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EPFL and former Stanford professor recognized for his significant impact on the electronic system design industry through pioneering technical contributions

MILPITAS, Calif. –– September 28, 2022 –– Dr. Giovanni De Micheli, Professor and Director of the Institute of Electrical Engineering (IEL) and of the Integrated Systems Centre at the École Polytechnique Fédérale de Lausanne (EPFL) in Lausanne, Switzerland, has been honored with the 2022 Phil Kaufman Award for Distinguished Contributions to Electronic System Design. The award is presented annually by the Electronic System Design Alliance (ESD Alliance), a SEMI Technology Community, and the Institute of Electrical and Electronics Engineers (IEEE) Council on Electronic Design Automation (CEDA).

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Dr. De Micheli was recognized for his extensive contributions to electronic design automation (EDA). His EDA tools and methodologies research has helped drive significant advances in the academic field of design automation and made a lasting impact on the industry through their incorporation into commercial EDA solutions. Notably, he developed multiple technologies while inspiring his students, university researchers and engineers in the industry. His work has expanded the fields of high-level synthesis, logic synthesis, and Network-on-Chip (NoC) for more than 30 years.

“Professor De Micheli, or Nanni to many of us who’ve been driving our industry forward for decades, stands as a relentless advocate for our field,” said Aart de Geus, Chairman and CEO of Synopsys. “While many predicted our industry was fully matured, he remained focused and creative, be it with the encoding of finite-state machines combined with logic minimization or solving the cell-library mapping problem with Boolean matching. I am not alone when I express my appreciation to Nanni for advancing the field, but most important, for continuing to add findings that keep our profession fresh and exciting!”

“For the over three decades that I have known Professor De Micheli, he has established himself as a true force in the EDA community,” said Dr. Patrick Groeneveld, past chair of the Design Automation Conference (DAC). “His key technical contributions lie in the areas of logic synthesis, hardware software co-design, NoC design and physical synthesis.”

“Dr. De Micheli has been a stalwart innovator and supporter of EDA with numerous and lasting contributions, and certainly he well deserves this honor,” said Gi-Joon Nam, President of the IEEE Council on EDA.

“On behalf of the ESD Alliance, I congratulate Professor De Micheli on receiving the 2022 Phil Kaufman award,” said Simon Segars, ESD Alliance Chairman. “The industry would not be where it is today without his groundbreaking research, which was often years ahead of its time. His impact on the industry is well-recognized and celebrated with this distinguished award.”

About Dr. Giovanni De Micheli

Dr. Giovanni De Micheli is a research scientist in electronics and computer science credited with inventing the NoC design automation paradigm and creating EDA algorithms and design tools. Before serving as Professor and Director of the Integrated Systems Laboratory at EPFL, he was Professor of Electrical Engineering at Stanford University. He was Director of the IEL at EPFL from 2008 to 2019 and served as program leader of the Swiss Federal Nano-Tera.ch program.

He holds a Nuclear Engineering degree from Politecnico di Milano, and Master of Science and Ph.D. degrees in Electrical Engineering and Computer Science from the University of California, Berkeley.

Professor De Micheli is a Fellow of the Association for Computing Machinery (ACM), the American Association for the Advancement of Science (AAAS) and IEEE; a member of the Academia Europaea; and an International Honorary member of the American Academy of Arts and Sciences. His current research interests include design technologies for integrated circuits and systems, including synthesis for emerging technologies. He is also interested in heterogeneous platform design for electrical components and biosensors, as well as in-data processing of biomedical information.

He authored the textbook Synthesis and Optimization of Digital Circuits and co-authored and/or co-edited 10 other books and more than 900 technical articles. His citation h-index is above 100 according to Google Scholar. He is member of the Scientific Advisory Boards of imec Leuven and STMicroelectronics.

Professor De Micheli received the 2020 IEEE Technical Committee Achievement Award in Cyberphysical Systems, the 2020 IEEE/CEDA Richard Newton Technical Impact Award, the 2019 ACM/SIGDA Pioneering Achievement Award, and the 2016 European Design and Automation Association (EDAA) Lifetime Achievement Award.

He also received the 2016 IEEE Computer Society’s Harry Goode Award for seminal contributions to design and design tools of NoCs; the 2012 IEEE Circuits and Systems (CAS) Society’s Mac Van Valkenburg Award for contributions to theory, practice and experimentation in design methods and tools; and the 2003 IEEE Emanuel R. Piore Award for contributions to computer-aided synthesis of digital systems.

He received the Golden Jubilee Medal for outstanding contributions to the IEEE CAS Society, the D. Pederson Award for best paper on IEEE Transactions on Computer Aided Design (CAD)/Integrated Computer Aided System (ICAS), and best paper awards at events including DAC; Design, Automation and Test in Europe (DATE); Nanoarch; and Mobihealth.

In addition, he served as Division 1 Director of IEEE, co-founder and President Elect of the IEEE Council on EDA, President of the IEEE CAS Society, and Editor-in-Chief of the IEEE Transactions on CAD/ICAS. He has also chaired the following technical conferences:  Memocode; DAC; DATE; pHealth; VLSI SoC; and IEEE International Conference on Computer Design (ICCD).

About the Phil Kaufman Award
The Phil Kaufman Award honors individuals who have had a demonstrable impact on the field of electronic system design through technology innovations, education/mentoring, or business or industry leadership. The award was established as a tribute to Phil Kaufman, the late industry pioneer who turned innovative technologies into commercial businesses that have benefited electronic designers. The 2021 recipient was Dr. Anirudh Devgan, President and CEO of Cadence Design Systems.

About the IEEE Council on Electronic Design Automation (CEDA)
The IEEE Council on Electronic Design Automation (CEDA) provides a focal point for EDA activities spread across seven IEEE societies (Antennas and Propagation, Circuits and Systems, Computer, Electron Devices, Electronics Packaging, Microwave Theory and Techniques, and Solid-State Circuits). The Council sponsors or co-sponsors over a dozen key EDA conferences including: the Design Automation Conference (DAC), Asia and South Pacific Design Automation Conference (ASP-DAC), International Conference on Computer-Aided Design (ICCAD), Design Automation and Test in Europe (DATE), and events at Embedded Systems Week (ESWEEK). The Council also publishes IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems (TCAD), IEEE Design & Test (D&T), and IEEE Embedded Systems Letters (ESL). The Council boasts a prestigious awards program in order to promote the recognition of leading EDA professionals, which includes the A. Richard Newton, Phil Kaufman, and Ernest S. Kuh Early Career Awards. The Council welcomes new volunteers and local chapters.

Stay in touch with IEEE CEDA
Website: www.ieee-ceda.org
LinkedIn: https://www.linkedin.com/groups/8343531
Facebook: https://www.facebook.com/ieeeceda/
Twitter: https://twitter.com/IEEECEDA

About the Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community representing members in the electronic system and semiconductor design ecosystem, is a community that addresses technical, marketing, economic and legislative issues affecting the entire industry. It acts as the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry. Visit www.semi.org/en/communities/esdato learn more.

Follow the ESD Alliance
ESD Alliance Bridging the Frontier blog
Twitter: @ESDAlliance
LinkedIn
Facebook

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

All trademarks and registered trademarks are the property of their respective owners.

 

Contacts

Nanette Collins
Public Relations for the ESD Alliance                                   
Email:
[email protected]

Phone: 1.617.437.1822

Michael Hall
SEMI
Email: [email protected]
Phone: 1.408.943.7988

Amanda Osborn
IEEE Council on EDA

Email: [email protected]

Phone 1.352.872.5544 ext. 123

MUNICH, Germany ─ September 27, 2022 ─ Innovations in advanced technologies such as Smart Mobility, Smart MedTech, advanced packaging, fab management, materials, and other semiconductor industry growth drivers will come into sharp focus as visionaries and experts gather at Messe München in Munich, Germany 15-18 November for SEMICON Europa 2022. Registration is open

LogoThemed Chips Powering The Data Age, and co-located with electronica, SEMICON Europa 2022 will also highlight challenges and opportunities in sustainability, workforce development and across the supply chain as the semiconductor industry unites to address these critical issues. Europe’s largest microelectronics event, SEMICON Europa 2022 will feature an exhibition, conferences, forums and panel discussions.

“We are delighted to welcome key semiconductor industry leaders from across the value chain back to Munich to collaborate and discuss innovations vital to semiconductor industry growth in Europe and around the world,” said Laith Altimime, President of SEMI Europe.

SEMICON Europa Highlights

  • Opening Ceremony: Executives from Airbus, Athinia, Edwards Vacuum, imec, Porsche and Samsung will share their perspectives on key topics such as accelerating innovation, a sustainable and connected future, and European manufacturing excellence.
  • Advanced Packaging Conference: Thought leaders will highlight advanced solutions for electronics packaging and test, manufacturing equipment and materials, design for reliability and test, and Heterogeneous Integration (HI). 
  • Fab Management Forum: Experts will discuss topics such as chip manufacturing, datafication of fabs, and AI in microelectronics manufacturing as the industry intensifies its focus on long-term resilience strategies in light of COVID-19 and recent supply chain disruptions.
  • ITF Beyond 5G - Powered by imec: Experts will discuss Radio Frequency (RF) technology challenges and opportunities ranging from materials and devices to integrated circuits (ICs) and modules as advanced chips and compound semiconductors pave the way to next-generation mobile connectivity.
  • SEMI Networking Night: This event will gather stakeholders from across the electronics industry to connect with peers and explore new business partnerships.

Executive Forum Program

  • The Future of Work: Experts will discuss the importance of inclusive leadership in building a sustainable workforce and overcoming critical industry challenges such as the global talent shortage and increasing workplace diversity.
  • Materials Innovation: This session will explore materials innovation developments and challenges related to atomic-scale processing and control of interfaces, morphology, composition, and 3D conformality.
  • Smart Mobility Forum: Led by SEMI Europe’s Global Automotive Advisory Council (GAAC), this forum will provide an overview of industry stakeholders across the automotive and electronics value chains and discuss opportunities for overcoming current challenges faced by the automotive semiconductor industry.
  • Electrification and Power Semiconductors: With semiconductor innovation enabling the electrification of a wide variety of industries, this session will highlight key trends in the field of power semiconductors such as improving semiconductor manufacturing efficiencies and technologies.
  • Smart and Green Manufacturing Summit: Fab investments worldwide continue to grow to meet the demands of digital transformation as the semiconductor industry works to reduce its carbon footprint. This summit will explore how greater automation, data analytics, and resource-saving technologies will help the semiconductor industry achieve its sustainability goals.

TechARENA Program

  • Integrated Photonics: Photonic Integrated Circuits (PICs) will play a key role in future infrastructure for communication, biosensing, and mobility. This session will showcase the latest PIC technologies and applications and provide insights into current scientific and industrial advancements.
  • Smart MedTech Forum: The global pandemic has proven that a collaborative ecosystem can accelerate the introduction of healthcare solutions. This forum will examine how the medical industry will evolve to develop future therapies.
  • Future of Computing: Experts will showcase innovative computing solutions for edge devices and lower power consumption, as well as new paradigms for more efficient computing solutions.
  • From Edge to Cloud – Leveraging AI-driven Mechatronics for Resilient Manufacturing: Powerful intelligent mechatronic systems are helping manufacturers across industries achieve greater levels of productivity. Industry experts will discuss how Intelligent Motion Control under Industry4.E (IMOCO4.E) can help businesses meet the challenges of digital transformation.
  • Innovation Showcase: SEMI will highlight microelectronics and semiconductor innovations in pre-recorded messages and product announcements.

For more details, please visit the SEMICON Europa 2022 website and connect with SEMI Europe on Twitter or LinkedIn @SEMIEurope (#SEMICONEuropa).

Press and media partners can register for free by contacting Serena Brischetto at [email protected]

SEMICON Europa Sponsors

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts
Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: 
[email protected]

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: 
[email protected]

SAN JOSE and MILPITAS, Calif. September 27, 2022 The Autonomous Vehicle Computing Consortium (AVCC), a global group of automotive and technology industry leaders cooperating on expediting the delivery of automated and assisted driving compute solutions, and SEMI, the global industry association that unites the entire electronics manufacturing and design supply chain, announced today an alliance to drive autonomous vehicle innovation. Per the terms of the agreement, leadership and members of the two organizations will work together to amplify their voices for greater reach, co-promote the development of technology standards, and offer recommendations for driving mass market adoption of autonomous vehicles.

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The AVCC and SEMI collaboration will focus on the SEMI Global Automotive Advisory Council (GAAC), a global platform within the SEMI Smart Mobility initiative that engages member companies and industry stakeholders to build partnerships, address shared challenges, exchange information, and pursue new innovation and business opportunities. AVCC and SEMI both count auto manufacturers (OEMs), Tier 1 companies, semiconductor device makers, equipment and materials suppliers and other industry organizations as member companies.

With a shared interest in the future of the automotive industry and a focus on innovation, the AVCC and SEMI alliance will strengthen the technical work and marketing efforts of both organizations,” said Armando Pereira, President of AVCC. “We are thrilled to begin working with SEMI and its members.”

“The partnership with AVCC will bring new capabilities to SEMI members participating in our Smart Mobility initiative,” said Bettina Weiss, Chief of Staff and Corporate Strategy and Global Smart Mobility Lead at SEMI. “We look forward to bringing our ecosystems together to accelerate solutions for the autonomous vehicle market.”

“Each organization brings unique perspective and contributions to the table,” added Pereira. “Together, AVCC and SEMI will reach a larger and broader audience of automotive industry decision makers with their research, reports, recommendations and standards. We believe together we will ultimately transition autonomous vehicles from early-market innovation to an everyday part of our mobile lives.”

Highlights of the AVCC and SEMI alliance include:

  • Collaboration on the development of documents and a timeline to produce more incisive, comprehensive, and detailed work for the benefit of the organizations’ target communities
  • Cross-sharing of news, social media posts, communications, documents, reports, and other resources with members and audiences of both organizations
  • Opportunities to present at each other’s events and co-present at industry events
  • Cross-promoting, authoring, and publishing blogs and articles

 

About AVCC
The Autonomous Vehicle Computing Consortium (AVCC) is a global nonprofit group of automotive and technology industry leaders coming together to help accelerate mass production of safe and affordable vehicles with assisted driving and autonomous compute technology (SAE levels 1-5). This computing platform will be designed specifically to move today’s AV prototype systems to deployment at scale. The group collaborates to develop requirements for the compute platform architecture, its hardware requirements, and software APIs for each building block in autonomous vehicle systems. www.avcconsortium.org

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Contacts
Armando Pereira, President/ AVCC
+1 925.262.1024
[email protected]

Sarah LaLiberte, Marketing Committee Co-Chair/ AVCC
+1 978.502.8558
[email protected]

Michael Hall/SEMI
+1 408.943.7988

[email protected]

MILPITAS, Calif. — September 27, 2022 — Global fab equipment spending for front-end facilities is expected to increase approximately 9% year-over-year (YOY) to a new all-time high of US$99 billion in 2022, SEMI announced today in its latest quarterly World Fab Forecast report. The report also shows the global fab equipment industry increasing capacity this year and again in 2023.  

Logo“After achieving a record level in 2022, the global fab equipment market is projected to remain healthy next year driven by new fabs and upgrade activity,” said Ajit Manocha, SEMI President and CEO.

 

Chart

 

Fab Equipment Spending by Region

Taiwan is expected to lead fab equipment spending in 2022, increasing investments 47% YOY to US$30 billion, followed by Korea at US$22.2 billion, a 5.5% decline, and China at US$22 billion, a 11.7% drop from its peak last year. Europe/Mideast this year is forecast to log record high spending of US$6.6 billion, a 141% YOY surge this year though outlays remain comparatively smaller than in other regions. Strong demand for high-performance computing (HPC) advanced technologies is driving the region’s jump in spending. The Americas and Southeast Asia are also expected to register record high investments in 2023.

Semiconductor Industry Continues to Boost Capacity

The SEMI World Fab Forecast report shows a global capacity increase nearing 8% in 2022, reaching 7.7%, after a 7.4% rise in 2021. The fab equipment industry last saw a YOY growth rate of 8% in 2010, when it topped 16 million wafers per month (200mm equivalents) – nearly half of the 29 million wafers per month (200mm equivalents) projected for 2023. Capacity growth is expected to continue in 2023, increasing 5.3%.

Capacity increases at 167 fabs and production lines will account for over 84% of equipment spending in 2022, a proportion expected to slip to 79% next year as 129 known fabs and lines add capacity.  

As expected, the foundry sector, with a share of 53%, will represent the bulk of equipment spending in 2022 and 2023, followed by memory at 32% in 2022 and 33% in 2023. The two sectors also account for the largest capacity increases.

The latest update of the SEMI World Fab Forecast report, published in September, lists 1,453 facilities and lines globally, including 148 volume facilities and lines with various probabilities that are expected to start production in 2022 or later.  

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: 
[email protected]

Christian G. Dieseldorff/SEMI
Phone: 1.408.943.7940
Email:
 [email protected]  

TAIPEI — September 13, 2022 — SEMICON Taiwan 2022 opens tomorrow as industry leaders and visionaries gather to discuss the latest innovations and trends driving microelectronics industry growth. The event – Sept. 14-16 at the Nangang Exhibition Center, Hall I (TaiNEX 1) in Taipei – will feature expert insights on key semiconductor industry topics such as advanced manufacturing, smart manufacturing, heterogeneous integration, compound semiconductors, automotive chips, sustainable manufacturing, semiconductor cybersecurity and workforce development. Registration is open.  

The region’s premier gathering of the advanced manufacturing supply chain, SEMICON Taiwan 2022 will feature more than 700 exhibitors from Taiwan and abroad at over 2,400 booths as well as the largest show floor in the event’s nearly 30-year history.

At a pre-exhibition press conference today, industry leaders shared strategies for Taiwan's growth and their perspectives on the future of the semiconductor industry. Special guest speakers included:

  • Ming-Hsin Kung, Minister of Taiwan’s National Development Council
  • Tien Wu, CEO of Advanced Semiconductor Engineering (ASE) and Vice Chairman of SEMI International Board of Directors
  • Doris Hsu, Chairperson & CEO of GlobalWafers Group and Member of SEMI International Board of Directors
  • Donghui Lu, Corporate Vice President and Head of Micron Taiwan

“Despite continuing global economic challenges, the semiconductor industry is poised for long-term growth, with the industry expected to reach $1 trillion by 2030,” said Terry Tsao, Global Chief Marketing Officer of SEMI and President of SEMI Taiwan. “We’re excited to host companies from across the semiconductor supply chain for the latest industry developments, trends and innovations as they explore new business partnerships and market opportunities and address some of the world’s greatest challenges.”

SEMICON Taiwan Highlights

SEMICON Taiwan 2022 focuses on critical themes including the following.

  • Advanced Manufacturing The IC Forum brings together manufacturers, equipment and materials suppliers, and academia to help solve manufacturing challenges with innovative strategies and methodologies. 
  • Compound Semiconductors To promote the development of Taiwan's compound semiconductor industry, the Compound Semiconductor Pavilion features a series of forums and industry meetups focused on future industry trends and technologies.
  • Semiconductor Cybersecurity – The Semiconductor Cybersecurity Pavilion introduces new SEMI Standards that establish security requirements for microelectronics manufacturing.
  • Smart Manufacturing – The Smart Manufacturing Expo Taiwan brings together smart manufacturing solution providers including software and hardware vendors and system integrators to explore innovations aimed at optimizing manufacturing processes while improving production capacity and yield.
  • Semiconductor Sustainability – The Semiconductor Sustainability Summit focuses on critical themes including Green Technology for Zero Waste, Carbon Reduction, and Sustainable Innovation.   ​
  • Heterogeneous Integration – The Heterogeneous Integration Global Summit 2022 takes aim at key topics including digital transformation and 3D heterogeneous integration trends and energy-efficient high-performance computing (HPC).
  • Automotive Chips – The Global Auto Chips Executive Summit gathers microelectronics and automotive industry leaders to discuss collaboration opportunities and ways to accelerate the development of automotive chips.
  • Workforce Development – The Workforce Development program connects students with companies from across the semiconductor supply chain and includes educational programs such as Talent Development, Women in Semiconductor (WiS) and Diversity and Inclusion seminars that offer insights into workforce development trends and career planning.

The 22 international forums at SEMICON Taiwan 2022 will also address topics including the following:

The Strategic Materials Conference Taiwan and FLEX Taiwan 2022 are concurrent with SEMICON Taiwan 2022.

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact
Monica Hung/SEMI Taiwan
Email: [email protected]  
Phone: +886.3.560.1777 ext. 207

MILPITAS, Calif. – September 7, 2022 – Global semiconductor equipment billings rose 7% from the first to the second quarter of 2022 and 6% year-over-year to US$26.43 billion, SEMI announced today in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.

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Compiled from data submitted by members of SEMI and the Semiconductor Equipment Association of Japan (SEAJ), the WWSEMS Report is a summary of the monthly billings figures for the global semiconductor equipment industry. 

Following are quarterly billings data in billions of U.S. dollars with quarter-over-quarter and year-over-year changes by region:

 

Region

2Q2022

1Q2022

2Q2021

2Q (QoQ)

2Q (YoY)

Taiwan

6.68

4.88

 5.04

37%

32%

China

6.56

7.57

 8.22

-13%

-20%

Korea

5.78

5.15

 6.62

12%

-13%

North America

2.64

2.62

 1.68

1%

57%

Europe

1.86

1.28

 0.71

46%

162%

Japan

1.65

1.90

 1.77

-13%

-7%

Rest of World

1.25

1.29

 0.84

-3%

50%

Total

 26.43

 24.69

 24.87

7%

6%

Sources: SEMI (www.semi.org) and SEAJ (www.seaj.or.jp), September 2022
Note: Summed subtotals may not equal the total due to rounding. 


The SEMI Equipment Market Data Subscription (EMDS) provides comprehensive market data for the global semiconductor equipment market. The subscription includes three reports:

  • Monthly SEMI Billings Report, a perspective on equipment market trends
  • Monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and 24 market segments
  • SEMI Semiconductor Equipment Forecast, an outlook for the semiconductor equipment market

For more information or to subscribe, please contact the SEMI Industry Research and Statistics Group at [email protected]. More information is also available online.

 

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: 
[email protected]

MILPITAS, Calif. – September 6, 2022 – The MEMS and Sensors Executive Conference (MSEC 2022) will gather industry visionaries and experts October 10-12 at the Coronado Island Marriott Resort in San Diego for insights into the latest trends and innovations in sensorization for growth markets including the metaverse, bio-medical, agriculture, sustainability and positioning, navigation and timing. Registration is open for MSEC 2022, hosted by the MEMS & Sensors Industry Group (MSIG), a SEMI technology community.

LogoThemed Sensorize to Survive and Thrive, MSEC 2022 will focus on technology solutions to pressing challenges in healthcare, the environment, resource management and safety. The event will showcase components, software, and systems critical to MEMS and sensors innovations.

Internet of Things (IoT) spending is surging as digital transformation continues apace, creating new opportunities for MEMS and sensors. The compound annual growth rate (CAGR) for IoT spending will reach 26.7% between 2022 and 2025 as the number of global IoT connections reaches a forecasted 31 billion, a tenfold increase from a decade ago, according to IoT Analytics. The market research firm reports that in 2020, IoT connections for smart devices such as cars, home electronics and connected industrial equipment outnumbered non-IoT-connected electronics for the first time.

“Sensors are driving the widespread adoption of smart and connected IoT systems, which require unprecedented amounts of data,” said Dr. Tim Brosnihan, executive director of the SEMI MEMS & Sensors Industry Group. “By better monitoring the air we breathe, the water we drink, the food we eat, the health of our bodies and the safety of our surroundings, sensors continue to improve the quality of our lives.”

MSEC Keynotes

HS

 

Benjamin Cook, Director of Hardware Research
META 

Grand Challenges for MEMS Augmented Reality & Virtual Reality

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HS

 

Stefan Finkbeiner, CEO
Bosch Sensortec GmbH 

How MEMS & Sensors Have Positively Impacted Our Lives

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HS

 

Roland Helm, Head of Segment Sensors
Infineon Technologies AG 

MEMS Microphones: Securing High-quality Audio for a New Remote Workforce

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MSEC 2022 will also feature sessions on topics including the following:

  • Diversity, Equity, and Inclusion Panel A.M. Fitzgerald & Associates LLCN5 Sensors Inc., Qualcomm Technologies and Robert Bosch LLC
  • Precision Agriculture: A Virtuous Endeavor or a Vicious Sink-hole of Disappointment? – Nio Labs
  • Sensing as a Service Product Showdown Inviza, N5 Sensors, Inc., and SiWare Systems
  • Industry Market Outlook and Emerging Trends MEMStaff

MSEC 2022 Business Networking Opportunities

  • Welcome Reception – Meet-and-greet networking opportunity for attendees
  • Picture This Scavenger Hunt – Team-building activity on Coronado Island with the opportunity to win prizes and network with industry peers
  • MSIG Industry Awards Dinner – Recognition of MSIG Hall of Fame Award Recipients and Emerging Leaders for 2022

COVID-19 Safety Protocols

The health and well-being of all event exhibitors and attendees remains the top priority for SEMI. MSEC 2022 health and safety guidelines to protect against spread of COVID-19 will help provide a safe experience for all attendees on-site. 

MSEC 2022 Premier Sponsors

Event sponsors also include Evatec, Okmetic Oy, Rogue Valley Microdevices, SUSS MicroTec, Teledyne Technologies and TEL.

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Learn more at MSEC 2022.

 

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: 
[email protected]

GRENOBLE, France – August 30, 2022 MEMS and imaging sensor innovations driving an explosion of Smart applications will take the spotlight as the SEMI MEMS & Imaging Sensors Summit gathers industry experts and visionaries next week for insights into intelligent sensing advancements. The event, 6-7 September in Grenoble, returns to the World Trade Center (WTC) in Grenoble. Registration is open. 

Mems Sensors Image LogoThemed Intelligent Sensing for Better and Smarter Living, the SEMI MEMS & Imaging Sensors Summit will highlight the latest technology developments and trends for key applications in segments such as automotive, healthcare, green manufacturing, smart vision, camera technology, industrial safety and air quality.

Executive Keynotes

“MEMS and sensors are improving the quality of life around the world, a trend that promises to pick up pace as innovators develop new sensor applications across nearly every industry imaginable to reshape the way people work and live,” said Ajit Manocha, president and CEO of SEMI, whose keynote will open the conference. “The SEMI MEMS & Imaging Sensors Summit assembles a premiere lineup of industry experts to explore future applications that will lead to a smarter world and drive sensing market growth.”

The Onlife era is driving a paradigm change in the man-machine interface to enable the Metaverse, Industry 5.0, autonomous vehicles and other innovations, opening new opportunities for MEMS and imaging devices. The keynote Semiconductors Powering the Future by Andrea Onetti, Executive Vice President of the MEMS Sub-Group at STMicroelectronics, will highlight the critical importance of collaboration across the semiconductor supply chain in bringing these new technologies to market.

In his keynote Implementing a Human Centric Approach for Innovative Smart Sensors, Sébastien Dauvé, CEO of CEA-Leti, will explore developments in innovative sensors for applications such as healthcare, wellness, environment, clean mobility, and cybersecurity.

MEMS & Imaging Sensors Summit Sessions

Common Track

  • During the summit’s first session, A Diverse and Sustainable Workforce Enabling Next Generation Innovation, industry leaders will discuss how workforce diversity can help spur innovation and leaders can create an inclusive environment where employees can thrive. The session, sponsored by Merck KGaA, Darmstadt, Germany and Edwards Vacuum, will close with a panel discussion.
  • Market Brief session speakers will highlight industry trends and market drivers.
  • The Intelligent Sensing will highlight new sensor technologies that enable fast, reliable edge computing to pave the way for smarter applications in industries such as automotive and medical.
  • The session dedicated to materials and equipment advances will highlight higher performance MEMS devices for new manufacturing techniques and equipment.
  • The emerging sensor applications sessions will feature industry leaders discussing the latest developments in photonics, biosensors, and spectroscopic technologies.
  • The final session will explore how the integration of optics and silicon through co-packaged optics (CPO) can meet growing performance and power efficiency demands fueled by the rapid growth of cloud data.

Parallel Sessions

After the common conference track, industry leaders will discuss MEMS and imaging technology advancements during the following parallel sessions:

  • The MEMS Track will present MEMS technology applications, devices and manufacturing trends, including the integration of multiple sensors into System in Package (SiP), MEMS for medical sensing, and system integration of data generation and data processing. Manufacturing advancements enabling 300mm wafer sizes, 3D integration and substrate diversification and environmental MEMS technologies will also come into focus.
  • The Imaging Track will explore imaging technology advancements and the future of sensing processes, design and computing. Industry experts will discuss the latest advancements in traditional Short-wave infrared (SWIR) imaging technology and the promise of new quantum dot SWIR as well as provide an overview of how more cost-effective sensors and solutions for SWIR hyperspectral imaging are enabling new consumer applications.

Networking

The exclusive exhibition area at the World Trade Center will offer networking and B2B matchmaking opportunities, including networking lunches on Sept. 6 and Sept. 7. The Chateau Sassenage will host a Gala Dinner, sponsored by JSR Micro N.V. and Teledyne, on Sept. 6. Dinner tickets can be reserved online or onsite. 

AEMtec GmbHOkmetic Oy
ASE, Inc.Onto Innovation
BeneqOPTIM Wafer Services
Bühler Leybold OpticsPolyteknik AS
Comet GroupPyxalis
ConfovisRENA Technologies GmbH
DELO Industrial AdhesivesSAES Getters SpA
DISCO HI-TEC EUROPE GmbHSCHOTT AG
Eurofins MASER B.V.SET
EV Group (EVG)Siemens EDA
EvatecSilvaco Europe Ltd.
Fraunhofer IPMSSÜSS MicroTec
GpixelSVCS Process Innovation
IQEVTT Ltd.
IRT NanoelecYole Group
KLA CorporationZero EC
Lam Research 


Premier Sponsors

The SEMI MEMS & Imaging Sensors Summit is hosted by SEMI Europe and the MEMS & Sensors Industry Group, a SEMI Technology Community.

For more information, please visit the SEMI MEMS & Imaging Sensors Summit website. Stay in touch on Twitter @SEMIEurope: #SensorsSummit #MEMS #Imaging #SEMIEurope

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact
Serena Brischetto / SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

SHANGHAI — August 23, 2022 — With sustainability, smart manufacturing and advanced packaging key to semiconductor industry growth and prosperity, SEMICON China 2022 will gather industry leaders and visionaries Oct. 5-7 at the Shanghai New International Expo Centre for the latest insights on these and other critical topics in the electronics industry. The world’s largest semiconductor conference and exhibition, SEMICON China is a key enabler of collaboration and innovation across the entire electronics supply chain including chip design, manufacturing, assembly and test, equipment and materials. Registration for the event, co-located with FPD China, is open.

LogoSEMICON China 2022 Highlights

  • Grand Opening Keynotes – Industry leaders will discuss global business and technology developments and market trends. A live broadcast of the keynotes will be accessible on the Grand Opening Keynotes webpage.
  • Supply Chain Theme: SEMI Innovation and Investment Forum (SIIP China) – The forum will focus on topics including economic environment, industry dynamics, trade disputes, STAR Market opportunities, international cooperation, equipment and materials procurement, semiconductor supply chain challenges and opportunities, and Internet of Things (IoT).
  • Smart Manufacturing Forum – Major semiconductor manufacturers such as Amkor Technology, Intel, Lam Research and Huawei and their suppliers will discuss the latest smart manufacturing capabilities and best practices.

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts
Cherry Sun
SEMI China
Email: 
[email protected] 
Phone: +86.21.6027.8548

Michael Hall
SEMI Headquarters
Email: 
[email protected]
Phone: 1.408.943.7988SEMICON China 2017 Presents Six Forums in China’s Explosive Growth Market

MILPITAS, Calif. August 16, 2022 SEMI, the global industry association that unites the entire electronics manufacturing and design supply chain, today announced the appointment of semiconductor industry veteran John Cooney as Vice President of Global Advocacy and Public Policy. Based in the Washington, D.C. office and reporting to SEMI President and CEO Ajit Manocha, Cooney brings more than 20 years of public policy experience to the role.  

SEMI logoCooney will oversee global government relations at SEMI, including directing strategies to manage and strengthen the association’s global public policy agenda and advocacy efforts. His work will include teaming with SEMI regional presidents to grow their government relations outreach and manage relationships with policymakers, association members and SEMI public policy committees.

John Cooney’s deep global government relations and semiconductor industry expertise will be a tremendous asset to SEMI as we continue our work to help shape public policy in advancing the interests of our members and the industry,” Manocha said. “We are confident that he will quickly have an impact in this crucial time when governments around the world are enacting legislation and offering incentives to bolster their domestic semiconductor ecosystems and ensure the resilience of their supply chains.”

“I am honored to join SEMI at this exciting time for the semiconductor industry as countries worldwide intensify their focus on the semiconductor industry’s vital importance to the broader electronics supply chain and global economy,” Cooney said. “I look forward to working with representatives at SEMI member companies to build on the association’s work to shape government policies on trade, tax, talent, technology and other key issues to help ensure the industry’s continuing growth.”

Cooney replaces former SEMI Vice President of Global Advocacy and Public Policy, Joe Pasetti.

“We thank Joe Pasetti for his contributions to the SEMI Global Advocacy program, especially his leadership in seeking the inclusion of a tax credit for U.S. facilities that produce semiconductors or chipmaking equipment in the U.S. CHIPS and Science Act and advocating for SEMI member companies in the semiconductor manufacturing and equipment segments to be eligible for incentives,” Manocha said.

Cooney joins SEMI from SkyWater Technology, a Minnesota-based SEMI member company, where he served as Director of Government Relations. Prior to his role at SkyWater, he held several senior-level leadership roles in the U. S. Department of Commerce, including as Chief of Staff and Senior Advisor for the International Trade Administration and Deputy Assistant Secretary for Global Operations of the U.S. and Foreign Commercial Service

Cooney received his B.A. in Political Science from the University of Minnesota.  

Visit SEMI Global Advocacy to learn more about public policy efforts and developments, and SEMI Workforce Development for more information on efforts to address the microelectronics industry’s talent needs.

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact   
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: 
[email protected]