Martinez, CA—EUV Tech (EUVT), a global leader in designing and manufacturing at-wavelength EUV metrology equipment, is excited to announce the release of the FALCON Photoresist Flood Exposure Tool. As our next-generation EUV resist characterization and diagnostics tool, FALCON allows photoresist manufacturers to rapidly and accurately test EUV resist sensitivity, as well as providing patterning materials developers critical insights into exposure mechanisms.

Built upon EUV Tech’s proven resist tool technology, FALCON is a fully automated tool that supports high-throughput contrast curves on EUV-patterning materials and radiation chemistry diagnostics by integrating a wide variety of optional add-on analysis and processing modules.

Enhancing FALCON’s platform is an array of in-situ analysis and process modules, including Fourier Transform Infrared (FTIR) Spectroscopy, Atomic Mass Spectrometry, Total Electron Yield (TEY), Photo-Electron Spectroscopy (PES), environmental and vacuum bake module with additional diagnostics, and a scanner-environment exposure module.

Key to FALCON’s effectiveness is its highly uniform exposure spot size of 6 mm, supporting high-sensitivity chemical analysis and over 1,000 exposures for a 300 mm wafer in a single recipe run. Built-in data visualization tools make it possible to analyze this rich data. Combining uniformity, high configurability, and deep data collection and analysis makes FALCON a highly efficient, cost-effective tool for advanced photoresist development.

For more information on the enhanced FALCON Flood Exposure Tool or any of EUV Tech’s at-wavelength metrology tools, please visit euvtech.com.

About EUV Tech
EUV Tech enables technology advancement in the frontiers of semiconductor manufacturing and material science through the development of world-leading EUV and soft-x-ray instrumentation and techniques.

For further information, contact:
EUV Tech, Inc.
[email protected]
+1 (925) 229-4388

• Read more about EUV Tech Advances Semiconductor Manufacturing with the Launch of FALCON

Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. For details about this solution developed in late 2024 and 2025, download the case study here: Customer Success: Powertech Technology Inc. (PTI) Advances Panel Level Packaging with Nordson.

PTI, one of the world’s top OSAT (Outsourced Semiconductor Assembly and Test) companies, worked with the Nordson applications team to set up a comprehensive PLP demonstration that achieved high-quality, void-free underfill results at scale, using the industry-leading ASYMTEK Vantage® Series fluid dispensing system, equipped with the ASYMTEK IntelliJet® Jetting system. Nordson’s precision technology mitigated warpage and optimized fluid flow while decreasing cycle time by almost 30%.

PLP offers a path to managing the complexity of larger die sizes and higher-density designs while maintaining manufacturability and cost efficiency as the semiconductor industry transitions from 300-mm wafers to panels. PTI is enabling PLP applications that are designed to meet the semiconductor industry’s growing demands to serve AI, high-performance computing (HPC), and chiplet-based architectures.

Underfill has been pivotal in semiconductor packaging since the adoption of flip-chips in the 1990s. As applications have become more demanding, particularly in high-performance CPUs, GPUs, and advanced architectures like flip-chip and 2.5D/3D ICs, the importance of underfilling to enhance mechanical reliability and thermal performance has grown. Since the beginning, Nordson developed innovations for underfill processes as the industry evolved from PC board, substrate, wafer, and now panel applications.

Nordson’s distributor, Jetinn Global Equipment Ltd., supported the advancements discussed in this case study by investing in demonstration equipment and providing expert technical support.

• Read more about Nordson Electronics Solutions develops panel-level packaging solution for Powertech Technology, Inc. that achieves yields greater than 99% for underfilling during semiconductor manufacturing

Test Research, Inc. (TWSE: 3030), the leading test and inspection systems provider for the electronics manufacturing industry, is proud to announce its successful partnership with Bosch in the development of an AI visual check solution for MEMS packaging.

Bosch has recognized TRI's valuable contribution to their success in MEMS packaging in 2025 with a Certificate of Appreciation. The certificate acknowledges the successful completion of the AI visual check for MEMS packaging, highlighting the strong cooperation and partnership between the two companies.

This collaboration demonstrates TRI's expertise in AI-driven inspection solutions and its commitment to providing valuable solutions for the electronics manufacturing industry. TRI's AI-powered solutions include the AI Defect Detection, AI Smart Programming, AI Verify Host, AI training tool, AI Station, and more.

Please visit the following link to learn more about TRI's AI Solutions:
https://www.tri.com.tw/en/about/about-107-2-2.html

Learn more about the Bosch Group by following the link below:
https://www.bosch-presse.de/pressportal/de/en/company-page.html

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About Test Research, Inc. (TRI)

TRI (TWSE: 3030), offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. Learn more at http://www.tri.com.tw. For sales and service information, please write to us at [email protected] or call +886-2-2832 8918.

• Read more about TRI and Bosch Partner on AI Solution for MEMS Packaging

Stanton Chase is pleased to announce that Sundar Rajan Ramalingam has joined the firm as a Partner in North America. His addition strengthens the firm's executive search and leadership consulting capabilities for the semiconductor sector at a time of rapid transformation.

Sundar brings nearly three decades of leadership experience across manufacturing and global technology sectors. He has scaled a multi-billion-dollar global engineering division and supported the growth of several Global Capability Centers (GCCs). Within the semiconductor ecosystem, he has played a pivotal role in building and advising leadership teams across chip design, chip-to-cloud platforms, semiconductor fabs, and foundry operations.

This deep operational and strategic background gives Sundar a unique perspective on the evolving talent needs of semiconductor organizations.

"The semiconductor industry is entering a pivotal era—what I call a 'perfect leadership storm'—driven by generative AI, strategic autonomy imperatives, and breakthroughs like 3nm and advanced packaging," said Sundar. "While these trends are accelerating innovation, the industry also faces a growing talent gap. Companies need capable leaders who can navigate complexity, scale innovation, and build resilient teams. I plan to use my experience in technology and manufacturing to help semiconductor companies find executives who deliver results and foster sustainable growth."

Sundar's career spans both strategic HR leadership and general management with P&L responsibility, offering clients a rare blend of technical insight and leadership development expertise.

"Sundar fits well with our North American team and fills a specific need in our practice," said Mickey Matthews, Managing Director at Stanton Chase in North America and Chair of the Governance Committee. "His time working across borders gives him a genuine understanding of how global teams function. Blending this multicultural understanding with Sundar's deep technology products and services vertical expertise matters a lot to the clients we serve and specifically in the semiconductor space."

Jan-Bart Smits, Managing Partner at Stanton Chase Amsterdam and Global Sector Leader for Semiconductors, added: "Sundar joins us when the semiconductor industry sits at a turning point. Firms in this sector are looking for something different in their executives—people who understand both market forces and engineering details. Sundar knows this world and will further enhance our ability to serve chip makers and their suppliers."

As the semiconductor industry moves into a new chapter—marked by AI-driven demand, geopolitical shifts, and the race toward next-gen nodes—Sundar's appointment signals Stanton Chase's commitment to helping clients lead with confidence and clarity.

Sundar holds an MBA from XLRI Jamshedpur (India) and completed executive education programs, including the Chief Human Resource Officer Program at Wharton, University of Pennsylvania.

He will serve clients from Stanton Chase offices in Baltimore and Raleigh, USA, as well as Bangalore, Hyderabad, and Chennai, India—locations near semiconductor business centers.

Click here to learn more about Sundar.

Click here to learn more about Stanton Chase's semiconductor expertise.

About Stanton Chase

Stanton Chase ranks among the top global retained executive search firms with more than 76 offices in 45 countries and a worldwide team of senior consultants. Stanton Chase serves clients across multiple industry specialties and places C-suite executives, senior managers, and board members for companies ranging from global corporations to emerging businesses. Stanton Chase belongs to the Association of Executive Search and Leadership Consultants (AESC), adhering to the highest industry standards of professionalism and ethics.

• Read more about Stanton Chase Welcomes Sundar Rajan Ramalingam as Partner in the Semiconductor Practice

[March 26, 2025 – Singapore] Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join SEMICON SEA held at the SANDS Expo and Convention Centre in Singapore from May 20 - 22, 2025. Visit booth #L2632 to learn about AI-powered AOI solutions for Advanced WLP/PLP and SEMI Back-End Package processes.

TRI will be exhibiting the new Wafer Inspection Platform, TR7950Q SII, featuring a High-resolution 2.5 μm 25MP camera and the TSV Metrology Module. The TR7950Q SII can perform Wafer Macroscopic 3D Inspection and micro measurement metrology. The TR7950Q SII can inspect Advanced WLP, Wafer Frame, Patterned Wafer, Wafer Bumping, WLCSP, through-silicon via (TSV), and more. The TR7950Q SII can measure TSV at ultra-high speeds, measuring sensing TSV depth, trench depth, oxide, nitride, PR, and PI film thickness.

Additionally, TRI will showcase the TR7007Q SII-S, the high-accuracy 3D SEMI SPI for precise solder measurements, supporting applications such as Mini-LED, C4 bumps (~100 μm Ø), and 008004 paste inspection. The lineup will also feature an X-ray Inspection Demo Station.

Join us at booth #L2632 at SEMICON SEA 2025 to discover TRI's cutting-edge SEMI inspection and metrology solutions!

• Read more about Advanced WLP/PLP and Back-End Inspection at SEMICON SEA 2025

PDF Solutions, Inc. (Nasdaq: PDFS) today announced it has entered into a definitive agreement to acquire secureWISE, LLC, the most widely used secure, remote connectivity solution in the semiconductor manufacturing equipment industry, from Telit IOT Solutions Inc.

The secureWISE global network enables equipment manufacturers to bring up new equipment faster, provide operational support, and maximize the value derived from the equipment customers’ investments. It is currently used by over 100 equipment vendors to connect and control their tools located in over 190 semiconductor fabs and to manage the exchange of multiple petabytes of data annually.

PDF Solutions empowers semiconductor companies to maximize their manufacturing effectiveness. The PDF Solutions platform breaks down data silos to enable engineers to uncover critical relationships across manufacturing and design, resulting in better process control, product screening, and equipment operations.

As the semiconductor industry becomes more globally distributed, and as advanced devices rely on the integration of multiple chiplets into a single package, more collaboration and integration are required across the semiconductor industry. This collaboration needs to be executed securely with each participant controlling access to its intellectual property.

Today, secureWISE customers have built applications on top of the secureWISE network to deliver equipment analytics. PDF Solutions expects the acquisition to accelerate equipment makers’ ability to derive value from equipment data by enabling them to leverage PDF Solutions’ Exensio analytics software.

Beyond enabling equipment vendors to build equipment analytics at foundries, the acquisition of secureWISE is expected to dramatically expand the capability of PDF Solutions’ secure DEX OSAT network by allowing equipment makers, fab operators, and fabless companies to collaborate to optimize chip manufacturing and test.

“This acquisition extends PDF Solutions analytics for equipment makers and fabless to the factory manufacturing level, which allows them to generate value from AI,” said Dr. John Kibarian, President, CEO and co-founder of PDF Solutions. He continued, “We provide the leading analytics platform for semiconductor manufacturing, and with secureWISE, the PDF Solutions platform will also be able to help members of the semiconductor ecosystem collaborate through a secure, direct connection and control the manufacturing process down to the production equipment.”

Mike Dempsey, Vice President of secureWISE LLC, said, “We believe PDF Solutions is the ideal partner to accelerate secureWISE’s evolution, ensuring we remain at the forefront of industry trends and ahead of our customers’ needs. This acquisition will strengthen our ability to anticipate, pioneer, and integrate a far richer suite of security, collaboration, and analytics capabilities into our platform. As data exchange and collaboration become increasingly relevant to the semiconductor industry, this acquisition will better position secureWISE to deliver maximum long-term benefit to its customers who have invested in our platform.”

Under the terms of the definitive agreement, PDF Solutions will pay a cash amount of $130.0 million, subject to customary purchase price adjustments. The purchase price will be funded by a combination of cash on hand and $70M of new bank debt. The acquisition is subject to certain closing conditions and is expected to close in the first calendar quarter of 2025.

TD Securities (USA) LLC acted as financial advisor and Latham & Watkins LLP acted as legal advisor to PDF Solutions.

Updated Financial Outlook
John Kibarian, CEO and President of PDF Solutions, said, “Assuming the transaction closes in the first quarter of 2025, and with purchase accounting adjustments, we would expect to achieve a full year 2025 revenue growth rate between 21% to 23% on year-over-year basis. Given that, we also expect to achieve 2025 gross margin in line with our corporate gross margin, our target model 20% operating margin, and for EPS to be slightly accretive.”

Conference Call
PDF Solutions will discuss this announcement on a live conference call beginning at 3:00 p.m. Pacific Time / 6:00 p.m. Eastern Time today. To participate in the live call, analysts and investors should pre-register at: https://register.vevent.com/register/BI9abfc7eadb2245c5ba00c59922fe6c87.

Registrants will receive dial-in information and a unique passcode to access the call. We encourage participants to dial into the call ten minutes ahead of the scheduled time. The teleconference will also be webcast simultaneously on the Company’s website at https://ir.pdf.com/webcasts. A replay of the conference call webcast will be available after the call on the Company’s investor relations website. A copy of this press release will also be available on PDF Solutions’ website at News & PR Archives - PDF Solutions following the date of this release.

Forward-Looking Statements
The statements in this press release regarding the expected future financial results, benefits and synergies of the secureWISE acquisition on PDF Solution’s product offerings, and the expected closing of the secureWISE acquisition are forward looking and are subject to future events and circumstances. Actual results could differ materially from those expressed in these forward-looking statements. Risks and uncertainties that could cause results to differ materially include risks associated with: uncertainties with respect to the timing of the closing of the proposed transaction, including when and whether all conditions to closing will be satisfied; the failure of expected benefits from the proposed transaction to be realized or to be realized within the expected time period; uncertainties with respect to the future performance of secureWISE following an acquisition by PDF Solutions; PDF Solution’s ability to integrate secureWISE and its product and service offerings, the cost and schedule of new product development; continued adoption of the PDF Solution’s and secureWISE’s solutions by new and existing customers; the fact that operating costs and business disruption may be greater than expected following the public announcement or consummation of the proposed transaction; potential adverse reactions or changes to business or employee relationships, including those resulting from the public announcement or consummation of the proposed transaction; the incurrence of significant transaction costs related to the proposed transaction; unknown or understated liabilities of secureWISE; and other risks set forth in PDF Solutions’ periodic public filings with the Securities and Exchange Commission, including, without limitation, its Annual Reports on Form 10-K, most recently filed for the year ended December 31, 2023, Quarterly Reports on Form 10-Q, and Current Reports on Form 8-K and amendments to such reports. The forward-looking statements made herein are made as of the date hereof, and PDF Solutions does not assume any obligation to update such statements nor the reasons why actual results could differ materially from those projected in such statements.

About PDF Solutions
PDF Solutions (Nasdaq: PDFS) provides comprehensive data solutions designed to empower organizations across the semiconductor and electronics industry ecosystem to improve the yield and quality of their products and operational efficiency for increased profitability. The Company’s products and services are used by Fortune 500 companies across the semiconductor and electronics ecosystem to achieve smart manufacturing goals by connecting and controlling equipment, collecting data generated during manufacturing and test operations, and performing advanced analytics and machine learning to enable profitable, high-volume manufacturing.

Founded in 1991, PDF Solutions is headquartered in Santa Clara, California, with operations across North America, Europe, and Asia. The Company (directly or through one or more subsidiaries) is an active member of SEMI, INEMI, TPCA, IPC, the OPC Foundation, and DMDII. For the latest news and information about PDF Solutions or to find office locations, visit: https://www.pdf.com.

Headquartered in Santa Clara, Calif., PDF Solutions also operates worldwide in Canada, China, France, Germany, Italy, Japan, Korea, Sweden, and Taiwan. For the Company’s latest news and information, visit https://www.pdf.com.

About secureWISE
The secureWISE platform enables secure and controlled remote connectivity, collaboration and service enablement in the semiconductor industry. The secureWISE suite of products and services is designed to give OEM suppliers role-based, real-time and on-demand access to their equipment that is installed at the production facilities of their customers, to deliver valuable operational insights, mission-critical performance, substantial time and cost savings, and new service revenue opportunities. As the only remote access tool built around the ISMI guidelines, secureWISE is installed in over 90% of the world’s 300mm semiconductor fabs and also numerous solar and chemical plants across the globe. https://www.telit.com/iot-platforms-overview/telit-securewise/

PDF Solutions and the PDF Solutions logo are trademarks or registered trademarks of PDF Solutions, Inc. and/or its subsidiaries in the United States and other countries. Other trademarks used herein are the property of their owners.

• Read more about PDF Solutions to Acquire secureWISE to Expand the Reach of its Semiconductor Manufacturing Data Platform

–– Breker Verification Systems today confirmed its RISC-V SystemVIP library components and test suite synthesis product portfolio is deployed in more than 15 commercial RISC-V semiconductor design projects, while its RISC-V products are used in several large-scale academic projects.

Large, complex application processor projects that range from data center, automotive and AI accelerator to consumer device applications rely on Breker’s RISC-V CoreAssurance™, SoCReady™ and Cache Coherency SystemVIPs across the RISC-V core and SoC verification stack. Breker executives are heading working groups in the evolving RISC-V International certification program.

“Breker Verification Systems’ products provide significant advantages on top of standard verification solutions, especially for the most challenging verification problems,” affirms Ty Garibay, President of Condor Computing. “Applying these approaches to RISC-V processor design was a natural extension, and leveraging this technology in the development of our high-performance CPU IP is already paying dividends.”

Breker’s test suite synthesis solution and SystemVIP library allow for enhanced verification coverage while significantly reducing test development time for complex scenarios. The verification of processor cores that leverage the RISC-V Open Instruction Set Architecture (ISA) requires testing specialized, unique scenarios. Breker’s RISC-V synthesized SystemVIPs make use of AI Planning Algorithms, cross-test multiplication and concurrent, multi-threaded scheduling provide rigorous testing from randomized instructions to unique coherency, paging and other complex system integration validation.

“MIPS RISC-V cores represent the state-of-the-art in advanced application processor solutions,” notes Steve Mullinnix, Senior Director, Design Verification, MIPS. “Working with Breker, we are able to verify complex, compounded scenarios unique to these devices quickly and efficiently.”

Breker is cooperating with academic institutions including Harvey Mudd College in Claremont, Calif., and Oklahoma University, developers of the Wally open-source processor core, and ETH Zurich in Zurich, Switzerland, that produced the Ariane processor core. Breker has provided application-level tests for these institutions while collaborating on next-generation verification environments.

“Breker is at the forefront of RISC-V verification,” comments David Harris, the Harvey S. Mudd Professor of Engineering Design. “It’s first-rate SystemVIP synthesis platform is a breakthrough verification tool and an effective problem-solver for our RISC-V programs.”

Additionally, executives from Breker are leading two working groups within RISC-V International’s Certification Steering Committee to develop a program to provide a quality stamp based on extensive, independent architectural testing.

“The rate of adoption of our tools is remarkable and supports our belief that test suite synthesis is a must-have tool for every RISC-V design project,” says David Kelf, Breker’s Chief Executive Officer. “Our efforts to build more features will continue as will our willingness to partner with leading project groups and industry organizations helping to cement the RISC-V ISA place across the semiconductor industry.”

Breker’s RISC-V CoreAssurance, SoCReady and SystemVIP
Breker unveiled RISC-V CoreAssurance, SoCReady and SystemVIP in June 2024, along with a complete range of tests for the entire RISC-V core verification stack. Starting with randomized instruction generation and microarchitectural scenarios, SystemVIP includes unique tests that check all integrity levels ensuring the smooth application of the core into an SoC, regardless of architecture, and the evaluation of possible performance and power bottlenecks and functional issues.

The SystemVIP can be extended for custom RISC-V instructions to be fully incorporated into the complete test suite crossed with other tests. It is self-checking and incorporates debug and coverage analysis solutions and can be ported across simulation, emulation, prototyping, post-silicon and virtual platform environments.

Breker’s SystemVIP is used for a variety of complex RISC-V core designs, including system coherency in a multicore SoC integrity test sets, high-coverage core test, power domain switching, hardware security access rules, and automated packet generation.

Breker at DVCon U.S. February 24-27 in San Jose
Breker will exhibit and demonstrate its RISC-V CoreAssurance and SoCReady SystemVIP and Trek Test Suite Synthesis solutions at DVCon U.S. February 24-26 at the DoubleTree Hotel in San Jose, Calif.

It will present a workshop titled “Complex Verification Example: RISC-V MMU Verification of Virtualization and Hypervisor Operation for CPU and SOC platforms” Monday, February 24, from 3:30 p.m. until 5 p.m. in the Oak Room.

To arrange a demonstration or private meeting, send email to [email protected].

About Breker Verification Systems
Breker Verification Systems solves complex semiconductor challenges across the functional verification process from streamlining UVM-based testbench composition to execution for IP block verification, significantly enhancing SoC integration and firmware verification with automated solutions that provide test content portability and reuse. Breker solutions easily layer into existing environments and operate across simulation, emulation and prototyping, and post-silicon execution platforms. Its Trek family is production-proven at leading semiconductor companies worldwide and enables design managers and verification engineers to realize measurable productivity gains, speed coverage closure and easy verification knowledge reuse. As a leader in the development of the Accellera Portable Stimulus Standard (PSS), privately held Breker has a reputation for dramatically reducing verification schedules in advanced development environments. Case studies that feature Altera (now Intel), Analog Devices, Broadcom, IBM and other companies leveraging Breker’s solutions are available on the Breker website.

Engage with Breker at:
Website: www.brekersystems.com
Twitter: @BrekerSystems
LinkedIn: https://www.linkedin.com/company/breker-verification-systems/
Facebook: https://www.facebook.com/BrekerSystems/

• Read more about Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification