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BERLIN, Germany ─ March 15, 2022 – To strengthen cybersecurity for semiconductor manufacturing in Europe, the industry must unify behind security standards, support decision-makers in adopting new technologies, and identify new skill sets needed to deploy and manage cybersecurity hardware, SEMI, the global industry association representing the electronics manufacturing and design supply chain, announced today. The findings mark the conclusion of a joint industry project on cybersecurity led by Coventry University’s Centre for Future Transport and Cities (CFTC) Systems Security Group (SSG) to examine drivers of computer hardware security adoption among businesses and consumers. The final report is now available.

SEMI logo“With hardware security critically important to the semiconductor industry, this project is a great step toward strengthening manufacturing cybersecurity to enable a safe and secure digital life,” said Laith Altimime, president of SEMI Europe. “SEMI welcomes the findings and will address these cybersecurity issues with our members. We thank the SSG research team for its invaluable support and are pleased to have partnered with it on this strategic initiative.”

The project, approved by the U.K. government’s Economic and Social Research Council (ESRC)-funded Discribe (Digital Security by Design Social Science) Hub, sought to identify the highest business costs of deploying cybersecurity solutions and reasons businesses do not implement stronger cybersecurity measures.

Following are key findings:  

  • The secure hardware ecosystem welcomes unified standards and common needs. Compliance and standards are main drivers of the adoption of secure hardware.
  • Support decision-makers in making adoption decisions.When gauging the costs and benefits of deploying cybersecurity hardware, companies must assess effectiveness at a systemic level.
  • Identify new skills sets needed to help drive adoption. Cybersecurity developers must identify overlaps between existing and new skills in order to effectively deploy security solutions. Developers also need sufficient support to leverage new hardware features.

Discribe funded the project in its mission to promote the commercial adoption of security technologies, expand the deployment of cybersecurity and ultimately help protect global economies against cyberattacks.

About SEMI

SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter

Association Contact

Serena Brischetto / SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

MILPITAS, Calif. — March 7, 2022 — Advanced semiconductor manufacturing topics ranging from yield management and metrology to new developments in improving post-pandemic manufacturing agility will come into sharp focus at SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2022), May 2-5, 2022, in Saratoga Springs, New York. More than 65 industry experts will gather to deliver 30 hours of technical presentations on the latest manufacturing strategies and methodologies. Registration is now open.

ASMC logoExpected to draw hundreds of attendees from across the industry, the 33rd annual ASMC will feature discussions on the global COVID-19 pandemic’s impact on manufacturing leadership, semiconductor market trends, heterogenous integration and quantum computing.

ASMC is the premier event for industry professionals to network and share insights into best practices for semiconductor manufacturing. The conference is co-chaired by Dr. Jean Wynne of IBM and Dr. Shubhodeep Goswami of GE Research.   

ASMC 2022 Keynotes and Invited Presentations

Bu

 

Dr. Huiming Bu, Vice President, Hybrid Cloud Technology Research & Albany Operation, 
IBM Research

The Future of Semiconductors: Chips and Chiplets

IBM

 

Hanford

Deirdre Hanford, Chief Security Officer, Synopsys

Product Innovation and the Acceleration of Design: Demand Drivers on a Secure and Resilient Supply Chain

 

Synopsys

 

Maire

Robert Maire, President, Semiconductor Advisors 

Emerging Trends in the Global Semiconductor Market

 

Loubet

Dr. Nicolas Loubet, Senior Technical Staff Member, Advanced CMOS Logic, IBM Research

Nanosheet Tutorial

IBM

 


ASMC 2022 technical sessions will cover topics including:

  • Advanced Process Control
  • Advanced Equipment Processes and Materials
  • Advanced Metrology
  • Advanced Semiconductor Developments
  • Contamination Free Manufacturing
  • Defect Inspection
  • Equipment Optimization
  • Factory Automation/Industrial Engineering/Smart Manufacturing
  • Yield Enhancement/Yield Management

ASMC will also feature the panel discussion Big Data and Artificial Intelligence for Operations Management in Advanced Semiconductor Manufacturing Industry.

This year the Women in Semiconductors (WiS 2022) program takes place on May 2 in conjunction with ASMC 2022. The program will address the importance of promoting diversity and inclusion in the workplace. Complimentary registration for is available for ASMC attendees. 

For more conference details, contact Paul Cohen at [email protected].                

About SEMI

SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

MILPITAS, Calif. – March 7, 2022 – The vital importance of workplace inclusion and diversity to the growth of the global semiconductor industry will take center stage as the Women in Semiconductors (WiS) program returns in-person on May 2 in conjunction with the SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2022) in Saratoga Springs, New York. WiS 2022 continues to connect more women in the semiconductor manufacturing industry while driving critical discussions across genders. Registration is complimentary to ASMC registrants and is now open.  

WiS logoWiS 2022 builds on the strength of past events with themes including mentorship, career networking and the critical role of companies in promoting gender diversity in the workplace. Industry stakeholders ranging from company leaders, team members and developers of internal programs supporting women will benefit from expert insights, open discussion and networking opportunities at WiS 2022. University STEM students and faculty attending WiS 2022 will learn more about these key workforce development issues and network with industry professionals as the chip industry continues to build its talent pipeline.  

The WiS 2022 keynote, Girls in STEM to Women in Leadership, will be presented by Garima Gautam, Supply Chain R&D Engineer at Intel Corporation. Alicia Scott, Sr. Director of People, Culture and DEI at onsemi, will share her journey from engineering to leadership in creating a more diverse and inclusive environment for the semiconductor industry.

A panel on Why Mentor? Why be Mentored, moderated by Shari Liss, Executive Director of the SEMI Foundation, includes panelists from Energetiq Technology, GlobalFoundries, IBM Research and TEL. WiS also includes an interactive breakout session on topics ranging from mentoring, leadership and addressing the broken rung.

WiS is co-chaired by Sarah El-Helw of Texas Instruments and Dr. Manjusha Mehendale of Onto Innovation.

For program details, please contact Margaret Kindling at [email protected] or (202) 393-5552.

About SEMI

SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

KUALA LUMPUR – 4 March 2022 – Semiconductor supply chain sustainability and resilience will come into sharp focus 21-23 June 2022 as SEMICON Southeast Asia, the region’s premier gathering of the semiconductor and microelectronics industry, returns to the Setia SPICE Convention Centre & Arena in Penang, Malaysia following a two-year hiatus due to the pandemic. Registration is open.

SEMICON Southeast Asia logo

“The rise of the cloud, 5G deployment, connected vehicles, and digitization have created unprecedented demand for high-perfor­mance computing,” said Linda Tan, president of SEMI Southeast Asia. “As the backbone of the connected world, the semi­conductor industry must maintain a sustainable balance of demand and supply to ensure the resiliency and flexibility of its supply chain. Insights into integrated supply chain networks are critical in enabling the industry to identify and manage any disruptions. SEMICON Southeast Asia 2022 will delve into this and much more as we continue our work to support industry players in Malaysia and around the region.”

SEMICON Southeast Asia 2022 will commemorate Malaysia’s 50th Year of Manufacturing Excellence and celebrate Penang’s reputation as the Silicon Valley of the East, built on decades of manufacturing excellence and industrial experience.

Themed Forward as One – Building A Resilient and Sustainable Electronics Supply Chain in Southeast Asia, SEMICON Southeast Asia 2022 will gather industry experts for the latest developments, innovations and trends across the semiconductor supply chain. Semiconductor manufacturing equipment companies, private-and-public partners and industry players will connect to explore new collaboration and growth opportunities.

“The electrical and electronics (E&E) industry is the cornerstone and strength of Malaysia’s manufacturing sub-sector, and the sector has grown tremendously, accelerated by the demands for semiconductors and chips during the pandemic,” said Datuk Arham Abdul Rahman, Chief Executive Officer of the Malaysian Investment Development Authority (MIDA). “MIDA is honoured to have worked with SEMI for the past eight years to promote and update our industry stakeholders on the technological advancements. We continue to value this partnership since the exposure to emerging trends and industry networking opportunities offered and gained at previous SEMICONs have been important to our prominent E&E industry players.”

“MIDA is committed to expanding our manufacturing ecosystem by encouraging and pursuing high-quality, high-technology investments driven by global digitisation in this industry in order to strengthen Malaysia’s supply chain, product innovation and talent development capabilities,” Rahman said. “SEMI Southeast Asia 2022 is perfectly aligned with our aspirations of encouraging the development of the industry through proactive and guided measures while allowing potential investors to explore Malaysia’s competitive advantages as an ideal investment destination.”

As part of Malaysia’s jubilee celebration, attendees at SEMICON Southeast Asia 2022 will feature a robust lineup of experts and thought leaders from semiconductor organisations around the world.

SEMICON Southeast Asia 2022 Highlights

  • Smart Manufacturing Pavilion will focus on technologies that can increase manufacturing efficiency as well as sustainable practices to minimise impact on the environment.
  • Smart Mobility Pavilion will showcase technologies and innovations that are driving urban mobility.
  • IoT Pavilion will highlight existing and emerging technologies and applications enabled by semiconductor innovation.
  • Technical Forums will offer insights on industry trends whilst providing networking and other information-sharing opportunities.
  • CxO Summit sessions will feature industry opinion leaders.
  • Business Matching Programs will connect industry players to explore business and technology partnerships and opportunities.
  • Workforce Development Pavilion will feature a career fair and talks by industry experts to help the industry build its talent pipeline.
  • Career Fair and SEMICON University Program will support workforce development in Malaysia.

To register for SEMICON Southeast Asia 2022 or for more information, visit the conference website.

About SEMI

SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Media Contacts

Ryan Teo
SEMI Southeast Asia Pte Ltd
[email protected]
+65 9859 0883

Reshvinder Kaur
[email protected] / [email protected]
+6017 275 7985

MILPITAS, Calif. — February 28, 2022 — SEMI, the industry association representing the global electronics design and manufacturing supply chain, today released the results of a survey of more than 400 U.S. member companies that highlight challenges facing the semiconductor industry. The survey results also offer insights into SEMI member perspectives on enhancing U.S. competitiveness through targeted public and private investments aimed at developing the industry’s manufacturing capacity, infrastructure and workforce. SEMI conducted the survey in partnership with MITRE Engenuity, the technology foundation for public good launched by MITRE two years ago.SEMI logo

“SEMI member insights from the survey are important guideposts for government investments to strengthen the U.S. microelectronics industry and ensure supply chain security,” said Melissa Grupen-Shemansky, CTO of SEMI. “Strategic investments in the domestic microelectronics industry are a significant opportunity for the U.S. to bolster its economy and better compete with other regions that incentivize their industrial development.”

Following are three primary takeaways from the survey:

  • Invest in the Entire Semiconductor Ecosystem: The U.S. needs to invest in a broad range of next-generation semiconductor technologies to help fuel innovation in areas including materials, equipment, packaging, security, machine learning, and advanced CMOS. Investments would help the U.S. retain leadership in several segments and regain the top position in others vital to national security. Opportunities for research and development span the entire semiconductor supply chain.
  • Public and Private Funding is Key: A combination of government and industry funding is key to strengthening domestic chip manufacturing and commercialization. Access to technical talent and research and development facilities is also vital.
  • Invest in Multi-Generational Workforce Initiatives: The U.S. semiconductor industry faces a dire shortage of talent for critical manufacturing and technical roles. Investments in K-12 STEM education, higher education, apprenticeships and vocational training must be made to alleviate workforce shortages.

“MITRE Engenuity is thrilled to partner with SEMI on the industry survey,” said Laurie Giandomenico, Chief Acceleration Officer for MITRE and MITRE Engenuity’s founder. “Our partnership is an example of a collaborative effort that will catalyze industry to come together.  We believe this is essential for national security as well as a healthy, global, semiconductor industry. The National Semiconductor Technology Center (NSTC) provides an opportunity to shape and revitalize the semiconductor ecosystem in the United States. Together we will tackle the complex challenges facing an industry that is foundational to the technologies that we work on with our government sponsors and industry partners. Our goal is to help ensure American innovation truly leads to American growth and create generational impact.”

Survey Respondents Overview

  • More than two-thirds of the respondents (~270) represented the materials, components, equipment, and device-maker markets.
  • Respondents included assembly and test as well as design automation companies.
  • Although all participants were based in the U.S., 25% represent companies headquartered abroad.
  • Over half of the survey respondents were C-suite level or hold executive leadership roles (e.g., VP, General Manager, Director).
  • Nearly a quarter of the respondents were engineers, scientists, and technical staff.
  • More than 50 respondents hold business development and strategic partnership roles.

Survey Respondents by Market Segment

Download the full study.

 

About SEMI

SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

About MITRE Engenuity

MITRE Engenuity, a subsidiary of MITRE, is a tech foundation for the public good. MITRE’s mission-driven teams are dedicated to solving problems for a safer world. Through our public-private partnerships and federally funded R&D centers, we work across government and in partnership with industry to tackle challenges to the safety, stability, and well-being of our nation.

MITRE Engenuity brings MITRE’s deep technical know-how and systems thinking to the private sector to solve complex challenges that government alone cannot solve. MITRE Engenuity catalyzes the collective R&D strength of the broader U.S. federal government, academia, and private sector to tackle national and global challenges, such as protecting critical infrastructure, creating a resilient semiconductor ecosystem, building a genomics center for public good, accelerating use case innovation in 5G, and democratizing threat-informed cyber defense.

www.mitre-engenuity.org

SEMI Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

New edition of SEMI and TechSearch International database encapsulates global footprint of key semiconductor industry segment

MILPITAS, Calif. – February 23, 2022 – SEMI and TechSearch International today announced a new edition of the Worldwide Assembly & Test Facility Database offering significantly expanded coverage that now includes integrated device manufacturer (IDM) facilities. The database – the only commercially available outsourced semiconductor assembly and testing (OSAT) supplier database available – is an essential business tool for any organization requiring the latest updates on facilities that provide packaging and testing services to the semiconductor industry.

SEMI logoFormerly known as the Worldwide OSAT Manufacturing Sites Database, the comprehensive database now includes more than 100 updates spanning packaging technology, product specialization and ownership/shareholder. With more than 100 new test facility additions to bring the total number of facilities tracked to 475, the database helps semiconductor manufacturers identify service offerings around the globe, an increasingly important task in supply chain management.

“In today’s climate of supply chain disruptions, it is more important than ever to have a good understanding of assembly and test locations,” said Jan Vardaman, president at TechSearch International. “The updated Worldwide Assembly & Test Facility Database is a valuable tool in keeping track of the packaging and assembly ecosystem.”

“Packaging, assembly and test are increasingly becoming key to furthering Moore’s Law through advanced technologies as well as reducing form factor and power consumption as the semiconductor industry continues to drive higher chip performance,” said Sanjay Malhotra, vice president of Corporate Marketing at SEMI. “The Worldwide Assembly & Test Facility Database shows increased focus on advanced packaging and new test capabilities to support innovations in computing, communications and other key end markets.”
 

OSAT Database chart

 

Combining the semiconductor industry expertise of SEMI and TechSearch International, the Worldwide Assembly & Test Facility Database update also lists revenues of the world's top 20 OSAT companies and captures changes in technology capabilities and service offerings.

The Worldwide Assembly & Test Facility Database offers insights into facilities in China, Taiwan, Korea, Japan, Southeast Asia, Europe and the Americas. The report highlights new and emerging packaging offerings by manufacturing locations and companies. Specific details tracked include:

  • Plant site location, technology, and capability: Packaging, Test, and other product specializations, such as sensor, automotive and power devices are highlighted
  • Packaging assembly service offered: Ball grid array (BGA), specific leadframe types such as quad flat package (QFP), quad flat no-leads (QFN), small outline (SO), flip-chip bumping, wafer-level package (WLP), Modules/System in Package (SIP), and sensors
  • New manufacturing sites announced, planned or under construction

Tracking advances in packaging technology – which directly affects chip performance, reliability, and cost – requires understanding company offerings by location. Key features of the updated report include:

  • More than 200 companies and more than 475 total back-end facilities (IDMs and OSATs)
  • Over 325 facilities with Test capabilities
  • Over 100 facilities offering leadframe chip-scale package (CSP)
  • Over 80 bumping facilities, including over 50 with 300mm wafer bumping capacity
  • More than 90 facilities offering wafer-level CSP (WLCSP) technology
  • New facilities offering fan-out wafer-level packaging (FOWLP) and fan-out panel-level packaging (FOPLP)
  • Over 110 OSAT facilities in China, over 100 in Taiwan, and over 45 in the Americas
  • Over 50 IDM Assembly and Test facilities in Southeast Asia, around 25 in China, and around 20 in the Americas 

Worldwide Assembly & Test Facility Database licenses are available for single-user and multi-users. SEMI members save up to 25 percent or more on licenses depending on the type. A sample copy of the report and pricing and ordering information for the database are available online.

For more information or to subscribe to SEMI market data, visit the SEMI Industry Research and Statistics Group online or contact [email protected].

 

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

About TechSearch International, Inc.
Founded in 1987, TechSearch International (Austin, Texas) is a technology licensing and consulting company specializing in accurate, relevant, and timely information on advanced packaging technology and market developments. Visit www.techsearchinc.com.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

MILPITAS, Calif. ─ February 16, 2021 – Advances driving the next generation of medical and mobility applications will take center stage at the SEMI MEMS and Sensors Technical Congress (MSTC 2022), April 26-27, 2022, as industry visionaries and experts gather to discuss the latest MEMS and sensors trends and innovations. Themed Sensorization: Technology for Better and Smarter Living, the in-person event at the David Brower Center in Berkeley, California will feature keynotes, panels, technical sessions, student posters and networking opportunities for participants to help grow their businesses. Registration is now open.

MSTC 2022 Sponsored by the SEMI MEMS & Sensors Industry Group (MSIG), MSTC 2022 will offer a deep dive into how to bring sensor products to market, from design through fabrication, testing and packaging, to end-use applications. Industry experts will explore the software and systems needed to expand both legacy and emerging MEMS and sensors to open new markets and business opportunities.

MSTC 2022 Keynote Speaker

Gary O'Brien

Gary O’Brien, Ph.D., NG Fellow, Innovation Systems, Flight Systems Division, Northrop Grumman Corporation (at Kennedy Space Center)

MEMS Aerospace Applications and Environments

Northrop Grumman logo


MSTC 2022 Technical Sessions 

MSTC 2022 will also showcase MEMS and sensors applications in the following areas:

  • MEMS and sensors for better living
  • MEMS for AR/VR
  • Quantum sensors  
  • Fab processing and technology
  • Sensors for better working 

More MSTC 2022 Highlights

  • Packaging process showdown 
  • Actuators session 
  • UC Berkeley College of Engineering lab tours, hosted by the Berkeley Sensor & Actuator Center
  • Networking reception showcasing technology application posters from future innovators – UC Berkeley students

See the complete agenda for MSTC 2022. Follow MSTC 2022 on Twitter and LinkedIn.

MSTC 2022 is the third of eight conferences comprising SEMI’s third annual Technology Leadership Series of the Americas. This coast-to-coast series provides a platform to foster critical discussions on short- and long-term influences as well as technical and business opportunities in the greater than $2.5 trillion global electronics markets.
 

About SEMI

SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

BRUSSELS, Belgium ─ February 08, 2022 – SEMI, the global industry association representing the electronics manufacturing and design supply chain, today applauded the publication of the European Chips Act. Launched to reinvigorate semiconductor manufacturing and innovation, the act calls to quadruple Europe’s production capacity by 2030 and lays out measures to avoid future supply chain disruptions.

SEMI logoUnder the act, the European Commission is called to step up investments in Europe’s capabilities to innovate in the design, production and packaging of advanced chips. Additionally, the act aims to strengthen the European Union’s R&D leadership and to address the skills shortages in the region.

“SEMI supports the European Chips Act and similar legislation and incentives designed to strengthen the resilience of the global semiconductor industry and create a more robust supply chain,” said Ajit Manocha, SEMI president and CEO. “The current chip shortage has extended lead times for semiconductor manufacturing equipment and materials, thus delaying efforts to expand semiconductor production capacity. To maximize the effectiveness of incentives aimed at expanding capacity and addressing extended supply chain issues, they should include investments in both new and existing semiconductor manufacturing equipment and materials facilities.”

“The European Chips Act is about bolstering Europe’s strengths,” said Luc Van den hove, chairman of the Semi Europe Advisory Board and president and CEO at imec. “By building on Europe’s unique assets, such as its leading equipment and material suppliers and its top-notch R&D, and by strengthening its manufacturing capabilities, both for mature as well as advanced technologies, Europe will reinforce its position in the global semiconductor ecosystem. This will secure Europe’s access to chip supplies that are indispensable for Europe's dominant industrial markets, as well as for its flourishing deep-tech start-up scene. Advanced chip technologies will pave the way to the next generation of innovative applications in autonomous cars, AR/VR, 6G-communication networks, smart robots, health diagnostics and personalized therapies. We are excited about this bold initiative to boost the European industry and are looking forward to contribute to it”.

“SEMI and the regional electronics ecosystem see the European Chip Act as a major step forward to advance the resilience and growth of the semiconductor industry in Europe,” said Laith Altimime, president of SEMI Europe. “With the shortage of critical components impacting the growth of numerous industries globally, we applaud the introduction of this timely initiative. We look forward to work with the European Commission and SEMI members to support this proposal and strengthen the European semiconductor ecosystem.” 

The European Chips Act is a key step forward to reinforce Europe’s capacities in semiconductors as a precondition for its future competitiveness, as well as a matter of technological security. The act is designed to build on the strengths of Europe’s semiconductor ecosystem and to address its weaknesses, supporting the European Union’s aims to develop a thriving, resilient supply chain and set measures to prepare for, anticipate and respond to future disruptions.

The European Chips Act is centred around five strategic objectives for the region:

  • Strengthen its research and technology leadership
  • Build and reinforce its own capacity to innovate in the design, manufacturing, and packaging of advanced chips, and turn them into manufactured products
  • Put in place an adequate framework to substantially increase its production capacity by 2030
  • Address the acute skills shortage, attract new talent, and support the emergence of a skilled workforce
  • Develop an in-depth understanding of global semiconductor supply chains

The unveiling of the European Chips Act is in line with similar initiatives to support semiconductor industry growth around the world. For example, in the United States, current legislation under consideration calls for US$52 billion in funding to increase domestic semiconductor production. Similarly, South Korea’s National Assembly approved rules and tax incentives to support and safeguard the local semiconductor industry, while China established 15 local semiconductor funds in a bid to supply 70% of its own chips needs by 2025.

Visit SEMI Global Advocacy and SEMI Europe Advocacy to learn more about SEMI public policy efforts.
 

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.
 

Association Contact

Serena Brischetto / SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

MILPITAS, Calif. — February 8, 2022 — Worldwide silicon wafer area shipments in 2021 increased 14% while wafer revenue rose 13% compared to 2020, topping $12 billion, to reach new all-time highs, the SEMI Silicon Manufacturers Group (SMG) reported in its year-end analysis of the silicon wafer industry.

SEMI logoSilicon shipments totaled 14,165 million square inches (MSI) compared to 12,407 MSI shipped in 2020 to meet surging broad-based demand for semiconductor devices and a wide variety of applications. 300mm, 200mm and 150mm wafer sizes all saw strong demand. Wafer revenue reached $12,617 million, surpassing the previous record of $12,129 million set in 2007.

“The robust year-over-year growth in silicon wafer area shipments and revenue reflects the heavy dependence of the modern economy on silicon wafers,” said Neil Weaver, outgoing chairman SEMI SMG 2018-2021 and vice president, Product Development and Applications Engineering at Shin Etsu Handotai America. “Wafers are the engine of digital transformation and new technologies that are reshaping how we live and work.”

                                           

Wafer Shipments


All data cited in this release includes polished silicon wafers such as virgin test wafers and epitaxial silicon wafers, as well as non-polished silicon wafers shipped to end users.

Silicon wafers are the fundamental building material for the majority of semiconductors, which are vital components of all electronic devices. The highly engineered thin disks are produced in diameters of up to 12 inches and serve as the substrate material on which most semiconductor devices, or chips, are fabricated.

The SMG is a sub-committee of the SEMI Electronic Materials Group (EMG) and is open to SEMI members involved in manufacturing polycrystalline silicon, monocrystalline silicon or silicon wafers (e.g., as cut, polished, epi). The SMG facilitates collective efforts on issues related to the silicon industry including the development of market information and statistics about the silicon industry and the semiconductor market.

For more information, please visit SEMI Worldwide Silicon Wafer Shipment Statistics.

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

MILPITAS, Calif. – February 4, 2022 – SEMI, the industry association serving the global electronics design and manufacturing supply chain, today commended the passage of the America COMPETES Act of 2022 by the United States House of Representatives. The bill includes funding for the Creating Helpful Incentives to Produce Semiconductors for America (CHIPS) Act, earmarked to strengthen U.S. semiconductor manufacturing and research.

SEMI logo“We are very pleased to see the House pass the America COMPETES Act of 2022 including robust funding for the CHIPS Act programs,” said Ajit Manocha, SEMI president and CEO. “This bill also includes an important clarification to ensure equipment and materials suppliers can access the Section 9902 grant program. With this provision, the CHIPS programs will attract new manufacturing facilities – both chip fabs and facilities for upstream suppliers – and support technologies and innovation critical to numerous industries in the U.S. and around the globe. This bill will strengthen the semiconductor supply chain in the United States to meet the challenges of the twenty-first century as well as bolster crucial workforce development programs. We look forward to working with Congress and the Biden Administration to quickly enact this funding into law.”

“We continue to urge quick action on the Advanced Manufacturing Investment Credit and restoration of the ability to immediately deduct research expenses which was removed at the start of this year,” Manocha said.

Visit SEMI Global Advocacy to learn more about public policy efforts and developments, and SEMI Workforce Development for more information on efforts to address the microelectronics industry’s talent needs.

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

SEMI Contact

Samer Bahou/SEMI

Phone: 1.408.943.7870

Email: [email protected]