SAN JOSE and MILPITAS, Calif. — September 27, 2022 — The Autonomous Vehicle Computing Consortium (AVCC), a global group of automotive and technology industry leaders cooperating on expediting the delivery of automated and assisted driving compute solutions, and SEMI, the global industry association that unites the entire electronics manufacturing and design supply chain, announced today an alliance to drive autonomous vehicle innovation. Per the terms of the agreement, leadership and members of the two organizations will work together to amplify their voices for greater reach, co-promote the development of technology standards, and offer recommendations for driving mass market adoption of autonomous vehicles.

The AVCC and SEMI collaboration will focus on the SEMI Global Automotive Advisory Council (GAAC), a global platform within the SEMI Smart Mobility initiative that engages member companies and industry stakeholders to build partnerships, address shared challenges, exchange information, and pursue new innovation and business opportunities. AVCC and SEMI both count auto manufacturers (OEMs), Tier 1 companies, semiconductor device makers, equipment and materials suppliers and other industry organizations as member companies.

“With a shared interest in the future of the automotive industry and a focus on innovation, the AVCC and SEMI alliance will strengthen the technical work and marketing efforts of both organizations,” said Armando Pereira, President of AVCC. “We are thrilled to begin working with SEMI and its members.”

“The partnership with AVCC will bring new capabilities to SEMI members participating in our Smart Mobility initiative,” said Bettina Weiss, Chief of Staff and Corporate Strategy and Global Smart Mobility Lead at SEMI. “We look forward to bringing our ecosystems together to accelerate solutions for the autonomous vehicle market.”

“Each organization brings unique perspective and contributions to the table,” added Pereira. “Together, AVCC and SEMI will reach a larger and broader audience of automotive industry decision makers with their research, reports, recommendations and standards. We believe together we will ultimately transition autonomous vehicles from early-market innovation to an everyday part of our mobile lives.”

Highlights of the AVCC and SEMI alliance include:

• Collaboration on the development of documents and a timeline to produce more incisive, comprehensive, and detailed work for the benefit of the organizations’ target communities
• Cross-sharing of news, social media posts, communications, documents, reports, and other resources with members and audiences of both organizations
• Opportunities to present at each other’s events and co-present at industry events
• Cross-promoting, authoring, and publishing blogs and articles

About AVCC
The Autonomous Vehicle Computing Consortium (AVCC) is a global nonprofit group of automotive and technology industry leaders coming together to help accelerate mass production of safe and affordable vehicles with assisted driving and autonomous compute technology (SAE levels 1-5). This computing platform will be designed specifically to move today’s AV prototype systems to deployment at scale. The group collaborates to develop requirements for the compute platform architecture, its hardware requirements, and software APIs for each building block in autonomous vehicle systems. www.avcconsortium.org

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Contacts
Armando Pereira, President/ AVCC
+1 925.262.1024
[email protected]

Sarah LaLiberte, Marketing Committee Co-Chair/ AVCC
+1 978.502.8558
[email protected]

Michael Hall/SEMI
+1 408.943.7988
[email protected]

• Read more about SEMI and AVCC Team to Promote Autonomous Vehicle Innovation and Mass Market Adoption

MILPITAS, Calif. — September 27, 2022 — Global fab equipment spending for front-end facilities is expected to increase approximately 9% year-over-year (YOY) to a new all-time high of US$99 billion in 2022, SEMI announced today in its latest quarterly World Fab Forecast report. The report also shows the global fab equipment industry increasing capacity this year and again in 2023.  

“After achieving a record level in 2022, the global fab equipment market is projected to remain healthy next year driven by new fabs and upgrade activity,” said Ajit Manocha, SEMI President and CEO.

Fab Equipment Spending by Region

Taiwan is expected to lead fab equipment spending in 2022, increasing investments 47% YOY to US$30 billion, followed by Korea at US$22.2 billion, a 5.5% decline, and China at US$22 billion, a 11.7% drop from its peak last year. Europe/Mideast this year is forecast to log record high spending of US$6.6 billion, a 141% YOY surge this year though outlays remain comparatively smaller than in other regions. Strong demand for high-performance computing (HPC) advanced technologies is driving the region’s jump in spending. The Americas and Southeast Asia are also expected to register record high investments in 2023.

Semiconductor Industry Continues to Boost Capacity

The SEMI World Fab Forecast report shows a global capacity increase nearing 8% in 2022, reaching 7.7%, after a 7.4% rise in 2021. The fab equipment industry last saw a YOY growth rate of 8% in 2010, when it topped 16 million wafers per month (200mm equivalents) – nearly half of the 29 million wafers per month (200mm equivalents) projected for 2023. Capacity growth is expected to continue in 2023, increasing 5.3%.

Capacity increases at 167 fabs and production lines will account for over 84% of equipment spending in 2022, a proportion expected to slip to 79% next year as 129 known fabs and lines add capacity.  

As expected, the foundry sector, with a share of 53%, will represent the bulk of equipment spending in 2022 and 2023, followed by memory at 32% in 2022 and 33% in 2023. The two sectors also account for the largest capacity increases.

The latest update of the SEMI World Fab Forecast report, published in September, lists 1,453 facilities and lines globally, including 148 volume facilities and lines with various probabilities that are expected to start production in 2022 or later.  

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Christian G. Dieseldorff/SEMI
Phone: 1.408.943.7940
Email: [email protected]  

• Read more about Global Fab Equipment Spending Forecast to Reach All-Time High of Nearly $100 Billion in 2022, SEMI Reports

TAIPEI — September 13, 2022 — SEMICON Taiwan 2022 opens tomorrow as industry leaders and visionaries gather to discuss the latest innovations and trends driving microelectronics industry growth. The event – Sept. 14-16 at the Nangang Exhibition Center, Hall I (TaiNEX 1) in Taipei – will feature expert insights on key semiconductor industry topics such as advanced manufacturing, smart manufacturing, heterogeneous integration, compound semiconductors, automotive chips, sustainable manufacturing, semiconductor cybersecurity and workforce development. Registration is open.  

The region’s premier gathering of the advanced manufacturing supply chain, SEMICON Taiwan 2022 will feature more than 700 exhibitors from Taiwan and abroad at over 2,400 booths as well as the largest show floor in the event’s nearly 30-year history.

At a pre-exhibition press conference today, industry leaders shared strategies for Taiwan's growth and their perspectives on the future of the semiconductor industry. Special guest speakers included:

• Ming-Hsin Kung, Minister of Taiwan’s National Development Council
• Tien Wu, CEO of Advanced Semiconductor Engineering (ASE) and Vice Chairman of SEMI International Board of Directors
• Doris Hsu, Chairperson & CEO of GlobalWafers Group and Member of SEMI International Board of Directors
• Donghui Lu, Corporate Vice President and Head of Micron Taiwan

“Despite continuing global economic challenges, the semiconductor industry is poised for long-term growth, with the industry expected to reach $1 trillion by 2030,” said Terry Tsao, Global Chief Marketing Officer of SEMI and President of SEMI Taiwan. “We’re excited to host companies from across the semiconductor supply chain for the latest industry developments, trends and innovations as they explore new business partnerships and market opportunities and address some of the world’s greatest challenges.”

SEMICON Taiwan Highlights

SEMICON Taiwan 2022 focuses on critical themes including the following.

• Advanced Manufacturing – The IC Forum brings together manufacturers, equipment and materials suppliers, and academia to help solve manufacturing challenges with innovative strategies and methodologies. 
• Compound Semiconductors – To promote the development of Taiwan's compound semiconductor industry, the Compound Semiconductor Pavilion features a series of forums and industry meetups focused on future industry trends and technologies.
• Semiconductor Cybersecurity – The Semiconductor Cybersecurity Pavilion introduces new SEMI Standards that establish security requirements for microelectronics manufacturing.
• Smart Manufacturing – The Smart Manufacturing Expo Taiwan brings together smart manufacturing solution providers including software and hardware vendors and system integrators to explore innovations aimed at optimizing manufacturing processes while improving production capacity and yield.
• Semiconductor Sustainability – The Semiconductor Sustainability Summit focuses on critical themes including Green Technology for Zero Waste, Carbon Reduction, and Sustainable Innovation.   ​
• Heterogeneous Integration – The Heterogeneous Integration Global Summit 2022 takes aim at key topics including digital transformation and 3D heterogeneous integration trends and energy-efficient high-performance computing (HPC).
• Automotive Chips – The Global Auto Chips Executive Summit gathers microelectronics and automotive industry leaders to discuss collaboration opportunities and ways to accelerate the development of automotive chips.
• Workforce Development – The Workforce Development program connects students with companies from across the semiconductor supply chain and includes educational programs such as Talent Development, Women in Semiconductor (WiS) and Diversity and Inclusion seminars that offer insights into workforce development trends and career planning.

The 22 international forums at SEMICON Taiwan 2022 will also address topics including the following:

• MEMS and Sensors Forum
• Power and Opto Semiconductor Forum
• Semiconductor Advanced Inspection and Metrology Forum
• Advanced Testing Forum

The Strategic Materials Conference Taiwan and FLEX Taiwan 2022 are concurrent with SEMICON Taiwan 2022.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact
Monica Hung/SEMI Taiwan
Email: [email protected]  
Phone: +886.3.560.1777 ext. 207

• Read more about SEMICON Taiwan 2022 Opens Tomorrow with Spotlight on Advanced Manufacturing, Heterogeneous Integration, Sustainability and Talent

MILPITAS, Calif. – September 7, 2022 – Global semiconductor equipment billings rose 7% from the first to the second quarter of 2022 and 6% year-over-year to US$26.43 billion, SEMI announced today in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.

Compiled from data submitted by members of SEMI and the Semiconductor Equipment Association of Japan (SEAJ), the WWSEMS Report is a summary of the monthly billings figures for the global semiconductor equipment industry. 

Following are quarterly billings data in billions of U.S. dollars with quarter-over-quarter and year-over-year changes by region:

The SEMI Equipment Market Data Subscription (EMDS) provides comprehensive market data for the global semiconductor equipment market. The subscription includes three reports:

• Monthly SEMI Billings Report, a perspective on equipment market trends
• Monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and 24 market segments
• SEMI Semiconductor Equipment Forecast, an outlook for the semiconductor equipment market

For more information or to subscribe, please contact the SEMI Industry Research and Statistics Group at [email protected]. More information is also available online.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Global Semiconductor Equipment Billings Increase 7% in Q2 2022, SEMI Reports

MILPITAS, Calif. – September 6, 2022 – The MEMS and Sensors Executive Conference (MSEC 2022) will gather industry visionaries and experts October 10-12 at the Coronado Island Marriott Resort in San Diego for insights into the latest trends and innovations in sensorization for growth markets including the metaverse, bio-medical, agriculture, sustainability and positioning, navigation and timing. Registration is open for MSEC 2022, hosted by the MEMS & Sensors Industry Group (MSIG), a SEMI technology community.

Themed Sensorize to Survive and Thrive, MSEC 2022 will focus on technology solutions to pressing challenges in healthcare, the environment, resource management and safety. The event will showcase components, software, and systems critical to MEMS and sensors innovations.

Internet of Things (IoT) spending is surging as digital transformation continues apace, creating new opportunities for MEMS and sensors. The compound annual growth rate (CAGR) for IoT spending will reach 26.7% between 2022 and 2025 as the number of global IoT connections reaches a forecasted 31 billion, a tenfold increase from a decade ago, according to IoT Analytics. The market research firm reports that in 2020, IoT connections for smart devices such as cars, home electronics and connected industrial equipment outnumbered non-IoT-connected electronics for the first time.

“Sensors are driving the widespread adoption of smart and connected IoT systems, which require unprecedented amounts of data,” said Dr. Tim Brosnihan, executive director of the SEMI MEMS & Sensors Industry Group. “By better monitoring the air we breathe, the water we drink, the food we eat, the health of our bodies and the safety of our surroundings, sensors continue to improve the quality of our lives.”

MSEC Keynotes

	Benjamin Cook, Director of Hardware Research META  Grand Challenges for MEMS Augmented Reality & Virtual Reality
	Stefan Finkbeiner, CEO Bosch Sensortec GmbH  How MEMS & Sensors Have Positively Impacted Our Lives
	Roland Helm, Head of Segment Sensors Infineon Technologies AG  MEMS Microphones: Securing High-quality Audio for a New Remote Workforce

MSEC 2022 will also feature sessions on topics including the following:

• Diversity, Equity, and Inclusion Panel – A.M. Fitzgerald & Associates LLC, N5 Sensors Inc., Qualcomm Technologies and Robert Bosch LLC
• Precision Agriculture: A Virtuous Endeavor or a Vicious Sink-hole of Disappointment? – Nio Labs
• Sensing as a Service Product Showdown – Inviza, N5 Sensors, Inc., and SiWare Systems
• Industry Market Outlook and Emerging Trends – MEMStaff

MSEC 2022 Business Networking Opportunities

• Welcome Reception – Meet-and-greet networking opportunity for attendees
• Picture This Scavenger Hunt – Team-building activity on Coronado Island with the opportunity to win prizes and network with industry peers
• MSIG Industry Awards Dinner – Recognition of MSIG Hall of Fame Award Recipients and Emerging Leaders for 2022

COVID-19 Safety Protocols

The health and well-being of all event exhibitors and attendees remains the top priority for SEMI. MSEC 2022 health and safety guidelines to protect against spread of COVID-19 will help provide a safe experience for all attendees on-site. 

MSEC 2022 Premier Sponsors

• Platinum: EV Group
• Gold: Infineon
• Bronze: Lam Research, NXP Semiconductors, Silex Technology and STMicroelectronics and KLA

Event sponsors also include Evatec, Okmetic Oy, Rogue Valley Microdevices, SUSS MicroTec, Teledyne Technologies and TEL.

Learn more at MSEC 2022.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about MSEC 2022 to Spotlight Latest Sensorization Innovations for Growth Markets

GRENOBLE, France – August 30, 2022 – MEMS and imaging sensor innovations driving an explosion of Smart applications will take the spotlight as the SEMI MEMS & Imaging Sensors Summit gathers industry experts and visionaries next week for insights into intelligent sensing advancements. The event, 6-7 September in Grenoble, returns to the World Trade Center (WTC) in Grenoble. Registration is open. 

Themed Intelligent Sensing for Better and Smarter Living, the SEMI MEMS & Imaging Sensors Summit will highlight the latest technology developments and trends for key applications in segments such as automotive, healthcare, green manufacturing, smart vision, camera technology, industrial safety and air quality.

Executive Keynotes

“MEMS and sensors are improving the quality of life around the world, a trend that promises to pick up pace as innovators develop new sensor applications across nearly every industry imaginable to reshape the way people work and live,” said Ajit Manocha, president and CEO of SEMI, whose keynote will open the conference. “The SEMI MEMS & Imaging Sensors Summit assembles a premiere lineup of industry experts to explore future applications that will lead to a smarter world and drive sensing market growth.”

The Onlife era is driving a paradigm change in the man-machine interface to enable the Metaverse, Industry 5.0, autonomous vehicles and other innovations, opening new opportunities for MEMS and imaging devices. The keynote Semiconductors Powering the Future by Andrea Onetti, Executive Vice President of the MEMS Sub-Group at STMicroelectronics, will highlight the critical importance of collaboration across the semiconductor supply chain in bringing these new technologies to market.

In his keynote Implementing a Human Centric Approach for Innovative Smart Sensors, Sébastien Dauvé, CEO of CEA-Leti, will explore developments in innovative sensors for applications such as healthcare, wellness, environment, clean mobility, and cybersecurity.

MEMS & Imaging Sensors Summit Sessions

Common Track

• During the summit’s first session, A Diverse and Sustainable Workforce Enabling Next Generation Innovation, industry leaders will discuss how workforce diversity can help spur innovation and leaders can create an inclusive environment where employees can thrive. The session, sponsored by Merck KGaA, Darmstadt, Germany and Edwards Vacuum, will close with a panel discussion.
• Market Brief session speakers will highlight industry trends and market drivers.
• The Intelligent Sensing will highlight new sensor technologies that enable fast, reliable edge computing to pave the way for smarter applications in industries such as automotive and medical.
• The session dedicated to materials and equipment advances will highlight higher performance MEMS devices for new manufacturing techniques and equipment.
• The emerging sensor applications sessions will feature industry leaders discussing the latest developments in photonics, biosensors, and spectroscopic technologies.
• The final session will explore how the integration of optics and silicon through co-packaged optics (CPO) can meet growing performance and power efficiency demands fueled by the rapid growth of cloud data.

Parallel Sessions

After the common conference track, industry leaders will discuss MEMS and imaging technology advancements during the following parallel sessions:

• The MEMS Track will present MEMS technology applications, devices and manufacturing trends, including the integration of multiple sensors into System in Package (SiP), MEMS for medical sensing, and system integration of data generation and data processing. Manufacturing advancements enabling 300mm wafer sizes, 3D integration and substrate diversification and environmental MEMS technologies will also come into focus.
• The Imaging Track will explore imaging technology advancements and the future of sensing processes, design and computing. Industry experts will discuss the latest advancements in traditional Short-wave infrared (SWIR) imaging technology and the promise of new quantum dot SWIR as well as provide an overview of how more cost-effective sensors and solutions for SWIR hyperspectral imaging are enabling new consumer applications.

Networking

The exclusive exhibition area at the World Trade Center will offer networking and B2B matchmaking opportunities, including networking lunches on Sept. 6 and Sept. 7. The Chateau Sassenage will host a Gala Dinner, sponsored by JSR Micro N.V. and Teledyne, on Sept. 6. Dinner tickets can be reserved online or onsite. 

Industry Leaders Exhibiting at MEMS & Imaging Sensors Summit

Premier Sponsors

• Platinum: ASE, Inc., Bühler, Infineon, KLA Corporation, SCHOTT
• Gold: Evatec, SÜSS MicroTec
• Silver: AEM
• Event: Caeleste, EV Group (EVG), Edwards Vacuum, JSR Micro N.V., Merck KGaA, Darmstadt, Germany, Okmetic Oy, Teledyne

The SEMI MEMS & Imaging Sensors Summit is hosted by SEMI Europe and the MEMS & Sensors Industry Group, a SEMI Technology Community.

For more information, please visit the SEMI MEMS & Imaging Sensors Summit website. Stay in touch on Twitter @SEMIEurope: #SensorsSummit #MEMS #Imaging #SEMIEurope

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact
Serena Brischetto / SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

• Read more about SEMI MEMS & Imaging Sensors Summit Opens Next Week to Spotlight Leading-Edge Applications

SHANGHAI — August 23, 2022 — With sustainability, smart manufacturing and advanced packaging key to semiconductor industry growth and prosperity, SEMICON China 2022 will gather industry leaders and visionaries Oct. 5-7 at the Shanghai New International Expo Centre for the latest insights on these and other critical topics in the electronics industry. The world’s largest semiconductor conference and exhibition, SEMICON China is a key enabler of collaboration and innovation across the entire electronics supply chain including chip design, manufacturing, assembly and test, equipment and materials. Registration for the event, co-located with FPD China, is open.

SEMICON China 2022 Highlights

• Grand Opening Keynotes – Industry leaders will discuss global business and technology developments and market trends. A live broadcast of the keynotes will be accessible on the Grand Opening Keynotes webpage.

• Power & Compound Semiconductor International Forum – The two-day program will highlight topics including wide band gap power electronics, optoelectronics, compound semiconductors in communications, and emerging power device technologies.

• Supply Chain Theme: SEMI Innovation and Investment Forum (SIIP China) – The forum will focus on topics including economic environment, industry dynamics, trade disputes, STAR Market opportunities, international cooperation, equipment and materials procurement, semiconductor supply chain challenges and opportunities, and Internet of Things (IoT).

• Design Innovation Forum: Electronic System Design Alliance Session – ARM China, CIP United and China Flash will showcase their latest semiconductor design innovations.

• Semiconductor Manufacturing and Advanced Packaging Forum – Global industry leaders and experts will share insights into advanced manufacturing and heterogeneous integration with a focus on key technologies, equipment and materials, and supply chain development.

• Smart Manufacturing Forum – Major semiconductor manufacturers such as Amkor Technology, Intel, Lam Research and Huawei and their suppliers will discuss the latest smart manufacturing capabilities and best practices.

• Sustainable Development (Green High-Tech Facility) Forum – With the implementation of sustainability practices across the semiconductor supply chain growing in urgency, this forum will address ways the industry can balance its growth with decarbonization goals.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts
Cherry Sun
SEMI China
Email: [email protected] 
Phone: +86.21.6027.8548

Michael Hall
SEMI Headquarters
Email: [email protected]
Phone: 1.408.943.7988SEMICON China 2017 Presents Six Forums in China’s Explosive Growth Market

• Read more about SEMICON China 2022 to Highlight Sustainability, Smart Manufacturing and Advanced Packaging

MILPITAS, Calif. — August 16, 2022 — SEMI, the global industry association that unites the entire electronics manufacturing and design supply chain, today announced the appointment of semiconductor industry veteran John Cooney as Vice President of Global Advocacy and Public Policy. Based in the Washington, D.C. office and reporting to SEMI President and CEO Ajit Manocha, Cooney brings more than 20 years of public policy experience to the role.  

Cooney will oversee global government relations at SEMI, including directing strategies to manage and strengthen the association’s global public policy agenda and advocacy efforts. His work will include teaming with SEMI regional presidents to grow their government relations outreach and manage relationships with policymakers, association members and SEMI public policy committees.

“John Cooney’s deep global government relations and semiconductor industry expertise will be a tremendous asset to SEMI as we continue our work to help shape public policy in advancing the interests of our members and the industry,” Manocha said. “We are confident that he will quickly have an impact in this crucial time when governments around the world are enacting legislation and offering incentives to bolster their domestic semiconductor ecosystems and ensure the resilience of their supply chains.”

“I am honored to join SEMI at this exciting time for the semiconductor industry as countries worldwide intensify their focus on the semiconductor industry’s vital importance to the broader electronics supply chain and global economy,” Cooney said. “I look forward to working with representatives at SEMI member companies to build on the association’s work to shape government policies on trade, tax, talent, technology and other key issues to help ensure the industry’s continuing growth.”

Cooney replaces former SEMI Vice President of Global Advocacy and Public Policy, Joe Pasetti.

“We thank Joe Pasetti for his contributions to the SEMI Global Advocacy program, especially his leadership in seeking the inclusion of a tax credit for U.S. facilities that produce semiconductors or chipmaking equipment in the U.S. CHIPS and Science Act and advocating for SEMI member companies in the semiconductor manufacturing and equipment segments to be eligible for incentives,” Manocha said.

Cooney joins SEMI from SkyWater Technology, a Minnesota-based SEMI member company, where he served as Director of Government Relations. Prior to his role at SkyWater, he held several senior-level leadership roles in the U. S. Department of Commerce, including as Chief of Staff and Senior Advisor for the International Trade Administration and Deputy Assistant Secretary for Global Operations of the U.S. and Foreign Commercial Service

Cooney received his B.A. in Political Science from the University of Minnesota.  

Visit SEMI Global Advocacy to learn more about public policy efforts and developments, and SEMI Workforce Development for more information on efforts to address the microelectronics industry’s talent needs.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact   
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI Appoints Industry Veteran John Cooney to Lead Global Advocacy and Public Policy

WASHINGTON D.C. — August 9, 2022 – SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the signing of the CHIPS and Science Act of 2022 by U.S. President Joe Biden. The legislation provides a 25% tax credit for U.S. facilities that produce semiconductors or chipmaking equipment and $52 billion in funding for new semiconductor programs. The funding includes $39 billion for grants available to chip manufacturers as well as semiconductor equipment and materials suppliers and $11 billion for federal semiconductor research programs.

“The CHIPS and Science Act secures landmark investments to bolster semiconductor manufacturing and R&D infrastructure as well as a wide range of ancillary industries in the United States,” said Ajit Manocha, SEMI president and CEO, who attended the signing ceremony. “We thank President Biden, Secretary Raimondo, the original CHIPS Act sponsors, leadership in Congress and the committees of jurisdiction for their support in enacting the investment tax credit and funding for CHIPS Act programs.”

“SEMI looks forward to continuing collaboration with the U.S. government and our member companies to ensure timely implementation of these programs to strengthen the U.S. semiconductor supply chain,” said Manocha. “The CHIPS and Science Act funding will also be instrumental in buttressing the National Semiconductor Technology Center (NSTC), National Advanced Packaging Manufacturing Program and related programs in order to drive chip industry innovations that will better the lives of people around the world.”

Visit SEMI Global Advocacy to learn more about public policy efforts and developments, and SEMI Workforce Development for more information on efforts to address the microelectronics industry’s talent needs.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

SEMI Contact
Samer Bahou/SEMI
Phone: 1.408.943.7870
Email: [email protected]

• Read more about SEMI Applauds President Biden’s Signing of CHIPS and Science Act of 2022

MILPITAS, Calif. — July 28, 2022 — SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the passage of the CHIPS and Science Act of 2022 by the United States House of Representatives. The bill provides a 25% tax credit for U.S. facilities that produce semiconductors or chipmaking equipment and $52 billion in funding for new semiconductor programs. The funding includes $39 billion for grants available to semiconductor manufacturers as well as equipment and materials suppliers and $11 billion for federal semiconductor research programs.

“Enactment of the investment tax credit and funding for CHIPS Act programs was made possible by the steadfast support of President Biden, Secretary Raimondo, the original CHIPS Act sponsors, leadership in Congress and the committees of jurisdiction,” said Ajit Manocha, SEMI president and CEO. “We thank them for their leadership and support and look forward to working to ensure these policies and programs are implemented quickly and consistently with the objective of strengthening the semiconductor supply chain in the United States.”

“The investment tax credit and funding for CHIPS Act programs will be instrumental in bolstering semiconductor manufacturing and R&D along with a wide range of technology-reliant U.S. supply chains, create thousands of high-skill jobs, and keep pace with incentive programs around the world,” said Manocha. “With semiconductor manufacturing fabs heavily reliant on a complex mix of equipment and materials providers, the inclusion of these critical contributors in the incentives will help to ensure the competitiveness and resiliency of the U.S. semiconductor ecosystem.”

Visit SEMI Global Advocacy to learn more about public policy efforts and developments, and SEMI Workforce Development for more information on efforts to address the microelectronics industry’s talent needs.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

SEMI Contact
Samer Bahou/SEMI
Phone: 1.408.943.7870
Email: [email protected]

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