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Taylor Zhao
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SiC—Silicon Carbide Webinar #4: Understanding Sic Chip Cost, the Impact of Defects, and the Case of Price Parity With Si at the System Level

Silicon devices are dominating power electronics due to their excellent starting material quality, streamlined fabrication, low-cost volume production, proven reliability and ruggedness, and design/circuit legacy. Although Si power devices continue to make progress, they are approaching their operational limits primarily due to their relatively low bandgap and critical electric field that result in high conduction and switching losses, and poor high temperature performance.

SiC power chips are gaining significant market share and are projected to capture over 30% of the power chip market by 2029. Their cost, however, remains above that of similarly rated silicon chips and increases disproportionately with area. In this presentation, various elements of SiC chip cost will be qualitatively analyzed including contributions of substrate, epitaxy, and chip manufacturing. Material defects will be discussed in terms of their impact on chip area scalability and yields, and wafer test maps will be presented to elucidate their correlation. Finally, the case of system-level price parity between Si and SiC will be made, achieved primarily through reduced mass and volume of magnetic components, and simplified thermal management

 

View other webinars in the SiC Series

  • Webinar #1—Silicon Carbide Material Properties, Key Applications, and Fabrication Basics: Making the Transition from Silicon
  • Webinar #2—Non-CMOS Compatible SiC Power Device Fabrication in Volume Si Fabs
  • Webinar #3—Bidirectional SiC and GaN Switch Technology 
  • Webinar #4—Understanding SiC Chip Cost, the Impact of Defects, and the Case of Price Parity With Si at the System Level 
  • Webinar #5—SiC Edge Termination Technology

 

Meet the Speaker

Biography

United States

Victor Veliadis, PowerAmerica
Victor Veliadis, PhD
Executive Director and Chief Technology Officer,
PowerAmerica

Now Available On-Demand!

Join us online for the fourth webinar in the Silicon Carbide Series—Understanding SiC chip cost, the impact of defects, and the case of price parity with Si at the system level.

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Xpeedic of Cupertino, Calif., unveiled RF EDA Solution 2023 edition today at the IEEE MTT International Microwave Symposium (IMS) here, showcasing its ability to accelerate the design of highly integrated RF modules and systems using its differentiating chip-package-system EDA tools and mass-production proven Integrated Passive Devices (IPD) IP.

The RF Electronic Design Automation (EDA) Solution includes XDS, Xpeedic’s RF system-level design and simulation platform, IRIS, its on-chip passive modeling and simulation tool, and iModeler, a passive model generation tool.

XDS provides schematic design and simulation, post-layout electromagnetic simulation with both method-of-moments (MoM)- and finite-element-method (FEM)-based solver technologies, electro-magnetic (EM) circuit co-simulation and tuning/optimization. In the new 2023 edition, XDS features a new filter synthesis algorithm and supports parametric padstack and permittivity, SNP-based LC matching in Smith Chart, bondwire simulation and hierarchy design for schematic and layout.

IRIS has been widely adopted for RFIC designs and certified for advanced process nodes. In the new 2023 edition, IRIS upgrades its accelerated 3D EM solver engine with improved run time and peak memory usage.

iModeler now includes built-in MoM cap, MiM cap, inductor and transformer templates, enables parameterized result exploration using built-in templates.

Xpeedic at IMS
Xpeedic will be in Booth #1121 at the IEEE MTT International Microwave Symposium (IMS) in the San Diego Convention Center in San Diego. Hours are today from 9:30 a.m. until 5 p.m., Wednesday, June 14, from 9:30 p.m. until 6 p.m. and Thursday, June 15, from 9:30 a.m. until 3 p.m. Attendees can stop by the booth to schedule demos or meetings by sending email to [email protected].

“Overview of Integrated Passive Devices (IPD) for RF Front-end Applications” will be presented by Xpeedic Wednesday at 3 p.m. at the MicroApps Theater in Booth #2447.

About Xpeedic
Xpeedic is a leading EDA provider to accelerate designs and simulations of next generation high-frequency, high-speed intelligent electronic products. Powered by its proprietary electromagnetic, circuit, and multi-physics solver technologies, Xpeedic is addressing challenges in designing IC in advanced nodes, 3D-IC with advanced packaging, high-speed digital, and RF systems for the markets including data center, automotive, communication, mobile, and IoT. Founded in 2010, Xpeedic has offices in both U.S. and China. For more information, please www.xpeedic.com.

Engage with Xpeedic
www.xpeedic.com
Twitter: @xpeedic
LinkedIn

Xpeedic of Cupertino, Calif., today announced its Integrated Passive Devices (IPD) shipments surpassed an unprecedented two-billion units accomplished through its mass production-proven IPD development platform that enables proliferation of IPDs to RF front-end modules.

Xpeedic’s IPDs and IPD development platform will be showcased today through Thursday at the IEEE MTT International Microwave Symposium (IMS) in San Diego.

“This is a momentous milestone for Xpeedic,” remarks its CEO Feng Ling. “Our commitment to continue addressing RF and other significant design challenges remains unchanged.”

Adoption of Xpeedic’s IPDs is driven by the need for smaller, high-performance, cost-effective, and reliable electronic systems across various industries. Advantages of the solution include:
• A rich set of IPD libraries on various IPD processes, such as high-resistivity silicon and glass for common, ready-for-mass production building blocks used in RF front-end modules.
• Trusted foundry and packaging ecosystem partners supporting both quick prototype and mass production.
• Home-grown electronic design automation (EDA) design flow tailored to meet specific needs for greater efficiency and productivity. Developing an in-house EDA design flow also fosters innovation and differentiation by incorporating internal design methodology that results in unique designs with competitive advantages.
• A dedicated and experienced design team enabling quick turnaround for customized IPDs.

Xpeedic at IMS
Xpeedic will be in Booth #1121 at the IEEE MTT International Microwave Symposium (IMS) in the San Diego Convention Center in San Diego. Hours are today from 9:30 a.m. until 5 p.m., Wednesday, June 14, from 9:30 a.m. until 6 p.m. and Thursday, June 15, from 9:30 a.m. until 3 p.m. Attendees can stop by the booth to schedule demos or meetings by sending email to [email protected].

“Overview of Integrated Passive Devices (IPD) for RF Front-end Applications” will be presented by Xpeedic Wednesday at 3 p.m. at the MicroApps Theater in Booth #2447.

About Xpeedic
Xpeedic is a leading EDA provider to accelerate designs and simulations of next generation high-frequency, high-speed intelligent electronic products. Powered by its proprietary electromagnetic, circuit, and multi-physics solver technologies, Xpeedic is addressing challenges in designing IC in advanced nodes, 3D-IC with advanced packaging, high-speed digital, and RF systems for the markets including data center, automotive, communication, mobile, and IoT. Founded in 2010, Xpeedic has offices in both U.S. and China. For more information, please www.xpeedic.com.

Engage with Xpeedic
www.xpeedic.com
Twitter: @xpeedic
LinkedIn

Kitchener, Ontario – PEER Group®, the largest supplier of innovative factory automation software products for the semiconductor industry, is sharing its SEMI® Standards expertise and insight during the industry-led Global Cybersecurity Forum, happening at SEMICON West 2023.

Featuring talks by executives from leading chip makers, OEMs, and suppliers, the forum, Securing the Future for Semiconductor Manufacturing, will highlight the current state of industry-wide cybersecurity status, risks, and effects and detail the collaboration plans to protect the entire semiconductor supply chain.

“Amid recent high-profile cyberattacks on fabs, the semiconductor industry is banding together in defense of our highly complex and valuable global supply chain,” says Doug Suerich, PEER Group’s Director of Marketing, “the Global Cybersecurity Forum provides a prominent platform for industry leaders to discuss this topic. The caliber of speakers reflects the critical importance cybersecurity is to semiconductor manufacturing and we look forward to advancing our defensive strategy together as an industry.”

Suerich will be moderating the four-hour forum, which is scheduled to begin at 1:00 p.m. PDT on Wednesday, July 12.

The forum will kick-off with keynote addresses by Brent Conran, CVP, Chief Information Security Officer, Intel Corporation, and James Tu, PhD, Head of Corporate Information Security, TSMC. Additional presenters include executives from Applied Materials, ASML, Lam Research, and the National Institute of Standards and Technology (NIST).

Mike Kropp, PEER Group’s Co-Founder, CEO, and President, will also speak during the forum, sharing insight into the potential vulnerabilities associated with software that is used on semiconductor tools and in factories and the best practices companies follow to mitigate these issues. Kropp will provide an overview of SEMI® E187 and E188, the new Cybersecurity Standards published by the SEMI Fab & Equipment Information Security and the SEMI Fab & Equipment Computer Device Security Task Forces.

PEER Group has extensive experience helping OEMs and factories comply with the various SEMI Smart Manufacturing Standards, which include Cybersecurity Standards E187 and E188. In addition to participating in the Global Cybersecurity Forum, PEER Group will also be exhibiting during the show. To learn more about PEER Group products and services, stop by booth 451 during SEMICON West or visit: https://www.peergroup.com/news-events/events/semicon-west-2023

About PEER Group
PEER Group® is the largest supplier of innovative factory automation software products for the semiconductor industry. Since 1992, our solutions have helped the world’s most advanced OEMs and factories reduce time to market and lower costs by solving their equipment automation, data management, and process control problems. A multi-award winning company, PEER Group has been named a Best Workplace by Great Place to Work Canada 11 times, and most recently was one of six recipients of Intel’s 2022 EPIC Outstanding Supplier Award, which recognizes the absolute top performers in the Intel supply chain. Follow PEER Group on LinkedIn and Twitter at @PEERgroup_Inc..

Axiomise, the leading provider of cutting-edge formal verification solutions that include training, consulting, services and custom apps, today launched its next-generation formalISA® app with open-source, formally verified RISC-V processors such as cv32e40p and WARP-V.

Also announced today is a new RISC-V Studio Portal with real-world formalISA applications and product demonstrations to help the RISC-V ecosystem understand the necessity of exhaustive formal and the kind of bugs that can be caught with formal methods.

“We are excited to share the app launch in conjunction with a new studio portal with real-world applications of formalISA and product demos,” remarks Dr. Darbari. “The app will enable the wider ecosystem of RISC-V to see why exhaustive formal verification is a necessity and what kind of bugs can be caught with formal methods. formalISA app is a powerful offering in realizing our vision of making formal normal. Axiomise has the tools and the skills to become the ‘go to’ RISC-V Verification expert.”

Dr. Darbari and his team will be at the RISC-V Summit Europe to demonstrate formalISA in Bay 7 from Tuesday, June 6, to Thursday, June 8, at Hotel Barcelo Sants in Barcelona, Spain.

About formalISA
Axiomise’s formalISA is a push-button formal verification solution used for architectural and micro-architectural verification of RISC-V processor cores. Initially launched four years ago, it has been used to formally verify numerous open-source and commercial RISC-V processors by identifying deep corner-case bugs and mathematically proving the absence of bugs on complex out-of-order and in-order cores.

A state-of-the-art proof status dashboard captures reporting and coverage information and provides full automation, saving time and cost. formalISA is powered by i-RADAR®, and a reporting and coverage solution called SURF.

formalISA is available now. Pricing is available upon request.

About Axiomise
Axiomise is accelerating formal verification adoption through its unique combination of training, consulting, services and specialized verification solutions for RISC-V. Axiomise was founded by Dr. Ashish Darbari, FBCS, FIETE, DPhil (Oxford), who has been a formal verification practitioner for more than two decades with 60 patents in formal verification and over 70 publications.

Engage with Axiomise at:
Website: www.axiomise.com
Twitter: @axiomise
LinkedIn: https://www.linkedin.com/company/axiomise/
Facebook: https://www.facebook.com/axiomise
Axiomise, formalISA and the Axiomise logo are trademarks of Axiomise Limited, UK.
Making formal normal is a registered trademark of Axiomise Limited, UK.

Virginia Beach, Virginia - Busch Vacuum Solutions, a leading provider of reliable solutions for SubFab Management, is proud to exhibit at this year's SEMICON West show and conference. As a reliable partner for vacuum pumps, gas abatement systems, leak detection and more, Busch provides the semiconductor industry with the highest quality solutions and services.

At SEMICON West, Busch is showcasing their comprehensive subfab management services. Critical SubFab systems are monitored and predictively maintained by Busch. Their SubFab management minimizes production downtime and enables energy-efficient operation and cost savings. Continuous monitoring extends maintenance intervals and the entire product life cycle. All Busch on-site service teams are certified to ISO9001:2016, ISO14001:2016 and ISO45001:2018 standards.

"We are proud of our comprehensive solutions for the semiconductor industry," said Mark Magill, Vice President of Medium High Vacuum at Busch Vacuum Solutions. "SubFab service capabilities and innovative products provide customers with reliable performance and maximum process safety to achieve optimal yields."

Magill also said they are featuring a new patented redundancy vacuum system at the show, “It uses an optimized combination of two pumps plus one booster to minimize changes in chamber pressure in case of pump failure.” This vacuum system eliminates wafer scrap and process excursion.

Visit Busch Vacuum Solutions at SEMICON WEST from July 11-15 in San Francisco, CA. Meet their experienced vacuum experts, exchange ideas and get valuable advice at booth #541.

About Busch
For more than 50 years, Busch has been an integral part of the global semiconductor industry by providing reliable solutions that enable manufacturers to produce advanced microchips. Their commitment to quality is in every product they offer and service provided. Continuous advancements ensure that Busch solutions are always state-of-the-art and used by hundreds of subfabs worldwide. www.buschusa.com | [email protected]

PEER Group®, the largest supplier of innovative factory automation software products for the semiconductor industry, has been announced as one of the founding members of the newly established SEMI® Midwest Chapter.

Formed to support SEMI member companies in the greater Midwest area and Ontario, Canada, the regional chapter provides a platform to identify, discuss, and find solutions to current topics impacting the semiconductor industry. The Midwest region has the potential to be a leader in semiconductor manufacturing following the 2022 groundbreaking of a new Intel® fab in Ohio and renewed industrial investments stimulated by the US Chips and Science Act.

Bob Kane, PEER Group’s Director of Factory Sales, will serve on the chapter’s Steering Committee and the Events Subcommittee. “The Midwest region, spanning into southern Ontario, has long been an industrial and manufacturing powerhouse and we’re excited to lend our support to the growth of the semiconductor industry in this strategically important region.”

To mark the establishment of the chapter, member companies are converging on Ann Arbour, MI on June 8 for the Inaugural SEMI Midwest Breakfast Forum. Taking place at the headquarters of process control and yield management company, KLA, attendees will hear from experts from the Center for Automotive Research, Intel, SK Siltron CSS, and SkyWater Technology as well as discuss future events and forums.

PEER Group is currently the chapter’s only Canadian company and sees this as an opportunity to help advance cross-border collaboration. “With our abundance of critical minerals, technology and trade infrastructure, and manufacturing talent, Canada has a strategic role to play in advancing North America’s domestic semiconductor supply,” says Mike Kropp, Co-founder, CEO, and President of PEER Group and member of the SEMI North American Advisory Board. “We look forward to working with other member companies to strengthen and expand semiconductor manufacturing in not only the Midwest, but all of North America.”

To register for the SEMI Midwest Breakfast Forum, visit: https://www.semi.org/en/connect/events/semi-midwest-chapter

About PEER Group
PEER Group® is the largest supplier of innovative factory automation software products for the semiconductor industry. Since 1992, our solutions have helped the world’s most advanced OEMs and factories reduce time to market and lower costs by solving their equipment automation, data management, and process control problems. A multi-award winning company, PEER Group has been named a Best Workplace by Great Place to Work Canada 11 times, and most recently was one of six recipients of Intel’s 2022 EPIC Outstanding Supplier Award, which recognizes the absolute top performers in the Intel supply chain. Follow PEER Group on LinkedIn and Twitter at @PEERgroup_Inc..

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Highlighted content

United States

Jennifer Braggin
Moderator
Jennifer Braggin
Director, Technology
Entegris
Soley Ozer, Intel
Dr. Soley Ozer
Strategic Assistant to Logic Technology Department GM
Intel
Stallar Jardine
Dr. Stallar Lufrano-Jardine
Sustainability & Supplier Diversity Program Manager
JSR Micro
EMG

In recent years, sustainability has emerged as a critical aspect of global development, demanding increased attention across industries. The semiconductor industry has a pivotal role to play in promoting environmental responsibility.

In this webinar we will hear the successes, challenges, and ongoing efforts from both a semiconductor device manufacturer and a semiconductor material supplier and how efforts across the supply chain influence each other. Join us as we foster knowledge sharing and collaborations to create a sustainable future for the semiconductor industry and the planet as a whole.

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A NEW CHAPTER IN MANUFACTURING INNOVATION

AMSTERDAM — DataProphet, a global leader in data-driven performance optimization solutions for digital-era manufacturing, is excited to announce the addition of Prof. Dr. Jürgen Grotepass to its esteemed industry advisory board.
Through his network and connections within the German Platform Industrie 4.0, ZVEI, and DIGITALEUROPE, Prof. Dr. Grotepass will help DataProphet extend its global footprint in the smart manufacturing space and establish additional strategic partnerships.

IMPACT EXPERIENCE WITH LEADING-EDGE 4IR INNOVATIONS
DataProphet’s inclusion of Prof. Dr. Grotepass in the broader team is a puzzle piece toward accelerating the adoption of solutions that move the needle on digital success in the manufacturing sector globally.

Prof. Dr. Grotepass brings over 30 years of experience in the manufacturing sector, with a strong background in machine vision technology. He holds a Ph.D. in electrical engineering from RWTH Aachen, focusing on Machine Vision.

The new advisory board member has been instrumental in driving digital transformation in the manufacturing industry as Chief Strategy Officer of Manufacturing Europe at HUAWEI Technologies Duesseldorf GmbH and the European Research Center (ERC) in Munich.

Prof. Dr. Grotepass has developed many AI supported and 5G-enabled Industry 4.0 use case innovations. A noteworthy example is via SmartFactory-KL in cooperation with 15+ industry partners. These showcased during Hannover Messe exhibits between 2018 and 2023. One of Prof. Dr. Grotepass’s projects solves for quality assurance. It uses machine vision to optimize the quality inspection of customized products by deploying secure cloud services and a federated learning approach.

DEMYSTIFYING MANUFACTURING’S DIGITAL-ERA — SOLUTION PROVISION, GUIDANCE, AND ALLIANCE
When asked what attracted him to collaborate with DataProphet in driving innovation in sustainable manufacturing performance, Prof. Dr. Grotepass shared this insight:

“Industries are currently progressing in the twin transition process (digital and green) with the carbon footprint of products and processes becoming a new currency. With access to data, AI will be a key enabler in turning empirical process knowledge into predictive solutions. Such solutions will yield savings for customers and related value chains.”

Prof. Dr. Grotepass points out that the electronics industry is spearheading digitalization and, therefore, is a good starting point for other verticals to frame their own digital maturity trajectory:

“In more traditional industries, such as steel and rubber, model creation for predictive and prescriptive AI still is a journey. Experience accumulates collaboratively over time. This is because process data in front end processes are still missing, calling for sensor integration to generate them.”

For traditional industries to evolve, Prof. Dr. Grotepass highlights the importance of multiple stakeholder collaboration and the role an AI-as-a-Service company like DataProphet plays in this context:

“Digitalization and the interaction between the three key players — solution provider, integrator, and end-user/operator — are becoming success indicators. DataProphet’s offerings in this domain serve as a solution provider, guide, and ally to customers on their journey.”

“With DataProphet, success is achieved with measurable KPIs. These include the OEE of processes and material as well as energy and carbon footprint savings, all demonstrated on customers’ premises,” Prof. Dr. Grotepass concludes.

NEXT-GENERATION MANUFACTURING PERFORMANCE SYNERGY
There is great synergy with DataProphet in Prof. Dr. Grotepass’s results-driven approach to manufacturing performance optimization. The AI-enabled quality assurance innovation mentioned earlier delivered a 30-40% productivity increase and lead time reduction.

Likewise, DataProphet prides itself on guaranteed value generation, its manufacturing customers enjoying a measurable return on assets and bottom line with the company’s data-driven solutions.

Prof. Dr. Grotepass’s background in academia, research, and industry leadership will provide DataProphet with unique insights, offering a well-rounded perspective on current trends, challenges, and opportunities in manufacturing.

In addition to his role at HUAWEI Technologies, Prof. Dr. Grotepass is a guest professor at Tongji University (CDHK: Chinese German College) in Shanghai. He is also an expert at the German Platform Industrie 4.0, as part of a working group on ‘Technology and Application Scenarios.’ Finally, at the ZVEI working Group ‘AI in Automation’ he acts as chairman, and is a DIGITALEUROPE Digital Manufacturing Executive Council member.

EXPANDING COLLABORATIVE MANUFACTURING INNOVATION FOR DIGITAL ERA SUCCESS
Prof. Dr. Grotepass’s wealth of expertise and experience will prove invaluable to DataProphet as it continues to innovate and expand its AI and ML offerings for the manufacturing sector. As Frans Cronje, CEO and co-founder at DataProphet, said of this development:

“We are honored to welcome Prof. Dr. Jürgen Grotepass to our industry advisory board. His vast experience and leadership in the manufacturing industry — particularly in machine vision, AI, and Industry 4.0 — will provide valuable insights and guidance. These will be brought to bear as we continue to develop end-to-end, cutting-edge AI and ML performance optimization solutions for our clients to realize value from the digital transition.”

And as Andrea Böhmert, Chairperson of the board of DataProphet, adds, “DataProphet is privileged to count a number of thought leaders in their respective fields as members of our Industry Advisory Board. These are our supporters, champions and guides in this fast changing industry and have been instrumental in ensuring that we as a team stay ahead of industry trends. Adding Prof. Dr. Jürgen Grotepass to this circle will help us to obtain even further insights into the latest thinking of some of Europe’s most active umbrella organizations driving industry initiatives. We couldn’t be closer to the pulse.”

Undoubtedly, Prof. Dr. Grotepass’s appointment to the industry advisory board will be a factor in extending DataProphet’s global footprint. His input will help ensure the company remains at the forefront of technological innovation in manufacturing worldwide.

Prof. Dr. Grotepass’s diverse experience working with multiple stakeholders, including OEMs, Tier 1 suppliers, and research institutions, shines a light on cross-industry collaboration. This is a strategy DataProphet passionately believes in.

About DataProphet
DataProphet is a global leader in AI-as-a-Service (AIaaS) process performance optimization for digital-era manufacturing success. Its IIoT platform and prescriptive AI technology measurably enhance efficiency, minimize waste, and improve product quality across industries. Clients experience a 40%+ increase in value with DataProphet PRESCRIBE, the company’s award-winning, results-driven, end-to-end prescription engine.

DataProphet tailors its solutions to each unique smart factory journey, supporting and accelerating digitalization roadmaps through consultation and collaboration. Manufacturers, Machine Builders, OEMs, and Tier 1 suppliers partner with its machine learning specialists to digitize processes, elevate their teams’ digital maturity, and realize their goals for sustainable production.