WASHINGTON D.C. — August 9, 2022 – SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the signing of the CHIPS and Science Act of 2022 by U.S. President Joe Biden. The legislation provides a 25% tax credit for U.S. facilities that produce semiconductors or chipmaking equipment and $52 billion in funding for new semiconductor programs. The funding includes $39 billion for grants available to chip manufacturers as well as semiconductor equipment and materials suppliers and $11 billion for federal semiconductor research programs.

“The CHIPS and Science Act secures landmark investments to bolster semiconductor manufacturing and R&D infrastructure as well as a wide range of ancillary industries in the United States,” said Ajit Manocha, SEMI president and CEO, who attended the signing ceremony. “We thank President Biden, Secretary Raimondo, the original CHIPS Act sponsors, leadership in Congress and the committees of jurisdiction for their support in enacting the investment tax credit and funding for CHIPS Act programs.”

“SEMI looks forward to continuing collaboration with the U.S. government and our member companies to ensure timely implementation of these programs to strengthen the U.S. semiconductor supply chain,” said Manocha. “The CHIPS and Science Act funding will also be instrumental in buttressing the National Semiconductor Technology Center (NSTC), National Advanced Packaging Manufacturing Program and related programs in order to drive chip industry innovations that will better the lives of people around the world.”

Visit SEMI Global Advocacy to learn more about public policy efforts and developments, and SEMI Workforce Development for more information on efforts to address the microelectronics industry’s talent needs.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

SEMI Contact
Samer Bahou/SEMI
Phone: 1.408.943.7870
Email: [email protected]

• Read more about SEMI Applauds President Biden’s Signing of CHIPS and Science Act of 2022

MILPITAS, Calif. — July 28, 2022 — SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the passage of the CHIPS and Science Act of 2022 by the United States House of Representatives. The bill provides a 25% tax credit for U.S. facilities that produce semiconductors or chipmaking equipment and $52 billion in funding for new semiconductor programs. The funding includes $39 billion for grants available to semiconductor manufacturers as well as equipment and materials suppliers and $11 billion for federal semiconductor research programs.

“Enactment of the investment tax credit and funding for CHIPS Act programs was made possible by the steadfast support of President Biden, Secretary Raimondo, the original CHIPS Act sponsors, leadership in Congress and the committees of jurisdiction,” said Ajit Manocha, SEMI president and CEO. “We thank them for their leadership and support and look forward to working to ensure these policies and programs are implemented quickly and consistently with the objective of strengthening the semiconductor supply chain in the United States.”

“The investment tax credit and funding for CHIPS Act programs will be instrumental in bolstering semiconductor manufacturing and R&D along with a wide range of technology-reliant U.S. supply chains, create thousands of high-skill jobs, and keep pace with incentive programs around the world,” said Manocha. “With semiconductor manufacturing fabs heavily reliant on a complex mix of equipment and materials providers, the inclusion of these critical contributors in the incentives will help to ensure the competitiveness and resiliency of the U.S. semiconductor ecosystem.”

Visit SEMI Global Advocacy to learn more about public policy efforts and developments, and SEMI Workforce Development for more information on efforts to address the microelectronics industry’s talent needs.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

SEMI Contact
Samer Bahou/SEMI
Phone: 1.408.943.7870
Email: [email protected]

• Read more about SEMI Applauds Final Passage of CHIPS and Science Act of 2022

MILPITAS, Calif. — July 27, 2022 — SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the passage of the Creating Helpful Incentives to Produce Semiconductors for America (CHIPS) Act of 2022 by the United States Senate and urged the House of Representatives to swiftly pass the legislation.

The bill provides a 25% tax credit for U.S. facilities that produce semiconductors or chipmaking equipment and $52 billion in funding for new semiconductor programs. The funding includes $39 billion for a grant program available to semiconductor manufacturers as well as equipment and materials suppliers and $11 billion for federal semiconductor research programs.

“It is crucial for the House to join the Senate in passing the investment tax credit and funding for CHIPS Act programs in order to bolster the semiconductor supply chain based in the United States and keep pace with industry incentives offered by other regions,” said Ajit Manocha, SEMI president and CEO. “These policies will strengthen semiconductor manufacturing and R&D in the U.S. while creating thousands of high-skill jobs. Ensuring the competitiveness and resiliency of the U.S. semiconductor ecosystem requires that semiconductor manufacturing equipment and materials providers – vital contributors to fabs – are included as eligible recipients of the incentives.”

Visit SEMI Global Advocacy to learn more about public policy efforts and developments, and SEMI Workforce Development for more information on efforts to address the microelectronics industry’s talent needs.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

SEMI Contact
Samer Bahou/SEMI
Phone: 1.408.943.7870
Email: [email protected]

• Read more about SEMI Commends Senate Passage of CHIPS Act of 2022, Urges House Approval

MILPITAS, Calif. – August 1, 2022 – With advanced materials a critical enabler of semiconductor growth applications, Strategic Materials Conference (SMC 2022) will gather top executives and leaders from every segment of semiconductor manufacturing for insights into the latest developments in advanced materials October 3-5, 2022 at the DoubleTree by Hilton in San Jose, Calif. SMC 2022 registration is open.

SMC is the premier event focused on drivers of advanced materials, highlighting opportunities for key materials across the electronics supply chain. Themed Materials Innovation – Powering a Trillion $ Semiconductor Industry, SMC 2022 will address the following key industry topics.

• Economic and Geopolitical Trends
• Technology Roadmaps
• Strategic Capital Driving Materials Innovation 
• Materials Driving Innovation for Emerging Logic and Memory Devices  
• Heterogeneous Integration  
• What Fabs Want from Materials Ecosystem: Executive Panel

According to McKinsey & Company, the global semiconductor industry is projected to reach $1 trillion by 2030, growth driven by markets including computing and data storage, wireless communication, and automotive, consumer and industrial electronics. Advanced semiconductor materials are key enablers of innovation in these and other segments.

Industry leaders presenting at SMC 2022 include:

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Strategic Materials Conference 2022 to Spotlight Innovations Paving the Way to $1 Trillion Semiconductor Industry

MILPITAS, Calif. — July 28, 2022 — Worldwide silicon wafer area shipments in the second quarter of 2022 surpassed the previous record high set in the first quarter of the year, edging up 1% quarter-over-quarter to 3,704 million square inches, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly report of the silicon wafer industry. Second-quarter silicon wafer shipments saw 5% growth from the 3,534 million square inches reported during the same quarter last year.

“Silicon shipments and demand remain robust driven by a strong semiconductor market,” said Anna-Riikka Vuorikari-Antikainen, Chairman of SEMI SMG and Chief Commercial Officer at Okmetic. “Inflation, as in the case of other wafer fabrication materials, continues to place upward pricing pressures on silicon. Wafer supply, in the face of continuing semiconductor fab expansions, remains constrained.”

Silicon Area Shipment Trends – Semiconductor Applications Only 

Source: SEMI (www.semi.org), July 2022

Data cited in this release include polished silicon wafers such as virgin test and epitaxial silicon wafers, as well as non-polished silicon wafers shipped to end users.

Silicon wafers are the fundamental building material for the majority of semiconductors, which are vital components of all electronic devices. The highly engineered thin disks are produced in diameters of up to 12 inches and serve as the substrate material on which most semiconductors are fabricated.

The SMG is a sub-committee of the SEMI Electronic Materials Group (EMG) and is open to SEMI members involved in manufacturing polycrystalline silicon, monocrystalline silicon or silicon wafers (e.g., as cut, polished, epi). The SMG facilitates collective efforts on issues related to the silicon industry including the development of market information and statistics about the silicon industry and the semiconductor market.

For more information, please visit SEMI Worldwide Silicon Wafer Shipment Statistics.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Worldwide Silicon Wafer Shipments Set New Record in Q2 2022, SEMI Reports

TAIPEI — July 26, 2022 — With Taiwan forecast to rank as a top buyer of chipmaking equipment, the stage is set for SEMICON Taiwan 2022 as companies from across the electronics design and manufacturing supply chain gather for insights into the latest trends, developments and innovations driving industry growth. Registration is open for the exhibition and conferences, September 14-16, 2022 at TaiNEX 1 in Taipei.

SEMICON Taiwan, the region’s largest semiconductor event with an expected 50,000 attendees, 2450 booths and 700 exhibitors, will spotlight seven key industry themes.

• Advanced Manufacturing
• Heterogeneous Integration
• Compound Semiconductors
• Auto Chips
• Smart Manufacturing
• ESG and Sustainability
• Semiconductor Cybersecurity

Taiwan is projected to maintain a top position in purchases of chipmaking equipment in 2022 and 2023 as global sales of total semiconductor manufacturing equipment reach a record $117.5 billion in 2022, according to the recent Mid-Year Total Semiconductor Equipment Forecast – OEM Perspective announced by SEMI.

“Long a semiconductor manufacturing powerhouse, Taiwan is a key enabler of trends including digital transformation, supply chain resilience and sustainability and remains central to the semiconductor industry’s continuing growth,” said Terry Tsao, Global Chief Marketing Officer at SEMI and the President of SEMI Taiwan. “We look forward to hosting industry leaders at SEMICON Taiwan 2022 as they gather to collaborate and drive innovations that address some of the world’s most pressing challenges.”

SEMICON Taiwan 2022 Highlights

• TSMC, Intel, ASE, AMD, AUO and other industry leaders will discuss the latest advances in 2.5D/3D IC packaging solutions and advanced testing technologies at the Heterogeneous Integration Global Summit 2022, IC Forum, and Advanced Testing Forum.

• Audi, Denso, Bosch, PixArt, Foxconn, Win Semiconductor and Qorvo will share innovative automotive technologies and help strengthen the network of design and manufacturing partners at the Global Auto Chips Executive Summit, MEMS & Sensors Forum, and Power and Opto Semiconductor Forum.

• Rockwell Automation, Lam Research, and Siemens will focus on data management, intelligent testing and analysis, and smart factories through case studies that highlight smart manufacturing opportunities and challenges at the Smart Manufacturing Forum. 

• Microsoft and TXOne Networks will explore zero-trust architectures and supply chain cybersecurity governance and standards in an effort to reduce cybersecurity risks and strengthen supply chain resilience at the Semiconductor Cybersecurity Global Summit.

• The Workforce Development Program series will feature industry, government, and academia representatives discussing key topics including the Talent Development Seminar - Empowering Youth Employability, Women in Semiconductor (WiS) Seminar, and Diversity and Inclusion Seminar as the semiconductor industry works to expand awareness of career opportunities and recruit skilled workers vital to innovation and industry growth.  

• To support the Pathway to Net-Zero Emissions in 2050 initiative announced by the Taiwan government in March 2022, the ESG & Sustainable Manufacturing Summit and Strategic Materials Conference Taiwan will bring together leading companies to share their progress in achieving zero waste, reducing carbon emissions, and developing green innovations.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact
Monica Hung/SEMI Taiwan
Email: [email protected]
Phone: +886.3.560.1777 ext. 207

• Read more about SEMICON Taiwan 2022 to Highlight Auto Chips, Advanced Manufacturing, Heterogeneous Integration and Sustainability

MILPITAS, Calif. – July 19, 2022 – SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded progress in the United States Senate on a robust package of federal incentives for the semiconductor supply chain and urged its timely passage in Congress. The bill includes $52 billion in funding for new semiconductor programs, including $39 billion for a grant program available to semiconductor manufacturers as well as equipment and materials suppliers. Additionally, a 25% tax credit is included for facilities that produce semiconductors or semiconductor manufacturing equipment.

“To strengthen the semiconductor supply chain in the United States and keep pace with other regions offering incentives, it is crucial for Congress to pass CHIPS funding and the investment tax credit,” said Ajit Manocha, SEMI president and CEO. “With semiconductor manufacturing facilities heavily reliant on a complex supply chain of equipment and materials providers, it is particularly important that these vital fab suppliers are eligible for incentives to ensure the resiliency, competitiveness and growth of the complete U.S. semiconductor ecosystem. SEMI also supports the addition of an advanced semiconductor research tax credit, extending the investment tax credit to materials suppliers, and other proposed reforms.”

Visit SEMI Global Advocacy to learn more about public policy efforts and developments, and SEMI Workforce Development for more information on efforts to address the microelectronics industry’s talent needs.
 

About SEMI

SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

SEMI Contact

Samer Bahou/SEMI
Phone: 1.408.943.7870
Email: [email protected]

• Read more about SEMI Applauds Senate Progress on CHIPS Act of 2022, Urges Timely Congressional Approval

SAN FRANCISCO — July 14, 2022 — Recognizing innovations and other outstanding accomplishments in flexible hybrid electronics (FHE), SEMI FlexTech, a SEMI Technology Community, yesterday presented the 2022 FLEXI Awards at the FLEX Conference and Exhibition, co-located with SEMICON West 2022 Hybrid in San Francisco. The FLEXI Awards spotlight FHE contributions in four categories: R&D Achievement, Product Innovation and Commercialization, Environmental Sustainability Champion, and Industry Leadership.

R&D Achievement – Dr. Sheng Xu of the University of California, San Diego, was recognized for developing a fully integrated wireless ultrasound patch that conforms to the human skin and continuously records central blood pressure waveforms and heart rate variability when wearers are in motion. Entries were evaluated for their world-class research, originality, and commercial potential for expanding the scope of flexible or printed electronics or their manufacturing processes.

Product Innovation and Commercialization – E Ink won a FLEXI for its color-changing car, the BMW iX Flow. The car is wrapped in E Ink Prism™, the company’s ultra-low power, bistable technology, to enable dynamic color change between black and white. With the color changes, the BMW iX Flow can better reflect ultraviolet (UV) light to keep the car cooler or absorb UV to keep it warmer while helping extend the battery life and range of electric vehicles. Entries were evaluated for design and ingenuity, potential or proven market adoption, and revenue generation.

Environmental Sustainability Champion – Dr. Robert Praino, co-founder of CHASM Advanced Materials, received a FLEXI for his leadership in promoting discussions on environmental sustainability at FLEX Conference executive planning meetings. Praino led the push to add a session focused on sustainability and power consumption at FLEX Conference 2021 and 2022. A key focus of the session is the recycling of rare materials required to power many leading-edge flexible electronics devices. The recognition honors a champion of advancing environmental sustainability in the FHE industry.   

Flexible Electronics Industry Leadership – Michael Ciesinski was recognized for his contributions to building awareness of FHE and their impact on the larger electronics industry.  Ciesinski dedicated nearly 30 years to promoting flexible electronics collaboration, technology development and advancement as CEO of the U.S. Display Consortium, later renamed SEMI FlexTech Alliance, and as vice president of SEMI Technology Communities. Ciesinski was instrumental in building a strong and vibrant flexible, printed, and hybrid electronics community by promoting the FHE industry. He also helped secure federal and industry research funding to grow the FHE ecosystem. Ciesinski contributed to the establishment of the Flexible Display Center, the Center for Microelectronics Manufacturing, NextFlex, and the Manufacturing Innovation Institute for FHE manufacturing.

The 2022 FLEXI Award Committee consisted of representatives from Applied Materials, Eli Lilly, STMicroelectronics, and UES.

About the FLEXI Awards
FLEXI has been the flexible hybrid electronics industry’s premier award since 2009. The awards are sponsored by SEMI FlexTech, a SEMI Technology Community dedicated to the growth of the FHE industry.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI FlexTech Announces 2022 FLEXI Award Winners for Outstanding Achievements in Flexible Electronics

SAN FRANCISCO, Calif. — July 13, 2022 — SEMI, the global industry association that unites the entire electronics manufacturing and design supply chain, announced it honored industry leaders for their outstanding accomplishments in developing Standards for the electronics and related industries. The SEMI Standards awards were presented at the SEMI International Standards reception held at SEMICON West 2022 Hybrid, July 12-14 at the Moscone Center in San Francisco.

SEMI International Standards Excellence Award

Presented since 1992, the Excellence Award this year honored the following leadership team of the Electron Microscopy Workflow Task Force including the primary task force leaders, document author, and SEMI Japan task force leaders:

• Richard Young, Thermo Fisher Scientific
• Laurens Kwakman, Consultant, formerly of Thermo Fisher Scientific
• Peter Wagner, Consultant
• Kyoichiro Asayama, JEOL
• Tsuyoshi Onishi, Hitachi High-Tech

The task force leaders identified gaps in standards needed to modernize the entire transmission electron microscope (TEM) workflow in semiconductor manufacturing lines in 2016 and led the formation of the Electron Microscopy Workflow Task Force. The effort involved a wide range of stakeholders including device manufacturers, TEM and related equipment manufacturers, and lamella carrier suppliers under the Physical Interfaces & Carriers North America Technical Committee Chapter.

The continuing work of the Electron Microscopy Workflow Task Force leadership team to automate the electron microscopy workflow will help the semiconductor industry improve quality and yields while accelerating time-to-market of advanced node devices.

Corporate Device Manufacturer Award

The North American SEMI International Standards Corporate Device Member Award recognizes a representative from a device manufacturer for outstanding contributions to the development of SEMI Standards.

Ryan Bond of Intel, with the support of the Fab & Equipment Computer and Device Security (CDS) Task Force, published the newest cybersecurity standard, SEMI E188 - Specification for Malware Free Equipment Integration. The Standard mitigates the spread of malware to manufacturing facilities during capital equipment delivery and support activities and helps both device manufacturers and equipment suppliers improve equipment reliability and uptime. Bond was instrumental in collecting and integrating feedback from multiple stakeholders, as well as crafting a cybersecurity standard that addresses the malware issue throughout the semiconductor supply chain.

Merit Award

The North American SEMI International Standards Merit Award recognizes major contributions to the SEMI International Standards Program in solving complex problems at the task force level and driving projects to completion.

• Stacy Ajouri of Texas Instruments and Mark Roos of Roos Instruments formed the RITdb Task Force under the Automated Test Equipment North America (NA) Global Technical Committee and drove the publication of SEMI E183 - Specification for Rich Interactive Test Database (RITdb). Describing data and event communications within a semiconductor test cell, the Standard will help test developers and end users resolve technical issues faster by providing real-time equipment updates.

• Carlo Luijten of ASML introduced high-level concepts for a second process cooling water (PCW) circuit at a higher temperature in addition to a refrigerated PCW to reduce energy consumption in factories. Luijten provided technical inputs and guidance that led to the revision to SEMI S23 - Guide for Conservation of Energy, Utilities and Materials Used by Semiconductor Manufacturing Equipment, published in October 2021.

• Michelle Bourke of Lam Research became a MEMS/NEMS North America co-chair in 2019 and re-energized two task forces to help drive the publication of two new MEMS-specific standards – SEMI MS12 - Specification for Silicon Substrates Used in Fabrication of MEMS Devices; and SEMI MS13 - Guide for Use of Test Patterns for Characterizing a Deep Reactive Ion Etching (DRIE) Process. Bourke and the SEMI-MSIG Manufacturing Working Group paved the way for the collaboration needed to address pre-competitive MEMS/NEMS challenges.

• Sreeni Rao of TDK InvenSense spearheaded the formation of the MEMS and Miniaturized Gas Sensing Task Force under the SEMI MEMS/NEMS North America Global Technical Committee. Rao and the SEMI-MSIG Device Working Group were instrumental in developing and publishing a new standard for MEMS and miniaturized gas sensors – SEMI MS14 - Guide for Critical Parameters of Gas Sensors.

Leadership Award

The North American SEMI International Standards Leadership Award recognizes individuals who have strengthened the SEMI Standards Program through member training, mentoring, and new member recruitment. Leaders play a critical role in grooming new volunteers to become productive committee contributors, efficiently guiding them through the standardization process.

Albert Fuchigami of PEER Group Inc. helped various group leaders navigate the SEMI Regulations in order to ballot numerous documents successfully. He co-leads the Information & Control (I&C) NA Diagnostic Data Acquisition Task Force and is a technical contributor to other groups including the I&C Advanced Backend Factory Integration, Computer Device Security, Generic Equipment Model (GEM) 300, Graphic User Interface, Metrics E-RAMP, Automated Test Equipment RITdb, and Traceability Equipment and Materials Traceability task forces.

Honor Award

The North American SEMI International Standards Honor Award recognizes individuals with a long-standing commitment to advancing SEMI Standards. 

Chris Evanston of Salus Engineering International has participated in SEMI Standards for more than 25 years, leading numerous task forces including the SEMI S27 (Evaluation Reports), S28 (Robotic and Load Port), and S2 Korea High Pressure Gas Safety Task Forces. Currently, he helps lead the SEMI S7 (Evaluation Qualification) Revision and S22 (Electrical) Revision Task Forces as co-chair of the Environmental, Health and Safety North America Technical Committee Chapter. He also co-chairs the NA Regional Standards Committee. With his long tenure, Evanston has become an effective mentor for the EH&S NA Global Technical Committee. 

For more information, visit the SEMI International Standards webpage.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI Standards’ Leaders Honored at SEMICON West 2022 Hybrid

The SEMI Executive Committee confirmed Kevin Crofton as Chairman of the SEMI Executive Committee and Tien Wu as Vice Chairman. The leadership appointments and the elected board members’ tenure take effect at the annual SEMI membership meeting on July 13 during SEMICON West 2022 Hybrid.     

“Congratulations to the newly elected and re-elected members to the SEMI Board of Directors,” said SEMI president and CEO Ajit Manocha. “The global business leaders on our board represent a mix of industry segments and regions. We greatly appreciate their efforts to ensure that SEMI delivers member value in order to help grow the worldwide microelectronics industry.”

SEMI’s 19 voting directors and 10 emeritus directors represent companies from Europe, China, Japan, Korea, North America, and Taiwan, reflecting the global scope of the association’s activities. SEMI directors are elected by the general membership as voting members of the board.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Email: [email protected]
Phone: 1.408.943.7988

• Read more about SEMI Announces Election and Re-Election of Board Members