Imec and Brewer Science present process solutions for CVD oxide deposition processes on ultrathin wafers at Electronic Components and Technology Conference (ECTC)

Process challenges during CVD oxide deposition on the backside of 20-µm thin 300-mm wafers temporarily bonded to glass carriers

Grande Lakes, FL – May 22, 2023 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, is presenting and exhibiting at Electronic Components and Technology Conference (ECTC) May 30th through June 2nd.

Dr. Koen Kennes from imec is copresenting with Brewer Science, Process challenges during CVD oxide deposition on the backside of 20-µm thin 300-mm wafers temporarily bonded to glass carriers, which evaluates a temporary carrier system during several backside processing steps on thin wafers down to 20 µm. The main focus is the impact of various chemical vapor deposited (CVD) oxides on thinned wafers supported by temporary bonding materials. Such wafers have the risk of deformation and even delamination during the deposition step. The presentation is May 31st at 10am, a part of Session 37: Interactive Presentations.

A step-by-step investigation reveals the deformation/delamination mechanism to be highly dependent on the oxide deposition conditions rather than the deposition temperatures. Controlling the stress in the oxide layer enables both high-temperature and low-temperature oxides to be successfully deposited on the backside of ultrathin wafers. The experimental results are corroborated with finite element simulations.

Figure 1. Schematic of the process flow. The wafer thinning starts by edge trimming the wafer followed by coating the release layer, BrewerBOND® T1107 material. After bonding with the temporary bonding material (TBM), BrewerBOND® C1301-50 material, the wafers are ground down to 55 µm and chemical mechanical polished (CMP) to smooth the surface. Further thinning is achieved via a wet etch step. After oxide and dielectric deposition, several wafers are transferred to a new carrier using a wafer flip step in which the original stack is bonded to a second carrier enabling debond of the first carrier.

“During high-temperature CVD oxide deposition on thinned wafers on temporary carriers, delamination of the thin wafer from the carrier was observed.” States Dr. Kennes, R&D team lead for bonding, assembly, and wafer-level packaging at imec. “Using FEM simulations and DOE experiments, the failure mechanism was identified, and process solutions were defined. This resulted in successful damascene processing on the backside of thinned wafers on glass carriers.”

Brewer Science is a Gold Sponsor of ECTC. You can connect with Brewer Science at booth #110 throughout the duration of the event May 30th through June 2nd. Learn more about Brewer Science’s innovative packaging solutions on their website, and connect with an expert by submitting a request on their website.

About Brewer Science
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique monitoring systems for industrial, environmental, and air applications. Our relationship-focused approach provides outcomes that facilitate and deliver critical information. Our headquarters are in Rolla, Missouri, with customer support throughout the world. We invite you to learn more about Brewer Science at www.brewerscience.com.

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PEER Group® has announced an upcoming webinar designed to help semiconductor equipment manufacturers prepare for the increasing demand from backend factories for automation capabilities and SEMI® Standards compliance in assembly and test processes.

Taking place on June 22, 2023, at 1:00 p.m. ET/11:00 a.m. MT, the webinar, Standardizing the Assembly and Test Process, will feature an in-depth discussion between Jason Cicero, Micron Technology’s Senior IT Domain Architect, and PEER Group’s Director of Marketing, Doug Suerich.

Topics covered will include: why the backend, including assembly and test, needs more automation and standardization, how this will impact equipment design and integration, common issues faced by factories when integrating new tools, and how equipment suppliers can help solve these issues. There will also be a live Q&A for attendees to ask questions during the webinar.

“The SEMI Standards Program has been around for more than 40 years,” says Suerich. “During that time, these standards have evolved into the guiding principles which ensure compatibility and interoperability across suppliers and factories, improving manufacturing productivity, quality, and reliability, and reducing the cost and pain of integrating new equipment onto the factory floor. Universally adopted in the frontend, we are starting to notice increasing demand from factories to implement standards in the backend, including assembly and test processes.”

Evidence of this shift is seen as major players in the frontend enter the assembly and test market while established facilities announce major capital investments into their operations. This expansion introduces new, high-value processes to assembly and test and closer integration with the frontend – both of which are enabled through the application of standards. Meanwhile, the SEMI Advanced Backend Factory Integration task force continues to investigate and promote the adoption of SEMI Standards for assembly and test.

The webinar is scheduled to last 30 minutes followed by a 15-minute Q&A. All registrants will have the opportunity to access a recording of the webinar. For more information, including how to register, visit: https://bit.ly/3mq2yf3

About PEER Group
PEER Group® is the largest supplier of innovative factory automation software products for the semiconductor industry. Since 1992, our solutions have helped the world’s most advanced OEMs and factories reduce time to market and lower costs by solving their equipment automation, data management, and process control problems. A multi-award winning company, PEER Group has been named a Best Workplace by Great Place to Work Canada 11 times, and most recently was one of six recipients of Intel’s 2022 EPIC Outstanding Supplier Award, which recognizes the absolute top performers in the Intel supply chain. Follow PEER Group on LinkedIn and Twitter at @PEERgroup_Inc..

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Deventer, May 11, 2023 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, and Svenska Grindmatriser AB (SGA), a well-established fabless IDM for the development and supply of customized mixed-signal ASICs, today announce that the companies have started a cooperation for high-volume production testing of SGA’s ASIC products.

The cooperation with RoodMicrotec as European partner enables SGA to meet the rapidly growing market demand. Furthermore, RoodMicrotec as a supplier will help SGA to strengthen its supply chain by providing flexible testing capacities as well as other quality assessment services.

“This collaboration offers us the opportunity to grow faster. In addition, both companies benefit from each other's knowledge, which is of tremendous value! Therefore, I am expecting this cooperation to be growing to a strategic level”, says Henrik Sjöberg, CEO of SGA.

Being a leading European service provider in the semiconductor industry, this partnership matches well with RoodMicrotec’s portfolio of capabilities.

Martin Sallenhag, CEO of RoodMicrotec, says, “This cooperation shows that we are a reliable partner for test and quality services in Europe. It is always nice to see that such strong companies as SGA rely on our expertise and test capabilities. In addition, this project helps us to strengthen our position as a service provider for the Swedish semiconductor industry.”

About SGA
SGA is a fabless manufacturer of analog and mixed-signal ASICs. SGA works closely with customers throughout the entire product lifecycle, from development to high-volume production. SGA's deep technical expertise and continuous quality focus has led to long-lasting partnerships in a broad set of industries. The company was founded in 1986 and is located in the city of Linköping, Sweden.
For more information please visit www.sga.se.
Further information
Henrik Sjöberg, CEO or Andreas Marinus, Sales
Phone +46 13 36 46 60, E-mail [email protected]

About RoodMicrotec
With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is a leading independent company for semiconductor supply and quality services. RoodMicrotec is a highly valued partner for many companies worldwide and offers specifically tailored turnkey solutions for each single customer's requirements. The turnkey services include project management, wafer test, assembly, final test, qualification, failure analysis, and logistics. All services provided by RoodMicrotec meet the high quality standards of the automotive, industrial, healthcare, and high reliability aerospace sectors. RoodMicrotec is headquartered in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.
For more information please visit https://www.roodmicrotec.com
Further information
Martin Sallenhag, CEO or Arvid Ladega, CFO
Phone +31 570 745623, E-mail [email protected]

This press release is available in English and German. In case of conflict between these versions, the English version shall prevail.

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Verific Design Automation today announced Vorak Solutions is its vendor of choice to assist Verific customers to accelerate projects that implement its SystemVerilog, Verilog, VHDL and UPF Parser Platforms.

“Vorak engineers are well-versed in Verific’s APIs,” remarks Rick Carlson, vice president of sales at Verific. “They are highly experienced and able to jump in to do small- to medium-sized projects, quickly understanding the project scope and details, communicating regularly and delivering high quality on schedule and on budget. We couldn’t have a better engineering services partner.”

Founded in 2015 in the United States and Armenia, Vorak Solutions provides cost-effective and high-quality development and quality assurance services for software, cloud migration and electronic design automation (EDA) flow integration and quality assurance testing.

Vorak’s knowledge of the Verific parser platforms and engineering expertise has been used to develop numerous applications and programs for Verific customers including Rapid Silicon and other noted semiconductor companies. It accelerates application development projects for customized solutions, product development and testing. In one example, a floorplan estimator was developed for a Verific customer who needed block-level initial estimates. In another, Vorak designed a custom hierarchy report that specified characteristics at each level.

“Verific is a company with a reputation of providing exceptional value and it’s a pleasure to work alongside its engineers,” says Georgi Mikichyan, COO of Vorak. “Our projects implementing the Verific parser platforms or building on top of the platforms always reinforce that Verific’s reputation is well warranted.”

About Vorak Solutions
Vorak Solutions, founded in 2015 in the United States and Armenia, was formed by experienced professionals from both countries based on a long-standing successful collaboration of the management and engineering teams. Vorak, Armenian for Quality, provides high-quality development and quality assurance services in the areas of software, cloud and EDA products at a fraction of first world engineering costs.

About Verific Design Automation
Verific Design Automation is the leading provider of SystemVerilog, Verilog, VHDL and UPF Parser Platforms that enable project groups to develop advanced electronic design automation (EDA) products quickly and cost effective worldwide. With offices in Alameda, Calif., and Kolkata, India, Verific has shipped more than 60,000 copies of its software used worldwide by the EDA and semiconductor industry since it was founded in 1999.

Engage with Verific at:
Email: [email protected]
Website: www.verific.com
LinkedIn: https://www.linkedin.com/company/verific-design-automation-inc/
Facebook: https://www.facebook.com/Verific-Design-Automation-100448363329771/

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Brewer Science and PulseForge Bring Photonic Debonding to Semiconductor Advanced Packaging at Scale

Co-presenting “Photonic Debonding for Wafer–Level Packaging” at CS MANTECH, held May 15-18 in Orlando, FL.

Orlando, Florida – April 25, 2023 – Brewer Science, Inc. and PulseForge, Inc. bring substantial cost savings, increased throughput, and other benefits with photonic debonding to semiconductor advanced packaging. This collaboration combines a global leader in manufacturing next-generation materials and processes with a unique technology provider.

Photonic debonding is a revolutionary technology that uses high-intensity pulses of light in conjunction with a proprietary inorganic light-absorbing layer to debond temporarily bonded wafer pairs. Photonic debonding using Brewer Science BrewerBOND® series materials enables back-end-of-line processing of ultrathin wafers. Collectively, PulseForge and Brewer Science offer a unique photonic debonding wafer support system suitable for advanced packaging applications.

Photonic debonding provides a substantially lower cost of ownership over incumbent industry alternatives. Photonic debonding can process warped wafers without requiring expensive and time-consuming warpage adjustment hardware. Photonic debonding is the first to introduce a reusable inorganic release layer, resulting in a clean, ash-free debonding process.

Brewer Science and PulseForge are co-presenting Photonic Debonding for Wafer–Level Packaging at CS MANTECH on Thursday, May 18 at 2:40 pm (Session 18). Additionally, Brewer Science is a gold sponsor and will exhibit at booth 224 throughout the duration of CS MANTECH, May 15 through May 18, 2023. You can also learn more about Brewer Science on May 16th at 5:40pm during Session 3: Thin films & materials in Grand Cypress G.

About Brewer Science, Inc.
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique quality monitoring systems for water and air applications. We are Certified Employee-Owned and a Certified B Corporation™, using our business as a force for good. Learn more at www.brewerscience.com.

About PulseForge, Inc.
PulseForge, Inc. utilizes applied energy in a precise and targeted manner to enable innovation in industrial manufacturing. Our expertise and tools empower our customers to explore novel materials and manufacturing methodologies, driving dynamic and efficient production at an industrial scale. Learn more at www.pulseforge.com

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Swedesboro, NJ, April 25, 2023 —Thomas Scientific, the most trusted supplier to the scientific community, today announced that Stan Haas has been appointed to President and Chief Executive Officer. Joining the company in 2017, Haas first served on the Board of Directors and then on the executive team as Chief Operating Officer. He brings more than 30 years of experience in the scientific-distribution industry, including executive-leadership positions in sales, operations, strategy and business development, services and global sourcing, along with extensive international experience. Known for building high-performing teams and delivering results, Haas is passionate about the scientific business and its critical role in fueling innovation in life sciences, biopharma, research, and microelectronics.

"I’m excited to continue driving Thomas Scientific in my new role as President and CEO, especially given our unique position to leverage our rich heritage and industry expertise in this ever-evolving scientific environment," said Haas. “Leading an industry pioneer with a 123-year legacy of serving science and catalyzing innovation, I’m honored to steer our exceptional leadership team in making the greatest positive impact in our community.”

Prior to joining Thomas Scientific, Haas served as COO at Affiliated Distributors, North America’s largest buying-group organization for construction and industrial supplies. Additionally, he held key executive-leadership roles at VWR Scientific (Avantor), where he helped shape the company’s strategy, evolving it from a $300 million U.S.-centric organization to a $4.2 billion global provider of scientific products and services.

“Since joining the Board nearly two years ago, I have had the pleasure of seeing Stan’s passion and expertise for not just serving the scientific community, but improving it,” said Lynn Calpeter, Chairperson of the Board for Thomas Scientific.

Haas holds an MBA from the University of St. Thomas, Minneapolis, as well as an undergraduate degree in microbiology from the University of Wisconsin-Madison.

Before Haas, Charles Simmons served as President and CEO for six years, guiding the company through the acquisition and successful integration of five companies, a global pandemic, and the post-COVID workplace. He will continue to serve on the Thomas Scientific Board of Directors.

Last year, Thomas Scientific was acquired by Broad Sky Partners, a private equity firm that partners with leading middle-market business services and consumer companies. As part of its governance structure, Ms. Calpeter, a Broad Sky Operating Partner and former General Electric finance executive, chairs the Thomas Scientific’s board.

About Thomas Scientific
Since 1900, Thomas Scientific has been the gold standard in scientific and laboratory products, providing the latest in supplies, equipment, and supply-chain solutions to the scientific community and supporting all laboratory research, biopharmaceutical, medical device, clinical diagnostics, cleanroom, and other related end-markets. For over a century, the global scientific community has relied on Thomas Scientific in every major public health breakthrough. As one of the most highly recognized companies for quality, reliability, and performance, Thomas Scientific is trusted by suppliers, distributors, and institutions to deliver individualized service, a comprehensive product portfolio, and customized supply-chain service solutions. In December 2021, Thomas Scientific was acquired by Broad Sky Partners, a private equity firm that partners with leading middle market business services and consumer companies. For more information, visit thomassci.com and follow them on Twitter, Facebook, Instagram, and YouTube.

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