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SAN FRANCISCO — July 12, 2022 — Global sales of total semiconductor manufacturing equipment by original equipment manufacturers are forecast to reach a record $117.5 billion in 2022, rising 14.7% from the previous industry high of $102.5 billion in 2021, and increase to $120.8 billion in 2023, SEMI announced today in releasing its Mid-Year Total Semiconductor Equipment Forecast – OEM Perspective at SEMICON West 2022 Hybrid.

LogoBoth the front-end and back-end semiconductor equipment segments are contributing to the market expansion. The wafer fab equipment segment, which includes wafer processing, fab facilities, and mask/reticle equipment, is projected to expand 15.4% to a new industry record of $101 billion in 2022, followed by a 3.2% increase to $104.3 billion in 2023.

“In line with the semiconductor industry’s determined push to increase and upgrade capacity, the wafer fab equipment segment is poised to reach the $100 billion milestone for the first time in 2022,” said Ajit Manocha, president and CEO of SEMI. “Secular trends across a diverse range of markets, coupled with strong investments in digital infrastructure, are powering another record year.”

Driven by demand for both leading-edge and mature process nodes, the foundry and logic segments are expected to increase 20.6% year-over-year to $55.2 billion in 2022 and another 7.9%, to $59.5 billion, in 2023. The two segments account for more than half of total wafer fab equipment sales.

Strong demand for memory and storage continues to contribute to DRAM and NAND equipment spending this year. The DRAM equipment segment is leading the expansion in 2022 with expected growth of 8% to $17.1 billion. The NAND equipment market is projected to grow 6.8% to $21.1 billion this year. DRAM and NAND equipment expenditures are expected to slip 7.7% and 2.4%, respectively, in 2023.

After surging 86.5% in 2021, the assembly and packaging equipment segment is expected to grow 8.2% to $7.8 billion in 2022 and edge down 0.5% to $7.7 billion in 2023. The semiconductor test equipment market is forecast to grow 12.1% to $8.8 billion in 2022 and another 0.4% in 2023 on demand for high-performance computing (HPC) applications.

Regionally, Taiwan, China, and Korea are projected to remain the top three equipment buyers in 2022. Taiwan is expected to regain the top position in 2022 and 2023, followed by China and Korea. Equipment spending for other regions tracked, except for Rest of World (ROW), is expected to grow in 2022 and 2023.

The following results reflect market size by segment and application in billions of U.S. dollars:

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Source: SEMI July 2022, Equipment Market Data Subscription

Total equipment includes new wafer fab, test, and A&P. Total equipment excludes wafer manufacturing equipment. Totals may not add due to rounding.

 

The current SEMI forecast is based on collective input from top equipment suppliers, the SEMI Worldwide Semiconductor Equipment Market Statistics (WWSEMS) data collection program and the industry-recognized SEMI World Fab Forecast database.

The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports:

  • Monthly SEMI North American Billings Report, an early perspective of equipment market trends
  • Monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and more than 22 market segments
  • Bi-annual Total Semiconductor Equipment Forecast – OEM Perspective, an outlook for the semiconductor equipment market

For more information online, please visit SEMI Market Data.

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: 
[email protected]

Foundation partners with CAEL to match worker interests and competencies with educational and career opportunities

Learn more at SEMICON West 2022 Hybrid, July 12-14 in San Francisco

MILPITAS, Calif. and INDIANAPOLIS, Indiana July 11, 2022 The SEMI Foundation, the non-profit arm of SEMI, and the Council for Adult and Experiential Learning (CAEL), a nonprofit membership organization working to improve education-to-career pathways for adult learners, today announced the launch of the SEMI Career Exploration Platform, designed to strengthen access for underrepresented workers to educational and employment opportunities in the U.S. semiconductor industry and to grow its talent pipeline. The interactive SEMI Career Exploration Platform links the knowledge and skills of workers with career and educational pathways ranging from internships, apprenticeships, and certificate and advanced degree programs.

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“With rising demand for semiconductors, the ongoing chip shortage, and the industry’s corresponding push to expand production, the talent gap will remain a headwind to microelectronics growth and innovation unless more people are drawn to careers in the industry,” said Shari Liss, executive director of the SEMI Foundation, the non-profit arm of SEMI, the global industry association representing the electronics manufacturing and design supply chain. “The SEMI Career Exploration Platform will help expand and diversify the industry’s talent pool by making it easier for people to chart a rewarding career path.”

“Recent global supply chain disruptions have underscored just how vital the semiconductor space is to our nation’s economy,” said Earl Buford, CAEL president. “As industry looks to ramp up capacity in the U.S., we must ensure our industry, workforce development and education sectors are aligned to realize these opportunities and ensure that they extend to all communities.”

The SEMI Career Exploration Platform matches users’ competencies and interests with occupations most likely to lead to career success and personal fulfillment. The Platform’s crosswalking feature, geared toward military veterans, maps their service experience and training to semiconductor industry career opportunities.  

Users can explore a job board, education programs, and the organizational profiles of companies and education providers throughout the country. They can also search semiconductor careers in areas including engineering, manufacturing and production, installation and maintenance, information technology, marketing, and business support.

The SEMI Career Exploration Platform is funded by Strada Education Network, a CAEL collaborator, and the SEMI Foundation. The partnership supports the work of SEMI to bolster the microelectronics industry talent pipeline through diversity, equity, and inclusion initiatives that create career pathways for traditionally underrepresented populations in the industry.

Roadtrip Nation, an educational production company, will create videos in collaboration with the SEMI Foundation and SEMI member companies that showcase success stories of microelectronics professionals to help raise awareness about career possibilities. Featuring traditionally underrepresented workers including women, people of color, and veterans, the videos will be available on the Roadtrip Nation website and featured in a PBS documentary airing next year.

More Details at SEMICON West Hybrid 2022

Learn more about the SEMI Career Exploration Platform in the Workforce Development Pavilion at SEMICON West 2022 Hybrid, July 12-14 at the Moscone Center in San Francisco.

About CAEL
Recognizing that adult learners are the backbone of the U.S. economy, CAEL helps forge a clear, viable connection between education and career success, providing solutions that promote sustainable and equitable economic growth. CAEL opens doors to opportunity in collaboration with workforce and economic developers; postsecondary educators; employers and industry groups; foundations and other mission-aligned organizations. By engaging with these stakeholders, we foster a culture of innovative, lifelong learning that helps individuals and their communities thrive. A membership organization established in 1974, CAEL is a part of Strada Collaborative, a mission-driven nonprofit. Learn more at cael.org and stradacollaborative.org.

About Roadtrip Nation
Roadtrip Nation is a 501(c)(3) nonprofit organization that humanizes career exploration through story and empowers individuals to connect their interests to fulfilling lives and careers. Through its award-winning public television series, New York Times bestselling book “Roadmap,” and educational programs and tools that provide visibility and insights into career possibilities and pathways, Roadtrip Nation gives people from all backgrounds confidence and belief in their ability to persist through challenges and define success for themselves. Roadtrip Nation has been showcased at the United Nations Social Innovation Summit, Clinton Global Initiative, NBC Education Nation, TEDx, Talks at Google, SXSW, and the Harvard Social Enterprise Forum. For more information, visit roadtripnation.com.

About Strada Education Network
Strada Education Network is a nonprofit dedicated to helping people take advantage of education and training after high school that helps them secure a good job, do meaningful work, contribute to their communities, and lead a fulfilling life. We believe education and training after high school have the potential to be the most powerful and equitable ways to help all people thrive in their careers and lives. To help students succeed beyond completion of a certificate or degree, we conduct research, make charitable grants and social impact investments, and support Strada Collaborative, which directly serves students and workers. Learn more at stradaeducation.org.

About the SEMI Foundation
The SEMI Foundation supports workforce development in the semiconductor industry. Our charge is to dramatically expand the pipeline of talented workers ready to fill the significant workforce deficits reported by companies worldwide. We are leveraging this critical need for new and more workers as an opportunity to diversify the talent pool, benefitting both the workers and their communities, as well as the companies who hire them.

The Foundation’s primary focus in diversifying the microelectronics industry workforce is to engage, educate and inspire Black, Indigenous, Latinx, and other marginalized people of color, veterans, and women to work in the rewarding sector in order to improve their lives and their communities while meeting the industry’s workforce needs.   

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

SEMI Contact
Michael Hall
Phone: 1.408.943.7988
Email: 
[email protected]

CAEL Contact
Carlo Bertolini
Phone: 1.312-499-2338
Email: [email protected]

TAIPEI – July 12, 2022 – SEMI Taiwan today launched the SEMI Auto IC Master, a comprehensive guide to automotive semiconductor and component providers in Taiwan.  Designed to enable closer collaboration among carmakers, automobile Tier 1 suppliers and Taiwan’s semiconductor IDM and fabless companies, the guide promises to help automakers better adapt production capacity to semiconductor supply chain disruptions and drive innovation. The guide is available through an online account or in hard copy and can be purchased by contacting the SEMI Taiwan representatives listed on the SEMI Auto IC Master webpage.    

Logo“The ongoing chip shortage underscores the need for SEMI member companies and the automotive supply chain to collaborate more closely to help maintain adequate chip supplies for automakers during supply chain disruptions,” said Terry Tsao, Global Chief Marketing Officer at SEMI and president of SEMI Taiwan. “The SEMI Auto IC Master helps lay the groundwork for automotive innovations in the coming decade and beyond.”
 

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Executives from the following organizations attended the SEMI Auto IC Master Press Conference today: (Front row, left to right) Ali Tech, ARTC, Holtek, ITE Tech, SUNPLUS TECHNOLOGY, SEMI Taiwan, UMC, Ministry of Economic Affairs, R.O.C., Ministry of Transportation and Communication, R.O.C., Hon Hai (Foxconn) Technology Group, Industrial Development Bureau, MOEA, ELAN MICROELECTRONICS, PIXART IMAGING, ICATCH TECHNOLOGY, AVISONIC TECHNOLOGY; (Back row, left to right) Realtek Semiconductor, PIXART IMAGING, SUNPLUS TECHNOLOGY, Etron Technology, Elite Semiconductor Microelectronics Technology, Novatek, CUBTEK, CAD Engineer, ICATCH TECHNOLOGY, ELAN MICROELECTRONICS, Macronix International, Holtek, ITE TECH, and GENERALPLUS TECHNOLOGY 

 

Automotive semiconductors are expected to record a compound annual growth rate (CAGR) of 16.5% through 2026, while electronic components spending for electric vehicles, self-driving cars, advanced driver assistance systems (ADAS) and other in-vehicle products is expected to increase 50% by 2030, according to market research firm Gartner.

“Taiwan’s chip manufacturing efficiency holds the key to enabling greater efficiencies between automakers and the semiconductor supply chain,” said John Hsuan, Honorary Vice Chairman of United Microelectronics Corp. (UMC). “Electric vehicle market growth is a key driver of semiconductor demand in the automotive sector, with the number of chips in an EV expected to exceed 3,000 in the future. I encourage additional Taiwanese semiconductor companies to work more closely with the automotive sector to help drive the expansion of this important market.”

“The publication of the SEMI Auto IC Master is merely the beginning and will evolve to continue to meet the needs of the automotive industry,” said Young Liu, Chairman of Hon Hai Technology Group. “The guide offers key details about Taiwan’s semiconductor ecosystem to help fuel the rapid growth of the new-energy vehicle market, positioning Taiwan as a key player in the global automotive chip market.”
 

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(Left to right) Gene Liu, Vice President of the SoC Design Center at Hon Hai Technology Group; John Hsuan, Honorary Vice Chairman of United Microelectronics Corp; and Terry Tsao, Global Chief Marketing Officer at SEMI and president of SEMI Taiwan. The three executives collaborated with Taiwanese automotive semiconductor chip manufacturers and suppliers upstream to downstream to launch the SEMI Auto IC Master. 

 

SEMI Auto IC Master Sponsors and Partners

Ali

Automotive Research and Testing Center

Avisonic

Chivalry

Clientron

CubTEK

ELAN

ESMT

Etron

Foxconn

Foxtron

Generalplus

Holtek

iCatch

ITE

Macronix

Novatek

PixArt

Realtek

Sunplus

 

 

 

The following Taiwan government officials and industry leaders showed their support for the growth of Taiwan’s automotive semiconductor community by attending the SEMI Auto IC Master press conference in Taipei on June 29.

  • Mei-Hua Wang, Minister of Economic Affairs
  • Wen-Jong Chi, Administrative Deputy Minister of Transportation and Communications
  • John Hsuan, Honorary Vice Chairman of United Microelectronics Corp. 
  • Gene Liu, Vice President of the SoC Design Center at Hon Hai Technology Group (Foxconn)
  • Terry Tsao, Global Chief Marketing Officer at SEMI and president of SEMI Taiwan

 

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The following executives attended the SEMI Auto IC Master launch event today, vowing to help usher in a new era for Taiwan’s automotive semiconductor industry. (Left to right) Terry Tsao, Global Chief Marketing Officer at SEMI and president of SEMI Taiwan; Gene Liu, Vice President of the SoC Design Center at Hon Hai Technology Group (Foxconn); Wen-Jong Chi, Administrative Deputy Minister of Transportation and Communications; Mei-Hua Wang, Minister of Economic Affairs; and John Hsuan, Honorary Vice Chairman of United Microelectronics Corp. 

 

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Monica Hung/SEMI Taiwan
Email: [email protected]
Phone: +886.3.560.1777 ext. 207

MILPITAS, Calif. July 11, 2022 — Electronic System Design (ESD) industry revenue increased 12.1% from $3,157.7 million in Q1 2021 to $3,540.5 million in Q1 2022, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report. The four-quarter moving average, which compares the most recent four quarters to the prior four, rose 14.5%.   

Logo“The industry continued to report double-digit year-over-year revenue growth in Q1 2022, with quarterly revenue reaching a record $3,540.5 million,” said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report. “Product categories Computer-Aided Engineering, Printed Circuit Board and Multi-Chip Module, Semiconductor Intellectual Property, and Services recorded growth for the quarter. Geographically, the Americas, Japan, and Asia Pacific (APAC) all reported revenue growth.”

The companies tracked in the EDMD report employed 51,328 people globally in Q1 2022, a 4.7% increase over the Q1 2021 headcount of 49,024 and up 0.2% compared to Q4 2021.

The quarterly EDMD report contains detailed revenue information with the following category and geographic breakdowns.

Revenue by Product and Application Category – Year-Over-Year Change

  • Computer-Aided Engineering (CAE) revenue increased 14.8% to $1,118.2 million. The four-quarter CAE moving average increased 12.5%.
  • IC Physical Design and Verification revenue decreased 7.5% to $631.2 million. The four-quarter moving average for the category declined 2.5%.
  • Printed Circuit Board and Multi-Chip Module (PCB and MCM) revenue increased 1.4% to $293.3 million. The four-quarter moving average for PCB and MCM rose 11.4%.
  • Semiconductor Intellectual Property (SIP) revenue jumped 23.7% to $1,376.5 million. The four-quarter SIP moving average grew 26.5%.
  • Services revenue increased 22.7% to $121.4 million. The four-quarter Services moving average increased 24.9%.

Revenue by Region – Year-Over-Year Change

  • The Americas, the largest reporting region by revenue, procured $1,522.7 million of electronic system design products and services in Q1 2022, an 18.5% increase. The four-quarter moving average for the Americas rose 18%.
  • Europe, Middle East, and Africa (EMEA) procured $434.1 million of electronic system design products and services in Q1 2022, a 3% decrease. The four-quarter moving average for EMEA grew 8.1%.
  • Japan’s procurement of electronic system design products and services increased 1.8% to $263.5 million. The four-quarter moving average for Japan rose 2.5%.
  • Asia Pacific (APAC) procured $1,320.3 million of electronic system design products and services in Q1 2022, a 13.2% increase. The four-quarter moving average for APAC increased 15.6%.

 

About the EDMD Report

The ESD Alliance Electronic Design Market Data (formerly the Market Statistics Service) report presents Electronic Design Automation (EDA), SIP and services industry revenue data quarterly. Both public and private companies contribute data to the report available from SEMI. Each quarterly report is published approximately three months after quarter close. EDMD report data is segmented as follows:

  • Revenue by product category (CAE, IC Physical Design and Verification, Semiconductor IP, PCB/MCM Layout, and Services) including numerous detailed sub-categories
  • Revenue by geographic region (Americas, EMEA, Japan and APAC)
  • Total employment at participating companies

For information about SEMI market research reports, visit the SEMI Market Research Reports and Databases Catalog.

About the Electronic System Design Alliance

The Electronic System Design (ESD) Alliance, a SEMI Technology Community, is the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry. As an international association of companies providing goods and services throughout the semiconductor design ecosystem, it is a forum to address technical, marketing, economic and legislative issues affecting the entire industry. For more information about the ESD Alliance, visit http://esd-alliance.org.

About SEMI

SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

The information supplied by the ESD Alliance is believed to be accurate and reliable, but the ESD Alliance assumes no responsibility for any errors that may appear in this document. All trademarks and registered trademarks are the property of their respective owners.

Press Contacts                                                                                 

Paul Cohen
ESD Alliance
A SEMI Technology Community
978-769-2106             

Jack Taylor
Siemens EDA PR
Siemens Digital Industries Software
512-560-7143 

MILPITAS, Calif. – July 11, 2022 – SEMICON West 2022 Hybrid opens tomorrow at the Moscone Center in San Francisco as more than 200 industry leaders, visionaries and technology experts gather for insights into critical microelectronics industry trends. July 12-14 at the Moscone Center in San Francisco, SEMICON West 2022 Hybrid will spotlight topics including sustainability, smart technologies and digital transformation while addressing key themes including workforce development, government investment in chip manufacturing and heterogeneous integration. Registration is open for both the live and virtual programs.

LogoThe event, North America’s premier exhibition and conference for the microelectronics supply chain, will feature on-site keynotes and executive panels with thought leaders from the semiconductor ecosystem, academia and government.

The Global Sustainability Summit will debut at SEMICON West 2022 Hybrid to help drive the collaboration necessary for the semiconductor industry to reduce its carbon footprint. Co-hosted by SEMI and McKinsey & Company, the summit comes as semiconductor ecosystem companies are increasingly committing to sustainability targets. In parallel, SEMI member companies are joining forces with startups to enable a greener chip industry as part of the SEMI Sustainability Initiative.  

SEMICON West 2022 Hybrid Smart Pavilions

  • Smart Manufacturing Pavilion The pavilion will feature data-sharing breakthroughs that are leading to smarter manufacturing processes, higher yields, and new semiconductor innovations. Thought leaders will engage attendees at the Meet the Experts Theater on topics including advances in sensors, processors, memory, 5G, and silicon photonics for improving data-sharing across the microelectronics supply chain. Emerging IC technologies for connected intelligence in electronics manufacturing will also be in focus.
  • Smart Mobility Pavilion Leading all new application spaces in chip growth, the transportation and mobility markets promise to fuel the expansion of segments such as flexible hybrid electronics (FHE), MEMS and sensors. The pavilion will also showcase semiconductor industry growth opportunities through advances in areas including autonomous vehicles, Internet of Things (IoT) applications, 5G and artificial intelligence (AI).
  • Smart MedTech Pavilion The pavilion will focus on future MedTech markets and applications and include technology demonstrations. Industry experts will discuss medical wearables and point-of-care instrument innovations driven by development of MEMS-based sensors and actuators.
  • Workforce Development Pavilion Building the microelectronics industry’s talent pipeline to sustain the current pace of innovation and growth is a top priority. Targeting both new strategies for recruiters and tactics for job seekers, the pavilion will highlight entry-level opportunities, searching for a job during uncertain times, and why microelectronics is a smart career choice.

SEMICON West 2022 Hybrid Sessions

  • SEMI Market Symposium – July 11, 1:00-5:00pm – Market trends and drivers and a midyear update on forecasts and insights on semiconductor equipment and materials, electronics design, and the manufacturing supply chain.  
  • Bulls & Bears – Perspectives on key semiconductor industry trends from Wall Street analysts in a moderated panel discussion.
  • TechTALKS – Discussions with experts on advanced manufacturing, materials, silicon photonics, MEMS and sensors, and heterogenous integration.
  • Test Vision Symposium – Insights from providers and users of test IP and equipment on coming trends and innovations.

The FLEX Conference, the annual event focused on flexible hybrid and printed electronics innovations, and the Design Automation Conference (DAC), the premier gathering focused on the design and design automation of electronic circuits and systems, will co-locate with SEMICON West 2022 Hybrid.

COVID-19 Safety Protocols

To ensure the well-being of all its exhibitors and visitors, SEMI monitors developing federal, state, and local health and safety recommendations and requirements to determine the most appropriate safety protocols for in-person events.

Recorded programming of select speakers at SEMICON West 2022 Hybrid will be available on-demand July 13, 2022, through August 13, 2022. Visitors will have direct access to exclusive online exhibitors during the live event.

Follow SEMICON West on Twitter: #SEMICONWest

 

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: 
[email protected]

SAN FRANCISCO, Calif. – July 13, 2022 – The Atlas V optical critical dimension metrology tool from Onto Innovation, Inc. has won the 2022 Best of West award, SEMI and Semiconductor Digest announced today at SEMICON West 2022 Hybrid, July 12-14 at the Moscone Center in San Francisco. Onto Innovation is a leader in process control, including un-patterned wafer quality, 3D metrology, macro defect inspection of wafers and packages, metal interconnect composition, factory analytics, and lithography for advanced semiconductor packaging.

LogoPresented by SEMI and Semiconductor Digest each year, the Best of West award recognizes innovative new products or services that are significantly advancing the electronics manufacturing supply chain or a particular manufacturing capability.

The new Atlas V metrology system is designed to measure several key steps that include buried features not visible by CD-SEM and other techniques. Through improvements in the optical systems, mechanical sub-systems and software algorithms, the Atlas V system can precisely measure the very subtle variations for device parameters and reveal weak process corners for engineers to improve fab process robustness. The Atlas V metrology system enables these critical dimensions to be measured with high accuracy and sensitivity, extending the capability of optical solutions for future generations of devices and eliminating the need for slower process control techniques.

The Atlas V technology enables the performance needed for customers’ development of GAA/3D NAND/DRAM and is over 100 times faster than X-ray solutions for these structures. Select Onto Innovation customers have validated the new optical critical dimension (OCD) technology and have appreciated the speed and resolution that was once thought to be beyond the limits of optical technology.

“Semiconductor manufacturers rely on the ingenuity of equipment suppliers such as Onto Innovation to make chips smaller and faster,” said Pete Singer, Editor-in-Chief of Semiconductor Digest. “The Atlas V is a great example of a product that meets the needs of next-generation semiconductor devices, such as the gate-all-around transistor.”

Onto Innovation will receive the Best of West award today at SEMICON West 2022 Hybrid.

About Semiconductor Digest

Through a mix of news, contributed articles and staff-written articles, Semiconductor Digest is dedicated to providing global information about the design, manufacturing, packaging and testing of semiconductors and other types of electronic devices, including MEMs, LEDs, displays, power electronics, optoelectronics/photonics, biomedical devices, solar cells, thin film batteries and flexible electronics. Semiconductor Digest consists of a website, magazine and topic-focused newsletters.

About SEMI

SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

SEMI Contact

Michael Hall
Phone: 1.408.943.7988
Email: [email protected]

Semiconductor Digest Contact

Pete Singer, Editor-in-Chief
Phone: 1.978.470.1806
Email: [email protected]

MILPITAS, Calif. – July 5, 2022 –SEMI and Semiconductor Digest today announced finalists for the Best of West award to be presented at SEMICON West 2022, July 12-14 at the Moscone Center in San Francisco. The Best of West Award winner will be announced at SEMICON West 2022 Hybrid on Wednesday, July 13, 2022.

LogoPresented by SEMI and Semiconductor Digest each year, the Best of West award recognizes innovative new products or services that are significantly advancing the electronics manufacturing supply chain or a particular manufacturing capability.

The following Best of West 2022 finalists will showcase their products on the SEMICON West 2022 Hybrid show floor:

Advantest: V93000 EX Test Station

The EX Test Station is a stand-alone test system that is compatible with Advantest V93000 series test systems. It brings the versatility, accuracy, and high-performance capabilities of the V93000 into the lab environment.

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ClassOne Technology: Solstice

ClassOne Technology’s Solstice® single-wafer platform delivers advanced electroplating and wafer-surface preparation technologies for compound semiconductors and other critical applications requiring ultimate wafer uniformity and process control in a single flexible, compact system.

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Nanotronics: nControl

nControl integrates the AIPC software solution with its DLC edge computing for manufacturing. AIPC aggregates real-time manufacturing process data and uses deep learning to build models that provide KPI predictions, anomalous activity alerts and autonomous control, enabling factories to automatically adapt to increase yields and avoid malfunctions.

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Onto Innovation: Atlas V

Atlas V, leveraging the latest improvements in source signal-to-noise ratio (SNR), coupled with the Onto Innovation AI Diffract (Machine Learning-guided modeling engine), enables the clean separation of signals related to nanosheets in gate-all-around (GAA) devices. Using individual nanosheet measurements from an inline tool capable of measuring a single location in less than a second, Atlas V enables a process control feedback loop that is critical for ramping yield to HVM levels.

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UCT: IoT Manifold

The IoT Manifold is an innovative concept that combines high-quality ultra-clean valves, remote control capabilities, sensing features and wireless connectivity systems.

The IoT Manifold is designed to maximize control over various systems and prevent human error, breakdowns, and unnecessary expenditures while enabling a safer working environment.

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About Semiconductor Digest

Through a mix of news, contributed articles and staff-written articles, Semiconductor Digest is dedicated to providing global information about the design, manufacturing, packaging and testing of semiconductors and other types of electronic devices, including MEMs, LEDs, displays, power electronics, optoelectronics/photonics, biomedical devices, solar cells, thin film batteries and flexible electronics. Semiconductor Digest consists of a website, magazine and topic-focused newsletters.

About SEMI

SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

SEMI Contact

Michael Hall
Phone: 1.408.943.7988
Email: [email protected]

Semiconductor Digest Contact

Pete Singer, Editor-in-Chief
Phone: 1.978.470.1806
Email: [email protected]

MILPITAS, Calif. — July 6, 2022 — FLEX Conference opens next week with keynotes, panel discussions, technical sessions and product-based demonstrations highlighting the latest innovations in flexible and printed electronics as they continue to re-shape how people work and live. July 11-14 at the Moscone Center in San Francisco, the event is co-located with SEMICON West Hybrid, North America’s premier microelectronics exhibition and conference that unites players across the entire electronics manufacturing and design supply chain. Registration for both events is open.  

LogoThemed Electronics in Motion, FLEX Conference 2022 will focus on equipment, processes, materials and applications driving the latest flexible hybrid electronics (FHE) technology breakthroughs. The event will also showcase innovations emerging from public-private partnerships formed by SEMI Technology Communities SEMI-FlexTech, SEMI-NBMC (Nano-Bio Materials Consortium) and SEMI-NextFlex.

Advances in sustainability across traditional and flexible electronics will come into focus at the Global Sustainability Summit at SEMICON West Hybrid and FLEX as FHE devices combine new levels of processing and sensing capability with improved power usage for greater energy efficiency.  

FLEX Conference 2022 Keynotes

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Dr. Michael D. McCreary, Chief Innovation Officer, Senior VP, 
E Ink Corporation

Electrophoretic Display Technology Will Change the Look of Automobiles, Transportation and Beyond

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Dawson Cagle, Ph.D., Intelligence Advanced Research Projects Activity (IARPA) 

Weaving Electronics into Textiles

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John D. Williams, Ph.D., Boeing Research and Technology 

Multilayer Flexible Electronic Devices for Iot and RF Applications

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Future FLEX Disruptors Session

Join six startup entrepreneurs in the flexible, flexible hybrid and printed electronics industries as they showcase their inventions, solicit valuable insights from a panel of venture capitalists and work to shape the future of electronics.  

  • Xina Quan, Co-founder and CEO, PyrAmesChanging Lives With Better Blood Pressure Measurements
  • Marc Rippen, CEO, AlertgyThe Challenges of Developing a Wearable Medical Device
  • James Lee, Co-founder and CEO, StratioDrive Safe, Eat Safe With Low-cost, Compact Infrared Camera
  • Rich Neil, Founder and CEO, RN TechnologiesMulti-Dimensional Build Platforms for Additive Manufacturing
  • Ram Prasad Gandhiraman, Founder and CEO, Space FoundryPlasma Jet Printing for Printed Electronics
  • Benjamin Dringoli, Co-Founder and CEO, TRAQCPrinting Without Interruption

Other Notable Speakers at FLEX Conference 2022

  • Samantha Stevens, JabilOptimization of Cu Ink Processing for Potential Replacement of Ag Inks in End-user FHE Based Applications
  • Michael Brothers, UES Inc.Optimization of Ink-Printed, 2D-Materials for Selective, Wearable, Environmental Sensors
  • Matthew Dyson, IDTechExA Roadmap for 3D Hybrid Electronics
  • Sheila Goodman, CHASM Advanced MaterialsTransparent CNT Hybrid Heater Films for Automotive De-icing Application
  • Shane Mitchell, Artimus RoboticsHASEL Actuation Technology: Artificial Muscles for the Next-generation of Robots
  • Carolyn Ellinger, Eastman Kodak CompanyUnderstanding the Advantages of Additive Manufacturing for Transparent and Flexible Electronics

FLEX Conference 2022 Breakout Sessions

  • FHE Applications
  • Flexible MedTech and Wearables
  • Printing and Processing
  • Reliability and Inspection
  • Strategies and Sustainability
  • Flexible Conductive Materials and Inks
  • Flexible Power
  • FHE Processing and Integration

The Design Automation Conference (DAC), the largest meeting in the electronic design automation (EDA) industry, will also co-locate with SEMICON West Hybrid 2022. Registration for DAC is open.

 

About SEMI

SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact   

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: 
[email protected]

MILPITAS, Calif. – July 5, 2022 – The CHIPS Act, microelectronics industry resilience and the future of mobility will come into focus next week at SEMICON West 2022 Hybrid, July 12-14 at the Moscone Center in San Francisco, as industry leaders deliver keynotes and participate in executive panels on these and other critical topics focused on industry growth. Registration is open.

SEMICON West Hybrid logoThe event, North America’s premier exhibition and conference for the microelectronics supply chain, will gather more than 200 industry leaders, visionaries and technology experts for insights into the latest trends, innovations and developments across the electronics supply chain.

SEMICON West 2022 Hybrid will also highlight industry challenges and opportunities for overcoming pressing issues such as sustainability, chip scarcity and the semiconductor workforce shortage while addressing key themes including digital transformation, and heterogeneous integration.

SEMICON West 2022 Hybrid Keynotes

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Laurie E. Locascio, Under Secretary of Commerce for Standards and Technology Director of the National Institute of Standards and Technology (NIST) 

NIST, Semiconductors, and the CHIPS Act

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Siva Sivaram, President of Technology and Strategy, Western Digital 

Flash Forward: How A Global Supply Chain Enables the Data Revolution

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Berthold Hellenthal, Head of Computing and Semiconductors, CAVIAD, a Volkswagen Group Company 

Semiconductor Innovation Driving Future Mobility 

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Vanessa Ahktar, Director, Kotter

The Science of Change: Navigating an Increasingly Chaotic World

 

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SEMICON West 2022 Hybrid Executive Panels

Day 1 will also feature the following executive panels:

How Are You Shaping a More Resilient Supply Chain – Perspectives and Possibilities

Moderator: Bettina Weiss, Chief of Staff and Corporate Strategy, SEMI

Panelists:

  • Bruce Tufts, Vice President,  Manufacturing Supply Operations, Director, Fab Materials Organization, Intel Corporation
  • Boris Finselberg, Vice President, Global Sector Technology, DHL Customer Solutions & Innovation
  • Doug Lefever, President & CEO, Advantest America; Executive Vice President, System Test Business Unit; Director, Managing Executive Officer Leader, Applied Research & Venture Team
  • Carolin Seward, VP, Sourcing Operations for Silicon, Google
  • Richard Barnett, Chief Marketing Officer, Supplyframe

The Value of a Veteran in the Workforce

Moderator: Larry Smith, Chairman, TEL U.S.

Panelists:

  • General Paul E. Funk II, Commanding General, U.S. Army Training and Doctrine Command
  • Katie Maloney, Business Line Manager, Edwards Vacuum
  • Ann Kelleher, Ph.D., Executive Vice President and General Manager of Technology Development, Intel Corporation
  • Shari Liss, Executive Director, SEMI Foundation
  • Ajit Manocha, President and CEO, SEMI

SEMI Global Sustainability Summit Keynotes

With decarbonization building momentum worldwide, the Global Sustainability Summit will debut on Day 2 at SEMICON West 2022 Hybrid to help drive the collaboration necessary for the semiconductor industry to reduce its carbon footprint. Co-hosted by SEMI and McKinsey & Company, the summit comes as semiconductor ecosystem companies are increasingly committing to sustainability targets. 

Keynote speakers will include:

The FLEX Conference, the annual event focused on flexible hybrid and printed electronics innovations, and the Design Automation Conference (DAC), the premier gathering focused on the design and design automation of electronic circuits and systems, will co-locate with SEMICON West 2022 Hybrid.  

COVID-19 Safety Protocols

To ensure the well-being of all its exhibitors and visitors, SEMI monitors developing federal, state, and local health and safety recommendations and requirements to determine the most appropriate safety protocols for in-person events.

Recorded programming of select speakers at SEMICON West 2022 Hybrid will be available on-demand July 13, 2022, through August 13, 2022. Visitors will have direct access to exclusive online exhibitors during the live event.

Follow SEMICON West on Twitter: #SEMICONWest

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: 
[email protected]

GRENOBLE, France – June 7, 2022 With MEMS and imaging sensor innovations driving an explosion in medical, mobility, communications and other Smart applications, the stage is set for the return of SEMI MEMS & Imaging Sensors Summit, 6-7 September, 2022, to the World Trade Center (WTC) in Grenoble, France. More than 400 industry experts will gather for insights into the latest technology developments and trends across the MEMS and sensors supply chain. Registration is open.  

LogoHosted by SEMI Europe and the MEMS & Sensors Industry Group, a SEMI Technology Community, and Themed Intelligent Sensing for Better and Smarter Living, the summit will open with insightful executive keynotes and feature sessions on the following critical semiconductor industry topics.

Program Sessions

Session 1: A Diverse and Sustainable Workforce Enabling Next Generation Innovation
Industry leaders will explore how diversity drives innovation and ways companies and corporate leaders can create an inclusive environment where employees and innovation thrive.

Session 2: Market Brief
Industry trends, market drivers and supply chain dynamics will come into focus.

Session 3: Insights into Emerging Applications
Experts will share their vision for emerging sensor applications and discuss the latest developments in biosensors, MEMS, photonics and spectroscopic technologies.

Session 4: Intelligent Sensing
Discussions will highlight new sensor technologies that enable fast and reliable edge computing to pave the way for smarter applications in industries such as automotive and medical.

Session 5: Technology Showcase
This session will spotlight the latest MEMS and imaging sensor products and applications. Deep and traditional tech companies and startups as well as researchers developing new products will demonstrate cutting-edge solutions. Companies can submit their product demonstration abstracts by June 30.

Session 6.1: MEMS Advancements 
Industry leaders will discuss new MEMS technology applications, devices and manufacturing trends. Application topics will include the integration of several sensors into System in Package (SiP), MEMS for medical sensing, and integrating data generation and data processing into the same system. Manufacturing topics will include advancements enabling 300mm wafer sizes, 3D integration and substrate diversification.

Session 6.2: Imaging Advancements 
Industry leaders will share their visions for sensing processes, design and computing.

Session 7.1: Environmental MEMS Technology Focus
Future MEMS-enabled environmental technologies that drive advances in everything from preventative maintenance and quality control to environmental monitoring will come into sharp focus.

Session 7.2: The Latest on Short-wave Infrared (SWIR)
This session will explore the latest advancements in traditional SWIR imaging technology from Lynred and the promise of new quantum dot SWIR image sensors from STMicroelectronics and Emberion. It will also cover insights from imec on new consumer applications enabled by affordable sensors, and a low-cost solution for SWIR hyperspectral imaging introduced from VTT.

Session 8: Materials and Equipment Advancements
Experts will discuss how materials and equipment advances are enabling higher performance MEMS devices for new manufacturing techniques and equipment.

Session 9: Optics, Co-Packaged Optics (CPO) and Optical Chips Packaging for MEMS and Imaging Sensors
Rapid growth of cloud data presents new speed and bandwidth requirements. Industry leaders will explore the integration of optics and silicon through CPO to meet growing performance demands and reduce power consumption.

More MEMS & Imaging Sensors Summit Highlights

  • Networking opportunities at the exhibition and a gala dinner for attendees of both MEMS and imaging sensor tracks to meet in-person.
  • Exhibition showcasing leading companies driving the future of MEMS/imaging and sensors design and manufacturing including:
    • ASE Group
    • DELO Industrial Adhesives
    • Eurofins MASER B.V.
    • EV Group (EVG)
    • Evatec
    • Fraunhofer IPMS
    • KLA
    • Okmetic Oy
    • SAES Getters SpA
    • SCHOTT
    • SET
    • Siemens EDA (represented by EDA Solutions Limited)

Premier sponsors

For more information, please visit the MEMS & Sensors Imaging Summit website.

Stay in touch on Twitter @SEMIEurope: #SensorsSummit #MEMS #Imaging #SEMIEurope

 

About SEMI

SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Serena Brischetto
SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]