Do you sometimes feel like you are operating in the dark when dealing with the new challenges and opportunities in process and design? These continue to emerge in parallel to ever shrinking semiconductor device geometries.
While Moore’s law and beyond are driving scale reduction, the industry is facing increased process sensitivity and complexity, and is redefining on-wafer defect tolerance in terms of size and complexity.
To detect, identify, understand the source and eliminate yield limiter defectivity are key for total wafer environment contamination characterization and control and are essential for yield enhancement to ensure the success of the latest technology nodes.
It is more imperative than ever that the semiconductor industry works together to enable improved defect detection, speciation/characterization metrology, and as needed, hybrid analytical technology for upcoming HVM readiness.
Join us for this session for speakers and discussion on tackling some of these industry challenges.
Virtual United States
7:30 am
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7:35 am
Paul Trio
Senior Manager, Strategic Initiatives
SEMI
Welcome
7:35 am
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7:55 am
Archita Sengupta
Sr. Technologist
Intel
IDM Perspective of Defectivity with regard to Next-Gen Metrology and Analysis Tools
New challenges and opportunities in process and design continue to emerge in parallel to ever shrinking semiconductor device geometries. While Moore’s law and beyond are driving scale reduction, the industry is facing increased process sensitivity and complexity, and is redefining on-wafer defect tolerance in terms of size and complexity.
Join us for this webinar-like session to discuss best-known methods from industry leaders
Challenges in Metrology & Analysis for Next Gen Semiconductor Industry
7:30 am - 10:00 am
Off
Add to Calendar Disabled
America/Los_Angeles
Session 2: Ultra Wide Band Gap Wafer and Heat Sink Diamond Substrates
4:15 pm - 4:35 pm
Off
Add to Calendar2021-09-23 16:15:002021-09-23 16:35:00Session 1: Ultra Wide Band Gap Wafer and Heat Sink Diamond SubstratesSEMI International Standards Program
Compound Semiconductor Technology Forum
Note: Forum language is mandarin, no simultaneous Interpretation provided
Session 2: Ultra Wide Band Gap Wafer and Heat Sink Diamond Substrates
Speaker: Xing Zhang, CEO of Compound Semiconductor Manufacturing（Xiamen) Co., Ltd
Thursday, September 23, 2021
16:30-17:00
Wuhu, Anhui, China
Webinar Link: Click here
Event Contact information:
Ein Wu
SEMI China
Email: [email protected]
Phone: 86.21.6027.8509ChinaSEMI.org[email protected]America/Los_Angelespublic
