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SEMI Press Release

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SEOUL, South Korea — Jan. 12, 2021 — Cutting-edge innovations in artificial intelligence (AI), smart manufacturing, sustainable manufacturing, and sensors for a hyper-connected world will take the spotlight at SEMICON Korea 2021 as the event goes virtual February 3-12 to help curb the spread of COVID-19. Registration is open.

SEMICON Korea 2021 Virtual Tile

All SEMICON Korea 2021 virtual conferences will be offered on-demand for unlimited viewing throughout the event with an All-In pass – enabling anyone in the world with a smartphone, tablet or PC to attend at their convenience.

Themed Toward the Hyper-Connected World, SEMICON Korea 2021 will offer the latest microelectronics industry insights and developments during 20 virtual sessions featuring more than 120 experts across critical areas of semiconductor manufacturing including AI, smart manufacturing, design automation, metrology and inspection, test, MEMS and sensors, and sustainability.

SEMI Technology Symposium
The SEMI Technology Symposium (STS) at SEMICON Korea 2021 will provide insights into the latest technology trends and the future of next-generation semiconductor technology across six areas: lithography, interconnection, device, etch, cleaning, CMP and packaging.

Workforce Development and DEI (Diversity, Empathy and Inclusion) 
With the microelectronics industry poised to seize unprecedented opportunities for growth, attracting the talent to drive the next wave of innovation is taking on increasing urgency. To help the industry build the workforce of the future, SEMICON Korea 2021 will feature Meet the Experts!, a mentoring program that connects university students and young talent with semiconductor engineers for tips on how to build a career in the semiconductor industry. The career development program will be offered online February 5.

Focused on increasing workforce DEI, the SEMICON Korea 2021 Women in Technology program will host female leaders from KLA, Lam Research, LG Chem, Merck KGaA, Darmstadt, Germany, and SK Telecom as they share insights on career development and how to attract more diversity to the semiconductor industry.

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Jaegwan Shim/SEMI
Phone: 82.02.531.7804
Email: [email protected]

Industry Reports 15% Revenue Growth Overall; Semiconductor IP and Asia Pacific Surpass $1B

MILPITAS, Calif. — January 11, 2021 — Electronic Design Automation (EDA) industry revenue increased 15% in Q3 2020 to $2,953.9 million, compared to $2,567.7 million in Q3 2019, with all categories logging significant gains, the Electronic System Design (ESD) Alliance Market Statistics Service (MSS) announced today. The four-quarter moving average, which compares the most recent four quarters to the prior four quarters, rose by 8.3%. The ESD Alliance is a SEMI Technology Community.

SEMI ESDA Logo

“The EDA industry reported a substantial double-digit year-over-year revenue increase for Q3 2020,” said Walden C. Rhines, Executive Sponsor, SEMI EDA Market Statistics Service. “All product categories and geographic regions reported increases in Q3. The Computer Aided Engineering (CAE), Semiconductor IP (SIP), and Services categories and, regionally, the Americas, Europe, Middle East and Africa, and Asia Pacific reported double-digit growth. Further, the Semiconductor IP category and the Asia Pacific region both surpassed $1 billion in quarterly revenue.”

The companies tracked in the MSS report employed 47,087 people in Q3 2020, a 4.8% increase over the Q3 2019 headcount of 44,950 and up 1.1% compared to Q2 2020.

The quarterly MSS report containing detailed revenue information with category and geographic breakdowns is available to ESD Alliance members.

Revenue by Product Category in Q3 2020

  • CAE revenue increased 10.7% to $927.6 million compared to Q3 2019. The four-quarter CAE moving average increased 7.2%.
  • IC Physical Design and Verification revenue increased 9.1% to $608.2 million compared to Q3 2019. The four-quarter moving average for the category rose 3.2%.
  • Printed Circuit Board and Multi-Chip Module (PCB and MCM) revenue increased 8.3% to $260.4 million compared to Q3 2019. The four-quarter moving average for PCB and MCM increased 9.8%.
  • SIP revenue increased 25.8% to $1,051.7 million compared to Q3 2019. The four-quarter SIP moving average grew 13.9%.
  • Services revenue increased 11% to $105.9 million compared to Q3 2019. The four-quarter Services moving average decreased 6.7%.

Revenue by Region in Q3 2020

  • The Americas, the largest reporting region by revenue, purchased $1,307.2 million of EDA products and services in Q3 2020, an 11.7% increase compared to Q3 2019. The four-quarter moving average for the Americas increased 5.1%.
  • Europe, the Middle East, and Africa (EMEA) revenue increased 4.9%, to $368.3 million compared to Q3 2019. The four-quarter moving average for EMEA grew 13.4%.
  • Japan revenue increased 6% to $232.4 million compared to Q3 2019. The four-quarter moving average for Japan rose 4.7%.
  • Asia Pacific (APAC) revenue increased 26.4% to $1,046 million compared to Q3 2019. The four-quarter moving average for APAC increased 11.3%.

About the MSS Report
The ESD Alliance Market Statistics Service reports EDA, IP and services industry revenue data quarterly and is available to Alliance members. Both public and private companies contribute data to the report. Each quarterly report is published approximately three months after quarter close. MSS report data is segmented as follows:

  • Revenue type (product licenses and maintenance, services, and SIP)
  • Application (CAE, PCB/MCM Layout, and IC Physical Design & Verification)
  • Region (the Americas, Europe Middle East and Africa, Japan, and Asia Pacific)

In addition, the report provides many subcategories of detail and lists total employment of the tracked companies.

About the Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community, is the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry. As an international association of companies providing goods and services throughout the semiconductor design ecosystem, it is a forum to address technical, marketing, economic and legislative issues affecting the entire industry. For more information about the ESD Alliance, visit http://esd-alliance.org.

About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

The information supplied by the ESD Alliance is believed to be accurate and reliable, but the ESD Alliance assumes no responsibility for any errors that may appear in this document. All trademarks and registered trademarks are the property of their respective owners.

Press Contacts
Paul Cohen
ESD Alliance
A SEMI Strategic Technology Community
978-769-2106

Jack Taylor
Siemens EDA
512-560-7143

MILPITAS, Calif. – December 21, 2021 – VLSIresearch has added SEMI president and CEO Ajit Manocha to its Semiconductor Industry Hall of Fame for his work on behalf of the industry in his current role and for many significant contributions throughout his career spanning four decades. This honor is awarded to executives who have made systematic contributions to advance the growth and impact of the semiconductor industry.

semi-logo

VLSI recognized Manocha for his leadership of SEMI efforts to address geopolitical trade tensions with its Global Advocacy program as well as for his initiative in navigating the many challenges of the COVID-19 pandemic impacting SEMI and the microelectronics industry. The honor comes on the heels of Manocha's induction into the Silicon Valley Engineering Hall of Fame earlier this year.

“Ajit Manocha is a deserving addition to the Semiconductor Industry Hall of Fame for his work in support of the industry at SEMI and for his role in establishing the fabless-foundry model during his distinguished career,” said G. Dan Hutcheson, CEO and chairman of VLSIresearch. “This year proved to be another stellar example of his sage leadership, as he guided SEMI through the impact of COVID-19 on its business while continuing to drive programs to support the industry during the challenges of the pandemic and highly charged geopolitics.”

“I thank my esteemed colleagues at VLSIresearch for this honor and for their ongoing work to record and celebrate the history and evolution of this critical industry that serves as the foundation for our digital world and every technology that makes it smarter,” said Manocha. “I am especially pleased that this recognition highlights the efforts of SEMI to address the most pressing concerns and opportunities of the industry, as we continue to drive innovation, growth, and progress around the globe.”

At SEMI, Manocha has repositioned the organization to address emerging challenges and opportunities for SEMI members worldwide. SEMI has broadened its reach across the electronics manufacturing and design supply chain, grown its global advocacy program to promote fair trade and strengthen its public policy influence, and expanded its workforce development programs and other initiatives to propel innovation across the industry.

Manocha began his career as a research scientist at AT&T Bell Laboratories, where he was granted over a dozen patents related to semiconductor manufacturing processes. He went on to hold executive leadership roles in global operations at Philips Semiconductors (NXP) and Spansion before serving as CEO at GLOBALFOUNDRIES, prior to joining SEMI. Manocha also served as an advisor to President Obama on the Advanced Manufacturing Partnership Steering committee and on the President’s Council of Advisors on Science and Technology (PCAST).

About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Samer Bahou/SEMI
Phone: 1.408.943.7870
Email: [email protected]

MILPITAS, Calif. — December 17, 2020 — North America-based manufacturers of semiconductor equipment posted $2.61 billion in billings worldwide in November 2020 (three-month average basis), according to the November Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 1.4 percent lower than the final October 2020 level of $2.65 billion, and is 23.1 percent higher than the November 2019 billings level of $2.1 billion.

semi logo

“Billings of North America-based semiconductor equipment manufacturers remain robust, though November shows some expected tapering after billings registered record highs early this fall,” said Ajit Manocha, SEMI president and CEO.

The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.

 

Billings
(3-mo. avg.)

Year-Over-Year

June 2020

$2,317.7

14.4%

July 2020

$2,575.3

26.7%

August 2020

$2,653.3

32.5%

September 2020

$2,743.3

40.0%

October 2020 (final)

 $2,648.2

27.3%

November 2020 (prelim)

 $2,611.6

23.1%

Source: SEMI (www.semi.org), December 2020

SEMI publishes a monthly North American Billings report and issues the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases. These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide. For an overview of available SEMI market data, please visit www.semi.org/en/MarketInfo.

The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Notes

Next SEMI Billings report is January 21, 2021 at 3:00pm Pacific.

For information on SEAJ Billings Express Report, visit www.seaj.or.jp.

BERLIN, Germany – 15 December, 2020 – Global industry executives from all seven SEMI regions will gather online for the inaugural SEMI Technology Unites Global Summit, February 15-19, 2021, for keynotes on the power of technology to unite the world and insights on how the microelectronics industry can shape the digital future. The virtual event will connect industry leaders and stakeholders across the entire electronics design and manufacturing value chain for the latest developments, trends and innovations in key areas of industry growth including smart mobility, smart medtech, and MEMS and sensors. Registration is open.

TUGS Logo

Semiconductors are revolutionizing the way people work and live by driving innovation across smart technologies including artificial intelligence (AI), Internet of Things (IoT), 5G and quantum computing and industries such as transportation and healthcare.

“The $426 billion semiconductor industry, the heartbeat of the $2 trillion global electronics design and manufacturing ecosystem, is powering global digital transformation,” said Ajit Manocha, SEMI president and CEO. “This megatrend, already accelerated by the COVID-19 pandemic, will help fuel the continued growth of the semiconductor industry – and is only possible when people, companies and industries collaborate. The SEMI Technology Unites Global Summit is an excellent platform for industry stakeholders to come together to help shape the digital future for societal and economic prosperity and to make a smart world a reality.”

The summit will open with the Executive Forum, where international technology leaders will offer insights into the future of smart technologies. The forum will enable connections and partnerships and illuminate market opportunities for creating a smart, sustainable future.

Executive Keynotes

Sabine Herlitschka gray background

Sabine Herlitschka, CEO of Infineon Technologies Austria AG

Infineon
Luc Van den hove gray background

Luc Van den hove, President and CEO of imec

imec logo
Emmanuel Sabonnadiere gray background

Emmanuel Sabonnadiere, CEO of Leti of CEA Tech

Leti Logo
Sekiguchi Akihisa gray background

Sekiguchi Akihisa, CTO of Tokyo Electron

TEL Logo
Maria Marced gray background

Maria Marced, President of TSMC Europe

tsmc
Maurice Geraets gray background

Maurice Geraets, Co-CEO of NXP Netherlands

NXP
Ruediger Dorn gray background

Ruediger Dorn, Industry Lead High Tech & Semiconductors at Google Corporation

Google Logo
An Steegen gray background

An Steegen, CTO at Umicore

Umicore Logo
Tadahiro Suhara gray background

Tadahiro Suhara, Managing Officer, Digital Solutions Business at JSR Corporation

JSR Logo Square
Sean Ding gray background

Sean Ding, Chief Scientist of AIoT at Alibaba Cloud Intelligent Group

Alibaba
Kevin Crofton gray background

Kevin Crofton, CEO of Comet

New Comet Logo 400 px
Kate Wilson gray background

Kate Wilson, VP of Marketing, Semiconductor Division at Edwards Vacuum

Sponsor
Chandran Nair gray background

Chandran Nair, CEO of AEM Holdings Ltd.

AEM Logo
Jörg Recklies gray background

Jörg Recklies, Senior VP
at Infineon Technologies

Infineon
John Nelson gray background

John Nelson, President and CEO of UTAC Holdings

UTAC

   
Key Online Features

  • Digital Exhibition
    • Easy-to-navigate platform with opportunities to curate the content to fit professional interests and connect with like-minded industry experts.
    • Exhibitors will appear in the related regional pavilion (according to their headquarters location) to better pitch the companies relevant to their businesses.
  • Global Brand Visibility
    • Standard and premium digital exhibition booths to showcase new products, corporate highlights, and interact with global clients.
  • Networking
    • Direct access to technology leaders for answers to pressing questions.
    • Opportunities to network with speakers, participants and customers through meet-the-expert sessions, live chats and video meetings.
  • Eight Programs
    • Mobility, Advanced Packaging, Medtech, Fab Management, Manufacturing, MEMS & Sensors, Advocacy, and Diversity & Inclusion, plus an Executive Forum.
  • Job Listings
    • Current job vacancies in the microelectronics industry.

The all-in-pass provides access to the entire event including forums, pavilions and the exhibition. The corporate pass provides access for unlimited employees. Visit www.technologyunites.org or contact [email protected] for more information.

Check the event guide to for details about the platform and business opportunities.

Follow #TechnologyUnites @SEMIEurope on LinkedIn and Twitter.   

Technology Unites Global Summit Premium Sponsors

Platinum 
CyberOptics Corporation, INFICON, Infineon Technologies, Picosun Oy, RENA Technologies GmbH, SPTS Technologies, a KLA company 

Gold 
AP&S International GmbH, Beneq Oy, Edwards Vacuum, EV Group, Semics Inc., SÜSS MicroTec, Tokyo Electron Limited  

Silver 
Comet, Evatec AG, Okmetic Oy, SPEA Automatic Test Equipment, VAT Group 

Event sponsors: Advantest, Applied Materials, DAS Environmental Expert GmbH, Fraunhofer Institute for Photonic Microsystems IPMS, imec, Infinitesima, Max Group, Merck KGaA, Darmstadt, Germany , PEER Group, Pfeiffer Vacuum, Posas GmbH, TRUMPF Hüttinger, Trymax Semiconductor Equipment BV 

Exhibiting Companies

TUGS Sponsor

 

About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Serena Brischetto / SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

ISS 2021 to kick off SEMI’s next 50 years with insights into business, economic and technology trends

MILPITAS, Calif. – December 15, 2020 – SEMI announced today that the virtual Industry Strategy Symposium (ISS) 2021 will take place January 12-13 with the theme Bridging the Gap Between the Physical and Digital Worlds. ISS will be the year’s first executive check-in, offering insights from leading analysts, economists, policymakers and technologists on major forces impacting the semiconductor industry. The annual symposium gives business leaders an insightful view to growth trends and industry intelligence, helping ensure that their company business plans and forecasts are based on current market conditions. Registration is now open.

ISS 2021 Banner


The COVID-19 pandemic is accelerating the digital transformation as the microelectronics industry looks ahead to historic growth opportunities with the emergence of artificial intelligence (AI), machine learning, the Internet of Things (IoT) and other cutting-edge technologies that are reshaping how we work and live in a hyper-connected world. The latest market insights are vital for business leaders to hatch new innovations and business models that will drive the next wave of industry growth.

“ISS is the premiere venue for imagining the future and turning among the best economic, market, geopolitical and technology insights into actionable intelligence and business opportunities,” said David Anderson, president of SEMI Americas and host of ISS. “This COVID-19 pandemic has shown that – from working from home to developing a vaccine at unprecedented speed – creating the solutions to the greatest challenges will take all of us, working together, as we continue to blur the lines between the physical and digital worlds.”

ISS 2021 highlights include the following:

Keynotes

  • Dr. Naga Chandrasekaran, senior vice president, Process R&D and Operations, Micron Technology
  • Congressman Michael McCaul, former U.S. ambassador to Russia, and current sponsor for the CHIPS Act for America

Economic trends and market perspectives affecting the chip industry

  • Dr. Catherine Mann, managing director and global chief economist, Citibank
  • Martin Rasser, senior fellow for the Technology and National Security Program, at the Center for a New American Security
  • Executives and economists from International Data Corporation, Yole Developpement, Linx Consulting, and VLSI Research

Discussions on market and application drivers

  • Top executives from Air Liquide Advanced Materials, IC Knowledge, Hitch Works, and EMD Performance Materials

ISS 2021 is the first of eight conferences comprising SEMI’s third annual Technology Leadership Series of the Americas. Aligned from coast to coast throughout 2021, the series is designed to foster critical discussions on the short- and long-term influences and opportunities in the $2 trillion emerging markets.

 

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Scott Stevens, for SEMI Americas
Phone: 1.512.288.4050
Email: [email protected]

 

 

SEMICON Japan Virtual

TOKYO – December 9, 2020 – SEMICON Japan 2020, the largest and most influential gathering of the electronics manufacturing and design supply chain in Japan, opens Friday as a virtual event with sustainable industry growth and the latest industry trends, developments and innovations in focus. ThemedEnabling a Smarter World, SEMICON Japan 2020 brings together industry leaders and visionaries from across the electronics supply chain December 11-18 for insights into semiconductor industry growth drivers including artificial intelligence (AI), 5G and 6G, hands-free driving and quantum computing. Registration will remain open throughout the event.

The SEMICON Japan 2020 virtual exposition is expected to draw nearly 20,000 attendees and more than 170 exhibiting companies. The event will feature an industry outlook to help set the stage for the coming year as the world continues to combat the COVID-19 pandemic and smart technologies become increasingly important at home and in the workplace.

“SEMICON Japan 2020 marks the first time the event will go virtual,” said Jim Hamajima, president of SEMI Japan. “The online venue will enable attendees worldwide to easily, safely and economically participate in the event from their PC or tablet at any time of the day.”

Keynotes to Highlight Keys to Sustainable Semiconductor Industry Growth

SEMICON Japan 2020 will feature more than 80 presentations and eight keynote programs December 11 to 18. The programs will be offered live during work hours in Japan and will be available to international audiences on-demand starting the next day. Listed below, all keynotes will feature English subtitles.

  • SMART Mobility 1
    • Asako Hoshino, Executive Vice President, Nissan Motor
    • Izumi Kawanishi, Senior Vice President, AI Robotics Business, Sony
  • The Era of Quantum
    • Jay Gambetta, IBM Fellow and Vice President of Quantum Computing, IBM Quantum, IBM Research
    • Carlos Augusto, Co-Founder and CTO, Quantum Semiconductor

For the keynote schedule, outlines and speaker bios, please see the SEMICON Japan keynotes page.

SEMICON Japan 2020 Virtual Resources

The virtual exposition will be available 10:00am to 5:00pm (Japan time) December 14 to 17. Attendees may access exhibitor booths and download materials 24 hours a day from December 11 to 18. Online conversations with exhibitors will be available only during exposition hours. Please see the SEMICON Japan 2020 Virtual website for the latest exhibitor directory.

The SEMICON Japan 2020 Virtual exposition will feature the following for a robust digital experience:

  • Poster displays
  • Product image displays
  • PDF downloads
  • Links to exhibitors’ web pages
  • Chat function for live visitor-exhibitor interactions (exposition hours only)
  • Meeting request and inquiry forms for visitors to connect with exhibitors

SEMICON Japan 2020 Virtual Sponsors

  • Platinum – Applied Materials, Lam Research, Screen Semiconductor Solutions and Tokyo Electron
  • Gold – Advantest, Ebara, Hitachi High-Tech, JSR, Kokusai Electric, Nikon and Tokyo Seimitsu
  • Silver – Entegris, Horiba and Kanken Techno
  • Bronze – KITZ SCT, Micronics Japan, Nihon Pall and Tokyo Weld
  • SMART Workforce – Advantest and THK

Register now for SEMICON Japan. For a detailed agenda, please see the SEMICON Japan Schedule-at-a-Glance.

About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Nobuyuki Sawada/SEMI Japan
Phone: 81-3-3222-5873
Email: [email protected]

MILPITAS, Calif. – December 4, 2020 – SEMI, the industry association serving the global electronics design and manufacturing supply chain, today released the following statement from president and CEO Ajit Manocha on the Fiscal Year 2021 National Defense Authorization Act.

semi logo

“SEMI supports the provisions included in the conference report on the Fiscal Year 2021 National Defense Authorization Act for programs to provide incentives for microelectronics manufacturing and research in the U.S. They are helpful steps to support microelectronics innovation and manufacturing. SEMI thanks Sens. Cornyn, Warner, Cotton and Schumer, Reps. Matsui and McCaul, and other congressional and administration leaders for their support and hard work to enact these provisions. We look forward to working with Congress and the administration to provide the funding needed to implement these programs and to enact the CHIPS Act investment tax credit which will provide the certainty needed to attract many more new, large-scale microelectronics manufacturing investments in the U.S.”

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Samer Bahou/SEMI
Phone: 1.408.943.7870
Email: [email protected]  

MILPITAS, Calif. – December 2, 2020 – Global semiconductor equipment billings surged 30% year-over-year and rose 16% to US$19.4 billion from the prior quarter, SEMI announced today in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.

semi logo

SEMI and the Semiconductor Equipment Association of Japan (SEAJ) gather the data from more 80 global equipment companies that provide monthly reports. Following are quarterly billings data in billions of U.S. dollars quarter-over-quarter and year-over-year change by region:

 

Region

Q32020

Q22020

Q32019

3Q2020/2Q2020

3Q2020/3Q2019

China

5.62

4.59

 3.44

23%

63%

Taiwan

4.75

3.51

 3.90

36%

22%

Korea

4.22

4.48

 2.20

-6%

92%

Japan

2.24

1.72

 1.67

30%

34%

North America

1.37

1.64

 2.49

-17%

-45%

Rest of the World

0.60

0.37

 0.76

64%

-21%

Europe

0.58

0.46

 0.39

25%

47%

Total

 19.38

 16.77

 14.86

16%

30%

Source: SEMI (www.semi.org) and  SEAJ (www.seaj.or.jp), December 2020

 

The SEMI Equipment Market Data Subscription (EMDS) provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports:

  • Monthly SEMI Billings Report, a perspective on equipment market trends
  • Monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and 24 market segments
  • SEMI Semiconductor Equipment Forecast, an outlook for the semiconductor equipment market.

For more information or to subscribe, please contact the SEMI Industry Research and Statistics Group at [email protected]. More information is also available online.

About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance  the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

 

San Francisco, Calif. — October 15, 2026 — SEMI and Semiconductor Digest today announced that the SonoFlex Acoustic System from Nordson Test & Inspection (Booth 5844) has won the Best of West award to be presented at SEMICON West 2026.

Presented by SEMI Americas and Semiconductor Digest each year, the Best of West award recognizes innovative new products or services that are significantly advancing the electronics manufacturing supply chain or a particular manufacturing capability.

The SonoFlex automated inspection tool delivers high throughput and better sensitivity for accurately locating defects in small panel-based assemblies, scanning 2x faster than legacy systems with Nordson’s advanced pulser and transducer technology. Panels can be inspected over the widest frequency range yet achieved in a production environment.

New FlexCore software, built from the ground up and combined with Nordson Intelligence AI Multi Gate Image Analysis (MGIA), identifies defects and isolates true void counts. SonoFlex’s modular design allows systems to be combined — up to four working alongside each other — increasing units per hour and throughput by as much as 8x.

“Nordson’s SonoFlex sets a new bar for acoustic inspection, combining faster throughput with the sensitivity and modularity fabs need for small panel-based assemblies,” said Pete Singer, Editor-in-Chief of Semiconductor Digest. “Congratulations to Nordson for winning the Best of West competition.”

SEMI Americas and Semiconductor Digest will honor the Best of West Award winner in Nordson Test & Inspection's booth today at 1 p.m. PDT .

About Semiconductor Digest

Through a mix of news, contributed articles and staff-written articles, Semiconductor Digest (www.semiconductor-digest.com), is dedicated to providing global information about the design, manufacturing, packaging and testing of semiconductors and other types of electronic devices, including MEMs, LEDs, displays, power electronics, optoelectronics/photonics, biomedical devices, solar cells, thin film batteries and flexible electronics. Semiconductor Digest consists of a website, magazine and topic-focused newsletters.

About SEMI

SEMI® is the global industry association connecting over 4,000 companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.