Consortium aims to accelerate reduction of greenhouse gas emissions across semiconductor value chain.

Consortium members and SEMI to participate at 2022 United Nations Climate Change Conference (COP27).

MILPITAS, Calif. — November 1, 2022 — SEMI, the industry association serving the global electronics manufacturing and design supply chain, and the new Semiconductor Climate Consortium (SCC), a group formed by companies across the semiconductor value chain to accelerate the ecosystem’s reduction of greenhouse gas emissions, today announced more than 60 founding members of the Consortium.

Representatives from SCC member companies and SEMI will hold informational sessions November 8-10 during COP27 in Sharm El Sheik, Egypt. Requests to attend a session and for more information on the SCC can be sent to [email protected].

The SCC is the first global collaborative of semiconductor ecosystem companies focused on reducing greenhouse gas emissions across the value chain. The consortium’s members are committed to working toward the following pillars and objectives:

• Collaboration – Align on common approaches, technology innovations and communications channels to continuously reduce greenhouse gas emissions.
• Transparency – Publicly report progress and Scope 1, 2 and 3 emissions annually.
• Ambition – Set near- and long-term decarbonization targets with the aim of reaching net zero emissions by 2050.

Founding members have affirmed their support of the Paris Agreement and related accords driving the 1.5⁰C pathway and are aligned on the need to drive climate progress within the semiconductor value chain. The SCC was conceptualized by companies meeting under the SEMI Sustainability Initiative, which will continue to focus on non-climate related Environment, Social and Governance (ESG) issues. 

“I applaud all Semiconductor Climate Consortium founding members for their leadership in this critical initiative and for their continued support of global sustainability efforts,” said Ajit Manocha, SEMI president and CEO. “While individual companies have taken significant steps to decarbonize, the industry must band together to develop green solutions and drive toward net zero. I encourage every company across the value chain to join the SCC and contribute to this crucial mission.”

Semiconductor Climate Consortium – 65 Founding Members

“The commitment and support of the Semiconductor Climate Consortium founding members is truly inspiring,” said Dr. Mousumi Bhat, vice president of Global Sustainability Programs at SEMI. “SCC members recognize the climate impact of the industry and the need for a heightened focus on collaboration to drive sustainable growth across the value chain. We look forward to setting meaningful sustainability goals and helping ensure a healthy environment for future generations.”

The next phase in the development of the SCC is the election of its governing council. Representing a broad cross-section of the value chain, the council will establish the Consortium’s priorities to be carried out by member-led work groups. 

See comments from Semiconductor Climate Consortium founding members on their participation.  

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI Announces Semiconductor Climate Consortium Founding Members

MILPITAS, Calif. — October 25, 2022 — Worldwide silicon wafer shipments reached a new record of 3,741 million square inches (MSI) in the third quarter of 2022, increasing 1.0% quarter-over-quarter and growing 2.5% from the 3,649 MSI recorded during the same quarter last year, the SEMI Silicon Manufacturers Group (SMG) reported in its quarterly analysis of the silicon wafer industry.

“While the semiconductor industry has faced macroeconomic headwinds, the silicon industry continues to show quarter-over-quarter shipment increases,” said Anna-Riikka Vuorikari-Antikainen, Chairman of SEMI SMG and Chief Commercial Officer at Okmetic. “As the role of silicon wafers is fundamental in the broader cyclical industry, we remain confident in long-term growth.”
 

Silicon Area Shipment Trends – Semiconductor Applications Only 

Data cited in this release include polished silicon wafers such as virgin test and epitaxial silicon wafers, as well as non-polished silicon wafers shipped to end users.

Silicon wafers are the fundamental building material for the majority of semiconductors, which are vital components of all electronic devices. The highly engineered thin disks are produced in diameters of up to 12 inches and serve as the substrate material on which most semiconductors are fabricated.

The SMG is a sub-committee of the SEMI Electronic Materials Group (EMG) and is open to SEMI members involved in manufacturing polycrystalline silicon, monocrystalline silicon or silicon wafers (e.g., as cut, polished, epi). The SMG facilitates collective efforts on issues related to the silicon industry including the development of market information and statistics about the silicon industry and the semiconductor market.

For more information, visit SEMI Worldwide Silicon Wafer Shipment Statistics.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Worldwide Silicon Wafer Shipments Set New Record in Q3 2022, SEMI Reports

HO CHI MINH CITY, Vietnam — 24 October 2022 — With Vietnam an emerging force in Asia’s microelectronics supply chain, the stage is set for the Vietnam Business Summit as industry stakeholders gather 10-11 November at the Renaissance Riverside Hotel Saigon in Ho Chi Minh City for insights into growth opportunities in Vietnam’s semiconductor industry and across the Southeast Asia electronics ecosystem. Hosted by SEMI Southeast Asia and the Ho Chi Minh City Semiconductor Industry Association (HSIA), the event is themed Connecting Vietnam to the Southeast Asia Semiconductor Ecosystem. 

The Vietnam Business Summit will feature perspectives from business leaders and government officials on Vietnam’s investment policies, talent development initiatives and digital transformation trends. The Summit will include a visit by attendees to Saigon Hi-Tech Park (SHTP), a 913-hectare state-of-the-art technology and science hub. Attendees will also tour the Vietnam National University Ho Chi Minh City, one of the two largest research universities in Vietnam and a key contributor to talent development in the region.  

“Singapore and Vietnam share a history of strong economic and people relations,” said Karen Leo, Deputy Executive Director of Singapore Global Network. “Building on this, we are excited to be a part of the Vietnam Business Summit where together with our Singapore enterprises, we look forward to bridging connections and inspiring new opportunities for people and businesses in Vietnam as well as the larger Southeast Asia region.”

“Vietnam is becoming a new destination for the semiconductor industry and plays a major role in developing its supporting industries, serving as an engine for the country’s economic growth,” said Nguyen Anh Tuan, Chairman of HSIA. “To become an emerging semiconductor chip manufacturing centre, the Vietnamese government must assist in infrastructure development, simplify administrative procedures, increase transparency, and continue to update regulations to ensure fair competition. We look forward to welcoming delegates to Vietnam and exchanging knowledge with our industry counterparts from SEMI Southeast Asia.”

“Saigon Hi-Tech Park is committed to supporting businesses in the semiconductor ecosystem within Vietnam and across Southeast Asia,” said Nguyen Anh Thi, President of SHTP. “Our mission is to build the foundation for high-tech industries, and the semiconductor industry plays an important role in attracting investment and development of this sector. The past two decades have seen foreign direct investment (FDI) forming the necessary infrastructure to support the development of high-tech enterprises in Vietnam. This is why connecting with communities, organizations, technology associations, and industries plays an important role in attracting resources for the development of SHTP. This summit is an opportunity for us to introduce our vision and goals to develop the semiconductor industry in the coming years.”  

“Vietnam is an emerging force in the global semiconductor supply chain and continues to show tremendous growth potential,” said Linda Tan, President of SEMI Southeast Asia. “The Vietnam Business Summit complements SEMI Southeast Asia’s vision to bolster the region’s supply chain. This summit has garnered strong interest from our members and partners, allowing us to form a party of more than 50 delegates from over eight countries who are thrilled to meet again in person this year for a series of compelling site tours, speeches, and conference topics aimed at fueling the growth of Vietnam’s semiconductor industry and the Southeast Asia microelectronics supply chain.”

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

For more information, please visit: https://www.semi.org/en/sea/events/vietnam-business-summit-2022

Association Contacts

Ryan Teo/SEMI Southeast Asia
Phone: 65.6392.9516
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Vietnam Business Summit to Highlight Region’s Semiconductor Industry Growth Opportunities

SEMI to launch model at GSMC to help organizations assess their Industry 4.0 technology deployment progress.

MILPITAS, Calif. — October 20, 2022 — Aiming to accelerate the adoption of Smart Manufacturing across the worldwide microelectronics supply chain, the SEMI Global Smart Manufacturing Conference (GSMC) will gather Industry 4.0 experts November 8-10 to share insights into state-of-the-art technologies and strategies designed to drive higher product quality, enhance production efficiencies and improve electronics manufacturing sustainability. Registration for the virtual conference is open.

Restricted travel and access to experts across global semiconductor supply chains have accelerated the implementation of Smart Manufacturing strategies, big data analytics, digital transformation, autonomous systems and AI/ML technologies. Presentations at GSMC 2022, organized by the SEMI Smart Manufacturing Initiative, will focus on critical topics identified within the SEMI Smart Manufacturing Roadmap.

GSMC 2022 will feature six sessions (i=Intelligent):

• Session 1 – i-Acquire: Data Sources, Variety and Acquisition
• Session 2 – i-Insights: Current Point Systems
• Session 3 – i-Digital Twin: Multi-Level Digital Twin
• Session 4 – i-Predict: AI/ML Solution Integration
• Session 5 – i-Autonomy: Smart Autonomous Control
• Session 6 – Foundational Topics Including Sustainability and Cybersecurity

Smart Manufacturing leaders presenting at GSMC include:

At GSMC 2022, SEMI will launch the Smart Manufacturing Initiative’s Industry 4.0 Readiness Assessment Model (IRAM) to help organizations to assess their Industry 4.0 technology deployment progress. Developed through a collaboration of SEMI and industry experts, the model is intended to help companies across the semiconductor supply chain identify technology enhancements critical to scaling and sustaining their smart manufacturing transformation.

The SEMI Smart Manufacturing Initiative is global with chapters in the Americas, China, Europe, Japan, Korea, Southeast Asia and Taiwan. Group members collaborate on Smart Manufacturing challenges and opportunities in their regions.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI Global Smart Manufacturing Conference Takes Aim at Speeding Adoption of Best Practices

TAIPEI, Taiwan — October 18, 2022 — Energy Taiwan, Taiwan's largest green energy exhibition, opens tomorrow at the Nangang Exhibition Center (TaiNEX 1) in Taipei as renewable energy technology leaders gather to share the latest trends and developments across Taiwan’s energy supply chain. Organized by SEMI and the Taiwan External Trade Development Council (TAITRA), the 3-day event connects domestic and foreign energy companies to explore new innovations and business opportunities.

“SEMI looks forward to hosting discussions at Energy Taiwan on green energy policies and cross-sector technology development that will help move Taiwan toward net-zero emissions,” said Terry Tsao, Global Chief Marketing Officer of SEMI and President of SEMI Taiwan. “Taiwan’s energy industry can only reach its full potential through the collaboration of industry, government and academia. The SEMI Sustainability Advisory Council and the SEMI Energy Group are key facilitators of these discussions.”

The Sustainability Advisory Council consists of more than 35 semiconductor ecosystem companies that are collaborating to organize a net zero strategy to advance decarbonization across the industry.

With 1,000 booths and an expected attendance of more than 10,000 – the largest Energy Taiwan ever – the event will feature five exhibition areas focused on key sectors of Taiwan’s energy industry.

Energy Taiwan Exhibitions

• PV Taiwan: Global photovoltaic (PV) manufacturers, supply chain vendors and suppliers such as Motech, TSEC, United Renewable Energy, Win Win Precision Technology and Ysolar will showcase the latest PV manufacturing equipment and materials, systems and components, cells and modules, testing and verification services, and related applications. Taiwan’s largest solar photovoltaic show, PV Taiwan is celebrating its 15th anniversary.

• Wind Energy Taiwan: Leading global wind energy developers and local supply chain players will highlight wind energy equipment raw materials, components, subsystems, maritime engineering, offshore wind foundations, system accessories, wind turbine systems, modules and cargo carriers, and talent development services. Participating companies include CI Wind Power Development, Fortune Electric, Northland Power, Hitachi Energy Taiwan, J&V Energy Technology, Ørsted Taiwan, Swancor Renewable Energy and WPD Taiwan Energy.

• Smart Storage Taiwan: The latest energy storage technologies for smart grids, smart meters, electric vehicles, and energy management systems will be displayed by companies including Billion Watts Technologies, Eco Energy, ETI CA Battery, Land San Electric, Leader Energy Storage Technology, Pihsiang Energy Technology, Power Electronics, Sysgration, Voltronic Power Technology, and Yu Chen System Technology.

• New – Emerging Power Taiwan: Hydrogen power and small hydropower as well as tidal, geothermal and biomass energy are critical to achieving net-zero carbon emissions by 2050. The British Office Taipei, Taiwan Institute of Economic Research, and Taiwan SHP Industries Alliance will showcase hydrogen power production equipment and materials, storage and delivery systems, and fuel cells.

• New – Net-Zero Taiwan: A wide range of solutions and services for carbon capture and storage, green power certification, carbon reduction, energy savings, and green finance will be showcased by exhibitors including Bank Sinopac, Delta Electronics, HD Renewable Energy, Taiwan Power Company, Taiwan Carbon Asset, Underwriters Laboratories Taiwan, and Vecow.

About SEMI Energy Group
Established by SEMI in 2008, the SEMI Energy Group supports a comprehensive renewable energy ecosystem that encompasses three major green energy supply chains: solar energy; wind power generation; and smart energy storage and power grids. In recent years, the scope of the SEMI Energy Group has expanded to include hydrogen energy, fuel cells, and green finance. The SEMI Energy Group’s energy industry committee facilitates communications among industry, government, and academia on green energy policy and technologies to achieve net-zero and sustainable development goals.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Monica Hung/SEMI Taiwan
Phone: 03.560.1777 ext.209
Email: [email protected]  

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected] 

• Read more about Energy Taiwan 2022 Opens Tomorrow to Spotlight Green Energy Innovations and Region’s Drive Toward Net-Zero Emissions

MILPITAS, Calif. — October 18, 2022 — Semiconductor manufacturers worldwide are estimated to increase 200mm fab capacity 20% from 2021 through 2025, adding 13 new 200mm lines as the industry reaches a record high of more than 7 million wafers per month (wpm), SEMI announced today in its 200mm Fab Outlook to 2025 report. Surging demand for automotive and other applications are driving the capacity expansion for power semiconductors and MEMS.

Chipmakers including ASMC, BYD Semiconductor, China Resources Microelectronics, Fuji Electronics, Infineon Technologies, Nexperia and STMicroelectronics have announced new 200mm fabs to meet growing demand.

The SEMI 200mm Fab Outlook to 2025 report shows fab capacity for automotive and power semiconductors growing at a rate of 58% from 2021 to 2025, followed by MEMS at 21%, foundry at 20% and analog at 14%.
 

Regional Outlooks

China will lead the world in 200mm capacity expansions with a 66% increase by 2025, followed by Southeast Asia at 35%, Americas at 11%, Europe and Mideast at 8%, and Korea at 2%. In 2022, China is expected to claim 21% share of global 200mm fab capacity, followed by Taiwan and Japan at 11% and 10%, respectively.

The SEMI 200mm Fab Outlook to 2025 report tracks more than 330 fabs and lines. The report reflects 75 updates across 53 facilities and lines and includes four new projects since the previous report in April 2022.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

Christian G. Dieseldorff/SEMI US
Phone: 1.408.943.7940
Email: [email protected]

Chih-Wen Liu/SEMI Taiwan
Phone: 886.932.309.146
Email: [email protected]

• Read more about Global 200mm Semiconductor Fab Capacity Projected to Surge 20% to Record High by 2025, SEMI Reports

MILPITAS, Calif. — October 17, 2022 — Electronic System Design (ESD) industry revenue increased 17.5% from $3,191.4 million in Q2 2021 to $3,748.7 million in Q2 2022, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report. The four-quarter moving average, which compares the most recent four quarters to the prior four, rose 15.3%.   

“The electronic design automation (EDA) industry in Q2 2022 posted the highest year-over-year (YOY) increase in over a decade,” said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report. “Quarterly revenue reached a record $3,748.7 million. All product categories and geographic regions recorded growth in the quarter.”

The companies tracked in the EDMD report employed 54,408 people globally in Q2 2022, an 8.9% increase over the Q2 2021 headcount of 49,964 and up 6% compared to Q1 2022.

The quarterly EDMD report contains detailed revenue information with the following category and geographic breakdowns.

Revenue by Product and Application Category – Year-Over-Year Change

• Computer-Aided Engineering (CAE) revenue increased 12.1% to $1,137.3 million. The four-quarter CAE moving average increased 12.9%.

• IC Physical Design and Verification revenue increased 13% to $657 million. The four-quarter moving average for the category increased 0.6%.

• Printed Circuit Board and Multi-Chip Module (PCB and MCM) revenue increased 22% to $347.1 million. The four-quarter moving average for PCB and MCM rose 12.9%.

• Semiconductor Intellectual Property (SIP) revenue jumped 22.6% to $1,476.7 million. The four-quarter SIP moving average grew 25.3%.

• Services revenue increased 23.2% to $130.7 million. The four-quarter Services moving average increased 24.8%.

Revenue by Region – Year-Over-Year Change

• The Americas, the largest reporting region by revenue, procured $1,643.4 million of electronic system design products and services in Q2 2022, a 20.2% increase. The four-quarter moving average for the Americas rose 18.5%.

• Europe, Middle East, and Africa (EMEA) procured $472 million of electronic system design products and services in Q2 2022, a 13.7% increase. The four-quarter moving average for EMEA grew 9%.

• Japan’s procurement of electronic system design products and services increased 6.1% to $252.3 million. The four-quarter moving average for Japan rose 4.3%.

• Asia Pacific (APAC) procured $1,381 million of electronic system design products and services in Q2 2022, a 17.9% increase. The four-quarter moving average for APAC increased 16.1%.

About the EDMD Report
The ESD Alliance Electronic Design Market Data (formerly the Market Statistics Service) report presents Electronic Design Automation (EDA), SIP and services industry revenue data quarterly. Both public and private companies contribute data to the report available from SEMI. Each quarterly report is published approximately three months after quarter close. EDMD report data is segmented as follows:

• Revenue by product category (CAE, IC Physical Design and Verification, Semiconductor IP, PCB/MCM Layout, and Services) including numerous detailed sub-categories
• Revenue by geographic region (Americas, EMEA, Japan and APAC)
• Total employment at participating companies

For information about SEMI market research reports, visit the SEMI Market Research Reports and Databases Catalog.

About the Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community, is the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry. As an international association of companies providing goods and services throughout the semiconductor design ecosystem, it is a forum to address technical, marketing, economic and legislative issues affecting the entire industry. For more information about the ESD Alliance, visit http://esd-alliance.org.

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

The information supplied by the ESD Alliance is believed to be accurate and reliable, but the ESD Alliance assumes no responsibility for any errors that may appear in this document. All trademarks and registered trademarks are the property of their respective owners.

Press Contacts                                                                                 

Paul Cohen
ESD Alliance
A SEMI Technology Community
978-769-2106             

Jack Taylor
Siemens EDA PR
Siemens Digital Industries Software
512-560-7143 

• Read more about Electronic System Design Industry Hits Record Revenue of Nearly $3.8 Billion in Q2 2022, ESD Alliance Reports

TOKYO – October 11, 2022 – With Japan accounting for more than 30% of semiconductor manufacturing equipment and materials sales worldwide, the stage is set for SEMICON Japan 2022 as Japanese and international companies from across the microelectronics manufacturing supply chain gather December 14-16 at Tokyo Big Sight for insights into the latest technology innovations, developments and trends. Industry experts and visionaries will discuss pressing semiconductor industry topics including smart sensing, mobility, flexible hybrid electronics, advanced packaging and materials, and quantum computing. Registration is open.

The new Advanced Packaging and Chiplet Summit (APCS) at SEMICON Japan will bring together industry leaders including AMD, ASE Group, Intel and NTT to discuss packaging innovations that are enabling more compact devices with lower power requirements, higher speeds and greater reliability – key in segments such as artificial intelligence (AI), 5G, and automotive. The Summit will also feature an exhibition and networking event.

Industry Visionaries Presenting at SEMICON Japan 2022

	Dario Gil, Senior Vice President and Director, IBM Research Opening Keynote Panel
	Tetsuro Higashi, Chairperson of the Executive Board, TIA; Chairman, Councils and Study Groups for Semiconductor and Device Industry Strategy Opening Keynote Panel
	Ravi Mahajan, Fellow, Intel Advanced Packaging and Chiplet Summit
	Jun Sawada, Chairman, Representative Member of the Board, NTT Keynote
	Chidi Chidambaram, Vice President of Engineering, Qualcomm Keynote
	Terushi Shimizu, Senior Executive Vice President, Sony Group Corporation; Representative Director, President and CEO, Sony Semiconductor Solutions Grand Finale Panel

SEMICON Japan 2022 Program Highlights

• FLEX Japan 2022 Conference – Experts from Elephantech, Meltin MMI, PI-CRYSTAL, PGV and Shiftall will discuss innovations that are driving new flexible hybrid electronics applications and market growth.
• SEMI Technology Symposium (STS) – Industry leaders and front-line engineers will explore the latest advances across key technology areas including smart sensing, testing, packaging, materials, power and lithography.
• Frontline of Quantum Computing Development – Quantum computing promises to drive electronics industry advances in areas such as materials development, product design and smarter manufacturing. Experts from Fujitsu and RIKEN will explore quantum computing trends and business opportunities.
• Next-Gen Mobility Forum – Representatives from the Ministry of Economic Trade and Industry and Japan Airlines will discuss the latest initiatives and trends in air mobility.
• SEMI Market Forum – The forum will feature the latest SEMI semiconductor manufacturing equipment and materials market forecasts, including updates on capital investments and production capacity in front-end fabs, as well as an electronics market outlook by market analyst firm Omdia.

SEMICON Japan 2022 Sponsors

• Platinum: Disco Corporation, Hightec Systems Corporation, Hitachi High-Tech Corporation, Screen Semiconductor Solutions Co., Ltd., and Tokyo Electron Limited
• Gold: Advantest, Applied Materials, Ebara, JSR, Kokusai Electric, Lam Research, Nikon, and Tokyo Seimitsu

Learn more at SEMICON Japan 2022.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Hiroki Yomogita/SEMI Japan
Phone: 81.3.3222.5854
Email: [email protected]

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMICON Japan 2022 to Spotlight Innovations Driving Semiconductor Industry Growth

MILPITAS, Calif. — October 11, 2022 — Semiconductor manufacturers worldwide are forecast to expand 300mm fab capacity at a nearly 10% compound average growth rate (CAGR) from 2022 to 2025, reaching an all-time high of 9.2 million wafers per month (wpm), SEMI announced today in its 300mm Fab Outlook to 2025 report. Strong demand for automotive semiconductors and new government funding and incentive programs in multiple regions are driving much of the growth.  

New fabs announced by companies including GlobalFoundries, Intel, Micron, Samsung, SkyWater Technology, TSMC and Texas Instruments are ramping in 2024 or 2025 to help meet the growth in demand.  

“While shortages of some chips have eased and supply of others has remained tight, the semiconductor industry is laying the groundwork to meet longer-term demand for a broad range of emerging applications as it expands 300mm fab capacity,” said Ajit Manocha, SEMI President and CEO. “SEMI is currently tracking 67 new 300mm fabs or major additions of new lines expected to start construction from 2022 to 2025.”
 

Regional Outlooks

China is projected to increase its global share of 300mm front-end fab capacity from 19% in 2021 to 23% in 2025, reaching 2.3 million wpm, a rise driven by factors including growing government investments in the domestic chip industry. With the growth, China is nearing global leader Korea in 300mm fab capacity and expected to overtake Taiwan, now in second place, next year.

Taiwan’s worldwide capacity share is expected to slip 1% to 21% from 2021 to 2025, while Korea’s share is also projected to edge lower 1% to 24% during the same period. Japan’s share of worldwide 300mm fab capacity is on a path to fall from 15% in 2021 to 12% in 2025 as competition with other regions increases. 

The Americas’ global share of 300mm fab capacity is forecast to rise from 8% in 2021 to 9% in 2025, driven partly by U.S. CHIPS Act funding and incentives. Europe/Mideast is projected to increase its capacity share from 6% to 7% during the same period on the strength of European CHIPS Act investments and incentives. Southeast Asia is expected to maintain its 5% share of 300mm front-end fab capacity during the forecast period.

Projected Capacity Growth Rates by Product Type

From 2021 to 2025, the 300mm Fab Outlook to 2025 shows Power-related capacity with the strongest growth at a 39% CAGR, followed by Analog at 37%, Foundry at 14%, Opto at 7% and Memory at 5%.

The latest update of the SEMI 300mm Fab Outlook to 2025 report tracks 356 current and future fabs.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Christian G. Dieseldorff/SEMI US
Phone: 1.408.943.7940
Email: [email protected]  

Chih-Wen Liu/SEMI Taiwan
Phone: 886.932.309.146
Email: [email protected]

• Read more about Global 300mm Semiconductor Fab Capacity Projected To Reach New High in 2025, SEMI Reports

Templeton Recognized Posthumously for Technical and Business Innovation 

MILPITAS, CALIF. –– October 3, 2022 –– Mark Templeton, the former managing director of investment firm Scientific Ventures, and a Lanza techVentures investment partner and board member, today was inducted posthumously into the Phil Kaufman Hall of Fame.

The honor, co-sponsored by the Electronic System Design (ESD) Alliance of SEMI and the IEEE Council on Electronic Design Automation (CEDA), recognizes Templeton’s significant and innovative contributions to the electronic system design industry. The Phil Kaufman Hall of Fame was founded in 2021 to honor deceased members of the semiconductor design industry, who are ineligible to receive the Phil Kaufman Award, a policy set by the IEEE.

At the time of his death in 2016, Templeton was a prominent and highly respected Silicon Valley venture capitalist who leveraged his engineering background to foster scientific advancement.

“Mark Templeton’s legacy of business innovation and creativity endures after his untimely death at age 57,” said Bob Smith, executive director of the ESD Alliance. “As a director and board member of numerous technology companies, he was instrumental in driving semiconductor intellectual property (IP) market growth by spearheading technical innovations and developing new business models.”

“In creating a new market segment, now widely known as silicon intellectual property, Mark Templeton left an indelible mark on the electronic system design industry,” said Gi-Joon Nam, president of CEDA and principal research scientist at IBM Research.

Templeton co-founded Artisan Components Physical IP in 1991, where he served as president and CEO. Under his leadership, Artisan Components quickly set the industry standard for implementing complex System on Chip (SoC) designs.

“Often overlooked is Mark’s genius,” said Lucio Lanza, managing director of Lanza techVentures, who nominated Mr. Templeton for recognition. “He created a new and innovative business model for silicon IP, moving away from upfront fees to a success-based approach.”

Artisan was the first company to offer free custom IP blocks for semiconductor design and was compensated once the design was completed, a model that has promoted design community growth ever since. Tens of thousands of chip designs using custom IP blocks have since been implemented, spanning 15 different process technologies and 18 foundries. Artisan went public in 1997 and was acquired by Arm in 2004. From 2004 to 2006, Templeton was president and Chief Strategy Office of Arm North America and also served on the Arm Holdings board of directors.

In addition, Templeton served as chairman of the board of Ablesky and president and CEO of Fabbrix from 2006 until it was acquired by PDF Solutions in 2007.

Templeton earned a Bachelor of Science degree in Engineering from Boston University.

About the IEEE Council on Electronic Design Automation (CEDA)
The IEEE Council on Electronic Design Automation (CEDA) provides a focal point for EDA activities spread across seven IEEE societies (Antennas and Propagation, Circuits and Systems, Computer, Electron Devices, Electronics Packaging, Microwave Theory and Techniques, and Solid-State Circuits). The Council sponsors or co-sponsors over a dozen key EDA conferences including: Design Automation Conference (DAC), Asia and South Pacific Design Automation Conference (ASP-DAC), International Conference on Computer-Aided Design (ICCAD), Design Automation and Test in Europe (DATE), and events at Embedded Systems Week (ESWEEK). The Council also publishes IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems (TCAD), IEEE Design & Test (D&T), and IEEE Embedded Systems Letters (ESL). The Council boasts a prestigious awards program in order to promote the recognition of leading EDA professionals, which includes the A. Richard Newton, Phil Kaufman, and Ernest S. Kuh Early Career Awards. The Council welcomes new volunteers and local chapters.

Stay in touch with IEEE CEDA
Website: www.ieee-ceda.org
LinkedIn: https://www.linkedin.com/groups/8343531
Facebook: https://www.facebook.com/ieeeceda/
Twitter: https://twitter.com/IEEECEDA

About the Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community representing members in the electronic system and semiconductor design ecosystem, is a community that addresses technical, marketing, economic and legislative issues affecting the entire industry. It acts as the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry.

Follow the ESD Alliance
https://www.semi.org/en/communities/esda/about-esda
ESD Alliance Bridging the Frontier blog
Twitter: @ESDAlliance
LinkedIn
Facebook

Association Contacts

Bob Smith
SEMI/ESD Alliance
Email: [email protected]
Phone: 1.650.269.8780

Nanette Collins                                                                                            
Public Relations for the ESD Alliance                                   
Email: [email protected]
Phone: 1.617.437.1822

• Read more about Mark Templeton Inducted into Phil Kaufman Hall of Fame by the ESD Alliance and IEEE CEDA