HO CHI MINH CITY, Vietnam — 24 October 2022 — With Vietnam an emerging force in Asia’s microelectronics supply chain, the stage is set for the Vietnam Business Summit as industry stakeholders gather 10-11 November at the Renaissance Riverside Hotel Saigon in Ho Chi Minh City for insights into growth opportunities in Vietnam’s semiconductor industry and across the Southeast Asia electronics ecosystem. Hosted by SEMI Southeast Asia and the Ho Chi Minh City Semiconductor Industry Association (HSIA), the event is themed Connecting Vietnam to the Southeast Asia Semiconductor Ecosystem. 

The Vietnam Business Summit will feature perspectives from business leaders and government officials on Vietnam’s investment policies, talent development initiatives and digital transformation trends. The Summit will include a visit by attendees to Saigon Hi-Tech Park (SHTP), a 913-hectare state-of-the-art technology and science hub. Attendees will also tour the Vietnam National University Ho Chi Minh City, one of the two largest research universities in Vietnam and a key contributor to talent development in the region.  

“Singapore and Vietnam share a history of strong economic and people relations,” said Karen Leo, Deputy Executive Director of Singapore Global Network. “Building on this, we are excited to be a part of the Vietnam Business Summit where together with our Singapore enterprises, we look forward to bridging connections and inspiring new opportunities for people and businesses in Vietnam as well as the larger Southeast Asia region.”

“Vietnam is becoming a new destination for the semiconductor industry and plays a major role in developing its supporting industries, serving as an engine for the country’s economic growth,” said Nguyen Anh Tuan, Chairman of HSIA. “To become an emerging semiconductor chip manufacturing centre, the Vietnamese government must assist in infrastructure development, simplify administrative procedures, increase transparency, and continue to update regulations to ensure fair competition. We look forward to welcoming delegates to Vietnam and exchanging knowledge with our industry counterparts from SEMI Southeast Asia.”

“Saigon Hi-Tech Park is committed to supporting businesses in the semiconductor ecosystem within Vietnam and across Southeast Asia,” said Nguyen Anh Thi, President of SHTP. “Our mission is to build the foundation for high-tech industries, and the semiconductor industry plays an important role in attracting investment and development of this sector. The past two decades have seen foreign direct investment (FDI) forming the necessary infrastructure to support the development of high-tech enterprises in Vietnam. This is why connecting with communities, organizations, technology associations, and industries plays an important role in attracting resources for the development of SHTP. This summit is an opportunity for us to introduce our vision and goals to develop the semiconductor industry in the coming years.”  

“Vietnam is an emerging force in the global semiconductor supply chain and continues to show tremendous growth potential,” said Linda Tan, President of SEMI Southeast Asia. “The Vietnam Business Summit complements SEMI Southeast Asia’s vision to bolster the region’s supply chain. This summit has garnered strong interest from our members and partners, allowing us to form a party of more than 50 delegates from over eight countries who are thrilled to meet again in person this year for a series of compelling site tours, speeches, and conference topics aimed at fueling the growth of Vietnam’s semiconductor industry and the Southeast Asia microelectronics supply chain.”

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

For more information, please visit: https://www.semi.org/en/sea/events/vietnam-business-summit-2022

Association Contacts

Ryan Teo/SEMI Southeast Asia
Phone: 65.6392.9516
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Vietnam Business Summit to Highlight Region’s Semiconductor Industry Growth Opportunities

SEMI to launch model at GSMC to help organizations assess their Industry 4.0 technology deployment progress.

MILPITAS, Calif. — October 20, 2022 — Aiming to accelerate the adoption of Smart Manufacturing across the worldwide microelectronics supply chain, the SEMI Global Smart Manufacturing Conference (GSMC) will gather Industry 4.0 experts November 8-10 to share insights into state-of-the-art technologies and strategies designed to drive higher product quality, enhance production efficiencies and improve electronics manufacturing sustainability. Registration for the virtual conference is open.

Restricted travel and access to experts across global semiconductor supply chains have accelerated the implementation of Smart Manufacturing strategies, big data analytics, digital transformation, autonomous systems and AI/ML technologies. Presentations at GSMC 2022, organized by the SEMI Smart Manufacturing Initiative, will focus on critical topics identified within the SEMI Smart Manufacturing Roadmap.

GSMC 2022 will feature six sessions (i=Intelligent):

• Session 1 – i-Acquire: Data Sources, Variety and Acquisition
• Session 2 – i-Insights: Current Point Systems
• Session 3 – i-Digital Twin: Multi-Level Digital Twin
• Session 4 – i-Predict: AI/ML Solution Integration
• Session 5 – i-Autonomy: Smart Autonomous Control
• Session 6 – Foundational Topics Including Sustainability and Cybersecurity

Smart Manufacturing leaders presenting at GSMC include:

At GSMC 2022, SEMI will launch the Smart Manufacturing Initiative’s Industry 4.0 Readiness Assessment Model (IRAM) to help organizations to assess their Industry 4.0 technology deployment progress. Developed through a collaboration of SEMI and industry experts, the model is intended to help companies across the semiconductor supply chain identify technology enhancements critical to scaling and sustaining their smart manufacturing transformation.

The SEMI Smart Manufacturing Initiative is global with chapters in the Americas, China, Europe, Japan, Korea, Southeast Asia and Taiwan. Group members collaborate on Smart Manufacturing challenges and opportunities in their regions.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI Global Smart Manufacturing Conference Takes Aim at Speeding Adoption of Best Practices

TAIPEI, Taiwan — October 18, 2022 — Energy Taiwan, Taiwan's largest green energy exhibition, opens tomorrow at the Nangang Exhibition Center (TaiNEX 1) in Taipei as renewable energy technology leaders gather to share the latest trends and developments across Taiwan’s energy supply chain. Organized by SEMI and the Taiwan External Trade Development Council (TAITRA), the 3-day event connects domestic and foreign energy companies to explore new innovations and business opportunities.

“SEMI looks forward to hosting discussions at Energy Taiwan on green energy policies and cross-sector technology development that will help move Taiwan toward net-zero emissions,” said Terry Tsao, Global Chief Marketing Officer of SEMI and President of SEMI Taiwan. “Taiwan’s energy industry can only reach its full potential through the collaboration of industry, government and academia. The SEMI Sustainability Advisory Council and the SEMI Energy Group are key facilitators of these discussions.”

The Sustainability Advisory Council consists of more than 35 semiconductor ecosystem companies that are collaborating to organize a net zero strategy to advance decarbonization across the industry.

With 1,000 booths and an expected attendance of more than 10,000 – the largest Energy Taiwan ever – the event will feature five exhibition areas focused on key sectors of Taiwan’s energy industry.

Energy Taiwan Exhibitions

• PV Taiwan: Global photovoltaic (PV) manufacturers, supply chain vendors and suppliers such as Motech, TSEC, United Renewable Energy, Win Win Precision Technology and Ysolar will showcase the latest PV manufacturing equipment and materials, systems and components, cells and modules, testing and verification services, and related applications. Taiwan’s largest solar photovoltaic show, PV Taiwan is celebrating its 15th anniversary.

• Wind Energy Taiwan: Leading global wind energy developers and local supply chain players will highlight wind energy equipment raw materials, components, subsystems, maritime engineering, offshore wind foundations, system accessories, wind turbine systems, modules and cargo carriers, and talent development services. Participating companies include CI Wind Power Development, Fortune Electric, Northland Power, Hitachi Energy Taiwan, J&V Energy Technology, Ørsted Taiwan, Swancor Renewable Energy and WPD Taiwan Energy.

• Smart Storage Taiwan: The latest energy storage technologies for smart grids, smart meters, electric vehicles, and energy management systems will be displayed by companies including Billion Watts Technologies, Eco Energy, ETI CA Battery, Land San Electric, Leader Energy Storage Technology, Pihsiang Energy Technology, Power Electronics, Sysgration, Voltronic Power Technology, and Yu Chen System Technology.

• New – Emerging Power Taiwan: Hydrogen power and small hydropower as well as tidal, geothermal and biomass energy are critical to achieving net-zero carbon emissions by 2050. The British Office Taipei, Taiwan Institute of Economic Research, and Taiwan SHP Industries Alliance will showcase hydrogen power production equipment and materials, storage and delivery systems, and fuel cells.

• New – Net-Zero Taiwan: A wide range of solutions and services for carbon capture and storage, green power certification, carbon reduction, energy savings, and green finance will be showcased by exhibitors including Bank Sinopac, Delta Electronics, HD Renewable Energy, Taiwan Power Company, Taiwan Carbon Asset, Underwriters Laboratories Taiwan, and Vecow.

About SEMI Energy Group
Established by SEMI in 2008, the SEMI Energy Group supports a comprehensive renewable energy ecosystem that encompasses three major green energy supply chains: solar energy; wind power generation; and smart energy storage and power grids. In recent years, the scope of the SEMI Energy Group has expanded to include hydrogen energy, fuel cells, and green finance. The SEMI Energy Group’s energy industry committee facilitates communications among industry, government, and academia on green energy policy and technologies to achieve net-zero and sustainable development goals.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Monica Hung/SEMI Taiwan
Phone: 03.560.1777 ext.209
Email: [email protected]  

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected] 

• Read more about Energy Taiwan 2022 Opens Tomorrow to Spotlight Green Energy Innovations and Region’s Drive Toward Net-Zero Emissions

MILPITAS, Calif. — October 18, 2022 — Semiconductor manufacturers worldwide are estimated to increase 200mm fab capacity 20% from 2021 through 2025, adding 13 new 200mm lines as the industry reaches a record high of more than 7 million wafers per month (wpm), SEMI announced today in its 200mm Fab Outlook to 2025 report. Surging demand for automotive and other applications are driving the capacity expansion for power semiconductors and MEMS.

Chipmakers including ASMC, BYD Semiconductor, China Resources Microelectronics, Fuji Electronics, Infineon Technologies, Nexperia and STMicroelectronics have announced new 200mm fabs to meet growing demand.

The SEMI 200mm Fab Outlook to 2025 report shows fab capacity for automotive and power semiconductors growing at a rate of 58% from 2021 to 2025, followed by MEMS at 21%, foundry at 20% and analog at 14%.
 

Regional Outlooks

China will lead the world in 200mm capacity expansions with a 66% increase by 2025, followed by Southeast Asia at 35%, Americas at 11%, Europe and Mideast at 8%, and Korea at 2%. In 2022, China is expected to claim 21% share of global 200mm fab capacity, followed by Taiwan and Japan at 11% and 10%, respectively.

The SEMI 200mm Fab Outlook to 2025 report tracks more than 330 fabs and lines. The report reflects 75 updates across 53 facilities and lines and includes four new projects since the previous report in April 2022.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

Christian G. Dieseldorff/SEMI US
Phone: 1.408.943.7940
Email: [email protected]

Chih-Wen Liu/SEMI Taiwan
Phone: 886.932.309.146
Email: [email protected]

• Read more about Global 200mm Semiconductor Fab Capacity Projected to Surge 20% to Record High by 2025, SEMI Reports

MILPITAS, Calif. — October 17, 2022 — Electronic System Design (ESD) industry revenue increased 17.5% from $3,191.4 million in Q2 2021 to $3,748.7 million in Q2 2022, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report. The four-quarter moving average, which compares the most recent four quarters to the prior four, rose 15.3%.   

“The electronic design automation (EDA) industry in Q2 2022 posted the highest year-over-year (YOY) increase in over a decade,” said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report. “Quarterly revenue reached a record $3,748.7 million. All product categories and geographic regions recorded growth in the quarter.”

The companies tracked in the EDMD report employed 54,408 people globally in Q2 2022, an 8.9% increase over the Q2 2021 headcount of 49,964 and up 6% compared to Q1 2022.

The quarterly EDMD report contains detailed revenue information with the following category and geographic breakdowns.

Revenue by Product and Application Category – Year-Over-Year Change

• Computer-Aided Engineering (CAE) revenue increased 12.1% to $1,137.3 million. The four-quarter CAE moving average increased 12.9%.

• IC Physical Design and Verification revenue increased 13% to $657 million. The four-quarter moving average for the category increased 0.6%.

• Printed Circuit Board and Multi-Chip Module (PCB and MCM) revenue increased 22% to $347.1 million. The four-quarter moving average for PCB and MCM rose 12.9%.

• Semiconductor Intellectual Property (SIP) revenue jumped 22.6% to $1,476.7 million. The four-quarter SIP moving average grew 25.3%.

• Services revenue increased 23.2% to $130.7 million. The four-quarter Services moving average increased 24.8%.

Revenue by Region – Year-Over-Year Change

• The Americas, the largest reporting region by revenue, procured $1,643.4 million of electronic system design products and services in Q2 2022, a 20.2% increase. The four-quarter moving average for the Americas rose 18.5%.

• Europe, Middle East, and Africa (EMEA) procured $472 million of electronic system design products and services in Q2 2022, a 13.7% increase. The four-quarter moving average for EMEA grew 9%.

• Japan’s procurement of electronic system design products and services increased 6.1% to $252.3 million. The four-quarter moving average for Japan rose 4.3%.

• Asia Pacific (APAC) procured $1,381 million of electronic system design products and services in Q2 2022, a 17.9% increase. The four-quarter moving average for APAC increased 16.1%.

About the EDMD Report
The ESD Alliance Electronic Design Market Data (formerly the Market Statistics Service) report presents Electronic Design Automation (EDA), SIP and services industry revenue data quarterly. Both public and private companies contribute data to the report available from SEMI. Each quarterly report is published approximately three months after quarter close. EDMD report data is segmented as follows:

• Revenue by product category (CAE, IC Physical Design and Verification, Semiconductor IP, PCB/MCM Layout, and Services) including numerous detailed sub-categories
• Revenue by geographic region (Americas, EMEA, Japan and APAC)
• Total employment at participating companies

For information about SEMI market research reports, visit the SEMI Market Research Reports and Databases Catalog.

About the Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community, is the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry. As an international association of companies providing goods and services throughout the semiconductor design ecosystem, it is a forum to address technical, marketing, economic and legislative issues affecting the entire industry. For more information about the ESD Alliance, visit http://esd-alliance.org.

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

The information supplied by the ESD Alliance is believed to be accurate and reliable, but the ESD Alliance assumes no responsibility for any errors that may appear in this document. All trademarks and registered trademarks are the property of their respective owners.

Press Contacts                                                                                 

Paul Cohen
ESD Alliance
A SEMI Technology Community
978-769-2106             

Jack Taylor
Siemens EDA PR
Siemens Digital Industries Software
512-560-7143 

• Read more about Electronic System Design Industry Hits Record Revenue of Nearly $3.8 Billion in Q2 2022, ESD Alliance Reports

TOKYO – October 11, 2022 – With Japan accounting for more than 30% of semiconductor manufacturing equipment and materials sales worldwide, the stage is set for SEMICON Japan 2022 as Japanese and international companies from across the microelectronics manufacturing supply chain gather December 14-16 at Tokyo Big Sight for insights into the latest technology innovations, developments and trends. Industry experts and visionaries will discuss pressing semiconductor industry topics including smart sensing, mobility, flexible hybrid electronics, advanced packaging and materials, and quantum computing. Registration is open.

The new Advanced Packaging and Chiplet Summit (APCS) at SEMICON Japan will bring together industry leaders including AMD, ASE Group, Intel and NTT to discuss packaging innovations that are enabling more compact devices with lower power requirements, higher speeds and greater reliability – key in segments such as artificial intelligence (AI), 5G, and automotive. The Summit will also feature an exhibition and networking event.

Industry Visionaries Presenting at SEMICON Japan 2022

	Dario Gil, Senior Vice President and Director, IBM Research Opening Keynote Panel
	Tetsuro Higashi, Chairperson of the Executive Board, TIA; Chairman, Councils and Study Groups for Semiconductor and Device Industry Strategy Opening Keynote Panel
	Ravi Mahajan, Fellow, Intel Advanced Packaging and Chiplet Summit
	Jun Sawada, Chairman, Representative Member of the Board, NTT Keynote
	Chidi Chidambaram, Vice President of Engineering, Qualcomm Keynote
	Terushi Shimizu, Senior Executive Vice President, Sony Group Corporation; Representative Director, President and CEO, Sony Semiconductor Solutions Grand Finale Panel

SEMICON Japan 2022 Program Highlights

• FLEX Japan 2022 Conference – Experts from Elephantech, Meltin MMI, PI-CRYSTAL, PGV and Shiftall will discuss innovations that are driving new flexible hybrid electronics applications and market growth.
• SEMI Technology Symposium (STS) – Industry leaders and front-line engineers will explore the latest advances across key technology areas including smart sensing, testing, packaging, materials, power and lithography.
• Frontline of Quantum Computing Development – Quantum computing promises to drive electronics industry advances in areas such as materials development, product design and smarter manufacturing. Experts from Fujitsu and RIKEN will explore quantum computing trends and business opportunities.
• Next-Gen Mobility Forum – Representatives from the Ministry of Economic Trade and Industry and Japan Airlines will discuss the latest initiatives and trends in air mobility.
• SEMI Market Forum – The forum will feature the latest SEMI semiconductor manufacturing equipment and materials market forecasts, including updates on capital investments and production capacity in front-end fabs, as well as an electronics market outlook by market analyst firm Omdia.

SEMICON Japan 2022 Sponsors

• Platinum: Disco Corporation, Hightec Systems Corporation, Hitachi High-Tech Corporation, Screen Semiconductor Solutions Co., Ltd., and Tokyo Electron Limited
• Gold: Advantest, Applied Materials, Ebara, JSR, Kokusai Electric, Lam Research, Nikon, and Tokyo Seimitsu

Learn more at SEMICON Japan 2022.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Hiroki Yomogita/SEMI Japan
Phone: 81.3.3222.5854
Email: [email protected]

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMICON Japan 2022 to Spotlight Innovations Driving Semiconductor Industry Growth

MILPITAS, Calif. — October 11, 2022 — Semiconductor manufacturers worldwide are forecast to expand 300mm fab capacity at a nearly 10% compound average growth rate (CAGR) from 2022 to 2025, reaching an all-time high of 9.2 million wafers per month (wpm), SEMI announced today in its 300mm Fab Outlook to 2025 report. Strong demand for automotive semiconductors and new government funding and incentive programs in multiple regions are driving much of the growth.  

New fabs announced by companies including GlobalFoundries, Intel, Micron, Samsung, SkyWater Technology, TSMC and Texas Instruments are ramping in 2024 or 2025 to help meet the growth in demand.  

“While shortages of some chips have eased and supply of others has remained tight, the semiconductor industry is laying the groundwork to meet longer-term demand for a broad range of emerging applications as it expands 300mm fab capacity,” said Ajit Manocha, SEMI President and CEO. “SEMI is currently tracking 67 new 300mm fabs or major additions of new lines expected to start construction from 2022 to 2025.”
 

Regional Outlooks

China is projected to increase its global share of 300mm front-end fab capacity from 19% in 2021 to 23% in 2025, reaching 2.3 million wpm, a rise driven by factors including growing government investments in the domestic chip industry. With the growth, China is nearing global leader Korea in 300mm fab capacity and expected to overtake Taiwan, now in second place, next year.

Taiwan’s worldwide capacity share is expected to slip 1% to 21% from 2021 to 2025, while Korea’s share is also projected to edge lower 1% to 24% during the same period. Japan’s share of worldwide 300mm fab capacity is on a path to fall from 15% in 2021 to 12% in 2025 as competition with other regions increases. 

The Americas’ global share of 300mm fab capacity is forecast to rise from 8% in 2021 to 9% in 2025, driven partly by U.S. CHIPS Act funding and incentives. Europe/Mideast is projected to increase its capacity share from 6% to 7% during the same period on the strength of European CHIPS Act investments and incentives. Southeast Asia is expected to maintain its 5% share of 300mm front-end fab capacity during the forecast period.

Projected Capacity Growth Rates by Product Type

From 2021 to 2025, the 300mm Fab Outlook to 2025 shows Power-related capacity with the strongest growth at a 39% CAGR, followed by Analog at 37%, Foundry at 14%, Opto at 7% and Memory at 5%.

The latest update of the SEMI 300mm Fab Outlook to 2025 report tracks 356 current and future fabs.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Christian G. Dieseldorff/SEMI US
Phone: 1.408.943.7940
Email: [email protected]  

Chih-Wen Liu/SEMI Taiwan
Phone: 886.932.309.146
Email: [email protected]

• Read more about Global 300mm Semiconductor Fab Capacity Projected To Reach New High in 2025, SEMI Reports

Templeton Recognized Posthumously for Technical and Business Innovation 

MILPITAS, CALIF. –– October 3, 2022 –– Mark Templeton, the former managing director of investment firm Scientific Ventures, and a Lanza techVentures investment partner and board member, today was inducted posthumously into the Phil Kaufman Hall of Fame.

The honor, co-sponsored by the Electronic System Design (ESD) Alliance of SEMI and the IEEE Council on Electronic Design Automation (CEDA), recognizes Templeton’s significant and innovative contributions to the electronic system design industry. The Phil Kaufman Hall of Fame was founded in 2021 to honor deceased members of the semiconductor design industry, who are ineligible to receive the Phil Kaufman Award, a policy set by the IEEE.

At the time of his death in 2016, Templeton was a prominent and highly respected Silicon Valley venture capitalist who leveraged his engineering background to foster scientific advancement.

“Mark Templeton’s legacy of business innovation and creativity endures after his untimely death at age 57,” said Bob Smith, executive director of the ESD Alliance. “As a director and board member of numerous technology companies, he was instrumental in driving semiconductor intellectual property (IP) market growth by spearheading technical innovations and developing new business models.”

“In creating a new market segment, now widely known as silicon intellectual property, Mark Templeton left an indelible mark on the electronic system design industry,” said Gi-Joon Nam, president of CEDA and principal research scientist at IBM Research.

Templeton co-founded Artisan Components Physical IP in 1991, where he served as president and CEO. Under his leadership, Artisan Components quickly set the industry standard for implementing complex System on Chip (SoC) designs.

“Often overlooked is Mark’s genius,” said Lucio Lanza, managing director of Lanza techVentures, who nominated Mr. Templeton for recognition. “He created a new and innovative business model for silicon IP, moving away from upfront fees to a success-based approach.”

Artisan was the first company to offer free custom IP blocks for semiconductor design and was compensated once the design was completed, a model that has promoted design community growth ever since. Tens of thousands of chip designs using custom IP blocks have since been implemented, spanning 15 different process technologies and 18 foundries. Artisan went public in 1997 and was acquired by Arm in 2004. From 2004 to 2006, Templeton was president and Chief Strategy Office of Arm North America and also served on the Arm Holdings board of directors.

In addition, Templeton served as chairman of the board of Ablesky and president and CEO of Fabbrix from 2006 until it was acquired by PDF Solutions in 2007.

Templeton earned a Bachelor of Science degree in Engineering from Boston University.

About the IEEE Council on Electronic Design Automation (CEDA)
The IEEE Council on Electronic Design Automation (CEDA) provides a focal point for EDA activities spread across seven IEEE societies (Antennas and Propagation, Circuits and Systems, Computer, Electron Devices, Electronics Packaging, Microwave Theory and Techniques, and Solid-State Circuits). The Council sponsors or co-sponsors over a dozen key EDA conferences including: Design Automation Conference (DAC), Asia and South Pacific Design Automation Conference (ASP-DAC), International Conference on Computer-Aided Design (ICCAD), Design Automation and Test in Europe (DATE), and events at Embedded Systems Week (ESWEEK). The Council also publishes IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems (TCAD), IEEE Design & Test (D&T), and IEEE Embedded Systems Letters (ESL). The Council boasts a prestigious awards program in order to promote the recognition of leading EDA professionals, which includes the A. Richard Newton, Phil Kaufman, and Ernest S. Kuh Early Career Awards. The Council welcomes new volunteers and local chapters.

Stay in touch with IEEE CEDA
Website: www.ieee-ceda.org
LinkedIn: https://www.linkedin.com/groups/8343531
Facebook: https://www.facebook.com/ieeeceda/
Twitter: https://twitter.com/IEEECEDA

About the Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community representing members in the electronic system and semiconductor design ecosystem, is a community that addresses technical, marketing, economic and legislative issues affecting the entire industry. It acts as the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry.

Follow the ESD Alliance
https://www.semi.org/en/communities/esda/about-esda
ESD Alliance Bridging the Frontier blog
Twitter: @ESDAlliance
LinkedIn
Facebook

Association Contacts

Bob Smith
SEMI/ESD Alliance
Email: [email protected]
Phone: 1.650.269.8780

Nanette Collins                                                                                            
Public Relations for the ESD Alliance                                   
Email: [email protected]
Phone: 1.617.437.1822

• Read more about Mark Templeton Inducted into Phil Kaufman Hall of Fame by the ESD Alliance and IEEE CEDA

EPFL and former Stanford professor recognized for his significant impact on the electronic system design industry through pioneering technical contributions

MILPITAS, Calif. –– September 28, 2022 –– Dr. Giovanni De Micheli, Professor and Director of the Institute of Electrical Engineering (IEL) and of the Integrated Systems Centre at the École Polytechnique Fédérale de Lausanne (EPFL) in Lausanne, Switzerland, has been honored with the 2022 Phil Kaufman Award for Distinguished Contributions to Electronic System Design. The award is presented annually by the Electronic System Design Alliance (ESD Alliance), a SEMI Technology Community, and the Institute of Electrical and Electronics Engineers (IEEE) Council on Electronic Design Automation (CEDA).

Dr. De Micheli was recognized for his extensive contributions to electronic design automation (EDA). His EDA tools and methodologies research has helped drive significant advances in the academic field of design automation and made a lasting impact on the industry through their incorporation into commercial EDA solutions. Notably, he developed multiple technologies while inspiring his students, university researchers and engineers in the industry. His work has expanded the fields of high-level synthesis, logic synthesis, and Network-on-Chip (NoC) for more than 30 years.

“Professor De Micheli, or Nanni to many of us who’ve been driving our industry forward for decades, stands as a relentless advocate for our field,” said Aart de Geus, Chairman and CEO of Synopsys. “While many predicted our industry was fully matured, he remained focused and creative, be it with the encoding of finite-state machines combined with logic minimization or solving the cell-library mapping problem with Boolean matching. I am not alone when I express my appreciation to Nanni for advancing the field, but most important, for continuing to add findings that keep our profession fresh and exciting!”

“For the over three decades that I have known Professor De Micheli, he has established himself as a true force in the EDA community,” said Dr. Patrick Groeneveld, past chair of the Design Automation Conference (DAC). “His key technical contributions lie in the areas of logic synthesis, hardware software co-design, NoC design and physical synthesis.”

“Dr. De Micheli has been a stalwart innovator and supporter of EDA with numerous and lasting contributions, and certainly he well deserves this honor,” said Gi-Joon Nam, President of the IEEE Council on EDA.

“On behalf of the ESD Alliance, I congratulate Professor De Micheli on receiving the 2022 Phil Kaufman award,” said Simon Segars, ESD Alliance Chairman. “The industry would not be where it is today without his groundbreaking research, which was often years ahead of its time. His impact on the industry is well-recognized and celebrated with this distinguished award.”

About Dr. Giovanni De Micheli

Dr. Giovanni De Micheli is a research scientist in electronics and computer science credited with inventing the NoC design automation paradigm and creating EDA algorithms and design tools. Before serving as Professor and Director of the Integrated Systems Laboratory at EPFL, he was Professor of Electrical Engineering at Stanford University. He was Director of the IEL at EPFL from 2008 to 2019 and served as program leader of the Swiss Federal Nano-Tera.ch program.

He holds a Nuclear Engineering degree from Politecnico di Milano, and Master of Science and Ph.D. degrees in Electrical Engineering and Computer Science from the University of California, Berkeley.

Professor De Micheli is a Fellow of the Association for Computing Machinery (ACM), the American Association for the Advancement of Science (AAAS) and IEEE; a member of the Academia Europaea; and an International Honorary member of the American Academy of Arts and Sciences. His current research interests include design technologies for integrated circuits and systems, including synthesis for emerging technologies. He is also interested in heterogeneous platform design for electrical components and biosensors, as well as in-data processing of biomedical information.

He authored the textbook Synthesis and Optimization of Digital Circuits and co-authored and/or co-edited 10 other books and more than 900 technical articles. His citation h-index is above 100 according to Google Scholar. He is member of the Scientific Advisory Boards of imec Leuven and STMicroelectronics.

Professor De Micheli received the 2020 IEEE Technical Committee Achievement Award in Cyberphysical Systems, the 2020 IEEE/CEDA Richard Newton Technical Impact Award, the 2019 ACM/SIGDA Pioneering Achievement Award, and the 2016 European Design and Automation Association (EDAA) Lifetime Achievement Award.

He also received the 2016 IEEE Computer Society’s Harry Goode Award for seminal contributions to design and design tools of NoCs; the 2012 IEEE Circuits and Systems (CAS) Society’s Mac Van Valkenburg Award for contributions to theory, practice and experimentation in design methods and tools; and the 2003 IEEE Emanuel R. Piore Award for contributions to computer-aided synthesis of digital systems.

He received the Golden Jubilee Medal for outstanding contributions to the IEEE CAS Society, the D. Pederson Award for best paper on IEEE Transactions on Computer Aided Design (CAD)/Integrated Computer Aided System (ICAS), and best paper awards at events including DAC; Design, Automation and Test in Europe (DATE); Nanoarch; and Mobihealth.

In addition, he served as Division 1 Director of IEEE, co-founder and President Elect of the IEEE Council on EDA, President of the IEEE CAS Society, and Editor-in-Chief of the IEEE Transactions on CAD/ICAS. He has also chaired the following technical conferences:  Memocode; DAC; DATE; pHealth; VLSI SoC; and IEEE International Conference on Computer Design (ICCD).

About the Phil Kaufman Award
The Phil Kaufman Award honors individuals who have had a demonstrable impact on the field of electronic system design through technology innovations, education/mentoring, or business or industry leadership. The award was established as a tribute to Phil Kaufman, the late industry pioneer who turned innovative technologies into commercial businesses that have benefited electronic designers. The 2021 recipient was Dr. Anirudh Devgan, President and CEO of Cadence Design Systems.

About the IEEE Council on Electronic Design Automation (CEDA)
The IEEE Council on Electronic Design Automation (CEDA) provides a focal point for EDA activities spread across seven IEEE societies (Antennas and Propagation, Circuits and Systems, Computer, Electron Devices, Electronics Packaging, Microwave Theory and Techniques, and Solid-State Circuits). The Council sponsors or co-sponsors over a dozen key EDA conferences including: the Design Automation Conference (DAC), Asia and South Pacific Design Automation Conference (ASP-DAC), International Conference on Computer-Aided Design (ICCAD), Design Automation and Test in Europe (DATE), and events at Embedded Systems Week (ESWEEK). The Council also publishes IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems (TCAD), IEEE Design & Test (D&T), and IEEE Embedded Systems Letters (ESL). The Council boasts a prestigious awards program in order to promote the recognition of leading EDA professionals, which includes the A. Richard Newton, Phil Kaufman, and Ernest S. Kuh Early Career Awards. The Council welcomes new volunteers and local chapters.

Stay in touch with IEEE CEDA
Website: www.ieee-ceda.org
LinkedIn: https://www.linkedin.com/groups/8343531
Facebook: https://www.facebook.com/ieeeceda/
Twitter: https://twitter.com/IEEECEDA

About the Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community representing members in the electronic system and semiconductor design ecosystem, is a community that addresses technical, marketing, economic and legislative issues affecting the entire industry. It acts as the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry. Visit www.semi.org/en/communities/esdato learn more.

Follow the ESD Alliance
ESD Alliance Bridging the Frontier blog
Twitter: @ESDAlliance
LinkedIn
Facebook

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

All trademarks and registered trademarks are the property of their respective owners.

Contacts

Nanette Collins
Public Relations for the ESD Alliance                                   
Email: [email protected]
Phone: 1.617.437.1822

Michael Hall
SEMI
Email: [email protected]
Phone: 1.408.943.7988

Amanda Osborn
IEEE Council on EDA
Email: [email protected]
Phone 1.352.872.5544 ext. 123

• Read more about Dr. Giovanni De Micheli Honored with 2022 Phil Kaufman Award Presented by ESD Alliance and IEEE CEDA

MUNICH, Germany ─ September 27, 2022 ─ Innovations in advanced technologies such as Smart Mobility, Smart MedTech, advanced packaging, fab management, materials, and other semiconductor industry growth drivers will come into sharp focus as visionaries and experts gather at Messe München in Munich, Germany 15-18 November for SEMICON Europa 2022. Registration is open. 

Themed Chips Powering The Data Age, and co-located with electronica, SEMICON Europa 2022 will also highlight challenges and opportunities in sustainability, workforce development and across the supply chain as the semiconductor industry unites to address these critical issues. Europe’s largest microelectronics event, SEMICON Europa 2022 will feature an exhibition, conferences, forums and panel discussions.

“We are delighted to welcome key semiconductor industry leaders from across the value chain back to Munich to collaborate and discuss innovations vital to semiconductor industry growth in Europe and around the world,” said Laith Altimime, President of SEMI Europe.

SEMICON Europa Highlights

• Opening Ceremony: Executives from Airbus, Athinia, Edwards Vacuum, imec, Porsche and Samsung will share their perspectives on key topics such as accelerating innovation, a sustainable and connected future, and European manufacturing excellence.
• Advanced Packaging Conference: Thought leaders will highlight advanced solutions for electronics packaging and test, manufacturing equipment and materials, design for reliability and test, and Heterogeneous Integration (HI). 
• Fab Management Forum: Experts will discuss topics such as chip manufacturing, datafication of fabs, and AI in microelectronics manufacturing as the industry intensifies its focus on long-term resilience strategies in light of COVID-19 and recent supply chain disruptions.
• ITF Beyond 5G - Powered by imec: Experts will discuss Radio Frequency (RF) technology challenges and opportunities ranging from materials and devices to integrated circuits (ICs) and modules as advanced chips and compound semiconductors pave the way to next-generation mobile connectivity.
• SEMI Networking Night: This event will gather stakeholders from across the electronics industry to connect with peers and explore new business partnerships.

Executive Forum Program

• The Future of Work: Experts will discuss the importance of inclusive leadership in building a sustainable workforce and overcoming critical industry challenges such as the global talent shortage and increasing workplace diversity.
• Materials Innovation: This session will explore materials innovation developments and challenges related to atomic-scale processing and control of interfaces, morphology, composition, and 3D conformality.
• Smart Mobility Forum: Led by SEMI Europe’s Global Automotive Advisory Council (GAAC), this forum will provide an overview of industry stakeholders across the automotive and electronics value chains and discuss opportunities for overcoming current challenges faced by the automotive semiconductor industry.
• Electrification and Power Semiconductors: With semiconductor innovation enabling the electrification of a wide variety of industries, this session will highlight key trends in the field of power semiconductors such as improving semiconductor manufacturing efficiencies and technologies.
• Smart and Green Manufacturing Summit: Fab investments worldwide continue to grow to meet the demands of digital transformation as the semiconductor industry works to reduce its carbon footprint. This summit will explore how greater automation, data analytics, and resource-saving technologies will help the semiconductor industry achieve its sustainability goals.

TechARENA Program

• Integrated Photonics: Photonic Integrated Circuits (PICs) will play a key role in future infrastructure for communication, biosensing, and mobility. This session will showcase the latest PIC technologies and applications and provide insights into current scientific and industrial advancements.
• Smart MedTech Forum: The global pandemic has proven that a collaborative ecosystem can accelerate the introduction of healthcare solutions. This forum will examine how the medical industry will evolve to develop future therapies.
• Future of Computing: Experts will showcase innovative computing solutions for edge devices and lower power consumption, as well as new paradigms for more efficient computing solutions.
• From Edge to Cloud – Leveraging AI-driven Mechatronics for Resilient Manufacturing: Powerful intelligent mechatronic systems are helping manufacturers across industries achieve greater levels of productivity. Industry experts will discuss how Intelligent Motion Control under Industry4.E (IMOCO4.E) can help businesses meet the challenges of digital transformation.
• Innovation Showcase: SEMI will highlight microelectronics and semiconductor innovations in pre-recorded messages and product announcements.

For more details, please visit the SEMICON Europa 2022 website and connect with SEMI Europe on Twitter or LinkedIn @SEMIEurope (#SEMICONEuropa).

Press and media partners can register for free by contacting Serena Brischetto at [email protected]. 

SEMICON Europa Sponsors

• Platinum: Samsung and Tokyo Electron (TEL)
• Gold: Edwards Vacuum and JCET Group
• Silver: Agilent, centrotherm clean solutions, Evatec, Exyte, Flexciton, KLA, and SÜSS MicroTec
• Event sponsors: ASE Global; Athinia; Atotech, an MKS Brand; EBARA, EV Group (EVG); INFICON; Koh Young Europe; Lab14; Lam Research; SCREEN; time:matters; and ZEISS

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts
Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMICON Europa 2022 to Highlight Smart Mobility, Smart MedTech, Advanced Packaging, Fab Management, Materials, Sustainability and Talent