PENANG, MALAYSIA - MARCH 2023 ViTrox, which aims to be the world’s most trusted technology company, is excited to announce the launch of the enhanced Tray-based Vision Handler, TR1000S⁺i!

The semiconductor business is continually changing and has grown significantly in recent decades. Some industry developments worth noticing in recent years, particularly for Integrated Circuit (IC) packages, have emerged. These trends include miniaturisation and the increased demand for IC packages due to the growth of the consumer electronics market, the automotive industry, and the medical industry.

Additionally, manufacturers are actively looking for cost-effective and well-performing equipment to secure product quality, which also includes automating inspections. Hence, we are bringing you our enhanced Tray-based Vision Handler, TR1000S⁺i! This solution is designed to cater for 360° inspection of BGA, QFP, QFN, CSP, TSSOP, MSOP, and SOP packages handled in tray-to-tape inspections.

Our TR1000S⁺i is now enhanced with an improved PP3 design with an added nozzle. The users can experience faster unit pick-and-place with three nozzles and the inspection speed is greatly improved. This translates to an average UPH increase of 24%!

The TR1000S⁺i also houses the following features:
1) Built-in de-taping module: reduces conversion time with a movable linear guide with a built-in jig.
2) Fetcher module: shortens translation time and unit pick-up time to higher throughput.
3) Auto pitching mechanism: expedites nozzle pitch conversion.
4) Easy 3D calibrations: simplifies calibration process (place and slot, no adjustments needed)‏, fast (only 5 minutes) and auto-illuminated.

In general, TR1000S⁺i is the enhanced version of the previous TR1000Si system. With the enhancement of the Tape & Reel as well as the additional nozzle piece, it will greatly reduce the Pick & Place bottleneck and generate higher throughput which compliments the high-speed vision inspection time. Thus, our TR1000S⁺i will guarantee you both quality assurance and productivity which is worth the low cost of investments. To ensure that they have a smooth automation journey with ViTrox, we have a team of technical support experts that are ready to provide top-notch services to you.

Ready to kickstart your automation journey? Reach out to us at [email protected] to learn more about how you can automate your IC package inspection effectively!

About ViTrox Technologies
ViTrox is committed to being the World’s Most Trusted Technology Company and the leading solutions provider through the most innovative, advanced, and cost-effective machine vision solution of excellent quality to its customers by integrating its technologies, people, and strategic alliances.

ViTrox offers a full spectrum of solutions, ranging from Middle & Back-end Semiconductor Inspection Solutions, SMT PCB Assembly Vision Inspection Solutions, Electronics Communication Systems, and Industry 4.0 Manufacturing Intelligence Solutions. ViTrox is headquartered in Penang, Malaysia, with offices in Asia, Germany, and the United States and sales and support sites worldwide.

For more information about ViTrox’s products and services, please visit www.vitrox.com.

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Brewer Science Earns GreenCircle Certification for Zero Waste to Landfill for Eighth Consecutive Year
Brewer Science is the first company in the semiconductor industry with GreenCircle Certification

Rolla, Mo.– March 2023–Brewer Science, a global technology leader, is pleased to announce it has earned Zero Waste to Landfill Certification for the eighth consecutive year. The Zero Waste to Landfill Certification represents Brewer Science’s commitment to the responsible management of end-of-life materials and demonstrates the company’s commitment to waste diversion practices.

Brewer Science is the first company in the semiconductor and microelectronics industry to achieve GreenCircle Certification – Zero Waste to Landfill. GreenCircle certifies an organization for Zero Waste to Landfill Certification if 100% of the materials leaving the facility are intended to be diverted from landfill via one of GreenCircle’s acceptable means of diversion. Waste diversion from landfill, defined as the prevention and reduction of generated waste through source reduction, recycling, reuse, or composting, has been characterized as one of the best ways manufacturing companies can demonstrate genuine environmental responsibility.

The in-person, on-site audit of the Rolla and Vichy manufacturing locations assessed 767,588 lbs of waste, and the company’s disposal methods.

Converted to energy: 65%
Fuel blending: 18%
Recycling: 12%
Reuse: 5%

Education continues to play an important role in advocating for sustainable development across the supply chain. Brewer Science has developed a new program aimed at bridging the gap in environmental initiatives among its stakeholders.

“The Sustainability Outreach Program we are launching this year is designed to work with our partners, whether that be our employees, suppliers, customers, or other organizations in the communities in which we serve, to collaborate and align on sustainability programs and projects to have a net positive impact on the environment,” states Matthew Beard, Executive Director, Strategic Planning, Management Systems, and Sustainability at Brewer Science.

For semiconductor companies, it is essential to evaluate the materials used in manufacturing, identify any more environmentally friendly alternatives, and handle the waste responsibly. Brewer Science established its Green Chemistry Program in 2019, which is an effort to identify chemical alternatives that are proven to be more sustainable, as well as divert hazardous materials for reuse applications. Additionally, Brewer Science organizes an annual community collection recycling program partnering with waste disposal companies and volunteer crews to prevent community e-waste from becoming a part of a landfill. The company shares about its sustainability programs via its blog and its “Going Green” page to encourage other tech companies to adopt more sustainable practices.

About Brewer Science
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique monitoring systems for industrial, environmental, and air applications. Our relationship-focused approach provides outcomes that facilitate and deliver critical information. Our headquarters are in Rolla, Missouri, with customer support throughout the world. We invite you to learn more about Brewer Science at www.brewerscience.com.

About the GreenCircle Certified, LLC
GreenCircle Certified, LLC was established to ensure specificity in third-party certification after encountering many unsubstantiated claims in the marketplace. Since 2009, GreenCircle has offered forward-thinking companies a competitive advantage by providing specific, third-party certification of environmental claims. GreenCircle’s rigorous evaluation process provides independent verification that claims of sustainable aspects of products and operations are valid. Manufacturers, suppliers, regulators, occupants, and consumers can be assured that products labeled with the GreenCircle Certified mark have been thoroughly assessed and their claims verified to applicable standards. Learn more at www.greencirclecertified.com/.

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Rochester, N.Y. – Linton Crystal Technologies announces Edward Przybycien has joined the company as principal engineer. His responsibilities will include overseeing the research, development, design and optimization of Linton’s crystal growing machines, supporting processing equipment and accessories. As such, Przybycien will serve as design lead throughout the product realization process. Located in Henrietta, New York, Linton is the world leader in the design, development and manufacture of Czochralski (CZ) silicon furnaces for production of monocrystalline silicon ingots for the semiconductor and solar industries.

“We are thrilled to have Ed join our team,” says Scott Blazey, director of operations. “With more than 25 years of mechanical design and cost reduction experience specific to crystal growing furnace and hot zone design, Ed will be an integral part of our continued growth at Linton Crystal Technologies.”

Przybycien is a technical professional with a wide range of mechanical design and engineering management experience. This is complemented by business experience as the principal of Przybycien Consulting LLC, through which he provided technical trade compliance services for more than a decade prior to joining LCT.

His engineering experience includes several years as a professional engineering consultant providing specialized design expertise for hot zone development, vacuum chamber design, and development of retrofit devices for semiconductor processing equipment, as well as 13 years with Kayex, Linton’s predecessor. With Kayex, he began as a mechanical project engineer developing custom assemblies, was the project manager for the 300mm grower and then served as engineering manager. In this last role, he directed the activities of 12 mechanical, electrical, and software engineering personnel and managed order engineering, R&D and product maintenance worldwide.

Przybycien earned his B.S. in Mechanical Engineering magna cum laude from State University of New York at Buffalo. Additionally, he completed training in Complying in U.S. Export Controls and Encryption and Technical Data Controls from the U.S. Bureau of Industry and Security, as well as several trainings regarding U.S. export transactions and controls from the Export Compliance Training Institute.

About Linton
Linton specializes in silicon and produces equipment for materials such as germanium and gallium arsenide. They also provide technical support, process engineering support and replacement parts to help clients get businesses off the ground, improve productivity and continue to innovate. Linton has been the exclusive owner of Kayex technology since 2013.
For more information, visit www.lintoncrystal.com.

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SLiM 100 delivers real-time detection and quantification of VOCs to the 1 ppb level

Santa Clara, CA — March 14, 2023 — Picarro Inc., a leading provider of chemical metrology systems for advanced semiconductor fabs, today announced the SLiM 100 Lithography Process Tool Monitoring System. The new 1-ppb class chemical metrology solution detects volatile organic compounds (VOCs) in the lithography process in real time, enabling semiconductor manufacturers to quickly take steps to prevent excursions and detect non-visual defects, thereby improving yield.

As design features shrink, small amounts of airborne molecular contamination (AMC) from VOCs are resulting in significant increases in non-visual defects on reticles and wafers. Crystal growth defects on reticles, hazing of scanner optics, and t-topping of photoresists are some of the serious problems that are caused by the presence of undesired VOCs. Ultimately, these contaminants not only damage expensive lithography tools; they result in yield loss on the wafer.

To mitigate the negative effects of VOCs in the lithography process, fab operators need real-time measurements of VOCs at very low concentration levels. This is very difficult to do in the fab environment with traditional technologies because they are slow and difficult to use.

The SLiM 100 system is a real-time measurement system that is designed to run 24/7 in the fab environment. It is a fully integrated chemical metrology system that is robust, easy to operate, and is ideal for use as a high-volume process monitoring and control system. It measures and monitors 10 organic compounds that negatively affect the lithography process with concentration sensitivity down to 1 part per billion. The system can also accommodate analyzers that measure inorganic molecules at parts-per-trillion concentration levels.

“The Picarro SLiM 100 enables fab operators to detect and resolve semiconductor manufacturing issues much faster than other solutions,” said Dr. Sanjay Yedur, Director of Product Management at Picarro. “This robust system will allow them to reduce costs by halting production of defective wafers sooner and minimize downtime of lithography tools for maintenance and repair."

About Picarro Semiconductor Solutions
Picarro’s Semiconductor business offers industry leading solutions for airborne molecular contamination (AMC) and chemical contaminant monitoring within fabs and process tools. Picarro’s Semiconductor solutions respond to contaminants in seconds, not hours, enabling semiconductor manufacturers to quickly mitigate contamination events in cleanrooms, FOUP, and lithography process equipment – improving production yield. For more information, visit semi.picarro.com.

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Xpeedic today was named the 2023 Herb Reiter Design Tool Provider of the Year Award recipient by 3D InCites for its Metis platform, developed to address the signal/power integrity challenges arising from the advanced packaging for 2.5D/3D IC chiplet designs.

The award will be presented today by Françoise von Trapp, Founder, 3D InCites, during the IMAPS Device Packaging in Fountain Hills, Ariz. “Xpeedic only recently appeared on our radar when the company announced it was selected by Chipletz for its smart substrate products,” says von Trapp. “We were excited to have them participate in this year’s 3D InCites Awards program for the first time and congratulate them on winning the prestigious Herb Reiter Design Tool Provider of the Year Award.”

The Metis platform’s multi-scale capability and capacity advantage enables unified EM simulation of die, interposer, and substrate without resorting to an error-prone cut-and-stitch approach used by legacy electronic design automation (EDA) tools. Its multi-mode option offers engineers a choice of speed and accuracy to cover design phases from architectural exploration to sign-off.

“As a first-time 3D Incites Award nominee, we are honored to be selected as the 3D InCites Herb Reiter Design Tool Provider Award recipient and grateful to our community for voting for us,” remarks Feng Ling, Founder and CEO of Xpeedic. “We pledge to continue working with our customers and ecosystem partners to tackle 3D IC and heterogeneous integration design challenges as leading IC companies have done by adopting Metis for next-generation HPC chip design in data center, automotive and AR/VR applications.”

The 3D InCites Awards program, now in its 10th year, recognizes industry-wide contributions in the development of heterogeneous integration and 3D technologies. A total of 36 companies from around the world all working to advance the heterogenous integration roadmap were nominated for 10 award categories. Xpeedic was the winner of the online vote and garnered enough judge votes to win in the category. The award is named for Herb Reiter, who retired in 2020 after a distinguished career as an EDA tool designer, self-proclaimed 3D evangelist, 3D InCites blogger, and proponent of heterogeneous integration.

Metis Availability and Pricing
The Metis platform and the entire Xpeedic portfolio is available now. Pricing is available upon request.

Visit the Xpeedic website for additional information. Email requests should be sent to [email protected].

About Xpeedic
Xpeedic is a leading EDA provider to accelerate designs and simulations of next generation high-frequency, high-speed intelligent electronic products. Powered by its proprietary electromagnetic, circuit, and multi-physics solver technologies, Xpeedic is addressing challenges in designing IC in advanced nodes, 3D-IC with advanced packaging, high-speed digital, and RF systems for the markets including data center, automotive, communication, mobile, and IoT. Founded in 2010, Xpeedic has offices in both U.S. and China. For more information, please www.xpeedic.com.

Engage with Xpeedic
www.xpeedic.com
Twitter: @xpeedic
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Deventer, March 8, 2023 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, today announces that its wholly owned subsidiary RoodMicrotec GmbH has entered into an agreement for a full and final settlement with Prime Capital Debt SCS, SICAV-FIS – Robus Recovery Sub-Fund ("Robus") regarding the perpetual bond that RoodMicrotec GmbH issued in 2010 and which is held by Robus.

As announced on 21 February 2022, Robus had initiated legal proceedings against RoodMicrotec GmbH before the Regional Court of Frankfurt am Main. Robus claimed being entitled to an 11.7% compensation payment in relation to 2017, 2018 and H1-2021. In addition, alleging non-compliance by RoodMicrotec GmbH of the terms and conditions of the 2010 perpetual bond, Robus claimed the immediate and full repayment of the nominal amount of the perpetual bond asserting grounds for the extraordinary termination of the perpetual bond. The total amount claimed by Robus in the proceedings amounted to EUR 2,568k to be increased with 11.7% interest for the applicable period.

Following an oral hearing held on 7 March 2023, the parties have reached agreement on a full and final settlement that was reached before and confirmed by the Regional Court of Frankfurt am Main. Pursuant to the settlement, RoodMicrotec GmbH shall pay a total amount of EUR 2,194k, in four equal instalments of EUR 548k each, by 31 March, 30 June, 30 September and 31 December 2023. RoodMicrotec will be able to pay the installments from free available cash.

RoodMicrotec is pleased that the ongoing litigation procedure is now settled and the dispute is closed.

About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well-established as a highly valued partner for many companies worldwide. The Company provides full-turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors.
RoodMicrotec’s headquarter is located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.
For more information visit https://www.roodmicrotec.com

This press release is published in English and German. In case of conflict between these versions the English version shall prevail.

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