Research. A doubling of 5G smartphone shipments and surging 5G base station deployments following the 2020 slowdown will also fuel the semiconductor industry expansion this year. One big contributor: 5G smartphones feature at least 50% more silicon than 4G models.

Lati said semiconductor industry sales will increase 8% this year as memory leads the recovery, with DRAM and NAND forecast to grow 13% and 12%, respectively. The global IT infrastructure buildout, 5nm demand ramp, and continuing liquidity measures by central banks will also help power industry growth in 2021. Lati predicted a bright future for the chip industry as technology figures prominently in much of global economic growth over the next 10 years. Equipment and semiconductor sales are expected to reach $200 billion and $1 trillion, respectively, in the early 2030s.

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