MILPITAS, Calif. — November 3, 2021 — SEMICON West, North America’s premier microelectronics exhibition and conference that unites players across the entire electronics manufacturing and design supply chain, and FLEX Conference, the annual event focused on flexible hybrid and printed electronics innovations, will co-locate at the Moscone Center in San Francisco, July 11-14, 2022. Registration for both events will open next spring.
“Flexible hybrid electronics (FHE) technologies are key drivers of digital transformation as they advance to enable smart transportation, buildings and infrastructure, equipment sensorization, and wearable and conformable medical devices,” said Dr. Melissa Grupen-Shemansky, SEMI CTO and vice president of SEMI Technology Communities. “Next year’s co-location of SEMICON West 2022 and FLEX Conference 2022 will gather microelectronics and FHE leaders to explore new innovation opportunities across both industries as they work together to advance system-level products through critical technologies such as heterogeneous integration.”
“With collaboration the fuel of microelectronics innovation, the co-location of SEMICON West 2022 and FLEX Conference 2022 promises to uncover new ways for semiconductor and FHE leaders to accelerate global digitization in ways that continue to improve how we work and live,” said David Anderson, president of SEMI Americas.
FLEX Conference, in its 20th year, showcases innovations emerging from public-private partnerships formed by SEMI Technology Communities SEMI-FlexTech, SEMI-NBMC (Nano-Bio Materials Consortium) and SEMI-NextFlex. At FLEX Conference 2022, keynotes, panels discussions, technical sessions, and product-based TechTALKS will highlight the latest advances in flexible and printed electronics, including applications that deepen interactions between users and their surroundings. The event will focus on equipment, processes, materials and applications driving the latest technology breakthroughs and how they help shape business strategy.
The Design Automation Conference (DAC), the largest meeting in the electronic design automation (EDA) industry, will also co-locate with SEMICON West 2022. Registration will open in the spring of 2022.
About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), MEMS & Sensors Industry Group (MSIG) and the SOI Consortium, are SEMI Strategic Technology Communities, defined groups within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.
Association Contact
Scott Stevens, Cardinal Communications for SEMI Americas
Phone: 1.512.288.4050
Email: [email protected]
“Silicon wafer shipments reached a new high in third quarter, with higher shipments in all diameters, which support the large variety of semiconductor devices needed for the modern economy,” said Neil Weaver, Chairman of SEMI SMG and Vice President of Product Development and Applications Engineering at Shin Etsu Handotai America. “Silicon wafer demand is expected to remain high, as many new fabs will ramp up in the next several years.”
“SEMI is thrilled that a semiconductor manufacturing tax credit for the production of chips and semiconductor tools has been included in the Build Back Better reconciliation bill,” said Ajit Manocha, SEMI president and CEO. “This credit will provide a strong incentive for the production of semiconductors and semiconductor manufacturing equipment in the United States and make the U.S. more competitive in this vital industry. We thank President Joe Biden, Senate Finance Committee Chairman Ron Wyden for his leadership and determination to include this provision, and the original co-sponsors of the FABS Act.”
“Monthly billings of North America-based semiconductor equipment manufacturers edged up in September to near the record high set in July,” said Ajit Manocha, president and CEO of SEMI “The ongoing growth in key end-market segments and silicon content continues to drive gains for the semiconductor manufacturing ecosystem including equipment.”





“We are seeing a significant increase in silicon shipments driven by strong secular demand for semiconductors across multiple end markets,” said Inna Skvortsova, an Industry Research & Statistics market analyst at SEMI. “The growth momentum is expected to continue in the following years but could be tempered by the slowing pace of the macroeconomic recovery and timing of the wafer manufacturing capacity additions needed to meet growing demand.”
“The industry reported double-digit year-over-year revenue growth for Q2 2021,” said Walden C. Rhines, Executive Sponsor, SEMI Electronic Design Market Data report. “Product categories Computer Aided Engineering (CAE), Printed Circuit Board and Multi-Chip Module (PCB and MCM), Semiconductor IP (SIP), and Services all reported double-digit growth.”
China is expected to claim the largest share of installed capacity – 33% – by 2023, followed by Japan at 17%, Europe and the Mideast at 16%, and Taiwan at 11%, proportions that are expected to change little as the industry remains on track to add more than 360,000 WPM in 2024.