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SEMI Press Release

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Global fab equipment spending for front-end facilities is expected to increase 20% year-over-year (YOY) to an all-time high of US$109 billion in 2022, marking a third consecutive year of growth following a 42% surge in 2021, SEMI announced today in its latest quarterly World Fab Forecast report. Fab equipment investment in 2023 is expected to remain strong.

SEMI logo"The global semiconductor equipment industry remains on track to cross the $100 billion threshold for the first time as shown in our latest update of the World Fab Forecast,”said Ajit Manocha, president and CEO of SEMI. “This historic milestone puts an exclamation point on the current run of unprecedented industry growth.”

WFF chart


Fab Equipment Spending by Region

Taiwan is expected to lead fab equipment spending in 2022, increasing investments 52% YoY to US$34 billion, followed by Korea at US$25.5 billion, a 7% rise, and China at US$17 billion, a 14% drop from its peak last year. Europe/Mideast is forecast to log record high spending of US$9.3 billion this year and, while comparatively smaller than outlays in other regions, its investments would represent a staggering growth of 176% YoY. Taiwan, Korea and Southeast Asia are also expected to register record-high investments in 2023.

In the Americas, the report shows fab equipment spending reaching US$9.3 billion in 2023, a 13% YoY rise following a 19% YoY increase in 2022, with the region retaining its fourth-place ranking both years in worldwide fab equipment spending.

Semiconductor Industry Continues to Boost Capacity

The SEMI World Fab Forecast report shows the global industry increasing capacity 8% this year after a 7% rise in 2021. Capacity growth is expected to continue in 2023, rising 6%. The fab equipment industry last saw a YoY growth rate of 8% in 2010, when it topped 16 million wafers per month (200mm equivalents) – nearly half of the 29 million wafers per month (200mm equivalents) projected for 2023.

Over 85% of equipment spending in 2022 will stem from capacity increases at 158 fabs and production lines, a proportion expected to edge down to 83% next year as 129 known fabs and lines add capacity.  

As expected, the foundry sector, with a share of about 53%, will account for the bulk of equipment spending in 2022 and 2023, followed by memory at 33% in 2022 and 34% in 2023. The two sectors also account for the largest capacity increases.

The latest update of the SEMI World Fab Forecast report, published in June, lists more than 1,400 facilities and lines globally, including 133 future facilities and lines with various probabilities that are expected to start volume production.

About SEMI

SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.orgto learn more, contact one of our worldwide offices, and connect with SEMI onLinkedIn andTwitter

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

MILPITAS, Calif. – June 7, 2022 – Sustainability, smart technologies and workforce development will take center stage at SEMICON West 2022 Hybrid, July 12-14 at the Moscone Center in San Francisco, as more than 200 industry leaders, visionaries and technology experts convene to present insights into the latest trends, innovations and developments across the microelectronics supply chain. The event, North America’s premier exhibition and conference for the microelectronics supply chain, will feature on-site keynotes, fireside chats, and executive panels with thought leaders from the semiconductor ecosystem, academia and government. Registration is open.

semicon west hybrid logo

With decarbonization building momentum worldwide, the Global Sustainability Summit will debut at SEMICON West 2022 Hybrid to help drive the collaboration necessary for the semiconductor industry to reduce its carbon footprint. Co-hosted by SEMI and McKinsey & Company, the summit comes as semiconductor manufacturers are increasingly committing to sustainability targets. In parallel, SEMI member companies are joining forces with startups to enable a greener chip industry as part of the SEMI Sustainability Initiative.  

SEMICON West 2022 Hybrid will also highlight opportunities for overcoming other worldwide challenges such as unmet demand for chips and the semiconductor workforce shortage while addressing key themes including government investment in chip manufacturing, digital transformation, and heterogeneous integration.

“With strong progress on CHIPS Act passage and significant new fab investments in the U.S., we’re thrilled to welcome back key semiconductor industry players to SEMICON West in July to explore new business and collaboration opportunities at the heart of continuing innovation,” said Joe Stockunas, president of SEMI Americas. “Companies from across the entire supply chain will network and showcase the latest technologies and products as we invite them to join the industry’s sustainability push, which is key for it to thrive.”

SEMICON West 2022 Hybrid Smart Pavilions

  • Smart Manufacturing Pavilion – The pavilion will feature data-sharing breakthroughs that are leading to smarter manufacturing processes, higher yields, and new semiconductor innovations. Thought leaders will engage attendees at the Meet the Experts Theater on topics including advances in sensors, processors, memory, 5G, and silicon photonics for improving data-sharing across the microelectronics supply chain. Emerging IC technologies for connected intelligence in electronics manufacturing will also be in focus.
  • Smart Mobility Pavilion – Leading all new application spaces in chip growth, the transportation and mobility markets promise to fuel the expansion of segments such as flexible hybrid electronics (FHE), MEMS and sensors. The pavilion will also showcase semiconductor industry growth opportunities through advances in areas including autonomous vehicles, Internet of Things (IoT) applications, 5G and artificial intelligence (AI).
  • Smart MedTech Pavilion – The pavilion will focus on future MedTech markets and applications and include technology demonstrations. Industry experts will discuss medical wearables and point-of-care instrument innovations driven by development of MEMS-based sensors and actuators.
  • Workforce Development Pavilion – Building the microelectronics industry’s talent pipeline to sustain the current pace of innovation and growth is a top priority. Targeting both new strategies for recruiters and tactics for job seekers, the pavilion will highlight entry-level opportunities, searching for a job during uncertain times, and why microelectronics is a smart career choice.

SEMICON West 2022 Hybrid Sessions

  • SEMI Market Symposium – Market trends and drivers and a midyear update on forecasts and insights on semiconductor equipment and materials, electronics design, and the manufacturing supply chain.   
  • Bulls & Bears – Perspectives on key semiconductor industry trends from Wall Street analysts in a moderated panel discussion.
  • TechTALKS – Discussions with experts on advanced manufacturing, materials, silicon photonics, MEMS and sensors, and heterogenous integration.
  • Test Vision Symposium – Insights from providers and users of test IP and equipment on coming trends and innovations.

The FLEX Conference, the annual event focused on flexible hybrid and printed electronics innovations, and the Design Automation Conference (DAC), the premier gathering focused on the design and design automation of electronic circuits and systems, will co-locate with SEMICON West 2022 Hybrid.

COVID-19 Safety Protocols

To ensure the well-being of all its exhibitors and visitors, SEMI monitors developing federal, state, and local health and safety recommendations and requirements to determine the most appropriate safety protocols for in-person events.

Recorded programming of select speakers at SEMICON West 2022 Hybrid will be available on-demand July 13, 2022, through August 13, 2022. Visitors will have direct access to exclusive online exhibitors during the live event.

Follow SEMICON West on Twitter: #SEMICONWest

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

BRUSSELS, Belgium ─ May 30, 2022 – Key executives from leading semiconductor companies, market analysts, economists and policymakers gather today for insights into the latest electronics industry trends, challenges and opportunities in Brussels, Belgium at the annual Industry Strategy Symposium Europe (ISS Europe) 2022.

ISS Europe logoThemed Resilient Europe: Semiconductors Enabling a Sustainable Digital Life, ISS Europe 2022 will present economic, technology, market, business, and geopolitical developments influencing the global electronics manufacturing industry as well as their implications for strategic business decisions.

 

ISS Europe Speakers

Headshot

 

Luc Van den hove, President and CEO,
imec 

Deep Tech: The Lodestar to Meet the Challenges of the 21st Century

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Headshot

 

Lucilla Sioli, Director for Artificial Intelligence and Digital Industry, DG CNECT

The EU Chips Act: Ensuring Europe’s Digital Sovereignty

Logo
Headshot

 

Sven Smit, Chairman McKinsey Global Institute,
McKinsey & Company

Lives and Livelihoods, Lost and Disrupted

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Headshot

 

Jens-Knut Fabrowsky, Executive Vice President Automotive Electronics,
Robert Bosch GmbH

Panel Discussion: Strengthening Europe’s Supply Chain Resilience: What Would It Take to Double European Capacity?

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Headshot

 

Kate Wilson, President, Semiconductor Division,
Edwards Vacuum 

Environmental Sustainability Through Collaboration

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Session 1: Making Environmental Sustainability Happen

Speakers will explore how semiconductor companies can comprehensively focus on sustainability, embed green practices and target disruptive innovations to reach environmental goals now being established worldwide. 

Session 2: Empowering a Diverse Workforce to Achieve the European Commission Goal by 2030

Experts will discuss internal organizational strategies and initiatives for a healthier and more inclusive work environment, including promoting industry role models.  

Session 3: Strengthening Europe’s Supply Chain Resilience: What Would It Take to Double European Capacity?

Europe is well-positioned to expand its semiconductor manufacturing sector, enable greater semiconductor supply chain resilience and ultimately fuel EU economic growth. Speakers will discuss opportunities for Europe to grow its semiconductor independence and global impact.

Each symposium session will feature a panel discussion.

European SEMI Award

Each year since 1989, SEMI Europe has presented the European SEMI Award to a person or team who has made a significant contribution to the European semiconductor, micro-systems, photovoltaic, or display industries. SEMI Europe will announce the 2021 award winner today.

Premium sponsors: Accenture, ASM, DAS Environmental Experts, DB Schenker, Ebara, Edwards, EV Group, Flexciton, Huawei, imec, LAM Research, Lynceus, NXP, OVIVO, Schneider Electric, TEL, VAT and Watlow.

For more details, please visit the Industry Strategy Symposium Europe (ISS Europe) 2022 website and connect with SEMI Europe on Twitter or LinkedIn @SEMIEurope (#ISSEurope).

 

About SEMI

SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Serena Brischetto / SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

Brussels, Belgium ─ May 30, 2022 ─ Imec President and CEO Luc Van den hove today received the 2021 European SEMI Award and Soitec CEO Paul Boudre the 2021 Special Service Award at the SEMI Industry Strategy Symposium Europe (ISS Europe 2022). Established more than 30 years ago, the European SEMI Award recognizes key players in the global manufacturing supply chain, highlighting their leadership excellence and strategic contributions that led to critical advances in the semiconductor industry.

ISS Europe logo“We applaud Luc Van den hove and Paul Boudre for their excellent work and outstanding research and development leadership and contributions to the European semiconductor community,” said Laith Altimime, president of SEMI Europe.

“The strong bonds between SEMI and imec go back a long way,” Luc Van den hove said. “We both understand that our industry’s grand challenges can only be addressed successfully if the entire ecosystem joins forces. In light of today’s economic and geopolitical turmoil, I feel – more than ever – committed to step up as a fierce proponent of regional and global collaboration. With this ambition in mind, I accept this year’s European SEMI Award with great pleasure.”

HeadshotVan den hove received his Ph.D. in electrical engineering from the KU Leuven in Belgium. He joined imec in 1984, starting his research career in the field of silicide and interconnect technologies and became manager of the imec micro-patterning group (lithography and dry etching) in 1988. In 1996, Van den hove was appointed department director of unit process step R&D, and in 1998 vice president of the silicon process and device technology division. In January 2007, he was appointed imec EVP and COO and has served as president and CEO of imec since 2009.

“I am very honored and grateful for this recognition by SEMI and my peers for a career entirely dedicated to semiconductors,” said Paul Boudre, CEO of Soitec. “Over decades, I had the chance to learn every day from interacting with amazing customers, suppliers and partners around the globe. I am also proud of what we achieved together, positioning semiconductors as a strategic industry in Europe. Above all, I feel privileged to have been given the opportunity to lead exceptional women and men who have enabled sustainable innovations that change the daily lives of billions of people.”

HeadshotBoudre holds a graduate degree in chemistry from France’s Ecole Nationale Supérieure de Chimie de Toulouse. He joined Soitec in 2007 as Director of Sales, Marketing and Business Development. He has been the CEO since 2015 and a member of the Board of Directors. During his 10 years at KLA-Tencor, he led the group’s European operations, then served as VP for Europe and the U.S. He held management duties in the industrial units of IBM Semiconductor (now part of GlobalFoundries), STMicroelectronics, Motorola Semiconductor (now part of NXP Semiconductors), and Atmel. Boudre has been active in the semiconductor industry for 30 years.

Nominations for the 2022 SEMI European Award are open. Please see award guidelines. Prior European SEMI Award recipients hailed from companies including CEA-Leti, Technical University of Dresden, Catholic University of Leuven, STMicroelectronics, EV Group, Infineon, and the Fraunhofer Institute. See the list of past SEMI European Award recipients.

For more details, please visit the European SEMI Award website and connect with SEMI Europe on Twitter or LinkedIn – @SEMIEurope, #EuropeanSEMIAward.

 

About SEMI

SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Serena Brischetto / SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

MILPITAS, Calif. – June 1, 2022 – Global semiconductor equipment billings grew 5% year-over-year to US$24.7 billion in the first quarter of 2022, SEMI announced today in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report. Quarter-over-quarter billings in the seasonally soft first quarter declined 10%.  

SEMI logo“Year-over-year first quarter equipment revenue growth is in sync with positive forecasts for 2022 as the semiconductor industry continues its robust increase of fab capacity,” said Ajit Manocha, SEMI president and CEO. “North America and Europe logged healthy quarter-over-quarter rises in equipment spending as they intensify efforts to bolster domestic chipmaking.”

Compiled from data submitted by members of SEMI and the Semiconductor Equipment Association of Japan (SEAJ), the Worldwide SEMS Report is a summary of the monthly billings figures for the global semiconductor equipment industry. 

Following are quarterly billings data in billions of U.S. dollars with quarter-over-quarter and year-over-year changes by region:

Region

1Q2022

4Q2021

1Q2021

1Q (QoQ)

1Q (YoY)

China

7.57

8.18

 5.96

-7%

27%

Korea

5.15

5.49

 7.31

-6%

-29%

Taiwan

4.88

6.86

 5.71

-29%

-15%

North America

2.62

2.30

 1.34

14%

96%

Japan

1.90

2.27

 1.66

-16%

15%

Rest of World

1.29

1.23

 1.02

5%

27%

Europe

1.28

1.09

 0.58

18%

119%

Total

 24.69

 27.41

 23.57

-10%

5%

Sources: SEMI (www.semi.org) and SEAJ (www.seaj.or.jp), June 2022
Note: Summed subtotals may not equal the total due to rounding.


The SEMI Equipment Market Data Subscription (EMDS) provides comprehensive market data for the global semiconductor equipment market. The subscription includes three reports:

  • Monthly SEMI Billings Report, a perspective on equipment market trends
  • Monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and 24 market segments
  • SEMI Semiconductor Equipment Forecast, an outlook for the semiconductor equipment market

For more information or to subscribe, please contact the SEMI Industry Research and Statistics Group at [email protected]. More information is also available online.

 

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

BRUSSELS, Belgium ─ May 30, 2022 ─ SEMI Europe, the industry association that unites the entire electronics manufacturing and design supply chain in Europe, today urged swift adoption of the European Chips Act and invited discussions on the legislation with the European Parliament, Member States and the European Commission. The Act aims to strengthen Europe’s competitiveness and resilience in semiconductor technologies and applications while enabling the region’s digital and green transition.

SEMI logo“Speedy adoption of the European Chips Act will significantly accelerate Europe’s work to attract investments to build up chip manufacturing capacity and R&D,” said Laith Altimime, president of SEMI Europe. “The Act is also a key step forward for Europe to substantially decarbonize semiconductor manufacturing and drive digital transformation.”

The European Council and Parliament continue to refine the European Chips Act with inputs from semiconductor industry stakeholders. A newly published SEMI Europe position paper offers the following recommendations for consideration of the European Commission, the Parliament, and the Council:

Chips for Europe Initiative

  • Strengthen R&D capabilities and ensure adequate funding.
  • Align new and existing pilot lines with anticipated future needs and trends and support open access to all parties within the EU semiconductor value chain.
  • The Chips Joint Undertaking needs to target Europe’s semiconductor industry needs.
  • Establish a dedicated skills and workforce development funding stream under the Chips Joint Undertaking.

Security of Supply

  • Provide a first-of-a-kind classification to target all relevant technology projects.
  • Foster fast track procedures.

Preparedness and Monitoring

  • Minimize risks to the semiconductor value chain and overall EU economic system.
  • Eliminate redundant data reporting requirements that cause administrative inefficiencies for semiconductor companies.
  • Establish requirements for safeguarding the confidentiality of industry data.
  • Encourage European initiatives with global partners, such as the EU-U.S. Trade and Technology Council.

Governance

  • Include stakeholders in Europe’s semiconductor ecosystem.

SEMI Europe also co-authored and signed a Joint Industry Statement with other industry stakeholder organizations representing the worldwide and European semiconductor ecosystem. The statement urges the European Commission, the Parliament, and the European Council to do the following:

  • Focus on investment conditions and opportunities to enhance European competitiveness.
  • Create a crisis response framework to help alleviate semiconductor industry disruptions.
  • Involve the semiconductor industry in Europe Chips Act governance.
  • Coordinate actions with global partners.

For more details, contact SEMI Europe:

Visit SEMI Global Advocacy and SEMI Europe Advocacy to learn more about SEMI public policy efforts.

 

About SEMI

SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

MILPITAS, Calif. — May 26, 2022 — SEMI and Michigan Governor Gretchen Whitmer today announced with the Michigan Economic Development Corporation that the SEMI Foundation has been awarded $1.5 million in funding to design and develop the SEMI Career and Apprenticeship Network (SCAN) in Michigan. The Community Development Block Grant (CDBG) and CARES Act funding will support semiconductor industry job training in Michigan.

SEMI logo“As global demand for semiconductors continues to grow, Michigan is poised to be a solution provider for semiconductor shortages and puts companies in the heart of semiconductor and battery R&D efforts nationwide,” said Governor Gretchen Whitmer. “Michigan is one of only three states that will be launching planning work to define curricula to support employers in the semiconductor industry. With this new apprenticeship program, along with our global manufacturing and automotive R&D leadership, we are leading the charge in addressing the universal industry demand for semiconductors while creating good jobs for Michigan workers.”

Long a key semiconductor industry market, Michigan is home to nearly one-fifth of U.S. auto production – more than any other state in the nation – and headquarters or technology centers of 26 original equipment manufacturers (OEMS), the greatest concentration in the country.  

“SCAN will provide critical job training to Michigan residents while helping the U.S. microelectronics industry address its talent shortage,” said Shari Liss, Executive Director of the SEMI Foundation. “We are thrilled to work in partnership with Michigan’s workforce development agencies and ecosystem to offer registered apprenticeships, a proven pathway to better jobs and greater economic mobility and opportunity.”

The SEMI Foundation will drive the SCAN program planning and development in Michigan in two phases: In phase one, the SEMI Foundation will engage key microelectronics employers, players in the automotive and manufacturing industries, and educational and workforce development providers. In phase two, the SEMI Foundation will conduct focus groups and work with employers to identify jobs in the greatest demand as well as the skills and competencies needed for a skilled, diverse workforce.

The funding comes three months after Liss testified before the Science Research and Technology Subcommittee, one of five subcommittees of the United States House on Science, Space, and Technology, as it discussed the U.S. semiconductor industry’s workforce needs. Liss stressed the need for increased industry visibility, more investment in K-12 STEM education and a stronger focus on diversity, equity and inclusion in the industry. Liss also pointed to the importance of programs like SCAN in re-skilling and up-skilling workers, particularly historically underrepresented wage earners in the industry and those affected by the COVID-19 pandemic, as well as earn-and-learn programs such as apprenticeships.

About SEMI Foundation

The SEMI Foundation is a 501(c)(3) nonprofit charitable organization founded in 2001 to support economic opportunity for workers and the sustained growth of the microelectronics industry. The Foundation accomplishes this through creating pathways and opportunities for job seekers, and tools and systems for semiconductor companies to attract, develop, and retain a diverse, innovative, and skilled workforce. Visit semifoundation.org to learn more, and connect with the Foundation on LinkedIn. SEMI is the Foundation’s parent organization.

About SEMI

SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

About Michigan Economic Development Corporation (MEDC)

The Michigan Economic Development Corporation is the state’s marketing arm and lead advocate for business development, job awareness and community development with the focus on growing Michigan’s economy. For more information on the MEDC and our initiatives, visit www.MichiganBusiness.org. For Pure Michigan® tourism information, your trip begins at www.michigan.org. Join the conversation on: Facebook, Instagram, LinkedIn, and Twitter.

SEMI Contact

Samer Bahou/SEMI
Phone: 1.408.943.7870
Email: [email protected]   

MUNICH, Germany ─ May 24, 2022 ─ SEMI Europe today announced the opening of the call for abstracts for SEMICON Europa 2022, Europe’s premier event connecting the entire electronics design and manufacturing supply chain, as the event returns to Messe München 15-18 November, in Munich, Germany for a live exhibition and conferences. Selected speakers at SEMICON Europa 2022, co-located with electronica, will share their expertise to the global microelectronics industry at the Advanced Packaging Conference (APC) and Fab Management Forum (FMF).

SEMICON Europa logoSEMICON Europa 2022 will convene experts and technologists for insights into the latest technology, materials and process innovations powering digital transformation and the next wave of semiconductor industry growth. The event will spotlight cutting-edge solutions that enable chipmakers to implement a broad range of new application-specific technologies.

Advanced Packaging Conference ─ Advanced Packaging Solutions in the Era of Digital Transformation

Advanced electronics packaging are integral to the system solutions required to enable mega trends in computing and communications and leading applications in markets such as medical devices and automotive. With collaboration critical to technology advances, experts from across the semiconductor supply chain who are driving innovations, technology concepts or roadmaps are invited to submit abstracts on advancements in the areas of Packaging/Assembly, Wafer/Package Test and Modelization. The submission deadline is June 10, 2022.

Fab Management Forum ─ Industry Meets Academia

New university graduates and young innovators looking to launch careers in the semiconductor industry will present their research and early-stage products to established fab managers. Key topics of interest are the Status of AI in Microelectronics Manufacturing and Advanced Analytics and Digital Twins for Faster, More Precise Decision Making. Students with doctorate and master’s degrees and their professors, as well as postgraduate researchers, research institutes and early start-ups and spinoffs, are invited to submit abstracts by June 17, 2022.  

Pre-recorded Presentations

In addition to the in-person programs, experts are invited to submit abstracts for the pre-recorded sessions on Friday, November 18. All pre-recorded presentations will be available to SEMICON Europa attendees onsite and virtually through the event website. The submission deadline is July 31, 2022.

Presentation abstracts, biographies and headshots must be submitted on the SEMICON Europa 2022 Call for Abstracts webpage. The conference language is English. All selected presenters will be notified in July 2022.

For more details, please visit the SEMICON Europa 2022 website and connect with SEMI Europe on Twitter or LinkedIn @SEMIEurope (#SEMICONEuropa).

SEMICON Europa Premier Sponsors

  • Platinum: TEL
  • Gold: Edwards, JCET
  • Silver: Evatec, SÜSS MicroTec
  • Event sponsors: ASE Group, Atotech INFICON, Lam Research, SCREEN

 

About SEMI

SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Serena Brischetto / SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

MILPITAS, Calif. — May 24, 2022 — SEMI, the global industry association that unites the entire electronics manufacturing and design supply chain, today announced that technology industry veteran and longtime SEMI member Joe Stockunas has joined SEMI as Americas President, reporting to Kevin Bauer, Chief Financial and Business Operations Officer.

SEMI logoStockunas will lead the SEMI Americas staff in increasing the value SEMI delivers to members, directing North America sales and services, and driving events and programs. He will also advocate for the microelectronics industry as part of the SEMI Global Leadership Team.

“We’re thrilled to welcome stalwart SEMI supporter Joe Stockunas to the organization and look forward to his leadership in advancing the interests of our member companies in the Americas,” said Ajit Manocha, SEMI president and CEO. “Joe’s passion for the semiconductor industry will be a tremendous asset to SEMI as he works to help our members grow their businesses and seize new partnership and innovation opportunities.”

“SEMI’s work to connect the global semiconductor ecosystem to the broader electronics supply chain is critical in driving digital transformation and addressing the industry’s most pressing challenges,” Stockunas said. “I’m eager to collaborate with the SEMI leadership team, staff and members to help the organization and the industry fulfill their extraordinary potential. I look forward to meeting with members and key industry stakeholders at SEMICON West this July.”

Stockunas and SEMI Americas will host SEMICON West Hybrid, North America’s premier microelectronics exhibition and conference, July 11-14, 2022, at the Moscone Center in San Francisco. Registration is open.

Stockunas replaces former SEMI Americas Regional President David Anderson, who is now president of NY CREATES, a research and economic development non-profit in New York state that performs advanced research in a number of technical areas.

Before joining SEMI, Stockunas served as executive vice president and corporate officer of Nordson Corporation, a leading global precision technology supplier, overseeing the company’s worldwide electronics systems business. Prior to Nordson, Stockunas worked at Air Products and Chemicals, Inc. for more than 30 years and held leadership positions in the materials and equipment business units of its Electronics Division.  

Stockunas previously served on the SEMI North America Advisory Board, SEMI Board of Industry Leaders, the Nordson Corporate Foundation and SEMI Foundation boards. He also served on global and non-profit boards of organizations including Showa Denko K.K., Kawasaki, The Bethlehem Historic Partnership, Hanyang Technologies, TriMEGA Electronics LLC, and the American Red Cross.

Stockunas received a B.S. in Metallurgy and Materials Engineering and completed his graduate studies at Lehigh University.

 

About SEMI

SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact   

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

DRESDEN, Germany — May 16, 2022 — Leading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, 14-15 June, 2022, in Dresden for insights into the latest heterogenous integration innovations for semiconductor applications enabling the future of intelligent systems. Registration is open.

3D & Systems Summit logo“We look forward to bringing together industry leaders for their perspectives on near-term 3D roadmaps and how the semiconductor industry can enable innovation for emerging applications,” said Laith Altimime, president of SEMI Europe. “Their insights promise to help the semiconductor industry address new technology challenges and requirements across the entire supply chain.”

Themed Enabling Low-Energy and High-Performance Applications, SEMI 3D & Systems Summit returns to Dresden with a broader scope of topics including: 

  • A Diverse and Sustainable Workforce Enabling Next-Generation Innovation
  • Status of High-End Performance Packaging (2.5D and 3D) - Technology and Market Trends
  • Updates from the 2021 Technology Showcase Winner: Transient Liquid Phase Sintering (Tlps) - Assembly for Heterogeneous Integration
  • Wafer Bonding and New Bonding Technologies
  • Heterogeneous Integration: From Design to Substrates and Technology Development
  • Testing Challenges, Inspection and Metrology
  • Optical Chips Packaging and Co-Packaging
  • Equipment and Materials for 3D Integration
  • High-Performance Computing and Artificial Intelligence

3D & Systems Summit Keynotes

Keil

Yvonne Keil, Director Global Indirect Procurement,
GlobalFoundries

GF logo
Swan

Johanna M. Swan, Intel Fellow and the Director of Package Research and Systems Solutions,    Intel

intel
Jan

E. Jan Vardaman, President,
TechSearch International, Inc.

TechSearch logo

 

 

Global Leaders to Present

3D & Systems Summit presenters include experts from global leaders such as AT&S, Atotech, Besi, CEA-Leti, DeepXscan, ETH Zurich, EV Group (EVG), Evatec AG, Fraunhofer IZM, GlobalFoundries, imec, Intel Deutschland GmbH, KLA, Merck KGaA, Darmstadt, Germany, NanoWired GmbH, Siemens EDA, SENTECH, Sipearl, SPTS Technologies, SÜSS MicroTec, TechSearch, and Yole Développement.Exhibition and Networking

The most prominent names in 3D integration microelectronics manufacturing will showcase their latest products and technologies at the exhibition area, including: adeia, AEMtec, BESI, Canon Anelva Corporation, Confovis, Evatec, EV Group, FormFactor FRT Metrology, Fraunhofer IZM-ASSID, HEIDENHAIN, Integrated Dynamics Engineering, Koh Young Europe GmbH, LPKF Laser & Electronics AG, OPTIM Wafer Services, Polyteknik AS, RENA and SENTECH. 

The summit will also feature business-to-business matchmaking and networking for participants to explore new partnerships and other business opportunities.

To reserve an exhibition space, contact Adi Hodorov at [email protected] and [email protected].

For more details, please visit the 3D & Systems Summit website and connect with SEMI Europe on Twitter or LinkedIn – @SEMIEurope, #3DSummit.

Premium Sponsors     

 

About SEMI

SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Serena Brischetto / SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]