MILPITAS, Calif. – June 17, 2021 – SEMI , the industry association serving the global electronics design and manufacturing supply chain, today expressed strong support for the Facilitating American-Built Semiconductors (FABS) Act. The bill, introduced by Senate Finance Committee Chairman Ron Wyden (D-Ore .) and Ranking Member Mike Crapo (R-Ida.), and co-sponsored by Senators Mark Warner (D-Va.), John Cornyn (R-Tex.), Debbie Stabenow (D-Mich.) and Steve Daines (R-Mont.), would create a 25% federal tax credit, with an election to receive the tax credit as a direct payment, for investments in semiconductor manufacturing facilities and equipment, as well as facilities and equipment to produce semiconductor manufacturing tools.

“SEMI commends Chairman Wyden, Ranking Member Crapo, and Senators Warner, Cornyn, Stabenow and Daines for their leadership to introduce a broad investment tax credit that will strengthen U.S. semiconductor supply chains and help U.S. policies keep pace with incentive proposals around the world,” said Ajit Manocha, SEMI president and CEO. “As lead times and demand for new tools grow, ensuring that upstream tool manufacturers can claim the tax incentive is particularly important.”

“We strongly support the FABS Act and look forward to working with the Senate, the House of Representatives and the Biden Administration to pass this critical legislation,” Manocha said.

About SEMI

SEMI^® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

SEMI Contact

Samer Bahou/SEMI
Phone: 1.408.943.7870
Email: [email protected]

• Read more about SEMI Supports Introduction of FABS Act in U.S. Senate to Spur Semiconductor Manufacturing Growth

MILPITAS, Calif. ─ June 14, 2021 ─ SEMI, the global industry association representing more than 2,400 semiconductor and electronics manufacturing companies worldwide, today called for closer cooperation on technology and trade between the European Union and the United States ahead of a meeting tomorrow of European Commission and U.S. government officials.

SEMI sent letters to U.S. President Joe Biden, European Commission President Ursula von der Leyen, and European Commissioner Thierry Breton, to request stronger dialogue between the European Union and United States on technology governance and the global rules-based trading system.

“Recognizing the critical importance of semiconductors to digital infrastructures and economies, governments around the world are stepping up to invest in their domestic microelectronics industries while also building strategic alliances with other countries,” said Ajit Manocha, SEMI president and CEO. “Ahead of tomorrow’s meeting between E.U. and U.S. officials, SEMI encourages a more robust transatlantic partnership on technology and trade to ensure the long-term resiliency of supply chains and to foster greater microelectronics innovation to help ensure global economic growth and prosperity.”

In the letters, SEMI expresses support for establishing an E.U.-U.S. Trade and Technology Council and encourages further commitment to constructive dialogue to ensure that cooperation on critical technologies and supply chains reflects the needs of both regions and the globally integrated microelectronics industry.

More information on SEMI Global Advocacy and the letters are available online.

To learn more about SEMI Europe Advocacy, visit semi.org/eu/global-advocacy.

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contacts Samer Bahou / SEMI Headquarters
Phone: +1.408.943.7870
Email: [email protected]

Serena Brischetto / SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

• Read more about SEMI Urges U.S. and European Union Cooperation on Technology and Trade

MILPITAS, Calif. — June 10, 2021 — Business and technology experts will gather July 13-14 at the SEMI Innovation for a Transforming World conference to discuss how digital transformation technologies such as machine learning and artificial intelligence (AI) are reshaping the way microelectronics need to be designed, manufacturing and packaged. Registration for the virtual event is now open.

Experts from Altimeter, Dell Technologies, IBM, Bank of America, Deloitte, McKinsey & Company, Disruption Advisors, Cornami and TechSearch will explore the COVID-19 pandemic’s acceleration of digital transformation and discuss new solutions and business models for the microelectronics industry.

The event will debut SEMI’s state-of-the-art digital marketplace strategy, designed to help SEMI members and attendees harness SEMI offerings and global reach to grow their businesses.  

“The global technology shifts of the past year present major inflection points and market opportunities for the microelectronics industry, forcing companies to respond quickly or risk being left behind,” said Dave Anderson, president of SEMI Americas and host of the event. “With digital transformation accelerating, Innovation for a Transforming World will examine how supply chains are realigning and new platforms for collaboration.”

Speakers will cover areas including:

• Market outlooks from equipment to materials and growing fab capacity expectations
• Technology trends and drivers ranging from machine learning to AI
• How next-generation microelectronics will need to be designed, manufactured, and packaged to tap new markets

About SEMI

SEMI^® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Scott Stevens, Cardinal Communications for SEMI Americas

Phone: 1.512.288.4050

Email: [email protected]

• Read more about SEMI Digital Transformation Conference to Help Microelectronics Industry Seize New Market Opportunities

MILPITAS, Calif. – June 8, 2021 – SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the Senate’s passage of $52 billion in funding for new incentives to promote U.S. semiconductor manufacturing and research. The funding is part of the United States Innovation and Competition Act (USICA).

“The strong investments in federal research related to semiconductors and significant, multi-year funding for the Section 9902 incentive program at the Department of Commerce will significantly improve U.S. competitiveness in this vital industry, strengthen a wide range of technology-reliant U.S. supply chains, create thousands of jobs, and keep pace with programs and proposals around the world,” said Ajit Manocha, SEMI president and CEO. “With semiconductor manufacturing facilities, or fabs, heavily reliant on a complex supply chain of equipment and materials providers, the Section 9902 program must support fab suppliers to strengthen the entire semiconductor supply chain. Talent is another critical industry need, and the bill will also make investments in education and workforce development by helping students access better quality science, technology, engineering, and math (STEM) education, while strengthening technical education and incumbent worker training programs.”

Additionally, SEMI applauded the Senate for acting on the Miscellaneous Tariff Bill, Generalized System of Preferences, and Section 301 tariff exclusion program. The measures provide tariff relief for American businesses and strengthen U.S. competitiveness in manufacturing.

“We thank Senate Majority Leader Schumer, Senator Cornyn, Senator Warner, Senator Young, Senator Cantwell, Senator Wicker and others for their leadership and support on these important issues,” Manocha said. “SEMI urges the House of Representatives to similarly fund these programs and ensure that they support the entire semiconductor supply chain in the United States.”

The USICA includes emergency appropriations to fund the semiconductor programs enacted in the Fiscal Year 2021 National Defense Authorization Act (NDAA), the Endless Frontier Act and several other bills. The House will need to pass companion legislation and reconcile any differences between the House and Senate bills before final legislation can be sent to the President to be enacted into law.

About SEMI

SEMI^® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

SEMI Contact

Samer Bahou/SEMI

Phone: 1.408.943.7870

Email: [email protected]

• Read more about SEMI Applauds Senate Passage of USICA Semiconductor Funding, Urges House Action

MILPITAS, Calif. – June 2, 2021 – Global semiconductor equipment billings increased 51% year-over-year and 21% from the prior quarter to US$23.6 billion, SEMI announced today in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.

Compiled from data submitted by members of SEMI and the Semiconductor Equipment Association of Japan (SEAJ), the Worldwide SEMS Report is a summary of the monthly billings figures for the global semiconductor equipment industry. 

Following are quarterly billings data in billions of U.S. dollars with quarter-over-quarter and year-over-year change by region:

Source: SEMI (www.semi.org) and  SEAJ (www.seaj.or.jp), June 2021

The SEMI Equipment Market Data Subscription (EMDS) provides comprehensive market data for the global semiconductor equipment market. The subscription includes three reports:

• Monthly SEMI Billings Report, a perspective on equipment market trends
• Monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and 24 market segments
• SEMI Semiconductor Equipment Forecast, an outlook for the semiconductor equipment market

For more information or to subscribe, please contact the SEMI Industry Research and Statistics Group at [email protected]. More information is also available online.

About SEMI
SEMI^® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance  the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about First Quarter 2021 Global Semiconductor Equipment Billings Increase 51% Year-Over-Year, SEMI Reports

MILPITAS, Calif. — May 24, 2021 — North America-based semiconductor equipment manufacturers posted $3.41 billion in billings worldwide in April 2021 (three-month average basis), according to the April Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 4.1% higher than final March 2021 billings of $3.27 billion and 49.5% higher than April 2020 billings of $2.28 billion.

“April billings of North America-based semiconductor equipment marked the fifth consecutive month of record growth,” said Ajit Manocha, SEMI president and CEO. “Equipment manufacturers continue to log steady growth as the industry works to meet accelerating demand for semiconductors across a wide range of end-market segments.”

The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.

Source: SEMI (www.semi.org), May 2021

SEMI publishes a monthly North American Billings report and issues the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases. These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide. For an overview of available SEMI market data, please visit www.semi.org/en/MarketInfo.

The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.

About SEMI

SEMI^® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Notes

Next SEMI Billings report is June 21, 2021 at 3:00pm Pacific.

For information on SEAJ Billings Express Report, visit www.seaj.or.jp. 

• Read more about North American Semiconductor Equipment Industry Posts April 2021 Billings, Logs Fifth Consecutive Month of Record Growth

MILPITAS, Calif. — May 25, 2021 — Semiconductor manufacturers worldwide are on track to boost 200mm fab capacity by 950,000 wafers, or 17%, from 2020 through 2024 to reach a record high of 6.6 million wafers per month, SEMI announced today in its 200mm Fab Outlook Report. 200mm fab equipment spending is expected to reach nearly $4 billion in 2021 after passing the $3 billion mark in 2020 and hovering between $2 billion and $3 billion from 2012 to 2019. The spending increase reflects in part the global semiconductor industry’s push to overcome the current chip shortage with 200mm fab utilization continuing at high levels.

“The 200mm Fab Outlook Report shows that, during the same period, wafer manufacturers will add 22 new 200mm fabs to help meet growing demand for 5G, automotive and Internet of Things (IoT) devices that rely on analog, power management and display driver integrated circuits (ICs), MOSFETs, microcontroller units (MCUs) and sensors,” said Ajit Manocha, SEMI president and CEO.

The SEMI 200mm Fab Outlook Report, covering the 12 years from 2013 to 2024, also reveals that foundries will account for more than 50% of fab capacity worldwide this year, followed by analog at 17% and discrete/power at 10%. Regionally, China will lead the world in 200mm capacity with 18% share in 2021, followed by Japan and Taiwan at 16% each.

200mm installed semiconductor capacity and fab count, 2013 to 2024

Equipment investments are projected to remain above $3 billion in 2022, with the foundry sector accounting for more than half of the spending, followed by discrete/power at 21%, analog at 15%, and MEMS and sensors at 7%.

The SEMI 200mm Fab Outlook Report reflects 365 updates across 146 facilities and lines since the most recent update of the report in 2019. The report includes details on more 300 200mm fabs and lines.

About SEMI

SEMI^® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contacts

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Christian G. Dieseldorff/SEMI
Phone: 1.408.943.7940
Email: [email protected]

• Read more about Global 200mm Fab Capacity on Pace to Record Growth to Meet Surging Demand and Address Chip Shortage, SEMI Reports

MILPITAS, Calif. — May 3, 2021 — Worldwide silicon wafer area shipments increased 4% to 3,337 million square inches in the first quarter of 2021 compared to the fourth quarter of 2020, topping the previous historical high set in the third quarter of 2018, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry. First-quarter 2021 silicon wafer shipments saw 14% growth from the 2,920 million square inches logged during the same quarter last year.

“Logic and foundry continue to drive strong demand for silicon wafers,” said Neil Weaver, chairman SEMI SMG and Vice President, Product Development and Applications Engineering at Shin Etsu Handotai America. “The memory market recovery further bolstered shipment growth in the first quarter of 2021.”

Silicon Area Shipment Trends – Semiconductor Applications Only

Source: SEMI (www.semi.org), May 2021

Data cited in this release includes polished silicon wafers such as virgin test and epitaxial silicon wafers, as well as non-polished silicon wafers shipped to end users.

Silicon wafers are the fundamental building material for the majority of semiconductors, which, in turn, are vital components of all electronics goods, including computers, telecommunications products, and consumer electronics. The highly engineered thin disks are produced in diameters of up to 12 inches and serve as the substrate material on which most semiconductor devices, or chips, are fabricated.

The SMG is a sub-committee of the SEMI Electronic Materials Group (EMG) and is open to SEMI members involved in manufacturing polycrystalline silicon, monocrystalline silicon or silicon wafers (e.g., as cut, polished, epi). The purpose of the SMG is to facilitate collective efforts on issues related to the silicon industry including the development of market information and statistics on the silicon industry and the semiconductor market.

For more information, please visit SEMI Worldwide Silicon Wafer Shipment Statistics.

About SEMI

SEMI^® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Silicon Wafer Shipments Edge Higher in First Quarter 2021 to Set New Record, SEMI Reports

MILPITAS, Calif. — April 26, 2021 — North America-based semiconductor equipment manufacturers posted $3.27 billion in billings worldwide in March 2021 (three-month average basis), according to the March Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 4.2% higher than final February 2021 billings of $3.14 billion and 48% higher than March 2020 billings of $2.21 billion.

“Fueled by strong demand for leading-edge technologies, billings of North America-based semiconductor equipment manufacturers continued to edge up in March to set a new historical high,” said Ajit Manocha, SEMI president and CEO.

The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.

Source: SEMI (www.semi.org), April 2021

SEMI publishes a monthly North American Billings report and issues the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases. These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide. For an overview of available SEMI market data, please visit www.semi.org/en/MarketInfo.

The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data. 

About SEMI 

SEMI^® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Notes 

Next SEMI Billings report is May 24, 2021 at 3:00pm Pacific. 

For information on SEAJ Billings Express Report, visit www.seaj.or.jp. 

• Read more about North American Semiconductor Equipment Industry Posts March 2021 Billings, Extending String of Record Highs

MILPITAS, Calif.  — April 12, 2021 — Advanced semiconductor manufacturing topics ranging from yield management and metrology to new developments in improving post-pandemic manufacturing agility will take center stage at SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2021), May 10-12, 2021, as more than 65 industry experts gather to deliver 30 hours of technical presentations on the latest manufacturing strategies and methodologies. Registration for the virtual event is now open.

Expected to draw hundreds of attendees from across the industry, the 32^nd annual ASMC will feature discussions on the global COVID-19 pandemic’s impact on manufacturing leadership, semiconductor market trends, heterogenous integration and quantum computing.

ASMC is the premier event for industry professionals to network and share insights into best practices for semiconductor manufacturing. The conference is co-chaired by Dr. Ishtiaq Ahsan of IBM and Alexa Greer of KLA.

ASMC 2021 Keynotes and Invited Presentations

	Dr. Gary L. Patton, Corporate VP, General Manager of Design Enablement, Intel Requirements for Manufacturing Leadership in the Post-Pandemic Era
	Dr. John Pellerin, VP and Chief Technologist, GLOBALFOUNDRIES A Reflection on the Impact of the Pandemic on the Semiconductor Industry
	Robert Maire, President, Semiconductor Advisors Emerging Trends in the Global Semiconductor Market
	Dr. Mukta Farooq, Distinguished Research Staff Member, IBM Research Heterogeneous Integration Developments
	Dr. Lester Lampert, Research Engineer, Intel Quantum Computing Tutorial
	Christian Dieseldorff, Senior Principal for Semiconductors at Industry Research, SEMI Semiconductor Manufacturing Market Trends

ASMC 2021 technical sessions will cover topics including:

• Advanced Equipment Processes and Materials
• Advanced Metrology
• Advanced Patterning / Design for Manufacturability
• Advanced Semiconductor Developments
• Advanced Process Control
• Contamination-Free Manufacturing
• Data Management
• Defect Inspection & Reduction
• Equipment Optimization
• Fabless Experience
• Factory Automation
• Industrial Engineering
• Innovative Silicon Devices and Processes
• Non-Silicon/Non-CMOS processing
• Patterning and 3D Metrology
• Smart Manufacturing
• Yield Enhancement
• Yield Methodologies

A workforce development panel discussion with executives from CITI, NY Creates, RIT, TSMC and  ST Microelectronics will be moderated by Ed Sperling, editor-in-chief at Semiconductor Engineering.

ASMC 2021 is the fourth of eight conferences comprising SEMI’s third annual Technology Leadership Series of the Americas. This coast-to-coast series provides a platform to foster critical discussions on short- and long-term influences as well as technical and business opportunities in the more than $2 trillion electronics supply chain.

For more conference details, contact Paul Cohen at [email protected]. The media should contact Scott Stevens (for SEMI Americas communications) at [email protected] for registration information.

About SEMI

SEMI^® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Scott Stevens, Cardinal Communications for SEMI Americas
Phone: 1.512.288.4050
Email: [email protected]

• Read more about Virtual ASMC 2021 to Spotlight Advanced Semiconductor Manufacturing Excellence