TAIPEI – July 12, 2022 – SEMI Taiwan today launched the SEMI Auto IC Master, a comprehensive guide to automotive semiconductor and component providers in Taiwan.  Designed to enable closer collaboration among carmakers, automobile Tier 1 suppliers and Taiwan’s semiconductor IDM and fabless companies, the guide promises to help automakers better adapt production capacity to semiconductor supply chain disruptions and drive innovation. The guide is available through an online account or in hard copy and can be purchased by contacting the SEMI Taiwan representatives listed on the SEMI Auto IC Master webpage.    

“The ongoing chip shortage underscores the need for SEMI member companies and the automotive supply chain to collaborate more closely to help maintain adequate chip supplies for automakers during supply chain disruptions,” said Terry Tsao, Global Chief Marketing Officer at SEMI and president of SEMI Taiwan. “The SEMI Auto IC Master helps lay the groundwork for automotive innovations in the coming decade and beyond.”
 

Executives from the following organizations attended the SEMI Auto IC Master Press Conference today: (Front row, left to right) Ali Tech, ARTC, Holtek, ITE Tech, SUNPLUS TECHNOLOGY, SEMI Taiwan, UMC, Ministry of Economic Affairs, R.O.C., Ministry of Transportation and Communication, R.O.C., Hon Hai (Foxconn) Technology Group, Industrial Development Bureau, MOEA, ELAN MICROELECTRONICS, PIXART IMAGING, ICATCH TECHNOLOGY, AVISONIC TECHNOLOGY; (Back row, left to right) Realtek Semiconductor, PIXART IMAGING, SUNPLUS TECHNOLOGY, Etron Technology, Elite Semiconductor Microelectronics Technology, Novatek, CUBTEK, CAD Engineer, ICATCH TECHNOLOGY, ELAN MICROELECTRONICS, Macronix International, Holtek, ITE TECH, and GENERALPLUS TECHNOLOGY 

Automotive semiconductors are expected to record a compound annual growth rate (CAGR) of 16.5% through 2026, while electronic components spending for electric vehicles, self-driving cars, advanced driver assistance systems (ADAS) and other in-vehicle products is expected to increase 50% by 2030, according to market research firm Gartner.

“Taiwan’s chip manufacturing efficiency holds the key to enabling greater efficiencies between automakers and the semiconductor supply chain,” said John Hsuan, Honorary Vice Chairman of United Microelectronics Corp. (UMC). “Electric vehicle market growth is a key driver of semiconductor demand in the automotive sector, with the number of chips in an EV expected to exceed 3,000 in the future. I encourage additional Taiwanese semiconductor companies to work more closely with the automotive sector to help drive the expansion of this important market.”

“The publication of the SEMI Auto IC Master is merely the beginning and will evolve to continue to meet the needs of the automotive industry,” said Young Liu, Chairman of Hon Hai Technology Group. “The guide offers key details about Taiwan’s semiconductor ecosystem to help fuel the rapid growth of the new-energy vehicle market, positioning Taiwan as a key player in the global automotive chip market.”
 

(Left to right) Gene Liu, Vice President of the SoC Design Center at Hon Hai Technology Group; John Hsuan, Honorary Vice Chairman of United Microelectronics Corp; and Terry Tsao, Global Chief Marketing Officer at SEMI and president of SEMI Taiwan. The three executives collaborated with Taiwanese automotive semiconductor chip manufacturers and suppliers upstream to downstream to launch the SEMI Auto IC Master. 

SEMI Auto IC Master Sponsors and Partners

The following Taiwan government officials and industry leaders showed their support for the growth of Taiwan’s automotive semiconductor community by attending the SEMI Auto IC Master press conference in Taipei on June 29.

• Mei-Hua Wang, Minister of Economic Affairs
• Wen-Jong Chi, Administrative Deputy Minister of Transportation and Communications
• John Hsuan, Honorary Vice Chairman of United Microelectronics Corp. 
• Gene Liu, Vice President of the SoC Design Center at Hon Hai Technology Group (Foxconn)
• Terry Tsao, Global Chief Marketing Officer at SEMI and president of SEMI Taiwan

The following executives attended the SEMI Auto IC Master launch event today, vowing to help usher in a new era for Taiwan’s automotive semiconductor industry. (Left to right) Terry Tsao, Global Chief Marketing Officer at SEMI and president of SEMI Taiwan; Gene Liu, Vice President of the SoC Design Center at Hon Hai Technology Group (Foxconn); Wen-Jong Chi, Administrative Deputy Minister of Transportation and Communications; Mei-Hua Wang, Minister of Economic Affairs; and John Hsuan, Honorary Vice Chairman of United Microelectronics Corp. 

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Monica Hung/SEMI Taiwan
Email: [email protected]
Phone: +886.3.560.1777 ext. 207

• Read more about New SEMI Auto IC Master Guide to Help Drive Closer Collaboration Between Taiwan Chip Providers and Automotive Ecosystem

MILPITAS, Calif. — July 11, 2022 — Electronic System Design (ESD) industry revenue increased 12.1% from $3,157.7 million in Q1 2021 to $3,540.5 million in Q1 2022, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report. The four-quarter moving average, which compares the most recent four quarters to the prior four, rose 14.5%.   

“The industry continued to report double-digit year-over-year revenue growth in Q1 2022, with quarterly revenue reaching a record $3,540.5 million,” said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report. “Product categories Computer-Aided Engineering, Printed Circuit Board and Multi-Chip Module, Semiconductor Intellectual Property, and Services recorded growth for the quarter. Geographically, the Americas, Japan, and Asia Pacific (APAC) all reported revenue growth.”

The companies tracked in the EDMD report employed 51,328 people globally in Q1 2022, a 4.7% increase over the Q1 2021 headcount of 49,024 and up 0.2% compared to Q4 2021.

The quarterly EDMD report contains detailed revenue information with the following category and geographic breakdowns.

Revenue by Product and Application Category – Year-Over-Year Change

• Computer-Aided Engineering (CAE) revenue increased 14.8% to $1,118.2 million. The four-quarter CAE moving average increased 12.5%.

• IC Physical Design and Verification revenue decreased 7.5% to $631.2 million. The four-quarter moving average for the category declined 2.5%.

• Printed Circuit Board and Multi-Chip Module (PCB and MCM) revenue increased 1.4% to $293.3 million. The four-quarter moving average for PCB and MCM rose 11.4%.

• Semiconductor Intellectual Property (SIP) revenue jumped 23.7% to $1,376.5 million. The four-quarter SIP moving average grew 26.5%.

• Services revenue increased 22.7% to $121.4 million. The four-quarter Services moving average increased 24.9%.

Revenue by Region – Year-Over-Year Change

• The Americas, the largest reporting region by revenue, procured $1,522.7 million of electronic system design products and services in Q1 2022, an 18.5% increase. The four-quarter moving average for the Americas rose 18%.

• Europe, Middle East, and Africa (EMEA) procured $434.1 million of electronic system design products and services in Q1 2022, a 3% decrease. The four-quarter moving average for EMEA grew 8.1%.

• Japan’s procurement of electronic system design products and services increased 1.8% to $263.5 million. The four-quarter moving average for Japan rose 2.5%.

• Asia Pacific (APAC) procured $1,320.3 million of electronic system design products and services in Q1 2022, a 13.2% increase. The four-quarter moving average for APAC increased 15.6%.

About the EDMD Report

The ESD Alliance Electronic Design Market Data (formerly the Market Statistics Service) report presents Electronic Design Automation (EDA), SIP and services industry revenue data quarterly. Both public and private companies contribute data to the report available from SEMI. Each quarterly report is published approximately three months after quarter close. EDMD report data is segmented as follows:

• Revenue by product category (CAE, IC Physical Design and Verification, Semiconductor IP, PCB/MCM Layout, and Services) including numerous detailed sub-categories
• Revenue by geographic region (Americas, EMEA, Japan and APAC)
• Total employment at participating companies

For information about SEMI market research reports, visit the SEMI Market Research Reports and Databases Catalog.

About the Electronic System Design Alliance

The Electronic System Design (ESD) Alliance, a SEMI Technology Community, is the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry. As an international association of companies providing goods and services throughout the semiconductor design ecosystem, it is a forum to address technical, marketing, economic and legislative issues affecting the entire industry. For more information about the ESD Alliance, visit http://esd-alliance.org.

About SEMI

SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

The information supplied by the ESD Alliance is believed to be accurate and reliable, but the ESD Alliance assumes no responsibility for any errors that may appear in this document. All trademarks and registered trademarks are the property of their respective owners.

Press Contacts                                                                                 

Paul Cohen
ESD Alliance
A SEMI Technology Community
978-769-2106             

Jack Taylor
Siemens EDA PR
Siemens Digital Industries Software
512-560-7143 

• Read more about Electronic System Design Industry Logs 12.1% Year-Over-Year Revenue Growth in Q1 2022, ESD Alliance Reports

MILPITAS, Calif. – July 11, 2022 – SEMICON West 2022 Hybrid opens tomorrow at the Moscone Center in San Francisco as more than 200 industry leaders, visionaries and technology experts gather for insights into critical microelectronics industry trends. July 12-14 at the Moscone Center in San Francisco, SEMICON West 2022 Hybrid will spotlight topics including sustainability, smart technologies and digital transformation while addressing key themes including workforce development, government investment in chip manufacturing and heterogeneous integration. Registration is open for both the live and virtual programs.

The event, North America’s premier exhibition and conference for the microelectronics supply chain, will feature on-site keynotes and executive panels with thought leaders from the semiconductor ecosystem, academia and government.

The Global Sustainability Summit will debut at SEMICON West 2022 Hybrid to help drive the collaboration necessary for the semiconductor industry to reduce its carbon footprint. Co-hosted by SEMI and McKinsey & Company, the summit comes as semiconductor ecosystem companies are increasingly committing to sustainability targets. In parallel, SEMI member companies are joining forces with startups to enable a greener chip industry as part of the SEMI Sustainability Initiative.  

SEMICON West 2022 Hybrid Smart Pavilions

• Smart Manufacturing Pavilion – The pavilion will feature data-sharing breakthroughs that are leading to smarter manufacturing processes, higher yields, and new semiconductor innovations. Thought leaders will engage attendees at the Meet the Experts Theater on topics including advances in sensors, processors, memory, 5G, and silicon photonics for improving data-sharing across the microelectronics supply chain. Emerging IC technologies for connected intelligence in electronics manufacturing will also be in focus.

• Smart Mobility Pavilion – Leading all new application spaces in chip growth, the transportation and mobility markets promise to fuel the expansion of segments such as flexible hybrid electronics (FHE), MEMS and sensors. The pavilion will also showcase semiconductor industry growth opportunities through advances in areas including autonomous vehicles, Internet of Things (IoT) applications, 5G and artificial intelligence (AI).

• Smart MedTech Pavilion – The pavilion will focus on future MedTech markets and applications and include technology demonstrations. Industry experts will discuss medical wearables and point-of-care instrument innovations driven by development of MEMS-based sensors and actuators.

• Workforce Development Pavilion – Building the microelectronics industry’s talent pipeline to sustain the current pace of innovation and growth is a top priority. Targeting both new strategies for recruiters and tactics for job seekers, the pavilion will highlight entry-level opportunities, searching for a job during uncertain times, and why microelectronics is a smart career choice.

SEMICON West 2022 Hybrid Sessions

• SEMI Market Symposium – July 11, 1:00-5:00pm – Market trends and drivers and a midyear update on forecasts and insights on semiconductor equipment and materials, electronics design, and the manufacturing supply chain.  

• Bulls & Bears – Perspectives on key semiconductor industry trends from Wall Street analysts in a moderated panel discussion.

• TechTALKS – Discussions with experts on advanced manufacturing, materials, silicon photonics, MEMS and sensors, and heterogenous integration.

• Test Vision Symposium – Insights from providers and users of test IP and equipment on coming trends and innovations.

The FLEX Conference, the annual event focused on flexible hybrid and printed electronics innovations, and the Design Automation Conference (DAC), the premier gathering focused on the design and design automation of electronic circuits and systems, will co-locate with SEMICON West 2022 Hybrid.

COVID-19 Safety Protocols

To ensure the well-being of all its exhibitors and visitors, SEMI monitors developing federal, state, and local health and safety recommendations and requirements to determine the most appropriate safety protocols for in-person events.

Recorded programming of select speakers at SEMICON West 2022 Hybrid will be available on-demand July 13, 2022, through August 13, 2022. Visitors will have direct access to exclusive online exhibitors during the live event.

Follow SEMICON West on Twitter: #SEMICONWest

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMICON West 2022 Hybrid Opens Tomorrow With Spotlight on Sustainability, Smart Technologies, Talent

SAN FRANCISCO, Calif. – July 13, 2022 – The Atlas V optical critical dimension metrology tool from Onto Innovation, Inc. has won the 2022 Best of West award, SEMI and Semiconductor Digest announced today at SEMICON West 2022 Hybrid, July 12-14 at the Moscone Center in San Francisco. Onto Innovation is a leader in process control, including un-patterned wafer quality, 3D metrology, macro defect inspection of wafers and packages, metal interconnect composition, factory analytics, and lithography for advanced semiconductor packaging.

Presented by SEMI and Semiconductor Digest each year, the Best of West award recognizes innovative new products or services that are significantly advancing the electronics manufacturing supply chain or a particular manufacturing capability.

The new Atlas V metrology system is designed to measure several key steps that include buried features not visible by CD-SEM and other techniques. Through improvements in the optical systems, mechanical sub-systems and software algorithms, the Atlas V system can precisely measure the very subtle variations for device parameters and reveal weak process corners for engineers to improve fab process robustness. The Atlas V metrology system enables these critical dimensions to be measured with high accuracy and sensitivity, extending the capability of optical solutions for future generations of devices and eliminating the need for slower process control techniques.

The Atlas V technology enables the performance needed for customers’ development of GAA/3D NAND/DRAM and is over 100 times faster than X-ray solutions for these structures. Select Onto Innovation customers have validated the new optical critical dimension (OCD) technology and have appreciated the speed and resolution that was once thought to be beyond the limits of optical technology.

“Semiconductor manufacturers rely on the ingenuity of equipment suppliers such as Onto Innovation to make chips smaller and faster,” said Pete Singer, Editor-in-Chief of Semiconductor Digest. “The Atlas V is a great example of a product that meets the needs of next-generation semiconductor devices, such as the gate-all-around transistor.”

Onto Innovation will receive the Best of West award today at SEMICON West 2022 Hybrid.

About Semiconductor Digest

Through a mix of news, contributed articles and staff-written articles, Semiconductor Digest is dedicated to providing global information about the design, manufacturing, packaging and testing of semiconductors and other types of electronic devices, including MEMs, LEDs, displays, power electronics, optoelectronics/photonics, biomedical devices, solar cells, thin film batteries and flexible electronics. Semiconductor Digest consists of a website, magazine and topic-focused newsletters.

About SEMI

SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

SEMI Contact

Michael Hall
Phone: 1.408.943.7988
Email: [email protected]

Semiconductor Digest Contact

Pete Singer, Editor-in-Chief
Phone: 1.978.470.1806
Email: [email protected]

• Read more about Onto Innovation Wins 2022 Best of West Award for Atlas V Optical Critical Dimension Metrology Tool

MILPITAS, Calif. – July 5, 2022 –SEMI and Semiconductor Digest today announced finalists for the Best of West award to be presented at SEMICON West 2022, July 12-14 at the Moscone Center in San Francisco. The Best of West Award winner will be announced at SEMICON West 2022 Hybrid on Wednesday, July 13, 2022.

Presented by SEMI and Semiconductor Digest each year, the Best of West award recognizes innovative new products or services that are significantly advancing the electronics manufacturing supply chain or a particular manufacturing capability.

The following Best of West 2022 finalists will showcase their products on the SEMICON West 2022 Hybrid show floor:

Advantest: V93000 EX Test Station The EX Test Station is a stand-alone test system that is compatible with Advantest V93000 series test systems. It brings the versatility, accuracy, and high-performance capabilities of the V93000 into the lab environment.
ClassOne Technology: Solstice ClassOne Technology’s Solstice® single-wafer platform delivers advanced electroplating and wafer-surface preparation technologies for compound semiconductors and other critical applications requiring ultimate wafer uniformity and process control in a single flexible, compact system.
Nanotronics: nControl™ nControl™ integrates the AIPC™ software solution with its DLC™ edge computing for manufacturing. AIPC™ aggregates real-time manufacturing process data and uses deep learning to build models that provide KPI predictions, anomalous activity alerts and autonomous control, enabling factories to automatically adapt to increase yields and avoid malfunctions.
Onto Innovation: Atlas V Atlas V, leveraging the latest improvements in source signal-to-noise ratio (SNR), coupled with the Onto Innovation AI Diffract (Machine Learning-guided modeling engine), enables the clean separation of signals related to nanosheets in gate-all-around (GAA) devices. Using individual nanosheet measurements from an inline tool capable of measuring a single location in less than a second, Atlas V enables a process control feedback loop that is critical for ramping yield to HVM levels.
UCT: IoT Manifold The IoT Manifold is an innovative concept that combines high-quality ultra-clean valves, remote control capabilities, sensing features and wireless connectivity systems. The IoT Manifold is designed to maximize control over various systems and prevent human error, breakdowns, and unnecessary expenditures while enabling a safer working environment.

About Semiconductor Digest

Through a mix of news, contributed articles and staff-written articles, Semiconductor Digest is dedicated to providing global information about the design, manufacturing, packaging and testing of semiconductors and other types of electronic devices, including MEMs, LEDs, displays, power electronics, optoelectronics/photonics, biomedical devices, solar cells, thin film batteries and flexible electronics. Semiconductor Digest consists of a website, magazine and topic-focused newsletters.

About SEMI

SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

SEMI Contact

Michael Hall
Phone: 1.408.943.7988
Email: [email protected]

Semiconductor Digest Contact

Pete Singer, Editor-in-Chief
Phone: 1.978.470.1806
Email: [email protected]

• Read more about SEMI Americas and Semiconductor Digest Announce 2022 Best of West Award Finalists

MILPITAS, Calif. — July 6, 2022 — FLEX Conference opens next week with keynotes, panel discussions, technical sessions and product-based demonstrations highlighting the latest innovations in flexible and printed electronics as they continue to re-shape how people work and live. July 11-14 at the Moscone Center in San Francisco, the event is co-located with SEMICON West Hybrid, North America’s premier microelectronics exhibition and conference that unites players across the entire electronics manufacturing and design supply chain. Registration for both events is open.  

Themed Electronics in Motion, FLEX Conference 2022 will focus on equipment, processes, materials and applications driving the latest flexible hybrid electronics (FHE) technology breakthroughs. The event will also showcase innovations emerging from public-private partnerships formed by SEMI Technology Communities SEMI-FlexTech, SEMI-NBMC (Nano-Bio Materials Consortium) and SEMI-NextFlex.

Advances in sustainability across traditional and flexible electronics will come into focus at the Global Sustainability Summit at SEMICON West Hybrid and FLEX as FHE devices combine new levels of processing and sensing capability with improved power usage for greater energy efficiency.  

FLEX Conference 2022 Keynotes

	Dr. Michael D. McCreary, Chief Innovation Officer, Senior VP,  E Ink Corporation Electrophoretic Display Technology Will Change the Look of Automobiles, Transportation and Beyond
	Dawson Cagle, Ph.D., Intelligence Advanced Research Projects Activity (IARPA)  Weaving Electronics into Textiles
	John D. Williams, Ph.D., Boeing Research and Technology  Multilayer Flexible Electronic Devices for Iot and RF Applications

Future FLEX Disruptors Session

Join six startup entrepreneurs in the flexible, flexible hybrid and printed electronics industries as they showcase their inventions, solicit valuable insights from a panel of venture capitalists and work to shape the future of electronics.  

• Xina Quan, Co-founder and CEO, PyrAmes – Changing Lives With Better Blood Pressure Measurements
• Marc Rippen, CEO, Alertgy – The Challenges of Developing a Wearable Medical Device
• James Lee, Co-founder and CEO, Stratio – Drive Safe, Eat Safe With Low-cost, Compact Infrared Camera
• Rich Neil, Founder and CEO, RN Technologies – Multi-Dimensional Build Platforms for Additive Manufacturing
• Ram Prasad Gandhiraman, Founder and CEO, Space Foundry – Plasma Jet Printing for Printed Electronics
• Benjamin Dringoli, Co-Founder and CEO, TRAQC – Printing Without Interruption

Other Notable Speakers at FLEX Conference 2022

• Samantha Stevens, Jabil – Optimization of Cu Ink Processing for Potential Replacement of Ag Inks in End-user FHE Based Applications
• Michael Brothers, UES Inc. – Optimization of Ink-Printed, 2D-Materials for Selective, Wearable, Environmental Sensors
• Matthew Dyson, IDTechEx – A Roadmap for 3D Hybrid Electronics
• Sheila Goodman, CHASM Advanced Materials – Transparent CNT Hybrid Heater Films for Automotive De-icing Application
• Shane Mitchell, Artimus Robotics – HASEL Actuation Technology: Artificial Muscles for the Next-generation of Robots
• Carolyn Ellinger, Eastman Kodak Company – Understanding the Advantages of Additive Manufacturing for Transparent and Flexible Electronics

FLEX Conference 2022 Breakout Sessions

• FHE Applications
• Flexible MedTech and Wearables
• Printing and Processing
• Reliability and Inspection
• Strategies and Sustainability
• Flexible Conductive Materials and Inks
• Flexible Power
• FHE Processing and Integration

The Design Automation Conference (DAC), the largest meeting in the electronic design automation (EDA) industry, will also co-locate with SEMICON West Hybrid 2022. Registration for DAC is open.

About SEMI

SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact   

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about FLEX Conference 2022 Set to Open With Focus on Latest Flexible Hybrid Electronics Innovations and Disruptors

MILPITAS, Calif. – July 5, 2022 – The CHIPS Act, microelectronics industry resilience and the future of mobility will come into focus next week at SEMICON West 2022 Hybrid, July 12-14 at the Moscone Center in San Francisco, as industry leaders deliver keynotes and participate in executive panels on these and other critical topics focused on industry growth. Registration is open.

The event, North America’s premier exhibition and conference for the microelectronics supply chain, will gather more than 200 industry leaders, visionaries and technology experts for insights into the latest trends, innovations and developments across the electronics supply chain.

SEMICON West 2022 Hybrid will also highlight industry challenges and opportunities for overcoming pressing issues such as sustainability, chip scarcity and the semiconductor workforce shortage while addressing key themes including digital transformation, and heterogeneous integration.

SEMICON West 2022 Hybrid Keynotes

	Laurie E. Locascio, Under Secretary of Commerce for Standards and Technology Director of the National Institute of Standards and Technology (NIST)  NIST, Semiconductors, and the CHIPS Act
	Siva Sivaram, President of Technology and Strategy, Western Digital  Flash Forward: How A Global Supply Chain Enables the Data Revolution
	Berthold Hellenthal, Head of Computing and Semiconductors, CAVIAD, a Volkswagen Group Company  Semiconductor Innovation Driving Future Mobility
	Vanessa Ahktar, Director, Kotter The Science of Change: Navigating an Increasingly Chaotic World

SEMICON West 2022 Hybrid Executive Panels

Day 1 will also feature the following executive panels:

How Are You Shaping a More Resilient Supply Chain – Perspectives and Possibilities

Moderator: Bettina Weiss, Chief of Staff and Corporate Strategy, SEMI

Panelists:

• Bruce Tufts, Vice President,  Manufacturing Supply Operations, Director, Fab Materials Organization, Intel Corporation
• Boris Finselberg, Vice President, Global Sector Technology, DHL Customer Solutions & Innovation
• Doug Lefever, President & CEO, Advantest America; Executive Vice President, System Test Business Unit; Director, Managing Executive Officer Leader, Applied Research & Venture Team
• Carolin Seward, VP, Sourcing Operations for Silicon, Google
• Richard Barnett, Chief Marketing Officer, Supplyframe

The Value of a Veteran in the Workforce

Moderator: Larry Smith, Chairman, TEL U.S.

Panelists:

• General Paul E. Funk II, Commanding General, U.S. Army Training and Doctrine Command
• Katie Maloney, Business Line Manager, Edwards Vacuum
• Ann Kelleher, Ph.D., Executive Vice President and General Manager of Technology Development, Intel Corporation
• Shari Liss, Executive Director, SEMI Foundation
• Ajit Manocha, President and CEO, SEMI

SEMI Global Sustainability Summit Keynotes

With decarbonization building momentum worldwide, the Global Sustainability Summit will debut on Day 2 at SEMICON West 2022 Hybrid to help drive the collaboration necessary for the semiconductor industry to reduce its carbon footprint. Co-hosted by SEMI and McKinsey & Company, the summit comes as semiconductor ecosystem companies are increasingly committing to sustainability targets. 

Keynote speakers will include:

• Ryan Panchadsaram, Co-Author Speed and Scale; Partner, Kleiner Perkins; Former U.S. Deputy Chief Technology Officer
• Gary Dickerson, President and CEO, Applied Materials
• Arvind Krishna, CEO, IBM Mukesh V. Khare, Vice President, IBM – Conversation format
• Ann Kelleher, Ph.D., Executive Vice President and General Manager of Technology Development, Intel Corporation
• Mark Liu, Chairman, Taiwan Semiconductor Manufacturing Company (TSMC)
• Christophe Fouquet, EVP EUV Business Line, ASML Board Member, ASML
• Anand Nambiar, EVP, Semiconductor Materials, EMD Electronics
• Shally Venugopal, Principal & Vivid Economics, North America Leader, McKinsey & Company
• Vicki Hollub, President and CEO, Occidental Petroleum Corporation – Fireside chat

The FLEX Conference, the annual event focused on flexible hybrid and printed electronics innovations, and the Design Automation Conference (DAC), the premier gathering focused on the design and design automation of electronic circuits and systems, will co-locate with SEMICON West 2022 Hybrid.  

COVID-19 Safety Protocols

To ensure the well-being of all its exhibitors and visitors, SEMI monitors developing federal, state, and local health and safety recommendations and requirements to determine the most appropriate safety protocols for in-person events.

Recorded programming of select speakers at SEMICON West 2022 Hybrid will be available on-demand July 13, 2022, through August 13, 2022. Visitors will have direct access to exclusive online exhibitors during the live event.

Follow SEMICON West on Twitter: #SEMICONWest

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMICON West 2022 Hybrid Keynotes and Executive Panels to Highlight CHIPS Act, Microelectronics Supply Chain Resilience, Sustainability, Mobility and Talent

GRENOBLE, France – June 7, 2022 – With MEMS and imaging sensor innovations driving an explosion in medical, mobility, communications and other Smart applications, the stage is set for the return of SEMI MEMS & Imaging Sensors Summit, 6-7 September, 2022, to the World Trade Center (WTC) in Grenoble, France. More than 400 industry experts will gather for insights into the latest technology developments and trends across the MEMS and sensors supply chain. Registration is open.  

Hosted by SEMI Europe and the MEMS & Sensors Industry Group, a SEMI Technology Community, and Themed Intelligent Sensing for Better and Smarter Living, the summit will open with insightful executive keynotes and feature sessions on the following critical semiconductor industry topics.

Program Sessions

Session 1: A Diverse and Sustainable Workforce Enabling Next Generation Innovation
Industry leaders will explore how diversity drives innovation and ways companies and corporate leaders can create an inclusive environment where employees and innovation thrive.

Session 2: Market Brief
Industry trends, market drivers and supply chain dynamics will come into focus.

Session 3: Insights into Emerging Applications
Experts will share their vision for emerging sensor applications and discuss the latest developments in biosensors, MEMS, photonics and spectroscopic technologies.

Session 4: Intelligent Sensing
Discussions will highlight new sensor technologies that enable fast and reliable edge computing to pave the way for smarter applications in industries such as automotive and medical.

Session 5: Technology Showcase
This session will spotlight the latest MEMS and imaging sensor products and applications. Deep and traditional tech companies and startups as well as researchers developing new products will demonstrate cutting-edge solutions. Companies can submit their product demonstration abstracts by June 30.

Session 6.1: MEMS Advancements 
Industry leaders will discuss new MEMS technology applications, devices and manufacturing trends. Application topics will include the integration of several sensors into System in Package (SiP), MEMS for medical sensing, and integrating data generation and data processing into the same system. Manufacturing topics will include advancements enabling 300mm wafer sizes, 3D integration and substrate diversification.

Session 6.2: Imaging Advancements 
Industry leaders will share their visions for sensing processes, design and computing.

Session 7.1: Environmental MEMS Technology Focus
Future MEMS-enabled environmental technologies that drive advances in everything from preventative maintenance and quality control to environmental monitoring will come into sharp focus.

Session 7.2: The Latest on Short-wave Infrared (SWIR)
This session will explore the latest advancements in traditional SWIR imaging technology from Lynred and the promise of new quantum dot SWIR image sensors from STMicroelectronics and Emberion. It will also cover insights from imec on new consumer applications enabled by affordable sensors, and a low-cost solution for SWIR hyperspectral imaging introduced from VTT.

Session 8: Materials and Equipment Advancements
Experts will discuss how materials and equipment advances are enabling higher performance MEMS devices for new manufacturing techniques and equipment.

Session 9: Optics, Co-Packaged Optics (CPO) and Optical Chips Packaging for MEMS and Imaging Sensors
Rapid growth of cloud data presents new speed and bandwidth requirements. Industry leaders will explore the integration of optics and silicon through CPO to meet growing performance demands and reduce power consumption.

More MEMS & Imaging Sensors Summit Highlights

• Networking opportunities at the exhibition and a gala dinner for attendees of both MEMS and imaging sensor tracks to meet in-person.
• Exhibition showcasing leading companies driving the future of MEMS/imaging and sensors design and manufacturing including:
  • ASE Group
  • DELO Industrial Adhesives
  • Eurofins MASER B.V.
  • EV Group (EVG)
  • Evatec
  • Fraunhofer IPMS
  • KLA
  • Okmetic Oy
  • SAES Getters SpA
  • SCHOTT
  • SET
  • Siemens EDA (represented by EDA Solutions Limited)

Premier sponsors

• Platinum Sponsors: ASE Group, Infineon, KLA, SCHOTT
• Gold Sponsors: Evatec, SUSS MicroTec Group
• Silver Sponsor: AEM
• Event sponsors: Caeleste, EV Group (EVG), JSR Micro N.V., Okmetic

For more information, please visit the MEMS & Sensors Imaging Summit website.

Stay in touch on Twitter @SEMIEurope: #SensorsSummit #MEMS #Imaging #SEMIEurope

About SEMI

SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Serena Brischetto
SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

• Read more about Intelligent Sensing for Better and Smarter Living – MEMS & Imaging Sensors Summit Returns to Grenoble

MILPITAS, Calif. – June 23, 2022 – MEMS & Sensors Industry Group (MSIG), a SEMI Technology Community, today announced a Request for Proposals (RFP) for funding the development and manufacture of advanced positioning, navigation and timing (PNT) sensor components and systems. SEMI MSIG will award funding to U.S. teams or organizations with a wide range of research and development capabilities. White paper proposals are due July 15, 2022 at 5:00pm PDT. The RFP contains details about the proposal submission process.

Today, when a GPS signal is lost, commercial PNT solutions use inertial measurement units (IMUs) to maintain positioning accuracy. Over time, however, the accuracy becomes less reliable due to accumulated IMU errors. The initiative aims to drive PNT innovations that pinpoint the position of mobile and stationary assets and enable reliable navigation in critical situations.

The RFP marks another partnership between SEMI MSIG and the Army Research Lab (ARL) PNT consortium to address common challenges, innovate, and accelerate business and technical results. ARL has identified the following research and development focus areas under the project:

• Thrust Area 1: Novel Materials, Fabrication, and Packaging Techniques for Low-SWaP (small size, weight and power consumption) Inertial and PNT Sensors
• Thrust Area 2: Advanced Active and Passive Integrated Photonics for Low-SWaP Atomic Clocks, Quantum Systems, and PNT Sensors
• Thrust Area 3: Advancements Towards Low-SWaP, GPS-Free PNT Technologies

The SEMI MSIG Technical Council and ARL subject matter experts will evaluate, prioritize and manage the proposals and their resulting projects. Funding granted by SEMI MSIG for the projects must be matched with cash and in-kind contributions from the grant recipient’s organization to cover total project costs. Organizations awarded funding for SEMI projects in the past have contributed 58% of the funding for the development program, with a minimum contribution of 50%.

The new round of R&D funding builds on the Phase 1 SEMI MSIG PNT program launched in 2020 to identify novel approaches to PNT solutions for GPS-denied environments. Emphasis will be placed on system solutions, including machine learning and sensor fusion software, cost-effective process innovation, advanced packaging solutions, component innovations, and disruptive materials development. R&D may include software, hardware, and advanced packaging requirements of optical and MEMS-based positioning and timing systems that improve bias stability and reduce sensor noise while advancing system-level performance to further the state of the art.

SEMI MSIG provided details about the RFP in a webinar last month and encourages candidates  to review the RFP and watch the webinar before submitting a proposal. The proposal due dates noted in the webinar have been extended, and the correct dates are in the RFP.
 

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI MEMS & Sensors Industry Group Invites Proposals for Funding of Positioning, Navigation and Timing Technology Innovations

PENANG, Malaysia – 20 June 2022 – Spotlighting critical issues including sustainability and supply chain resilience, SEMICON Southeast Asia 2022, the region’s premier gathering of the semiconductor and microelectronics industry, opens tomorrow as experts convene for insights into the latest industry trends, developments and innovations. Returning to the Setia SPICE Convention Centre in Penang for the first time in three years due to the pandemic, the 21-23 June event will connect semiconductor manufacturing equipment companies, private and public partners, and other key industry stakeholders to explore new collaboration and growth opportunities.

Themed Forward as One – Building A Resilient and Sustainable Electronics Supply Chain in Southeast Asia, SEMICON Southeast Asia 2022 will commemorate Malaysia’s 50^th year of manufacturing excellence and celebrate Penang’s reputation as the Silicon Valley of the East. The exhibition and conferences are expected to draw more than 10,000 attendees and will feature two themed pavilions, two global pavilions, and technology forums to address key electronics manufacturing supply chain issues and trends.

The CxO Summit at SEMICON Southeast Asia 2022 will bring together industry thought leaders for perspectives on how companies across the supply chain can become more resilient to overcome industry disruptions such as the pandemic and chip shortage. Speakers will include:

• Ajit Manocha, President and CEO of SEMI – Welcome Speech
• Datuk Arham Abdul Rahman, CEO of Malaysian Investment Development Authority Malaysia (MIDA) – Opening Speech
• KC Ang, Chairman of the SEMI SEA Regional Advisory Board and Senior Vice President of Global Fab Operations at GlobalFoundries Singapore – Building Resiliency and Sustainability in the Semiconductor Industry
• Tim Archer, President and CEO of Lam Research – The Future of Innovation and Collaboration: The Semiverse
• Irving Tan, Executive Vice President of Global Operations at Western Digital – Supply Chain Resiliency
• Herbert Blaschitz, Executive Vice President, ATF, at Exyte Singapore – Creating Sustainable and Smart Wafer Fabs for the Future
• Chan Ping Chong, Vice-Chairman of the SEMI Southeast Asia Regional Advisory Board, and Smart Manufacturing Executive Vice President and General Manager of Product and Solutions at Kulicke & Soffa, Singapore – Advocating a Sustainable Supply Chain in the New Age of Digitalization
• Glen Brownlie, Vice President of Malaysian Operations at ams-Osram Malaysia – Optical Solutions in Digitization and Smart Living

The panel discussion Building a Resilient & Sustainable Electronics Supply Chain will culminate the CxO Forum.

Other SEMICON Southeast Asia 2022 Highlights

• Smart and Sustainable Manufacturing Journey will focus on state-of-the-art technologies that can increase manufacturing efficiency and world-class sustainable practices.
• World of IoT Pavilion will highlight start-ups and their latest technologies and solutions enabled by semiconductor innovation.
• Technical Forums will offer insights on industry and technology trends whilst providing networking and other information-sharing opportunities.
• Workforce and Talent Development Pavilion will feature the region’s largest E&E career fair and career talks by industry experts to help the industry build its talent pipeline.
• SEMICON University Program will feature aspiring leaders from the E&E industry and a robust panel to engage in a discussion on Diversity, Equity and Inclusivity (DEI).

Visit the SEMICON Southeast Asia 2022 website for more information.

About SEMI

SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Media Contacts

Ryan Teo
SEMI Southeast Asia Pte Ltd
[email protected]
+65 9859 0883

Reshvinder Kaur (for SEMI Southeast Asia Pte Ltd)
[email protected]
+6017 275 7985

• Read more about SEMICON Southeast Asia 2022 Opens Tomorrow With Focus on Sustainability and Supply Chain Resilience