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San Diego, CA and Hsinchu, TaiwanOctober 27, 2025 ElevATE Semiconductor, a leader in high-density, low-power, pin electronics (PE) and device power supplies (DPS), voltage/current sources (VI), and parametric measurement units (PMU) solutions, is excited to announce the opening of its first office in Hsinchu, Taiwan. The new location will strengthen support for customers and partners across Asia through localized engineering expertise and closer collaboration. 

The facility will serve as a regional hub for sales, applications, and quality and failure analysis engineering, enabling ElevATE to deliver direct and high-speed support to its growing customer base. ElevATE’s corporate headquarters and production operations will remain in San Diego, ensuring customers worldwide continue to receive the same quality, reliability, and responsiveness they rely on today.  

Located in the heart of Taiwan’s semiconductor ecosystem, the Hsinchu office underscores ElevATE’s commitment to building close relationships with regional customers, accelerating support, and driving adoption of its advanced test IC solutions. 

“Opening an office in Hsinchu is an important step for us,” said Johnny Chung, Asia Sales Manager at ElevATE Semiconductor. “It gives us a stronger local presence and lets us work closely with customers in their time zone. By adding this office to the resources we already have in Asia, we can respond faster and support our partners more effectively.” 

As ElevATE expands its geographic footprint, the company also plans to grow its Taiwan team with key hires in applications and quality and failure analysis engineering. These roles will complement its U.S.-based teams to enhance global coverage and help drive adoption of ElevATE’s next generation test IC solutions worldwide. 

This expansion is part of ElevATE’s long-term strategy to strengthen its global presence and invest in the future of semiconductor test technology, empowering customers to bring next-generation test systems and instruments to market with confidence.  

About ElevATE Semiconductor ElevATE is a leader in high-performance IC design for the automated test equipment (ATE) industry. The company is committed to supporting the semiconductor and system test community by providing advanced integrated circuits (ICs) that address the complex challenges of ATE. With a focus on designing efficient, high-density solutions, ElevATE aims to reduce the overall cost of testing for its customers, both now and in the future. For more information, visit www.elevatesemi.com 

Nijmegen, October 20, 2025 – Chip Integration Technology Center (CITC) will become part of TNO. This strategic move marks a significant step toward ensuring the long-term continuity and stability of CITC’s research and operations. The integration emphasizes TNO’s ambition to take a leading position in the innovation of chip packaging technologies and strengthen the regional semiconductor ecosystem in Nijmegen.

“In the coming years, TNO aims to play a key role in the development of advanced chip packaging in the Netherlands,” says Arnaud de Jong, director of High Tech Industry at TNO. “By integrating CITC into TNO, we can intensify and expand our research efforts. We also contribute to the further development of Lifeport in Nijmegen as a strong, future-proof semiconductor ecosystem.” With the investment in CITC, TNO connects chip technology activities between Nijmegen and other semiconductor hubs such as Eindhoven.

Advanced chip packaging
CITC was founded in 2019 by TNO and Delft University of Technology (TU Delft), among others, as an independent innovation center for advanced chip packaging technology. Within an ecosystem of companies, research institutions and educational organizations, CITC has developed into a broad R&D hub that collaborates on technological breakthroughs in advanced chip packaging.

“CITC’s integration into TNO marks a noteworthy moment for CITC. This step underscores our shared vision for the future of chip integration and packaging technology,” says Jeroen van den Brand, general manager of CITC in Nijmegen. “This provides room for growth, accelerates innovation, and strengthens CITC’s international position as a center of expertise for chip packaging.”

Strategic choice for Nijmegen
CITC’s integration into TNO will formally take effect on January 1, 2026. CITC will become part of TNO’s High Tech Industry business unit and will remain located at the Noviotech Campus in Nijmegen. Toni Versluijs, chairman of the CITC Supervisory Board: “CITC continues on its current course. For the Supervisory Board, it is essential that, with TNO’s ambition and investment, we secure continuation of the CITC activities, while building on the existing talent and technology and give CITC room to grow further.”

Lucas van Vliet, member of the CITC Supervisory Board on behalf of TU Delft: “The collaboration between TU Delft and TNO within CITC will change form as of January 1 but remains as strong as ever. TU Delft believes in the importance and growth potential of chip packaging and sees incorporating CITC into a strong organization like TNO as an opportunity to further accelerate innovation in chip technology.”

- ENDS -

About CITC
CITC is a non-profit, joint innovation center specializing in heterogeneous integration and advanced chip packaging technology. With the aim of bridging the gap between academia and industry, CITC has created an effective ecosystem where companies, research and educational institutions collaborate. CITC was founded in 2019 with strategic partners TNO and Delft University of Technology and is supported by the province of Gelderland and Nijmegen municipality. Located on Noviotech Campus Nijmegen, CITC is perfectly situated in the heart of the Dutch semiconductor industry.
www.citc.org

About TNO
TNO is the largest independent research and technology organization in the Netherlands and one of the largest in the EU. We innovate, investigate, and orchestrate, collaborating closely with governments, universities and the private sector. We inform government on policies and empower evidence-based decision-making through rigorous investigations, cutting-edge scientific insights, and reliable measurements. By building national and international consortia and ecosystems, we drive technological and methodological breakthroughs that help to realise a secure, sustainable, healthy, and digital society, and strengthen the earning power of the Dutch economy.
www.tno.nl/en/

Contact
Christian Ketelaars, Communications Manager
E [email protected]
M +31 (0)6 48 15 42 92

Breker Donates Advanced Test Suite Components to RISC-V International for Use in Future Compliance Activities

• Donation includes open-source system integrity tests for core and SoC certification
• Unique Breker tests complements existing test sets
• Breker’s RISC-V SystemVIP will be demonstrated at booth #P4 during RISC-V Summit North America 2025

SAN JOSE, CALIF. –– October 16, 2025––Breker Verification Systems today announced a donation to RISC-V International of a subset of its RISC-V advanced test suite developed through its work with more than 20 RISC-V core producers.

The donation is designed to be complementary to the existing Architectural Compliance Test (ACT) and ongoing ISA compliance activities, consisting of unique tests not available from other sources.

Breker provides test suites for the complete verification of RISC-V cores and SoCs from detailed microarchitectural analysis to advanced system integrity validation. The radonation will consist of a subset of these tests to target ISA compliance. The test donation will cover both core and SoC certification and will include, but is not limited to, coherency, hypervisor, vectors, advanced interrupt architecture, IOMMU and other scenarios. Each component is designed to complement existing tests.

“Breker is now working with over 20 commercial entities and other organizations to verify their RISC-V cores, providing us with unique experience of the myriad of unusual verification issues inherent in these processors,” says David Kelf, Breker’s CEO. “We are giving back to the RISC-V community by providing a subset of these tests, open source, that can target ISA compliance and for other purposes.”

The announcement of the donation coincides with the RISC-V Summit North America Tuesday, October 21, through Thursday, October 23, at the Santa Clara Convention Center in Santa Clara, Calif. As a Platinum Sponsor, Breker will exhibit in Booth #P4 and offer five presentations as part of the RISC-V Summit program.

“At RISC-V International, we greatly value the expertise of the Breker team and the contributions they have made to ongoing ISA compliance work,” remarks Andrea Gallo, RISC-V International’s CEO. “I am looking forward to Breker’s donation and the impact it can have in complementing and extending our existing ACT test suites.”

Breker’s donation provides alignment with RISC-V International programs. This will provide value to the company’s customers, as well as the RISC-V designer community, by aligning Breker’s full RISC-V verification test suite with RISC-V test developments.

In addition to existing test suites and generators, which are focused on random instruction generation for instruction set architecture testing, with SystemVIPs, Breker has been able to significantly extend testing to advanced system-level integrity. Using test suite synthesis technology, Breker is able to provide a high degree of coverage by driving cross functional stress verification and unpredictable corner case discovery. The donation will include tests generated using test suite synthesis.

David Kelf and Adnan Hamid, Breker’s Executive President and CTO, were elected Chairperson of the Requirements Working Group and Vice-Chairperson of the Test Plan Working Group, respectively, in the RISC-V International Certification Steering Committee.

Breker at RISC-V Summit North America 2025
Breker will demonstrate its RISC-V CoreAssurance and SoCReady SystemVIPs and Trek Test Suite Synthesis solutions at RISC-V Summit North America, Tuesday, October 21 through Thursday, October 23, at the Santa Clara Convention Center.

Presentations featuring Breker executives include:
Member Day: “Framework for RISCV Certification—Software, Hardware and Systems”
Nambi Ju, Lyle Technologies, LLP
Tuesday at 4 p.m. in Grand Ballroom H (Level 1)

Demo: “RISC-V AIA Expanding Interrupts: Applications, Implementation and Verification”
Adnan Hamid
Wednesday at 1 p.m.
Exhibit Hall A, Demo Theater

“RISC-V System Level Certification from Verification Foundations”
Adnan Hamid
Wednesday at 3:15 p.m.
Theater (Level 2)

Lightning Round: “Leveraging AI to understand the RISC-V ISA Specification”
Dave Kelf and Nambi Ju
Wednesday at 4:15 p.m.

“Unleashing ML Processing Power Through RISC-V Vectors: Applications, Implementation and Verification”
Brian Baker, Solutions Architect
Thursday at 2:35 p.m.
Grand Ballroom G (Level 1)

To arrange a demonstration or private meeting, send email to [email protected].

About Breker Verification Systems
Breker Verification Systems solves complex semiconductor challenges across the functional verification process from streamlining UVM-based testbench composition to execution for IP block verification, significantly enhancing SoC integration and firmware verification with automated solutions that provide test content portability and reuse. Breker’s solutions include a SystemVIP library of scenarios for RISC-V and Arm, core and SoC testing, coherency, security and other critical areas. Breker solutions easily layer into existing environments and operate across simulation, emulation, prototyping, and post-silicon execution platforms. Its Trek family is production-proven at leading semiconductor companies worldwide and enables design managers and verification engineers to realize measurable productivity gains, speed coverage closure and easy verification knowledge reuse. As a leader in the development of the Accellera Portable Stimulus Standard (PSS), privately held Breker has a reputation for dramatically reducing verification schedules in advanced development environments. Case studies that feature Analog Devices, Broadcom, IBM and other companies leveraging Breker’s solutions are available on the Breker website.

Engage with Breker at:
Website: www.brekersystems.com
Twitter: @BrekerSystems
LinkedIn: https://www.linkedin.com/company/breker-verification-systems/
Facebook: https://www.facebook.com/BrekerSystems/

TrekSoC, TrekSoC-Si, RISC-V CoreAssurance SystemVIP and RISC-V SoCReady SystemVIP are registered trademarks of Breker Verification Systems. Breker Verification Systems acknowledges trademarks or registered trademarks of other organizations for their respective products.

Via Automation Debuts Agentic AI-Based Platforms for Smart Manufacturing at SEMICON West

• Set to revolutionize semiconductor manufacturing operations, paving the way for self-healing factories and resilient supply chains
• Demos of Via Connect and Via Co-Pilot available during SEMICON West October 7 to October 9 in Booth #7438
• Via Automation “Developing Explainable Digital Twins and Connecting to Via CoPilot Agents for Autonomous Tool Operations” at Smart Manufacturing Theater

FREMONT, CALIF.––September 23, 2025––Via Automation today unveiled Via Connect and Via Co-Pilot, Agentic AI-based platforms that combine edge data integration with AI-driven human collaboration to revolutionize enterprise manufacturing operations and pave the way for self-healing factories and resilient supply chains.

Demonstrations of Via Connect and Via Co-Pilot will be available during SEMICON West October 7 to October 9 at the Phoenix Convention Center in Phoenix, Ariz.

“Predictive maintenance isn’t just about preventing breakdowns, it’s about enhancing yield and enabling smarter, safer and more efficient industrial operations,” remarks Nitin Parekh, CEO at Via Automation. “With Via Connect and Via Co-Pilot, enterprises can move beyond pilot projects into scalable, trusted and ROI-positive predictive maintenance programs.”

Introducing AI-Powered Industrial Automation
Unplanned equipment downtime cost manufacturers more than $1.5 trillion globally per year, a problem that grows more expensive annually. The cost of a single hour of downtime has surged by 50% in just two years.

Via Automation’s Via Connect and Via Co-Pilot powers real-time, AI-driven decisions across the factory floor, enhancing efficiency, optimizing operations, reducing unplanned downtime, elevating performance across all areas.

Via Connect
Traditional solutions rely on dashboards and complex visualizations that don't solve the root problem. Via Connect seamlessly offers data integration at the edge by acting as the digital fabric between assets, IoT sensors and enterprise systems. Via Connect can be connected into digital twin models to provide holistic monitoring capabilities as a software development kit (SDK) for equipment vendors to integrate with their equipment.

With its edge-ready processing capabilities, Via Connect can detect low-latency anomalies directly at the factory floor and integrates with manufacturing execution systems (MES), enterprise resource planning (ERP) systems and cloud platforms including AWS, Azure and Databricks using out-of-the box connectors.

For predictive maintenance, it ensures unified data collection of real-time vibration, temperature and process signals streamed from machines and IoT endpoints. Using Via Connect, predictive models can access clean, contextualized data without integration bottlenecks, one of the biggest hurdles in scaling predictive maintenance initiatives.

Via Co-Pilot
Where Connect enables data orchestration, Via Co-Pilot elevates operational intelligence, acting as a decision assistant to unite humans with AI tools for smarter decision making.

Via Co-Pilot turns predictive maintenance from a “black-box algorithm” into a trusted co-worker—accelerating adoption and building operator confidence by providing AI-Driven insights for warnings of equipment degradation using machine learning models trained on sensor data. Its diagnostics are easily explainable, interpretable and highlight root causes, such as bearing wear or lubrication breakdown. It enables collaborative workflows for engineers, operators and managers to interact with AI that delivers recommendations, validate insights and trigger automated work orders

It also offers continuous learning opportunities with its feedback loops that improve model accuracy over time and adapt to new operating conditions.

Via Automation can AI enable any equipment or fab with Via Connect and Via Co-pilot. An intuitive interface gives manufacturing teams the ability to build and deploy custom workflows without deep AI expertise and focus on keeping their equipment running smoothly and efficiently.

Early results show that Via Connect and Via Co-Pilot together reduce unplanned downtime by between 30-40% and maintenance costs by between 15-20%. They extend asset life by about 25% and improve operator safety and compliance reporting.

Via Automation at SEMICON West October 7-9 in Phoenix, Ariz.
Via Automation will exhibit and demonstrate its Connect and Co-Pilot at SEMICON West in Booth #7438 Tuesday, October 7, through Thursday, October 9, at the Phoenix Convention Center in Phoenix, Ariz.

Kiran Karunakaran, Via’s CTO, will present “Developing Explainable Digital Twins and Connecting to Co-Pilot Agents for Autonomous Tool Operations” Wednesday in the Smart Manufacturing Pavilion Theater.

To arrange a demonstration or private meeting, send email to [email protected].

About Via Automation
Via Automation is a pioneering technology company that specializes in creating advanced automation solutions designed to optimize and transform fab operations for advanced semiconductors. Leveraging cutting-edge AI and machine learning technologies, it develops intuitive, scalable and robust tools aimed at enhancing productivity, efficiency and data-driven decision-making. Via Automation’s commitment to innovation and customer-centric solutions make it a leader in the fab and equipment automation space, driving progress and operational excellence for improving operations and maintenance with AI.
Engage with Via Automation at:
Website: Getvia.ai/
Email: [email protected]
LinkedIn: https://www.linkedin.com/company/getvia/

For more information, contact:
Nanette Collins
Public Relations for Via Automation
[email protected]

PDF Solutions Secures Landmark Contract with Global IDM Customer
Large 2025 Contract Validates High-Volume Manufacturing Strategy

PDF Solutions, Inc. (Nasdaq: PDFS) today announced a landmark contract signing: a significant multi-year agreement to expand a prior contract and deploy eProbe® tools, Characterization Vehicle® infrastructure, and associated Exensio® analytics software across multiple high-volume manufacturing facilities of a major global semiconductor manufacturer.

Breakthrough Technology Scales to Mass Production

PDF Solutions' eProbe technology delivers contactless testing of 3D semiconductor structures using electron beam, optimized for each wafer's specific design characteristics. This agreement encompasses multiple eProbe systems with deployment in 2025, supported by PDF Solutions' comprehensive software suite for machine optimization and results analysis.

The contract marks a pivotal milestone that validates PDF Solutions' strategic vision and demonstrates the critical role of eProbe technology in both advanced node development and high-volume manufacturing.

Integration of Process characterization, Design and in-line Fabrication data

PDF Solutions combines the eProbe DirectScan™ application with Characterization Vehicle test chips and Exensio analytics software to enable faster yield learning in high-volume manufacturing environments.

This landmark contract validates the approach of integrating process characterization data with design layout data and in-line fabrication data to enhance detectability to ppb levels to accelerate root cause for yield diagnosis and variability control.

Secure Connected Solutions Drive Value

PDF Solutions will deploy eProbe tools and associated software at the Foundry’s manufacturing sites, using PDF Solutions’ secureWISE® network to provide secure remote equipment support and maintenance. This deployment exemplifies PDF Solutions' strategic vision: creating a cross-industry analytics and collaboration platform that connects key players in the semiconductor ecosystem.

Comprehensive connectivity is essential for achieving faster yield ramps and delivering on the promise of AI in semiconductors. To successfully implement AI solutions, the industry needs automated connections between data sources, tools, and enterprise software systems across the entire semiconductor supply chain.

About PDF Solutions
PDF Solutions (Nasdaq: PDFS) provides comprehensive data solutions designed to empower organizations across the semiconductor and electronics industry ecosystem to improve the yield and quality of their products and operational efficiency for increased profitability. The Company’s products and services are used by Fortune 500 companies across the semiconductor and electronics ecosystem to achieve smart manufacturing goals by connecting and controlling equipment, collecting data generated during manufacturing and test operations, and performing advanced analytics and machine learning to enable profitable, high-volume manufacturing.

Founded in 1991, PDF Solutions is headquartered in Santa Clara, California, with operations across North America, Europe, and Asia. The Company (directly or through one or more subsidiaries) is an active member of SEMI, INEMI, TPCA, IPC, the OPC Foundation, and DMDII. For the latest news and information about PDF Solutions or to find office locations, visit https://www.pdf.com.

Headquartered in Santa Clara, California, PDF Solutions also operates worldwide in Canada, China, France, Germany, Italy, Japan, Korea, Sweden, and Taiwan. For the Company’s latest news and information, visit https://www.pdf.com.

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Join us for an insightful webinar as we present the findings from the 2025 Semiconductor Supply Chain Survey, a collaborative effort between the SEMI Supply Chain Management initiative and McKinsey & Company.

The annual survey aims to establish benchmarks for operational agility metrics, covering the entire value chain from material suppliers to OEMs, offering a comprehensive view of the landscape. New this year are additional insights on trends in LTAs and organizational supply chain management capabilities

During this webinar, we will share results from the survey uncovering key trends, challenges, and opportunities within the semiconductor supply chain. By attending, you'll gain valuable insights to benchmark your organization against peers, identify areas for improvement, and course-correct more effectively. Please contact us if you like to learn about how your company can participate in the SCM initiative.

United States

SCM

Join us for a webinar highlighting the 2025 Semiconductor Supply Chain Survey results, conducted by SEMI SCM initiative and McKinsey & Company. Gain fresh insights into operational agility, LTAs, and SCM capabilities across the value chain. Discover key trends, challenges, and opportunities to benchmark your organization and strengthen supply chain resilience.

Choose your session:

9:00 am - 10:00 am Off Add to Calendar 2025-09-23 09:00:00 2025-09-23 10:00:00 2025 Semiconductor Supply Chain survey: Insights for strategy and capabilities Join us for a webinar highlighting the 2025 Semiconductor Supply Chain Survey results, conducted by SEMI SCM initiative and McKinsey & Company. Gain fresh insights into operational agility, LTAs, and SCM capabilities across the value chain. Discover key trends, challenges, and opportunities to benchmark your organization and strengthen supply chain resilience.Choose your session:US/EU: 9:00 AM – 10:00 AM PT [ Register Now ]Asia/US: 5:00 PM – 6:00 PM PT [ Register Now ] United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles

Speakers

 

Henry Marcil

Partner

McKinsey & Company

Bio: Leader in McKinsey’s Advanced Industries Practice, focused on semiconductors n and key end markets (e.g., high tech)

Leads McKinsey’s Resiliency and Geopolitics service line in Semiconductor

 

Kushal Jolapara

Engagement Manager

McKinsey & Company

Bio: Manager in McKinsey's Operations practice, with a focus on product development and procurement service lines

Leads Supply Chain studies for Advanced Industries clients including Aerospace, Auto and Semiconductors

Dan Peacock

Engagement Manager

McKinsey & Company

Bio: Manager in McKinsey’s Operations Practice, focused on procurement and capital projects

Leads Operations projects at Foundries, IDMs, and equipment clients

 

Event Contact:

Krish Dharma

[email protected]

Agenda

•    Lead times throughout the semiconductor value chain
•    Landscape and trends in purchasing agreements and LTAs
•    Demand forecasts, backlogs, and end markets
•    Market outlook, opportunities, and threats
•    New for 2025: Organizational capabilities in supply chain management

Event format
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Overview
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Registration for the Global Executive Summit is closed.  Please contact Heidi Hoffman at [email protected] with any questions.  

Belgium France Germany India Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam 360x317 GES25 Executive

SEMI Japan has included the Okura Hotel and 3 other hotels convenient to the Okura in the Hotel Block for SEMICON Japan - taking place December 17-19 at Tokyo Big Sight.  View the hotels and rates HERE.

Google Link
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Building on the foundational work of the SEMI Sustainability Climate Consortium and the 2025 Global Climate Summit Workshops (GCSW), this closed-door summit is designed to shift our industry from alignment to action. We are convening a select group of key Executive decision makers & senior leaders from fabs, fabless companies, hyperscalers, and key suppliers and energy partners to: 

  • Showcase and accelerate progress on priority climate initiatives: Abatement, Gas Substitution, Green Materials, and Energy
  • Define clear deliverables and next-phase commitments that unlock scale and momentum
  • Strengthen executive collaboration to remove barriers, share ownership, and drive measurable results

This Summit is not about what we could do — it’s about what we will do, and who will lead.

Click here for the Executive Briefing outlining the event objectives, and the action pathways and methods of engagement for all attendees.  Plan ahead on how presence can shape outcomes that accelerate our industry's decarbonization.

Okura Hotel
Tokyo
Japan

Monday, December 15, 2025

9:00 am - 9:20 am

Coffee & Registration

9:25 am - 9:30 am
 Masahiko (Jim) Hamajima - President, SEMI Japan
Jim Hamajima
President
SEMI Japan

9:30 am - 9:45 am
Ajit Manocha, SEMI
Ajit Manocha
CEO & President
SEMI
Carolin Seward, Google
Carolin Seward
VP of Custom Silicon Sourcing and Operations
Google

GES Opening

9:45 am - 10:25 am
Carolin Seward, Google
Moderator
Carolin Seward
Google
Jinman Han
Jinman Han
President
Samsung Foundry
Jens Liebermann
Jens Liebermann
Senior VP of Global Business
BASF
Sundeep Bajikar
Sundeep Bajikar
Corp. VP Head of Corp Strategy
Applied Materials
Sam Naffziger
Sam Naffziger
SVP & Fellow of Product Technology Architecture
AMD

Fireside Chat: Bending the Curve of Emissions Through Industry Collaboration

Join senior executives from Apple, Samsung Foundry, BASF and Applied Materials, for a discussion on the partnerships required to meaningfully bend the curve towards decarbonization. In an industry already operating under tremendous constraints, what are the lower hanging fruits that are ripe for intentional, precompetitive collaboration? And what can be solved independently?

10:25 am - 10:40 am
Sam Naffziger
Sam Naffziger
SVP & Fellow of Product Technology Architecture
AMD

Spotlight: AMD on the role of Silicon Design for Energy Efficiency

Discover how fabless leaders are driving decarbonization through innovations in energy-efficient product architecture and the critical role of silicon design in minimizing "Use Phase" emissions, the largest contributor to a chip's carbon footprint.

10:40 am - 11:10 am
Anne Meegan
Moderator
Anna Meegan
Director of Sustainability
Google Platforms & Devices
Angela Baker
Angela Baker
VP Sustainability
Qualcomm
Dharmesh Jani
Dharmesh Jani
Director, AI Infra Ecosystem & Partnerships
Meta
Cooper Elsworth
Cooper Elsworth
Sr. TPM, Advanced Energy Labs
Google

End-User Panel: The Decarbonization Imperative

Hear from technology leaders at AMD, Qualcomm, Meta, and Google on why accelerated decarbonization is a business imperative. This panel explores how end-users are (1) acting with a sense of urgency, (2) engaging and enabling their supply chains, (3) driving energy efficient design to drive innovation to accelerate collective progress.

11:10 am - 11:25 am

Break

11:25 am - 11:30 am
Bruce Gall Google
Bruce Gall
Strategic Partnerships
Google

Overview of Priority Initiatives

Priority Initiative: Fab Upstream Materials

11:30 am - 11:40 am
Saifi Usmani, EMD Electronics
Saifi Usmani
VP Global Sustainability
SEMI

Opening Remarks

From Fragmentation to Focus: Outlining a strategy to activate the fab supply chain with a unified customer voice and collaborative support.

11:40 am - 12:10 pm
Bessima
Bessma Aljarbou
Head of Strategy of Environment & Supply Chain Innovation
Apple, Inc.

Keynote: Apple's Supply Chain Engagement

Hear from Apple senior leadership on supply chain engagement and decarbonization, using commercial levers and the power of support and collaboration.

12:10 pm - 12:40 pm
Handy Ko TSMC
Handy Ko
Director, Materials Management
TSMC

From Ambition to Action: A Fab's Role in Upstream Decarbonization

Hear about TSMC's upstream scope 3 (supply chain) decarbonization leadership and recognition of the business imperative, which have been embedded into their core supplier engagement program.

12:40 pm - 12:55 pm
Andrea Jorissen
Andrea Jorissen
Supplier Carbon Solutions
Apple, Inc.

Solutions Enablement & Calls-to-Action

Highlighting clean energy advanced procurement academies and demand aggregation case studies. Announce renewed ambitions and goals for fab upstream scope 3 decarbonization.

12:55 pm - 1:55 pm

Networking & Lunch

Priority Initiative: Clean Electricity

1:55 pm - 2:05 pm
Rebecca Green
Rebecca Green
Partner
ERM
Ken Haig
Ken Haig
Senior Director Government Affairs
Microsoft

Opening Remarks

Setting the stage for collective action on clean electricity in Asia.

2:05 pm - 2:30 pm
Patrick Tan
Patrick Tan
Head of Wider Asia, APAC
Aurora Energy Research

From Visibility to Viability: Developer Insights on Building a Net Zero Future

Hear a market outlook on Clean Electricity in Korea, Japan, and Taiwan, examining current barriers to renewable expansion and the major opportunities driving investment and clean energy growth through 2030.

2:30 pm - 2:55 pm
William Hudson
Will Hudson
Director, Energy & Sustainability Policy
Microsoft

Keynote: Clean Electricity Policy Action & Urgency

Accelerating Clean Electricity expansion requires clear, coordinated policy action. By uniting around shared advocacy priorities, industry and government can remove barriers, unlock renewable supply, and strengthen cost competitiveness across Korea, Japan, and Taiwan.

2:55 pm - 3:25 pm
YS Kim SK HYNIX
Yong Sung Kim
Head of Clean Energy
SK Hynix

Deep Dive: A Clean Semiconductor Partnership in Korea

Explore the proposed Clean Semiconductor Partnership (CSP), SEMI’s flagship initiative to accelerate Clean Electricity development in Korea by aligning industry, government, and utilities on policy reform and procurement innovation, creating a model for collaborative clean energy expansion across Asia.

3:25 pm - 3:40 pm
William Hudson
Will Hudson
Director, Energy & Sustainability Policy, Asia Pacific
Microsoft

Calls to Action

From discussion to action, secure collective advocacy priorities, resource commitments, and endorsement of the Clean Semiconductor Partnership as the pilot for accelerating Clean Electricity expansion across the region.

3:40 pm - 4:10 pm

Break

4:10 pm - 4:50 pm
Rebecca Green
Moderator
Rebecca Green
ERM
Josh Seidenfeld
Josh Seidenfeld
Supply Chain Clean Energy Lead
Google
Chikako Matsumoto
Chikako Matsumoto
Director, Managing Executive Officer
Sumitomo Mitsui Trust Group
Rei Ushikubo
Rei Ushikubo
Director and Head of the Carbon-Free Solutions Division
Shizen Energy
Daisuke Tsujimoto
Daisuke Tsujimoto
Executive Officer, CSO
Renova Inc.

Day 1 Closing Panel: Accelerating Affordability: Scaling Clean Energy Through Collaboration.

How banks, fabs, and retailers can work together to lower renewable energy prices and spread risk, while examining how AI and digital innovation can accelerate price reductions across the supply chain, grid integration, and project development.

4:50 pm - 5:00 pm
Saifi Usmani, EMD Electronics
Saifi Usmani
Vice President, Sustainability
SEMI

Day 1 Closing Remarks and Look Ahead

Reflect on the day's takeaways and action items.

5:00 pm - 6:00 pm

Member-to-Member Meetings / Break

6:00 pm - 6:30 pm

Networking Reception

Join us for Networking in the Orchard Foyer

6:30 pm - 8:30 pm
Alison Drury
Alison Drury
Global Technology Industry Lead
ERM

Dinner with Fireside Chat: “2030 in Focus: Choices That Will Define a Decade”

A forward-looking conversation on how the semiconductor industry can navigate the convergence of climate action, geopolitics, and AI to define its leadership in 2030.

Tuesday, December 16, 2025

8:30 am - 9:15 am

Coffee & Networking

9:15 am - 10:00 am
Saifi Usmani, EMD Electronics
Saifi Usmani
VP Global Sustainability
SEMI

Day 2 Opening

Opening remarks will summarize Day 1 and preview Day 2.

9:30 am - 10:00 am
Lora Ho
Lora Ho
SVP Strategy & ESG
TSMC

TSMC Keynote

Hear from industry leader TSMC on their strategy for decarbonizing advanced semiconductor manufacturing and how it connects to the four GES Priority Initiatives including a new, collaborative path to scale low-GWP gas substitutions from R&D to high-volume manufacturing.

10:00 am - 10:15 am

Break

Priority Initiative: Gas Substitution

10:15 am - 10:25 am
Bruce Gall Google
Bruce Gall
Strategic Partnerships
Google

Opening Remarks

Current efforts to pursue low Global Warming Potential (GWP) gas substitutions in etch and chamber clean applications remain fragmented, resulting in high material costs for HVM application. While promising gas substitutions exist, the traditional paths of small scale or single customer adoption are typically too expensive due to cost scaling limitations. So how do we enable low GWP gas substitutions that also meet cost (as well as performance) expectations? By coordinating a fab-led, industry wide approach to
1) Prioritize a single, low GWP target gas for replacement
2) Co-create and execute a phased experimental plan

10:25 am - 10:45 am
Vahid Vahedi, PhD
Vahid Vahedi
CTO
Lam Research

Equipment Perspective: Scaling Low-GWP Gas Substitution

Hear from a top equipment leader on the process innovations and industry collaboration required to scale low-GWP gas substitution from R&D to high-volume manufacturing

10:45 am - 11:05 am
Steven Scheer
Steve Scheer
SVP Compute System Scaling
imec

imec’s Gas Assessment Platform for Sustainability (GAPS) 

Learn about imec’s Gas Assessment Platform for Sustainability (GAPS) project and how it can be leveraged as an industry test bed for low GWP gas substitution

11:05 am - 11:35 am
Bruce Gall Google
Moderator
Bruce Gall
Google
Rachel Potter EMD
Rachel Potter
VP of Specialty Gas
EMD / Merck
Vahid Vahedi, PhD
Vahid Vahedi
CTO
Lam Research
Steven Scheer
Steve Scheer
SVP Compute System Scaling
imec

It Takes an Ecosystem: A Value Chain Panel on Accelerating Low-GWP Adoption

Hear perspectives from leaders in electronic design automation (EDA), materials, and equipment OEMs on the challenges and opportunities in driving industry adoption of low GWP gases

11:35 am - 11:45 am
Bruce Gall Google
Bruce Gall
Strategic Partnerships
Google

Calls to Action

From Commitment to Action: Outlining the roadmap and action plan for the Gas Substitution Initiative.

11:45 am - 12:45 pm

Networking Lunch

Priority Initiative: Abatement

12:45 pm - 1:10 pm
Beth Elroy
Elizabeth Elroy
VP Sustainability
Micron

Opening Remarks & Keynote

Industry-wide collaboration is critical to accelerate technology innovation and unlock scalable, cost-effective abatement solutions to ease abatement deployment challenges on cost, facilities, space, utilities and operational complexity. Micron will deliver a keynote sharing the abatement journey and the state of current efforts in emission measurement.

1:10 pm - 1:50 pm
Josh Robbins
Moderator
Josh Robbins
Google
Phil Kester
Phil Kester, PhD
Senior Chemical Engineer
Guild Associates
HK KIM KIMM
Dr. Hak-Joon Kim
Korea Institute of Machinery & Materials

F-GHG Catalyst Development & Funding Vehicles

Catalytic abatement remains an important technology, but further research and efforts are needed to identify new catalytic materials, scale performance, and improve their recyclability. Hear from a leading fab and a leading catalyst developer and learn about a promising funding opportunity lead by the Korean government.

1:50 pm - 2:20 pm
Yong Keong Goh
Moderator
Yong Keong Goh
Senior Manager
Micron
Martin Tollner
Martin Tollner
President, Semiconductor Division
Edwards
Morihara Kanken
Atsushi Morihara
Chief Technical Officer
Kanken
Rene Reichardt
Rene Reichardt
CEO
DAS EE
Jong Pil Yoon
Jong Pil Yoon
President
EcoEnergen

F-GHG and Nitrous Oxide Abatement Technology Panel

Abatement technologies are advancing rapidly, and new breakthroughs are on the horizon. Engage with leading abatement suppliers on their outlook on technology roadmaps, strategic priorities and collaborative opportunities.

2:20 pm - 2:30 pm
Kongyeong Goh
YongKeong Goh
Micron
Josh Robbins
Joshua Robbins
Google

Closing Remarks: Abatement

Call-to-actions for commitment to drive high efficiency and low-fuel abatement solutions to accelerate carbon footprint reduction and commercialization, and advance emission measurement technologies to simplify performance verification.

2:30 pm - 2:45 pm
Saifi Usmani, EMD Electronics
Saifi Usmani
VP Global Sustainability
SEMI

Calls to Action Summary & Closing

Hear the takeaways from the Summit and actions for moving forward in our decarbonization journey.

- Sustainability

Semiconductor value-chain executives will gather to align on key initiatives and calls to action, based on our shared decarbonization ambitions, insights and progress thus far.  Together, we will forge an actionable plan for global industry collaboration in three focus areas:  direct emissions, energy-related emissions, and reporting.  This invite-only event will be conducive to accelerating the decarbonization across the industry.

9:00 am - 5:00 pm Off Add to Calendar 2025-12-15 09:00:00 2025-12-16 17:00:00 Global Executive Summit Tokyo 2025 Semiconductor value-chain executives will gather to align on key initiatives and calls to action, based on our shared decarbonization ambitions, insights and progress thus far.  Together, we will forge an actionable plan for global industry collaboration in three focus areas:  direct emissions, energy-related emissions, and reporting.  This invite-only event will be conducive to accelerating the decarbonization across the industry. Okura Hotel Tokyo Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo
Event format
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Brewer Science Named 2025 National Top Workplace in Manufacturing Industry

Ninth Consecutive Year Receiving 2025 Top Workplace in Greater St. Louis

Rolla, MO – August 7, 2025 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, has been named a 2025 National Top Workplace in the Manufacturing Industry, marking the fifth consecutive year the company has received this recognition.

Brewer Science has been named 2025 Top Workplaces based on employee feedback

This list is based solely on employee feedback gathered through a third-party survey administered by employee engagement technology partner Energage LLC, a research company with more than 18 years of experience surveying over 27 million employees at 70,000 organizations. Results are calculated by comparing the survey’s research-based statements, including 15 Culture Drivers proven to predict high performance against industry benchmarks.

In addition to being named a National Top Workplace in the Manufacturing Industry, Brewer Science received regional recognition as a 2025 Top Workplace in Greater St. Louis, marking the ninth consecutive year the company has received this recognition.

“Being recognized as a Top Workplace both on a national industry level, as well as locally within our community, speaks volumes to Brewer Science’s dedication in providing our employee-owners with the most fulfilling work experience,” states Dan Brewer, co-CEO at Brewer Science.

Providing customized solutions to customers’ unique, complex situations requires a high regard for a sense of purpose and commitment by everyone within the company. This dedication has been instilled through the company values and creates a workplace flourishing with culture. The employees at Brewer Science are attentive to their roles in the company and the value they articulate to the customers, suppliers, and industry. This has been exemplified by the company becoming Certified Employee-Owned in 2020. Additionally, the company was recognized for meeting the highest corporate social and environmental standards, transparency, and accountability to all stakeholders by becoming a Certified B Corporation™ in 2021.

Learn more about Brewer Science’s company culture and explore career opportunities by visiting our website: https://www.brewerscience.com/about-us/company/careers/

About Brewer Science

Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique quality monitoring systems for water and air applications. We are Certified Employee-Owned and a Certified B Corporation™, using our business as a force for good. Our headquarters are in Rolla, Missouri, with customer support throughout the world. Learn more at: www.brewerscience.com.

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Company Contact:

Nathan Ayres

Tel: (US) +1.573.364.0444, ext. 1923

Email: [email protected]

Brewer Science Named 2025 National Top Workplace in Manufacturing Industry

Lightium, MPI Corporation, and Axiomatic_AI Announce Strategic Partnership to Revolutionize Photonic Integrated Circuit (PIC) Device Testing with AI-Driven Solutions
Zurich, Switzerland; Hsinchu, Taiwan; and Boston, USA – January 6, 2025 – Lightium AG, MPI Corporation, and Axiomatic_AI Inc. have entered into a Memorandum of Understanding (MoU) to jointly develop the world's first Intelligent, Autonomous, and Integrated Test Solution (IAITS) for photonic devices.
This strategic collaboration aims to revolutionize the testing and qualification processes of photonic integrated circuit (PIC) devices by uniting state-of-the-art artificial intelligence, next-generation hardware, and deep domain expertise. The IAITS platform will deliver breakthrough performance in testing workflows—enabling unmatched efficiency, precision, and scalability to meet the ever-evolving demands of the photonics industry.
A Unified Vision for the Future of Photonics Testing
This partnership is driven by a shared commitment to deliver groundbreaking AI driven and self-optimizing solutions to the photonics industry. By combining Axiomatic_AI’s cutting-edge, reasoning-based, self-learning artificial intelligence with MPI Corporation’s industry-leading wafer probing systems and automation software, and leveraging Lightium AG’s advanced testing infrastructure and deep expertise in ultra-high-speed photonic device measurements, the collaboration aims to bring fully integrated, intelligent photonic integrated circuit (PIC) test solutions to market.
Together, the three companies are creating a unified AI platform that addresses the growing complexity and performance demands of characterizing photonic integrated circuits—unlocking new levels of automation, precision, and scalability for next-generation applications.
Disruptive Value Creation Across Hardware and Human Resources
The Intelligent, Autonomous, and Integrated Test Solution (IAITS) introduces a new paradigm in photonic integrated circuit (PIC) testing, delivering transformative value across both technology infrastructure and human capital.
Key Benefits of IAITS:
• Increased Throughput: By automating complex test routines, minimizing downtime, and optimizing measurement system utilization, IAITS significantly accelerates test cycles and reduces iteration times.
• Enhanced Human Efficiency: The system reduces reliance on manual operation, programming, and debugging—freeing skilled personnel to focus on high-value engineering and strategic innovation tasks.
IAITS will be commercially available as an advanced software add-on package for MPI Corporation’s wafer probing systems. Designed to support both R&D and high-volume production environments, the solution sets a new industry benchmark for efficiency, precision, and scalability—ultimately lowering the total cost of testing and accelerating time-to-market for next-generation PIC devices.
About Lightium AG
Lightium AG is a Swiss-based startup specializing in Photonic Integrated Circuit (PIC) foundry and design services, built on its proprietary, production-grade Thin-Film Lithium Niobate (TFLN) platform. Lightium accelerates customer innovation by delivering unmatched photonic performance, a streamlined and cost-efficient supply chain, and seamless scalability from prototyping to high-volume manufacturing.
As Europe’s first production-grade TFLN foundry, Lightium plays a pivotal role in enabling next-generation photonic solutions across a diverse range of industries, including telecommunications, data communications, quantum computing, artificial intelligence, and space technologies.
Further information can be found at: Lightium - Thin Film Lithium Niobate (TFLN) Photonic Foundry
About MPI Corporation
MPI Corporation, headquartered in Taiwan, is a global leader in advanced probe systems and testing solutions for the semiconductor, photonic, and photonic integrated circuit (PIC) industries. The company designs and manufactures high-performance wafer probing systems known for their exceptional precision, automation capabilities, and scalability—empowering cutting-edge testing across research, development, and high-volume production.
MPI’s innovations play a critical role in advancing next-generation technologies in wireless communication, electronics, and photonics. The company is publicly listed on the Taipei Exchange (TAIEX: 6223).
For more information, please visit: About MPI Corporation – Global Semiconductor Testing Leader
About Axiomatic_AI Inc.
Axiomatic_AI Inc., headquartered in Boston, is a pioneering startup developing physics-based reasoning artificial intelligence to accelerate innovation and reduce the cost and risk associated with deep-tech development. Its cutting-edge AI technologies are redefining how high-tech industries design, measure, and optimize complex systems—enabling faster, smarter decision-making across R&D and production environments.
Axiomatic_AI’s mission is to unlock new efficiencies and capabilities in fields where precision and complexity are paramount.
Learn more at: https://axiomatic-ai.com/mission/

This cutting-edge panel-level wet processing demo tool handles large 510 × 515 mm substrates, delivering world class, high density Through Glass Vias (TGV) formation and ultra-small taper angles essential for advanced packaging in high performance computing.

Gütenbach, Germany – July 15, 2025 – RENA Technologies, a leading manufacturer of wet processing equipment for semiconductor and advanced packaging production, today announced the ramp-up of its dedicated glass core substrates facility in Germany. This new line, designed for substrates up to 510 × 515 mm, immediately opens for customer test lots, underscoring RENA's proven expertise in glass processing and creating new opportunities for process development and customer sample production. “As experts in precision wet processing, we can now offer large panel demo services for high aspect ratio through glass via (TGV) formation on various glass types,” said Dr. Holger H. Kuehnlein, SVP Technology at RENA. “Our alkaline based TGV process delivers extremely small taper angles, low sidewall roughness, and exceptional dimensional control at panel scale, enabling high density via applications. Customers can begin validating these capabilities today.”

Why Glass, and Why Wet Processing?
Glass substrates offer significant advantages for advanced electronics, including ultra-flat surfaces, low dielectric loss, and superior thermal stability. However, realizing these benefits at scale requires defect free surface preparation and the formation of uniform, high density TGVs with minimal taper angles. RENA's wet processing systems are specifically designed to address both challenges:
1. Surface Engineering – Our systems ensure precise cleaning and stress relief across 600 x 600mm panels with submicron total thickness variation (TTV).
2. Chemically Formed TGVs – Following initial laser modifications performed by our specialist partners, RENA’s proprietary chemistries form, enlarge and shape each via to exact specifications. This process consistently delivers very small taper angles and smooth sidewalls, ideal for subsequent metallization.

By collaborating with leading German and international laser partners, RENA offers customers the flexibility to choose their preferred laser vendor while ensuring all downstream wet processing steps are handled by our advanced equipment.

Key Highlights of the New Facility
Panel Size: Focus on 510 x 515mm and up to 600 × 600mm, smaller possible
Tool Set: Alkaline TGV etching, advanced rinse/dry, optical inspection & metrology
Field-Proven Recipes: Process conditions migrated from high volume tools
On-Demand Access: Customers may run demo substrates, qualify custom chemistries, or request full process flows
Sustainability: Low temperature chemistries and closed loop water reclamation reduce energy and ultrapure water (UPW) consumption

Market Impact
High-Performance Computing (HPC) as well as 5G/6G RF modules increasingly require new package designs, including panel-level fan-out and trend towards more complex chiplet architectures. Glass substrates, long considered the “holy grail” for core and interposer material, effectively eliminate the limitations imposed by warpage and dielectric loss in organic substrates. By combining laser modification from our vetted partners with RENA's chemistry driven via shaping, designers can now validate glass packaging concepts on the lab-platform proven at 600x600mm dimensions.
“With this lab-tool, we've created a great opportunity for semiconductor manufacturers to perform demos on panel level glass substrates,” added Peter Schneidewind, CEO of RENA. “From surface preparation to via formation, our wet process flow is ready for customers substrates to support TGV technology breakthroughs. This is world class made in Black Forest.”

Availability & Engagement Model
• Testing available now
• Flexible collaboration: Bring your own laser modified substrates, or leverage RENA’s ecosystem partners to benefit from joint process development support, and metrology services for process validation.

About RENA Technologies GmbH
RENA Technologies is a leading global supplier of production machines for wet chemical surface preparation. RENA products are used in path-breaking application fields such as semiconductors, MedTech, renewable energies, the glass industry and additive manufacturing. RENA equipment is used to treat or modify surfaces of, for example, semiconductor wafers, solar cells, glass, optical substrates, 3D-printed metal components or other high-tech products using wet chemical processes. RENA offers proven standard machines as well as customer-specific solutions and process support.

CONTACT
Sales:
Felix Fink
Phone: +49 7723 9313-403
E-Mail: [email protected]

Press:
Dirk Hensel
Phone:+49 7723 9313-914
E-Mail: [email protected]
www.rena.com