MUNICH, Germany ─ May 24, 2022 ─ SEMI Europe today announced the opening of the call for abstracts for SEMICON Europa 2022, Europe’s premier event connecting the entire electronics design and manufacturing supply chain, as the event returns to Messe München 15-18 November, in Munich, Germany for a live exhibition and conferences. Selected speakers at SEMICON Europa 2022, co-located with electronica, will share their expertise to the global microelectronics industry at the Advanced Packaging Conference (APC) and Fab Management Forum (FMF).

SEMICON Europa 2022 will convene experts and technologists for insights into the latest technology, materials and process innovations powering digital transformation and the next wave of semiconductor industry growth. The event will spotlight cutting-edge solutions that enable chipmakers to implement a broad range of new application-specific technologies.

Advanced Packaging Conference ─ Advanced Packaging Solutions in the Era of Digital Transformation

Advanced electronics packaging are integral to the system solutions required to enable mega trends in computing and communications and leading applications in markets such as medical devices and automotive. With collaboration critical to technology advances, experts from across the semiconductor supply chain who are driving innovations, technology concepts or roadmaps are invited to submit abstracts on advancements in the areas of Packaging/Assembly, Wafer/Package Test and Modelization. The submission deadline is June 10, 2022.

Fab Management Forum ─ Industry Meets Academia

New university graduates and young innovators looking to launch careers in the semiconductor industry will present their research and early-stage products to established fab managers. Key topics of interest are the Status of AI in Microelectronics Manufacturing and Advanced Analytics and Digital Twins for Faster, More Precise Decision Making. Students with doctorate and master’s degrees and their professors, as well as postgraduate researchers, research institutes and early start-ups and spinoffs, are invited to submit abstracts by June 17, 2022.  

Pre-recorded Presentations

In addition to the in-person programs, experts are invited to submit abstracts for the pre-recorded sessions on Friday, November 18. All pre-recorded presentations will be available to SEMICON Europa attendees onsite and virtually through the event website. The submission deadline is July 31, 2022.

Presentation abstracts, biographies and headshots must be submitted on the SEMICON Europa 2022 Call for Abstracts webpage. The conference language is English. All selected presenters will be notified in July 2022.

For more details, please visit the SEMICON Europa 2022 website and connect with SEMI Europe on Twitter or LinkedIn @SEMIEurope (#SEMICONEuropa).

SEMICON Europa Premier Sponsors

• Platinum: TEL
• Gold: Edwards, JCET
• Silver: Evatec, SÜSS MicroTec
• Event sponsors: ASE Group, Atotech INFICON, Lam Research, SCREEN

About SEMI

SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Serena Brischetto / SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

• Read more about SEMICON Europa 2022 Call for Abstracts Opens: Advanced Packaging Conference and Fab Management Forum

MILPITAS, Calif. — May 24, 2022 — SEMI, the global industry association that unites the entire electronics manufacturing and design supply chain, today announced that technology industry veteran and longtime SEMI member Joe Stockunas has joined SEMI as Americas President, reporting to Kevin Bauer, Chief Financial and Business Operations Officer.

Stockunas will lead the SEMI Americas staff in increasing the value SEMI delivers to members, directing North America sales and services, and driving events and programs. He will also advocate for the microelectronics industry as part of the SEMI Global Leadership Team.

“We’re thrilled to welcome stalwart SEMI supporter Joe Stockunas to the organization and look forward to his leadership in advancing the interests of our member companies in the Americas,” said Ajit Manocha, SEMI president and CEO. “Joe’s passion for the semiconductor industry will be a tremendous asset to SEMI as he works to help our members grow their businesses and seize new partnership and innovation opportunities.”

“SEMI’s work to connect the global semiconductor ecosystem to the broader electronics supply chain is critical in driving digital transformation and addressing the industry’s most pressing challenges,” Stockunas said. “I’m eager to collaborate with the SEMI leadership team, staff and members to help the organization and the industry fulfill their extraordinary potential. I look forward to meeting with members and key industry stakeholders at SEMICON West this July.”

Stockunas and SEMI Americas will host SEMICON West Hybrid, North America’s premier microelectronics exhibition and conference, July 11-14, 2022, at the Moscone Center in San Francisco. Registration is open.

Stockunas replaces former SEMI Americas Regional President David Anderson, who is now president of NY CREATES, a research and economic development non-profit in New York state that performs advanced research in a number of technical areas.

Before joining SEMI, Stockunas served as executive vice president and corporate officer of Nordson Corporation, a leading global precision technology supplier, overseeing the company’s worldwide electronics systems business. Prior to Nordson, Stockunas worked at Air Products and Chemicals, Inc. for more than 30 years and held leadership positions in the materials and equipment business units of its Electronics Division.  

Stockunas previously served on the SEMI North America Advisory Board, SEMI Board of Industry Leaders, the Nordson Corporate Foundation and SEMI Foundation boards. He also served on global and non-profit boards of organizations including Showa Denko K.K., Kawasaki, The Bethlehem Historic Partnership, Hanyang Technologies, TriMEGA Electronics LLC, and the American Red Cross.

Stockunas received a B.S. in Metallurgy and Materials Engineering and completed his graduate studies at Lehigh University.

About SEMI

SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact   

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Technology Industry Veteran Joe Stockunas Joins SEMI as Americas President

DRESDEN, Germany — May 16, 2022 — Leading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, 14-15 June, 2022, in Dresden for insights into the latest heterogenous integration innovations for semiconductor applications enabling the future of intelligent systems. Registration is open.

“We look forward to bringing together industry leaders for their perspectives on near-term 3D roadmaps and how the semiconductor industry can enable innovation for emerging applications,” said Laith Altimime, president of SEMI Europe. “Their insights promise to help the semiconductor industry address new technology challenges and requirements across the entire supply chain.”

Themed Enabling Low-Energy and High-Performance Applications, SEMI 3D & Systems Summit returns to Dresden with a broader scope of topics including: 

• A Diverse and Sustainable Workforce Enabling Next-Generation Innovation
• Status of High-End Performance Packaging (2.5D and 3D) - Technology and Market Trends
• Updates from the 2021 Technology Showcase Winner: Transient Liquid Phase Sintering (Tlps) - Assembly for Heterogeneous Integration
• Wafer Bonding and New Bonding Technologies
• Heterogeneous Integration: From Design to Substrates and Technology Development
• Testing Challenges, Inspection and Metrology
• Optical Chips Packaging and Co-Packaging
• Equipment and Materials for 3D Integration
• High-Performance Computing and Artificial Intelligence

3D & Systems Summit Keynotes

	Yvonne Keil, Director Global Indirect Procurement, GlobalFoundries
	Johanna M. Swan, Intel Fellow and the Director of Package Research and Systems Solutions,    Intel
	E. Jan Vardaman, President, TechSearch International, Inc.

Global Leaders to Present

3D & Systems Summit presenters include experts from global leaders such as AT&S, Atotech, Besi, CEA-Leti, DeepXscan, ETH Zurich, EV Group (EVG), Evatec AG, Fraunhofer IZM, GlobalFoundries, imec, Intel Deutschland GmbH, KLA, Merck KGaA, Darmstadt, Germany, NanoWired GmbH, Siemens EDA, SENTECH, Sipearl, SPTS Technologies, SÜSS MicroTec, TechSearch, and Yole Développement.Exhibition and Networking

The most prominent names in 3D integration microelectronics manufacturing will showcase their latest products and technologies at the exhibition area, including: adeia, AEMtec, BESI, Canon Anelva Corporation, Confovis, Evatec, EV Group, FormFactor FRT Metrology, Fraunhofer IZM-ASSID, HEIDENHAIN, Integrated Dynamics Engineering, Koh Young Europe GmbH, LPKF Laser & Electronics AG, OPTIM Wafer Services, Polyteknik AS, RENA and SENTECH. 

The summit will also feature business-to-business matchmaking and networking for participants to explore new partnerships and other business opportunities.

To reserve an exhibition space, contact Adi Hodorov at [email protected] and [email protected].

For more details, please visit the 3D & Systems Summit website and connect with SEMI Europe on Twitter or LinkedIn – @SEMIEurope, #3DSummit.

Premium Sponsors     

• Platinum: ASE Group
• Gold: Besi, Evatec, and SÜSS MicroTec
• Silver: KLA and Lam Research
• Event: Edwards, EV Group, imec, JCET and JSR Micro

About SEMI

SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Serena Brischetto / SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

• Read more about SEMI 3D & Systems Summit to Spotlight Trends in High-Performance, Energy-Efficient Applications

SHANGHAI, China ─ May 18, 2022 ─ SEMI today announced that SEMICON China 2022, originally scheduled for June 15-17 at the National Exhibition and Convention Center (NECC) in Shanghai, has been cancelled due to the ongoing COVID-19 pandemic and related government control measures. As an alternative to the event, the largest and most influential gathering of the semiconductor supply chain in China, SEMI has organized a special edition of SEMICON China, concurrent with FPD China, at the Shanghai New International Expo Center with the following schedule:

• Exhibition: October 5-7, 2022
• Forums: October 4-7, 2022

With the health and safety of event exhibitors and visitors as top priority, SEMI will continue to follow China government guidelines for pandemic prevention and control. SEMI is in contact with SEMICON China and FPD China exhibitors and sponsors with details about participating in the October events.

About SEMI

SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Cherry Sun
SEMI China
Email: [email protected] 
Phone: +86.21.6027.8548

• Read more about SEMICON China and FPD China Cancelled; Special Edition Scheduled for October 2022

MILPITAS, Calif. — May 17, 2022 — SEMI, the global industry association that unites the entire electronics manufacturing and design supply chain, and the UCLA Center for Heterogeneous Integration and Performance Scaling (UCLA CHIPS) today announced that they have won a $300,000 grant from the U.S. Department of Commerce’s National Institute of Standards and Technology (NIST) to produce a roadmap for advancing heterogeneous integration and advanced packaging technologies in the United States.

The roadmap will build upon the International Technology Roadmap for Semiconductors (ITRS) and Heterogeneous Integration Roadmap (HIR) by translating the HIR into a blueprint that defines requirements for rolling out the roadmap in U.S. semiconductor factories. The grant, one of the first awarded by NIST's Advanced Manufacturing Technology Roadmap Program (MfgTech), will fund the project for 18 months.

Supported by microelectronics leaders, SEMI and UCLA CHIPS will create a technology-neutral communications platform for peers across the supply chain, academics and industry experts. SEMI will also define a process for prioritizing and guiding critical areas of the HIR to standardization, while UCLA will organize academically themed workshops and panels to ensure the roadmaps are scalable and extendible as new applications evolve and new processes are developed.

“While the Heterogeneous Integration Roadmap is application-focused, our work will translate this roadmap into a manufacturing infrastructure blueprint that starts at the basic materials used in advanced packaging and breaks down integrated processes into individual unit processes,” said Dr. Subramanian Iyer, distinguished professor of electrical and computer engineering and director of UCLA CHIPS, which is housed at the UCLA Samueli School of Engineering. “Some of them will diverge from traditional silicon processes and include custom manufacturing tools and processes that address dies, wafers and panels. Our roadmap will also be customizable to work with many application-dependent variables."

“SEMI and UCLA CHIPS look forward to leveraging our expertise in semiconductor and packaging roadmaps – from upstream innovations to downstream manufacturing infrastructure – to develop the HIR and take the next step toward factory implementation,” said Dr. Melissa Grupen-Shemansky, SEMI CTO and Vice President of SEMI Technology Communities. “SEMI will also turn to its workforce development strategies to offer heterogeneous integration technology training at all levels of education to meet the growing need for advanced packaging talent in the U.S.” 

About UCLA
As the No. 1 public research university, our mission is the creation, dissemination, preservation and application of knowledge for the betterment of our global society. Located by the Pacific Coast in Los Angeles, we have over 40,000 students enrolled in degree and graduate studies. The university prides itself on a vibrant student body and alumni network that is active in communities around the world.

About SEMI

SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact   

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about UCLA and SEMI Win NIST Funding to Produce Heterogeneous Integration Roadmap

MILPITAS, Calif. — May 4, 2022 — SEMI today announced the promotion of 20-year SEMI veteran Paul Trio to Director of the SEMI International Standards program, effective immediately. Trio will lead the global SEMI Standards staff in managing the industry committees, task force and group meetings, balloting and processes for creating SEMI Standards, with particular emphasis on growing the coverage of the standards. Trio succeeds James Amano, who is transitioning to lead the SEMI Sustainability Initiative.

Trio will report to Dr. Melissa Grupen-Shemansky, SEMI CTO and Vice President of SEMI Technology Communities.

“Paul’s expertise in creating standards to help meet pressing semiconductor industry challenges makes him a strong leader entering the next 50 years of SEMI Standards,” Grupen-Shemansky said. “He has deep working knowledge of the SEMI Standards ratification process, the engineering considerations necessary to prepare standards for adoption, and the importance of involving all key stakeholders. Under Paul’s leadership, we look forward to continuing to advance standards in vital areas across the semiconductor supply chain including traceability, data management, cybersecurity, and emerging technologies such as heterogeneous integration.”

Trio most recently lead several SEMI technology communities including the Collaborative Alliance for Semiconductor Test (CAST) and Semiconductor, Components and Instrumentation and Subsystems (SCIS). He spearheaded the collaboration of these groups, comprised of the leading IC device makers and equipment suppliers, on topics such as traceability and zero defects. 

Trio began his career at SEMI in SEMI Standards, managing committees such as Environmental Health and Safety (EHS), Information & Control (I&C), and Physical Interfaces and Carriers (PIC) before his promotion to lead the North America Standards staff. Trio holds an MBA, Master of Science degree in System Engineering and an undergraduate degree in Electrical Engineering from San Jose State University.

SEMI Standards has published more than 1,000 standards and will celebrate its 50^th anniversary since the original M1 Standard was published in 1973. The standard established wafer specifications, enabling the semiconductor industry to innovate the processes needed to create smaller transistors with greater precision. Learn more about SEMI International Standards.  

About SEMI

SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI Veteran Paul Trio Takes Reins of SEMI Standards Program

MILPITAS, Calif. – April 28, 2022 – Unisem, a global provider of semiconductor assembly and test services, has won the Packaging Process Showdown at MEMS & Sensors Technical Congress (MSTC) for its presentation MEMS Cavity Packages —The Applications, Options and Considerations. Unisem was chosen by more than 100 conference attendees gathered April 26-27 at the David Brower Center in Berkeley, California for insights into the latest MEMS and sensors trends and innovations. SEMI MEMS & Sensors Industry Group (MSIG) stages the event.

Alan Evans, MEMS business development manager at Unisem, detailed the advantages of cavity packages and the wide variety of applications they support. Unisem joined Amkor Technology and Promex Industries at MSTC 2022 in showcasing unique designs and effective packaging techniques to meet the needs of a wide range of MEMS and sensors customers.

Roger Flynn, manager of MEMS and Sensor Products at Amkor, described the company’s platforms and building blocks that incorporate multiple sensors into a single package, while Richard Otte, president of Promex Industries, detailed his company’s approach and solutions to addressing MEMS assembly issues.

“Congratulations to Unisem, Amkor Technology, and Promex Industries for an enlightening and energetic Showdown,” said Tim Brosnihan, executive director of SEMI MSIG. “While winning is noteworthy, competing was really the accomplishment. MSTC attendees enjoyed lending their voices to an unscientific vote on the MEMS packaging process ideas that appeals most to their sense of what the market needs. The Showdown exemplifies how SEMI MSIG meets the needs of our members with timely technical and market insights.”

MSTC is an annual technical event that gathers technical experts in the field. Its sister events, MEMS & Imaging Sensors Summit (September 6-8, 2022 in Grenoble, France) and the MEMS & Sensors Executive Congress (October 11-13, 2022 in San Diego, California), also highlight MEMS and sensors business trends and market opportunities.                       

About SEMI

SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact   

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Unisem Wins MEMS Packaging Process Showdown at MEMS & Sensors Technical Congress

MILPITAS, Calif. — May 2, 2022 — More than 65 industry experts will deliver technical presentations on the latest manufacturing strategies and methodologies as SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2022) opens today in Saratoga Springs, New York. Topics ranging from yield management and metrology to new developments in improving post-pandemic manufacturing agility will take center stage at the May 2-5 event.

Drawing hundreds of attendees from across the industry, the 33^rd annual ASMC features discussions on topics including the global COVID-19 pandemic’s impact on manufacturing leadership, semiconductor market trends, heterogenous integration and quantum computing. ASMC is the premier event for industry professionals to network and share insights into best practices for semiconductor manufacturing.

ASMC 2022 Keynotes and Invited Presentations

	Dr. Huiming Bu, Vice President, Hybrid Cloud Technology Research & Albany Operation, IBM Research The Future of Semiconductors: Chips and Chiplets
	Deirdre Hanford, Chief Security Officer, Synopsys  Product Innovation and the Acceleration of Design: Demand Drivers on a Secure and Resilient Supply Chain
	Robert Maire, President, Semiconductor Advisors Emerging Trends in the Global Semiconductor Market
	Dr. Nicolas Loubet, Senior Technical Staff Member, Advanced CMOS Logic, IBM Research Nanosheet Tutorial

ASMC 2022 technical sessions will cover topics including:

• Advanced Process Control
• Advanced Equipment Processes and Materials
• Advanced Metrology
• Advanced Semiconductor Developments
• Contamination Free Manufacturing
• Defect Inspection
• Equipment Optimization
• Factory Automation/Industrial Engineering/Smart Manufacturing
• Yield Enhancement/Yield Management

ASMC will also feature the panel discussion Big Data and Artificial Intelligence for Operations Management in Advanced Semiconductor Manufacturing Industry.

The Women in Semiconductors (WiS 2022) program, to be held today in conjunction with ASMC 2022, will address mentorship, sponsorship and creating a culture of support for women in management and leadership. Complimentary WiS 2022 registration is available for ASMC 2022 attendees. 

ASMC 2022 is co-chaired by Dr. Jean Wynne of IBM and Dr. Shubhodeep Goswami of GE Research.  

For more conference details, contact Paul Cohen at [email protected].                              

About SEMI

SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about ASMC 2022 Opens to Spotlight Advanced Semiconductor Manufacturing Excellence

MILPITAS, Calif. — May 2, 2022 — Worldwide silicon wafer area shipments in the first quarter of 2022 surpassed the previous record high set in the third quarter of 2021, rising 1% quarter-over-quarter to 3,679 million square inches, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry. First-quarter 2022 silicon wafer shipments saw 10% growth from the 3,337 million square inches reported during the same quarter last year.

“This new silicon shipping milestone points to continued growth in all areas of the semiconductor market,” said Anna-Riikka Vuorikari-Antikainen, Chairman of SEMI SMG and Chief Commercial Officer at Okmetic. “Silicon wafer supply remains tight and may stay constrained with many new announced semiconductor fab investments.”

Silicon Area Shipment Trends – Semiconductor Applications Only

Source: SEMI (www.semi.org), May 2022

Data cited in this release include polished silicon wafers such as virgin test and epitaxial silicon wafers, as well as non-polished silicon wafers shipped to end users.

Silicon wafers are the fundamental building material for the majority of semiconductors, which are vital components of all electronics including computers, telecommunications products, and consumer devices. The highly engineered thin disks are produced in diameters of up to 12 inches and serve as the substrate material on which most semiconductor devices, or chips, are fabricated.

The SMG is a sub-committee of the SEMI Electronic Materials Group (EMG) and is open to SEMI members involved in manufacturing polycrystalline silicon, monocrystalline silicon or silicon wafers (e.g., as cut, polished, epi). The SMG facilitates collective efforts on issues related to the silicon industry including the development of market information and statistics about the silicon industry and the semiconductor market.

For more information, please visit SEMI Worldwide Silicon Wafer Shipment Statistics.

About SEMI

SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Worldwide Silicon Wafer Shipments Edge Higher to New Record in First Quarter 2022, SEMI Reports

MILPITAS, Calif. — April 26, 2022 — FLEX Conference will gather industry experts July 11-14, 2022, at the Moscone Center in San Francisco for keynotes, panel discussions, technical sessions and product-based demonstrations highlighting the latest innovations in flexible and printed electronics. The event will co-locate with SEMICON West Hybrid, North America’s premier microelectronics exhibition and conference that unites players across the entire electronics manufacturing and design supply chain. Registration for both events is open.  

Themed Electronics in Motion, FLEX Conference 2022 will focus on equipment, processes, materials and applications driving the latest flexible hybrid electronics (FHE) technology breakthroughs. The event will also showcase innovations emerging from public-private partnerships formed by SEMI Technology Communities SEMI-FlexTech, SEMI-NBMC (Nano-Bio Materials Consortium) and SEMI-NextFlex.

“FLEX Conference has consistently helped turn great ideas into game-changing applications for smart transportation, buildings and infrastructure; equipment sensorization; wearable and conformable medical devices; and more,” said Dr. Melissa Grupen-Shemansky, SEMI CTO and vice president of SEMI Technology Communities. “We are excited to co-locate FLEX with SEMICON West Hybrid to advance the integration of traditional rigid electronics with flexible electronics to improve the way the world works and lives.”

Advances in sustainability across both industries will come into focus at the Global Sustainability Summit at SEMICON West Hybrid and FLEX as flexible electronics combine new levels of processing and sensing capability with improved power usage to make the devices more eco-friendly.

FLEX Conference 2022 Keynote (More keynotes to be announced.)

Dr. Michael D. McCreary, Chief Innovation Officer, Senior VP, E Ink Corporation Electrophoretic Display Technology Will Change the Look of Automobiles, Transportation and Beyond

FLEX Conference 2022 Breakout Sessions

• FHE Applications
• Flexible MedTech and Wearables
• Printing and Processing
• Reliability and Inspection
• Strategies and Sustainability
• Flexible Conductive Materials and Inks
• Flexible Power
• FHE Processing and Integration

The Design Automation Conference (DAC), the largest meeting in the electronic design automation (EDA) industry, will also co-locate with SEMICON West Hybrid 2022. Registration for the event is open.

About SEMI

SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact   

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about FLEX Conference 2022 to Highlight Latest Flexible Hybrid Electronics Innovations