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Test Vision Symposium is the premier event for semiconductor and system test experts, organized with a vision towards the future of test, to discuss upcoming trends, innovations, and requirements. It gathers an elite group of providers and users of test IP and equipment, to hear and engage with leaders in the field. You'll meet, learn, and network with 100+ participants in the field of test. Held in conjunction with SEMICON West assures access to a wide range of expertise and experience.

Test Vision is made possible due to our corporate sponsors, press partners and other partners mentioned below as well as our team of volunteers in the program committee and steering committee.

 

REGISTER TODAY

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United States Register for Test Vision at SEMICON West 2026 Business Technical

2025 Partner Sponsors

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AEM
Cohu Logo
Soliton
Teradyne logo

2025 Associate Sponsors

Chroma ATE Logo
FormFactor
Siemens_2025
SPEA_TestVision

2025 Supporter Sponsors

Nidec

Industry Conference Partner

swt
swta

Interested in becoming a 2026 Test Vision Symposium sponsor? Download the form here.

The Test Vision Symposium (TVS) is proudly brought to you by the Collaborative Alliance for Semiconductor Test (CAST) – CAST develops, coordinates, and directs all SEMI services for the semiconductor test community.

Test Vision Symposium at SEMICON West 2026

The Test Vision Symposium at SEMICON West brings together semiconductor test experts and industry visionaries to explore and shape the future of testing. This year’s theme, “Tomorrow’s Test Vision” highlights the collaborative and innovative spirit driving the next wave of advancements in semiconductor testing.

As advancements in AI, advanced packaging, silicon photonics, and high-performance computing accelerate, test strategies must evolve in parallel. Increasing device complexity makes testing essential for reducing time to market, ensuring reliability, controlling costs, optimizing performance, and enabling scalable manufacturing across applications from autonomous vehicles, renewable energy to AI‑powered systems and next-generation consumer electronics.

Test Vision 2026 provides a forum for open dialogue, knowledge sharing, and forward‑looking perspectives on semiconductor testing. This year’s symposium brings the “vision” back into Test Vision—fostering collaboration, partnership, and innovation to enable the next phase of real‑time evolution in test technologies.

We invite abstracts that explore innovative test methodologies, data‑driven approaches, and solutions addressing challenges such as AI enablement, thermal management, and heterogeneous integration. 

The symposium features keynote speakers, panel sessions, poster sessions, and a host of papers focused on industry trends, challenges, and solutions facing the test community. The symposium is co-located at SEMICON West and is held as an in-person event.

If you have questions, please contact the program manager and registration chair - Basak Ulutas Ozturkler from SEMI.

Stay tuned for 2026 Agenda!

Test Vision Symposium 2024 Photos

Moscone Center
San Francisco, CA
United States

Wednesday, October 8, 2025

9:00 am - 12:20 pm
Lauren Getz
Lauren Getz
Product Manager
Teradyne Somerville

Test Vision: Day 1 - Session 1: Hardware

9:00 am - 9:10 am
Alan Liao
Alan Liao
Director, Probe BU Product Marketing
FormFactor

Welcome Remarks

9:10 am - 9:20 am
Lauren Getz
Lauren Getz
Product Manager
Teradyne

Program Overview

9:20 am - 9:50 am
Paul Berndt
Paul Berndt
Consultant
NW Test Engineering

Best ATE Paper Award of 2024 Award and Presentation

9:50 am - 10:50 am
Samer Kabbani
CEO
AEM

Test Vision Keynote

10:50 am - 11:05 am
KAVIYA RAVI
Signal Integrity Engineer
Advantest

Design Optimization to mitigate Crosstalk for high-speed signals

11:05 am - 11:20 am
Daniele Varetto
Daniele Varetto
Senior Engineer SPEA S.p.A.

Advanced Test Methodologies for High-Performance ADC and DAC Converters

11:20 am - 11:35 am
\Nupur A. Basak
Nupur A. Basak
Sr. Staff Signal Integrity Engineer
Intel

High Bandwidth interposer integrated test socket for System Test

11:35 am - 11:50 am
Jason Doege
Product Manager
Siemens EDA

High Bandwidth Scan Testing on Limited Interfaces

11:50 am - 12:05 pm
Navin Subramani
Solutions Architect - Automation & AI
Soliton Technologies Inc

Accelerating Semiconductor Test Development using Generative AI

12:05 pm - 12:20 pm
Junko Nakaya
Junko Nakaya
Global Marketing Communications
Advantest America

Session 1 Review + Raffle

1:30 pm - 3:00 pm
Adrian Kwan
Adrian Kwan
Senior Business Development Manager
Advantest America Inc.

Test Vision: Day 1 - Session 2: Test Development

1:30 pm - 1:45 pm
Ken Lanier, BSEE
Ken Lanier, BSEE
Dir of Business Development
Teradyne

The Changing Culture of Test

1:45 pm - 2:00 pm
Hailin Wang
Application Engineer
ElevATE Semiconductor
Varun Krishnamurthy
Sr. Quality Engineer
ElevATE Semiconductor

Implementing Effective Test Limits for Rapid Root-Cause Analysis in RMA Investigations

2:00 pm - 2:15 pm
Aishwarya Suresh
HBM Reliability Engineer
Micron Technology Inc

AI-Driven Test Innovation to Improve Reliability in Vertically Integrated Memory Devices

2:15 pm - 2:30 pm
Preston McWithey
Preston McWithey
Product Engineer
Siemens EDA
Steve Palosh
Field Applications Engineer
Siemens EDA
Pete Orlando
Product Manager
Siemens EDA

DFT Architecture Enabling Adaptive Test

2:30 pm - 2:45 pm
Brian Buras
Solution Architect
Advantest

Using AI to Test AI: Accelerating Hill Climbing with Automated Evaluation of RAG-Based LLM Agents

2:45 pm - 3:00 pm
Robert Schneider
Business Development Manager
Advantest

Session 2 review + Raffle

3:00 pm - 3:10 pm
Basak Ulutas Ozturkler
SEMI

CAST Update: Metrology & AI Working Group

3:10 pm - 5:00 pm
Trent Weaver
Trent Weaver
Product Manager
Teradyne
Rick Marshall
PDF

Test Vision Poster Session and Reception

3:10 pm - 5:00 pm
Uthrakumar Arumuganainar
Head of Business Solutions
Soliton Technologies

Accelerating Post-Silicon Validation with TestOps: A DevOps-Inspired, AI-Enabled Workflow

3:10 pm - 5:00 pm
Venkatesh Perumal Pranay Chandragiri
Senior Lead - Technical Solutions
Soliton Technologies Pvt Ltd
Navin Subramani
Solutions Architect - Automation & AI
Soliton Technologies Inc

Addressing the Dynamic Landscape of Post-Silicon Validation with A Standardized Software Framework

3:10 pm - 5:00 pm
John Byrnes
Sales Manager
Semilab USA LLC

Advanced inspection systems for next-generation photonic materials

3:10 pm - 5:00 pm
Dushsyant K Rajamohan
Product Manager
Keysight Technologies

Advancing IC Reliability Through Capacitive-Based, Non-Destructive Wire-bond Defect Screening

3:10 pm - 5:00 pm
Marc Jacobs
Technical Sales & Fabless Prod Mgmt. Advisor
PDF Solutions
Ming Zhang
Ming Zhang, PhD
VP, Fabless Solutions
PDF Solutions

AI for Test, the New Frontier

3:10 pm - 5:00 pm
Jaelyn S. Liang
Jaelyn S. Liang
Research Intern
UCSD Health

An FPGA-Based Neuromorphic-Deep Learning Fusion Architecture for Energy Efficient AI Applications

3:10 pm - 5:00 pm
Bert Woods
ICPMS Applications Chemist
Agilent Technologies

An Innovative Way to Achieve Lowest the Detection Limits in an All Hot Plasma via ICP-MS

3:10 pm - 5:00 pm
Andy Kittross
AI SW Architect
Teradyne

Artificial Intelligence Agents Boost Engineer Productivity

3:10 pm - 5:00 pm
Trevor Thornton
Professor of Electrical Engineering
Arizona State University
Ankita Kashyap
Research Assistant
Arizona State University

Automated Testing of Large-Area Diamond Schottky Diode Arrays for Enhanced Manufacturability

3:10 pm - 5:00 pm
Pouya Tavousi
Dr
University of Connecticut

Correlative Imaging Pipeline for High-Precision and Fast Test Metrology of TSV Arrays

3:10 pm - 5:00 pm
JERRY BROZ
VP, Business Development & Strategic Marketing Gel-Pak,
a Delphon Industries Company
Victoria Tran, PhD
Victoria Tran, PhD
Director of R&D Gel-Pak,
a Delphon Industries Company

Data Integrity and Device Handling Challenges For Expanded Wafer and Device Testing

3:10 pm - 5:00 pm
Navin Subramani
Solutions Architect - Automation & AI
Soliton Technologies Inc

Domain Knowledge: The Key Ingredient to Effective and Sustainable Agentic Systems

3:10 pm - 5:00 pm
YU-HSIEN LIN
Director of Product Marketing
Onto Innovation

Enabling Yield and Reliability in Next-Gen HBM Packaging Thru Laser-Based Glass Carrier Inspection

3:10 pm - 5:00 pm
Navin Subramani
Solutions Architect - Automation & AI
Soliton Technologies Inc

Domain Knowledge: The Key Ingredient to Effective and Sustainable Agentic Systems

3:10 pm - 5:00 pm
YU-HSIEN LIN
Director of Product Marketing
Onto Innovation

Enabling Yield and Reliability in Next-Gen HBM Packaging Thru Laser-Based Glass Carrier Inspection

3:10 pm - 5:00 pm
Rebecca McCordic
Nordson

Enhancing Acoustic Image Analysis Through Machine Learning

3:10 pm - 5:00 pm
Takumi Kobayashi
HIOKI E.E. CORPORATION
Ivan DeGuzman
HIOKI E.E. CORPORATION

Flying Probe Tester Solution for Advanced Package

3:10 pm - 5:00 pm
Vidyut Gopal
EMD Electronics

From Lab to Fab: Building the Collaborative R&D Engine for Materials Innovation

3:10 pm - 5:00 pm
Junzhe Xie
Graduate Research Assistant
Arizona State University
Ziyi He
PhD
Arizona State University
Houqiang Fu
Assistant Professor
Arizaon State University

GaN High Electron Mobility Transistors with Novel Dielectrics and Etching for Power Electronics

3:10 pm - 5:00 pm
Vineet Pancholi
Manufacturing Test Technologist
Amkor Technology, Inc.
YoungSoo Lee
Sr. Director
Amkor Technology Inc.

High Performance Compute: Advanced Packaging Impacts to Test Equipment

3:10 pm - 5:00 pm
Treasa S. Hlaing
Treasa S. Hlaing
Senior Executive Program Manager
ElevATE Semiconductor Inc.

High Voltage DUT Power Supply IC for Automotive Grade Testing

3:10 pm - 5:00 pm
YU-HSIEN LIN
Director of Product Marketing
Onto Innovation

High-Speed Photoluminescence Inspection for Killer Defect Detection/Binning in Power Semi Substrates

3:10 pm - 5:00 pm
Yashvi Singh
Senior Front End Technology Development
Supplier Development Manager at Micron Technology

High-Temp Characterization of Monolayer MoSe₂ FETs for Extreme Environment Sensors & Electronics

3:10 pm - 5:00 pm
Edward Nelson
Edward Nelson
AFM Technical Specialist
Nanosurf / SPEC-TII
Dominik Ziegler
CEO
Nanosurf AG

High-Throughput Wafer Metrology: Roughness and Mechanical Mapping with Alphacen 300

3:10 pm - 5:00 pm
Diwas Shrestha
Business Development Manager
Advantest Europe GmbH
Michael Kwok
Advantest Europe GmbH

High-Volume Manufacturing Testing for Silicon Photonics and Co-Packaged Optics: Gaps and Solutions

3:10 pm - 5:00 pm
Mason Lyu
Mason Lyu
Senior Manager
Chroma ATE Inc.

How Heterogeneous Integration Is Reshaping ATE Requirements

3:10 pm - 5:00 pm
Anastasiia Makhniaieva
Anastasiia Makhniaieva
Software Engineer
ElevATE Semiconductor

Improving Productivity in Test Program Management with GitHub Version Control

3:10 pm - 5:00 pm
Jeffrey hwang
Director
Group / CRD / Corporate Test R&D

In-Process Test Challenges in Hybrid Packaging Assembly

3:10 pm - 5:00 pm
Brent Bullock
Test Technology Director
Advantest America Inc

Killer problems warrant cross-company data analytics, upon occasion

3:10 pm - 5:00 pm
Anis Rahman
Anis Rahman
Chief Technology Officer
Applied Research & Photonics, Inc.

Lattice Damage of GaN and HEMT Investigated by T-Ray Imaging and Deep-level Time-Domain Spectroscopy

3:10 pm - 5:00 pm
Vidya Vijay
Vidya Vijay
Director,
Business Development

Metrology Sensor Technology Significantly Improving Yields & Processes for Front-End Tools

3:10 pm - 5:00 pm
Govarthanam Krishnasamy
Govarthanam Krishnasamy
Manager - Cloud Ventures | Semiconductor Speciality
Soliton Technologies Pvt. Ltd.

Modernizing Post-Silicon Validation Using a GenAI-Based Agentic TestOps Ecosystem

3:10 pm - 5:00 pm
Laura Rojas
Machine Learning Engineer
Teradyne

Modernizing Post-Silicon Validation Using a GenAI-Based Agentic TestOps Ecosystem

3:10 pm - 5:00 pm
Pearl He
CEO
Gubo Technologies

Revolutionizing AMS Chip Validation : AI Agent-Assisted Workflow for Validation Engineers

3:10 pm - 5:00 pm
Anis Rahman, [email protected]
Chief Technology Officer
Applied Research & Photonics, Inc.
Rick Wise
Applied Research & Photonics, Inc.

Semiconductor Carrier Concentration and Transition Layer Profiling by T-ray Pump-Probe Interference

3:10 pm - 5:00 pm
Josh Magnus
Graduate Student
University of Arizona
Khanh Kieu
Professor
University of Arizona

Surface Profilometry of Semiconductor Chips with Third Harmonic Generation Microscopy

3:10 pm - 5:00 pm
JUYANG WENG, PhD
President
GENISAMA
Min Guo
GENISAMA

Testing AI: A Flood of Post-Selection Misconduct (P-Hacking) and a Holistic Solution

Brent Bullock
Test Technology Director
Advantest America Inc

The Age of Singulated Die Test

Klaus Bergner
Klaus Bergner
CTO
VACOM

Total and Partial Vacuum Measurement: Verification for High-Purity Applications and Guard for Load Locks

3:10 pm - 5:00 pm
Deepshikha Shekhawat
Business Intelligence Program Manager
Advanced Micro Devices
Neeraj C. Shukla
Neeraj C. Shukla
Data Architect
Deloitte USA

Toward an Autonomous Test Decision Center: A Vision for Context-Aware Engineering Intelligence

3:10 pm - 5:00 pm
Oytun Tasgit
Business Development Manager
Microdiagnostics 3D-Micromac AG

Ultrafast Laser-Based Sample Preparation: Enhancing FIB/SEM Workflows for High-Throughput Analysis

3:10 pm - 5:00 pm
Constantinos Xanthopoulos
Senior Data Scientist
Advantest America, Inc.

Upskilling Test Engineers with AI

3:10 pm - 5:00 pm
Benny Weng
Advantest

Vibe Coding in Practice: Accelerating Semiconductor Test Applications with LLMs

Thursday, October 9, 2025

9:00 am - 11:45 am
Rich Dumene
Principal Test Architect
Renesas Electronics Corporation

Test Vision: Day 2 - Session 3: Test Analysis

9:00 am - 10:00 am
Octavio Martínez
Vice President of Engineering
Qualcomm

Qualcomm - Presentation Title TBD

10:00 am - 10:15 am
Deepshikha Shekhawat
Business Intelligence Program Manager
Advanced Micro Devices
Neeraj C. Shukla
Neeraj C. Shukla
Data Architect
Deloitte USA

Redefining Test Success: A Vision for Dynamic Key Performance Indicators in Semiconductor Operations

10:15 am - 10:30 am
Fangmin Chu
Fangmin Chu
Senior Consulting Manager
Advantest

Cloud-IoT Integration for Real-Time Data-Driven Optimization in Semiconductor Test

10:30 am - 10:45 am
yesh Kolla
yesh Kolla
Vice President, Circuit and Technology
Ampere Computing

Revolutionizing Semiconductor Design and Testing for AI and Cloud-Native Compute

10:45 am - 11:00 am
Tareq Aljaber
Tareq Aljaber
CEO & Founder
Averroes.ai Inc.

Accelerating Visual Test with Accessible AI for High-Accuracy Model Deployment

11:00 am - 11:30 am
Jin Yu
Head of Machine Learning
Teradyne
Sandeep Kumar Goel

Leveraging ML to Detect Defective Through Silicon Via (TSV) in 3D Integrated Chips (3DICs)

11:30 am - 11:45 am
Padmanabha Srinivasamurthy
Padmanabha Srinivasamurthy
Software Architect
Teradyne

Session 3 Review + Raffle

12:45 pm - 4:05 pm
Preston McWithey
Preston McWithey
Product Engineer
Siemens EDA

Test Vision: Day 2 - Session 4: Silicon Photonics

12:45 pm - 1:30 pm
Ian Mazsa
Vice President of Semiconductor Test
Cohu

Keynote - Cohu

1:30 pm - 1:45 pm
Dan Rishavy
Dan Rishavy
Strategic Market Development Director
FormFactor

Innovative Testing Strategies for Si Photonic Devices in Engineering and Production Applications

1:45 pm - 2:00 pm
Ira H. Leventhal
Ira H. Leventhal
Vice President
Advantest America, Inc.

Transitioning from Copper to Optics: HVM-Scalable Test Solutions for CPO-based HPC Devices

2:00 pm - 2:15 pm
Vineet Pancholi
Vineet Pancholi
Manufacturing Test Technologist
Amkor Technology, Inc.

Manufacturing Test Challenges for Co-Packaged Optics

2:15 pm - 2:30 pm
Matthew Griffin
Matthew Griffin
Sr. Product Manager
Teradyne

Scaling Photonics Test for the Next Decade: Lessons from Wafer to Co-Packaged Optics

2:30 pm - 2:45 pm
Akshay Dipakkumar Harlalka
Akshay Dipakkumar Harlalka
Staff Mechanical Engineer
Atomic Machines Inc.

Advancing Fault Detection for 3D and Heterogeneous Semiconductor Systems

3:00 pm - 3:15 pm
Basak Ulutas Ozturkler
SEMI

Session 4 review + Raffle

3:15 pm - 4:00 pm
gaurav verma
Gaurav Verma, MS, BTech
Senior Director of Engineering
Qualcomm
Marc Hutner
Marc Hutner
Director of Product Management
Siemens EDA
Nitza Basoco
Technology and Market Strategist
Teradyne
Sudhakar Raman
SVP and General Manager of Probe BU
FormFactor
Rich Lathrop
VP of Test Technology
Advantest

Panel session: Test Technology in a Collaborative Era: Advancing Standards for Chiplets, Heterogeneous Integration, and System-Level Validation

4:00 pm - 4:05 pm
gaurav verma
Gaurav Verma, MS, BTech
Senior Director of Engineering
Qualcomm

Closing Remarks

- CAST

Join us for the Test Vision Symposium in person event taking place on October 13-15 at SEMICON West 2026

Submit your abstract today!

9:00 am - 5:00 pm Off Add to Calendar 2026-10-14 09:00:00 2026-10-15 17:00:00 Test Vision Symposium Join us for the Test Vision Symposium in person event taking place on October 13-15 at SEMICON West 2026. Submit your abstract today! Moscone Center San Francisco, CA United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
Event format
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On
United States Register KPMG Webinar.png Business Executive Technical

The webinar will cover KPMG’s current view of the Semiconductor sector and highlight results from our recently released Semiconductor Executive Outlook for 2019 as well as provide an overview of the role MEMS and Sensors will play in driving growth in the industry. 

The session will provide a deep dive into the automotive sector and how MEMS and Sensors are a key part of the ecosystem that will change transportation over the next decade. The webinar will also touch on other applications that will drive growth in MEMS and Sensors such as Smart Manufacturing, Medical Devices and Wearables.

United States

8:00 am - 8:05 am

Introduction

8:05 am - 8:50 am
Scott Jones KPMG
Scott Jones
Partner, KPMG Strategy Group

Biography

Scott is a Partner in KPMG’s Strategy group, leads the firm’s Semiconductor Practice for Advisory and has nearly 20 years of experience working with semiconductor and other high tech companies. He began his career at Intel in finance and later became a program manager in the Enterprise Product Group. After departing Intel he covered the Semiconductor sector at JPMorgan for the #1 ranked equity research team on Wall Street. Later he joined AlixPartners to lead their Semiconductor Practice and the Digital Transformation for the Technology, Media and Telecom sector.

Scott is recognized as a thought leader in the Semiconductor industry with a series of publications on R&D Efficiency, Portfolio Management and Operations. He has also led numerous panels and delivered presentations on advanced technology topics such as 3D/2.5D TSV, EUV, 3D NAND, and AI at industry and client events.

He has worked with a large group of clients across the high-tech landscape including: Intel, Qualcomm, GlobalFoundries, ARM, Western Digital, Xilinx, Lam Research, VMware, HP Enterprise, Microsemi, Allegro Microsystems, Microchip Technologies, KKR, CVC, Veritas Capital, One Equity Partners and others.

8:50 am - 9:00 am

Q&A

MSIG

A MEMS & Sensors Industry Group Hosted Webinar

 
8:00 am - 9:00 am Off Add to Calendar 2019-05-29 08:00:00 2019-05-29 09:00:00 MSIG WEBINAR - MEMS: A World of Opportunities A MEMS & Sensors Industry Group Hosted Webinar   United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
Event format
United States Global Standards

Hyatt Regency
St. Croix, 2nd floor
Minneapolis, MN
United States

Standards

Standards Contact Information:

Kevin Nguyen
Manager, SEMI HQ Operations
Email: [email protected]
Phone: 408.943.7997

8:00 pm - 9:00 pm Off Add to Calendar Disabled America/Los_Angeles

Registration

CEO Outlook 540 pixel

There is no charge for this event, however advance registration is required.

CEO Outlook 540 pixel
United States PanelCollage300.jpg Business Executive Featured Speakers

Moderator

 

Ed Sperling

Ed Sperling
Editor-in-Chief 
Semiconductor Engineering

 

Panelists

 

Wally Rhines

Walden Rhines 
CEO Emeritus
Mentor, A Siemens Business 

 

 

Jack Harding

Jack Harding 
President and CEO
eSilicon 

 

 

John Kibarian

John Kibarian 
CEO 
PDF Solutions 

 

 

John Chong

John Chong
VP Product and Business Development
Kionix

SEMI HQ
673 S Milpitas Blvd.
Milpitas, CA 95035
United States

5:30 pm - 6:00 pm

Registration

6:00 pm - 7:00 pm

Networking Dinner

7:00 pm - 8:30 pm

Panel Discussion

ESD Alliance

Organized by

SEMI ESDA

 

Join us for the ESD Alliance 2019 CEO Outlook Thursday, May 23, at SEMI in Milpitas, Calif. Our moderator, Ed Sperling, editor in chief of Semiconductor Engineering, will lead a discussion with our panelists John Chong, vice president of product and business development for Kionix, Jack Harding, president and CEO of eSilicon, John Kibarian, PDF Solutions’ president and CEO, and Wally Rhines, CEO emeritus of Mentor, a Siemens Business. 

Recognizing that the ESD Alliance is now part of SEMI where our collective focus is on the broader electronic product design and manufacturing chain, this year's CEO Outlook includes 2 panelists from the ESD Alliance and 2 panelists who have experience and expertise in other aspects of the chain.

The distinguished panel will discuss major new trends they see, with the potential opportunities they anticipate. 

5:30 pm - 9:00 pm Off Add to Calendar 2019-05-23 17:30:00 2019-05-23 21:00:00 ESD Alliance CEO Outlook Organized by   Join us for the ESD Alliance 2019 CEO Outlook Thursday, May 23, at SEMI in Milpitas, Calif. Our moderator, Ed Sperling, editor in chief of Semiconductor Engineering, will lead a discussion with our panelists John Chong, vice president of product and business development for Kionix, Jack Harding, president and CEO of eSilicon, John Kibarian, PDF Solutions’ president and CEO, and Wally Rhines, CEO emeritus of Mentor, a Siemens Business.  Recognizing that the ESD Alliance is now part of SEMI where our collective focus is on the broader electronic product design and manufacturing chain, this year's CEO Outlook includes 2 panelists from the ESD Alliance and 2 panelists who have experience and expertise in other aspects of the chain. The distinguished panel will discuss major new trends they see, with the potential opportunities they anticipate.  SEMI HQ 673 S Milpitas Blvd. Milpitas, CA 95035 United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles

Registration

SEMI Members                               * FREE

ESD Alliance Members                  * FREE

Non-members                                   $40 

*Registration required

United States Register jim hogan v4.jpg Business Executive Featured Speakers

The Electronic System Design Alliance

The Electronic System Design (ESD) Alliance, a SEMI Strategic Association Partner, is the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry. As an international association of companies providing goods and services throughout the semiconductor design ecosystem, it is a forum to address technical, marketing, economic and legislative issues affecting the entire industry.

Learn more about the ESD Alliance. 

ESDA Logo

 

 

 


Featured Speakers

jim and paul


 

 




 

            Jim Hogan                      Paul Cunningham

SEMI
673 S. Milpitas Blvd
Milpitas, CA 95035
United States

6:30 pm - 7:30 pm

Registration, Networking Dinner Including a Beer & Wine Bar

7:30 pm - 9:00 pm

Jim Hogan Interviews Paul Cunningham, and Q&A

ESD Alliance

ESD Alliance presents 
A Fireside Chat with Jim Hogan and
Paul Cunningham

Join us on Wednesday, April 10, as ESD Alliance presents the Jim Hogan series of "Crossing the Chasm.” At this popular event, Jim interviews and moderates a discussion with a successful entrepreneur from the design ecosystem.

Kicking off the 2019 series the focus will be on Paul Cunningham PhD, Corporate Vice President and General Manager of the System Verification Group at Cadence Design Systems. Cunningham shares his experience as a co-founder of Azuro, a provider of "clock concurrent optimization" technology. He took Azuro from concept to product, and ultimately, it was successfully acquired by Cadence where Paul is now an executive.

The Jim Hogan Series is told first-hand and invites audience participation along with Q&A. You'll learn directly from successful entrepreneurs to understand how they navigated the path from startup to a successful exit. 

6:30 pm - 9:00 pm Off Add to Calendar 2019-04-10 18:30:00 2019-04-10 21:00:00 ESD Alliance presents — A Fireside Chat with Jim Hogan and Paul Cunningham ESD Alliance presents — A Fireside Chat with Jim Hogan and Paul Cunningham Join us on Wednesday, April 10, as ESD Alliance presents the Jim Hogan series of "Crossing the Chasm.” At this popular event, Jim interviews and moderates a discussion with a successful entrepreneur from the design ecosystem. Kicking off the 2019 series the focus will be on Paul Cunningham PhD, Corporate Vice President and General Manager of the System Verification Group at Cadence Design Systems. Cunningham shares his experience as a co-founder of Azuro, a provider of "clock concurrent optimization" technology. He took Azuro from concept to product, and ultimately, it was successfully acquired by Cadence where Paul is now an executive. The Jim Hogan Series is told first-hand and invites audience participation along with Q&A. You'll learn directly from successful entrepreneurs to understand how they navigated the path from startup to a successful exit.  SEMI 673 S. Milpitas Blvd Milpitas, CA 95035 United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
United States Register Blockchain and manufacturing Business Executive Technical

Digital transformation is continuing to change the way we look at building applications. For years, enterprises have been attempting to streamline manufacturing functions and the associated supply chain by building marketplaces, “standardized” exchange formats, and monolithic systems. However, in many cases, these solutions have missed the mark, and resulted in processes that are fragmented, brittle, and unable to share data seamlessly. 

Blockchain, the underlying technology behind Bitcoin and other cryptocurrency platforms, can potentially address many of these issues. The ability to share information via a shared, trusted distributed network with embedded business logic has many potential benefits for the manufacturing industry, especially when combined with techniques from the IoT and AI communities. Join this webinar to hear about enterprise blockchains, associated manufacturing use cases, and several items (including myths) that must be considered for a successful blockchain enterprise implementation.

United States

8:00 am - 8:05 am

Introduction

8:05 am - 8:50 am
Nelson Petracek TIBCO
Nelson Petracek
Chief Technology Officer, TIBCO Software Inc

Biography

As the global Chief Technology Officer (CTO) of TIBCO Software Inc., Nelson Petracek is helping to shape the development of TIBCO's emerging technology platforms and products. With over 20 years of experience, Nelson works to deliver solutions for the next stage of digital business, drawing upon his deep knowledge of cloud, blockchain, low-code applications, microservices, and event processing. A strong technology evangelist, he works with customers to identify and define the appropriate use of various technologies and architectures and advises on best practices and information delivery patterns. Nelson received his Bachelor of Commerce in Computational Science from the University of Saskatchewan.

8:50 am - 9:00 am

Q&A

A SEMI Smart Data Hosted Webinar

8:00 am - 9:00 am Off Add to Calendar 2019-04-23 08:00:00 2019-04-23 09:00:00 BIG DATA WEBINAR: Blockchain & Manufacturing: A "Smarter" Way to Drive Efficiencies in the Semiconductor and Electronic Supply Chains A SEMI Smart Data Hosted Webinar United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
Event format
United States GET CONNECTED FOR LATEST UPDATES ITPC Drupal Event Tile 360x317 Business Executive

TRAVEL

Fairmont Kea Lani, Maui

Four Seasons Resort O'ahu at Ko Olina
92-1001 Olani St
Kapolei, Hawaii 96707
Maps and Directions

The closest airport is Daniel K. Inouye International Airport (HNL)

SPECIAL HOTEL RATES FOR ITPC ATTENDEES ONLY—The conference room block is now sold out. 

Please contact the Fairmont Hotel directly to inquire about current availability and rates.

GROUND TRANSPORTATION

For transportation assistance between Kahului Airport (OGG) and the Fairmont Kea Lani, please contact:

The Wright Company
Phone: +1 (808) 572-1160
Email: [email protected]
They will be happy to assist with your airport arrival and departure arrangements.

Fairmont Kea Lani, Maui

Thank You to Our 2025 Sponsors

Learn about opportunities to align your company with ITPC, the premiere worldwide event for global semiconductor manufacturing and supply chain executives. Have your company featured during the conference as industry leaders and luminaries share insights on the latest economic, geopolitical, and technology trends.

Contact
Shane Poblete
Director, Business Development - Expositions and Events, SEMI Americas
[email protected] 
 

 

Featured Speakers

Save the dates for ITPC 2026—November 1–4!
 



ITPC 2025—Join Industry Leaders at ITPC to Navigate the Opportunities and Uncertainty of the AI Era 

As artificial intelligence reshapes industries at an unprecedented pace, the global semiconductor ecosystem stands at the epicenter of both extraordinary opportunity and profound uncertainty. Against this backdrop of rapid evolution, ITPC 2025 convenes senior executives and decision-makers from across the supply chain to spotlight emerging business models, cross-border policy developments, and the critical role of partnerships in building a resilient and agile global semiconductor industry. 

Anchored by visionary keynotes on the theme Navigating the Opportunities and Uncertainty of the AI Era, this year’s conference will examine the strategic imperatives for companies operating at the intersection of technological advancement and geopolitical complexity.
 

Sessions

Program sessions will dive into four critical areas: 

  • Markets & Applications—Exploring where AI is driving demand across sectors
  • Trade & Geopolitics—Addressing the evolving global policy landscape and its impact on supply chains
  • Future Trends—Offering insight into emerging business and economic forces
  • Technology—Spotlighting the innovation roadmap from advanced packaging to next-generation AI compute

Together, these tracks will empower participants to anticipate disruptions, forge resilient strategies, and unlock the transformative potential of AI in a rapidly shifting global landscape. 

View the 2025 Event Guide
 

Don't Miss Out!

ITPC offers intimate and exclusive access to visionaries on the front line of Navigating the Opportunities and Uncertainty of the AI Era. 

Mark your calendars now and plan on joining industry leaders at ITPC to contribute your perspective, catch up with colleagues, and forge new connections.  


Thank You

A sincere appreciation to the executives serving on the ITPC Global CommitteeWe thank the committee for their time and expertise in developing the ITPC program. 
 

ITPC History

The SEMI International Trade Partners Conference—ITPC has championed industry coordination for over four decades. The event was originally designed to support collaboration and productive trans-pacific relationship amidst severe trade tensions that threatened supply chain prosperity in the 1980s. Having successfully contributed to a spirit of cooperation and mutual business interest, the event continues to promote alignment in the era of globalization. It has developed into a premier executive thought-leadership and relationship-building event to support global industry executive-level engagement.
 

Questions?

For program, please contact:

For sponsorship opportunities, please contact:

Photo Gallery

Four Seasons Resort Oahu at Ko Olina
92-1001 Olani St
Kapolei, HI 96707
United States

SUNDAY, NOVEMBER 2, 2025

4:00 pm - 7:00 pm

Check-In

6:00 pm - 7:30 pm

Welcome Reception

Sponsor—TEL

TEL

MONDAY, NOVEMBER 3

7:00 am - 7:45 am

Breakfast

Sponsor—Pfeiffer Vacuum

Pfeiffer Vacuum
Janice Golda, Intel
Chair, ITPC Global Committee
Janice Golda
Senior Director, Lithography Strategic Sourcing,
Intel
7:45 am - 8:00 am
Joe Stockunas, SEMI Americas
Joe Stockunas
President,
SEMI Americas
Ajit Manocha, SEMI
Ajit Manocha
President & CEO,
SEMI

Session 1—Keynotes

Session Sponsor—NY CREATES

NY CREATES
8:00 am - 8:30 am
Christophe Fouquet, ASML
Christophe Fouquet
President & CEO,
ASML
8:30 am - 9:00 am
Naga Chandrasekaran, Intel
Naga Chandrasekaran
Executive Vice President, Chief Technology and Operations Officer, and General Manager of Intel Foundry, Technology and Manufacturing,
Intel
9:00 am - 9:30 am
Prabu Raja, Applied Materials
Prabu Raja
President, Semiconductor Products Group,
Applied Materials
9:30 am - 9:40 am

Break

Sponsor—CKD

CKD
9:40 am - 10:10 am
Siwoo Lee
Siwoo Lee
Executive Vice President, DRAM R&D Pathfinding,
Samsung Electronics

10:10 am - 10:40 am
Tomoharu Watanabe, KIOXIA
Tomoharu Watanabe
Director, Executive Vice President & Executive Officer, Chief Operating Officer,
KIOXIA

10:40 am - 11:10 am
Babak Sabi
Babak Sabi
Vice President Technology, Annapurna Lab,
Amazon Web Services (AWS)

11:10 am - 12:00 pm

Attendee Engagement & Perspective

12:00 pm - 1:00 pm

Lunch

Sponsor—Ebara

Ebara

Session 2—Markets & Applications

Session Sponsor—Exyte

Exyte
1:00 pm - 1:30 pm
Handel Jones, IBS
Handel Jones
Founder & CEO,
IBS

AI Opportunities at the Edge and in Data Centers

1:30 pm - 2:00 pm
Hidehito Takahashi, Resonac
Hidehito Takahashi
Representative Director, President and Chief Executive Officer,
Resonac
2:00 pm - 2:30 pm
Lita Shon-Roy, TECHCET
Lita Shon-Roy
President/CEO,
TECHCET (CMC)

Materials Markets & Supply Chains – Trends and ChokePoints

2:30 pm - 2:45 pm

Break

Sponsor—Tekscend Photomask

Tekscend Photomask

Session 3—Trade & Geopolitics

2:45 pm - 3:00 pm
Royal Kastens, SEMI
Royal Kastens
Vice President, Global Public Policy & Advocacy,
SEMI

Trade & Geopolitical Update

3:00 pm - 4:30 pm
Ian Steff, mySilicon Compass
Moderator
Ian Steff
President & CEO,
mySilicon Compass
Sandra Watson, Arizona Commerce Authority
Panelist
Sandra Watson
President & CEO,
Arizona Commerce Authority
Gerard de Graaf, European Union
Panelist
Gerard de Graaf
Senior EU Envoy to the US for Digital & Head of EU Office, San Francisco,
European Union
Panelist
Koji Yamashita
Director, Office of Technology Analysis and Leakage Prevention Policy, Trade and Economic Security Bureau,
METI

7:00 pm - 9:30 pm

Reception & Banquet

Sponsors—Edwards & Sumitomo Cryogenics (SHI)

ITPC 2023 Banquet Sponsors | Edwards + Sumitomo Cryogenics SHI

TUESDAY, NOVEMBER 4

7:00 am - 7:45 am

Breakfast

Sponsor—ASM Japan

ASM

Session 4—Future Trends

Session Sponsor—Advantest

Advantest
7:45 am - 8:15 am
Thomas Piliszczuk
Thomas Piliszczuk
Executive Vice President, Global Partnerships and Strategy,
imec

8:15 am - 8:45 am
Prineha Narang, UCLA
Prineha Narang
Professor,
University of California. Los Angeles
8:45 am - 9:15 am
Jun Sawada OBE, NTT
Jun Sawada OBE
Executive Chairman,
NTT
9:15 am - 9:45 am
Steve Johnston, EMD Electronics
Steve Johnston
Vice President, Head of Technology Enablement,
EMD Electronics/Merck KGaA

9:45 am - 10:00 am

Break

Sponsor—Dongjin Semichem

Dongjin Semichem
10:00 am - 11:15 am

Future Trends Roundtable

G. Dan Hutcheson, TechInsights
Moderator
G. Dan Hutcheson
Vice Chair,
TechInsights
Doug Lefever, Advantest
Panelist
Doug Lefever
Representative Director and Group CEO,
Advantest
Steve Johnston, EMD Electronics
Panelist
Steve Johnston
Vice President, Head of Technology Enablement,
EMD Electronics / Merck KGaA
Prineha Narang, UCLA
Panelist
Prineha Narang
Professor,
University of California, Los Angeles

11:20 am

Golf Shuttle Starts

11:30 pm - 1:00 pm

Lunch for Non-Golfers

Sponsor—Syensqo

SYENSQO Logo 170x65
12:30 pm

Golf Tournament Shotgun Start—Wailea Emerald Course

Sponsor—Hitachi High-Tech America

Hitachi
6:00 pm - 9:00 pm

Reception & Banquet

Sponsor—Comet

Comet

WEDNESDAY, NOVEMBER 5

7:00 am - 8:00 am

Breakfast

Sponsor—Applied Materials

Applied Materials

Session 5—Technology

Session Sponsor—Kanken Techno

Kanken Techno
7:45 am - 8:15 am
Woong Sun Lee, SK hynix
Woong Sun Lee
Chief Executive Officer, SK hynix Semiconductor West Lafayette; Senior Vice President,
SK hynix

8:15 am - 8:45 am
Subramanian Iyer, UCLA
Subramanian Iyer
Distinguished Professor,
University of California, Los Angeles

9:00 am - 9:15 am

Break

Sponsor—Applied Materials

Applied Materials
9:00 am - 10:30 am
Janice Golda, Intel
Moderator
Janice Golda
Senior Director, Lithography Strategic Sourcing,
Intel
Om Nalamasu, PhD, Applied Materials
Panelist
Omkaram Nalamasu
Sr. Vice President & Chief Technology Officer,
Applied Materials
Takahisa Amemiya, FICT Limited
Panelist
Takahisa Amemiya
President & CEO,
FICT Limited
Jeffrey Welser, IBM Research
Panelist
Jeffrey Welser
Chief Operating Officer and Vice President
IBM Research
Woong Sun Lee, SK hynix
Panelist
Woong Sun Lee
Chief Executive Officer, SK hynix Semiconductor West Lafayette; Senior Vice President,
SK hynix
11:00 am
Joe Stockunas, SEMI Americas
Joe Stockunas
President,
SEMI Americas

Closing Remarks

-

The Industry’s Premier Semiconductor Executive Conference 

For more than 40 years, the SEMI International Trade Partners Conference—ITPC has served as our premium networking and knowledge-sharing event for C-suite executives in the global semiconductor and microelectronics design and manufacturing supply chain.

Off Add to Calendar 2026-11-01 00:00:00 2026-11-04 00:00:00 ITPC 2026—International Trade Partners Conference The Industry’s Premier Semiconductor Executive Conference For more than 40 years, the SEMI International Trade Partners Conference—ITPC has served as our premium networking and knowledge-sharing event for C-suite executives in the global semiconductor and microelectronics design and manufacturing supply chain. Four Seasons Resort Oahu at Ko Olina 92-1001 Olani St Kapolei, HI 96707 United States SEMI.org [email protected] Pacific/Honolulu public Pacific/Honolulu

Contacts

Main Contact
Taylor Zhao

E-mail: [email protected]

SEMI Americas
Agnes Cobar

Tel: +1.408.943.7952
E-mail: [email protected]

SEMI China
Xianbo Sun (孙贤波)

Tel: +86.21.6027.8569
E-mail: [email protected]

SEMI Europe
Laith Altimime

Tel: +49.160.9800.5809
E-mail: [email protected]

SEMI Japan
Arisa Minaki

Tel: +81.3.3222.5803
E-mail: [email protected]

SEMI Korea
Hyun Cha

Tel: +82.2.531.7801
E-mail: [email protected]

SEMI Southeast Asia
Linda Tan

Tel: +65.6339.6361
E-mail: [email protected]

SEMI Taiwan
Jamie Lee

Tel: +886.3.560.1777 x507
E-mail: [email protected]

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United States Doug Lefever Business Executive

For more than three decades, ITPC has been the preeminent conference to strengthen relationships and foster an exchange of ideas on the prevailing geo-political landscape, emerging technology trends, and dynamic market opportunities. Share your perspective with insightful and influential global leaders that attend this elite executive conference.  

Fairmont Kea Lani
4100 Wailea Alanui Dr
Maui, HI 96753
United States

-

 

The SEMI International Trade Partners ConferenceITPC, is an annual industry gathering that promotes open dialogue and fosters rapport among the world's top executives in the semiconductor and microelectronics manufacturing ecosystem.

 

 

Off Add to Calendar 2019-11-03 00:00:00 2019-11-06 00:00:00 International Trade Partners Conference — ITPC 2019   The SEMI International Trade Partners Conference—ITPC, is an annual industry gathering that promotes open dialogue and fosters rapport among the world's top executives in the semiconductor and microelectronics manufacturing ecosystem.     Fairmont Kea Lani 4100 Wailea Alanui Dr Maui, HI 96753 United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles

Pricing

Members: $1825

Non-Members: $2280

 

Attendees from academia receive the member rate pricing. Please contact Agnes Cobar at [email protected] for the discount code.

  • Coming Soon—Tour or Networking Activity
  • Reception
  • Breakfasts
  • Lunch
  • Awards Reception & Dinner
  • Breaks
  • Lunch & Learn Packet
  • Proceedings

*Travel-related expenses are not included

Cancellations received on or before February 28, 2026 are fully refunded with a $100 processing fee.  Refunds will not be issued for cancellations (including no-shows) made after February 28, 2026, and only substitutions are accepted with a written note from the registered attendee.  Please email your cancellations or substitutions on company letterhead to Michelle Fabiano at [email protected].

+
United States MSEC 2026 Cambridge Tile 540x351 Business Executive Training

HOTEL

Hyatt Regency Boston/Cambridge

Hyatt Regency Boston / Cambridge—Book Your Room
575 Memorial Dr, Cambridge, MA 02139

Services and Benefits

• $259/night 
• Resort fee waived
• Discounted overnight parking $35
• Complimentary WIFI in guest rooms
• Contracted room rate is not guaranteed

Book your room today by contacting Sara Dadie at [email protected].
 

Hyatt Regency Boston/Cambridge

BECOME A SPONSOR FOR MSEC 2026! 

Sponsorship opportunities can be tailored to meet your specific branding and marketing objectives. 
View our Sponsorship Brochure
Contact Tim Janes | [email protected] | +1 720-939-4992

2026 Sponsors

Platinum

EV Group

Gold

Infineon Logo 170x65

Bronze

Robert Bosch Logo 170x65
KLA
Lam Research

Event

Inficon Logo 170x65
Silex Microsystems Logo 170x65
Teledyne MEMS Logo 170x65

Media Partners

SENSORIZING THE FUTURE: MEMS AND SENSORS AT THE EDGE OF PERCEPTION

The MEMS and Sensors Executive Congress 2026 is designed for senior executives across the MEMS and sensors supply chain and adjacent industries.  Industry economic, business updates will be covered from different aspects of the ecosystem, together with forward-looking strategic and technology trends. The opportunities and challenges brought about by key technologies will be explored. The growth in existing and emerging MEMS and sensors markets, together with the resulting new components, software, and systems needs, will also be discussed.  The usual networking and deal making opportunities will be a key feature as usual. 

 

Get a deep dive on—                                                                                                                                                                                                                                       

  • Disruptive Technologies; AI, Robotics, and Advanced Sensor Technologies
  • Bio-Medical/MEMS Healthcare
  • MEMS & Sensors Expansion
  • Market Dynamics
  • Strategic Outlooks
  • Supply Chain & Geopolitics
  • Roadmaps 2030 and beyond
  • Sensor Manufacturing
  • Investment Trends
  • Sensor Startups
  • Positioning, Navigation, Timing

 

WHO SHOULD ATTEND?

CEO  ●  Chairmen  ●  Presidents  ●  Senior Executives  ●  Executive Vice Presidents  ●  CTO  ●  Startup Founders  ●  Financial Analysts  ●  Market Researchers  ●  Consulting Firms


WHAT ATTENDEES ARE SAYING ABOUT MSEC    

 

MSEC 2026 EXECUTIVE PLANNING COMMITTEE

Thank you to these industry leaders for their time and expertise supporting the continued success of this annual conference. 

 

PROGRAM & EVENT CONTACT

Agnes Cobar 
Director, Programs & Committees
[email protected]

SPONSORSHIP OPPORTUNITIES

Tim Janes
Account Manager, Events 
[email protected]

 

STAY IN THE KNOWFill out the INTEREST FORM

MSEC Photo Gallery

Hyatt Regency Boston / Cambridge
575 Memorial Dr
Cambridge, MA 02139
United States

TUESDAY, MARCH 31, 2026

1:00 pm - 6:00 pm

Registration

1:00 pm - 4:00 pm

Team Building Activity: "Picture This" Boston Edition

5:30 pm - 7:00 pm

Welcome Reception

Meet-and-greet Networking Opportunity for MSEC Attendees before the Program Begins

WEDNESDAY, APRIL 1, 2026

7:00 am - 8:00 am

Registration and Breakfast

8:00 am - 8:10 am
Paul Carey, SEMI
Paul Carey
Director
SEMI MSIG

Welcome Remarks

8:10 am - 8:20 am
Stefan Finkbeiner
Stefan Finkbeiner
General Manager & CEO
Bosch Sensortec GmbH

Welcome Remarks—MSIG Chair

Session 1—Keynotes

8:20 am - 8:25 am
Michelle Bourke_LAM
Michelle Bourke
Managing Director of Strategic Marketing and Specialty Technologies
Lam Research

Session Overview

8:25 am - 8:30 am
David Kirsch, EV Group
David Kirsch
Vice President & General Manager, North America
EV Group

Message from EV Group, Our Platinum Sponsor

EV Group
8:30 am - 9:00 am
Kurt Busch, Syntiant
Kurt Busch
Co-Founder and CEO
Syntiant

Sensors and AI as the Next Generation Interface—Turning the Physical World into Conversations

9:00 am - 9:30 am
Phil Waggoner
Phil Waggoner, PhD
Director, Chemistry & Data Analytics R&D
Thermo Fisher Scientific

Sequencing DNA with Semiconductors—The Incredible Potential and Challenges of Silicon Devices in the Life Sciences

9:30 am - 10:00 am
Vijay Somandepalli
Vijay Somandepalli, PhD
UAS & AAM Director, MassRobotics
Co-Founder & CTO, Enigma Aerospace

From Digital Hype to Physical Reality

10:00 am - 10:45 am

Networking Break

Session 2—Global Sensor Market Outlook & Strategic Trends

10:45 am - 10:50 am
Anson Yeganegi
Anson Yeganegi
Director of Business Development
TDK USA

Session Overview

10:50 am - 11:15 am
Samarjit Das Headshot
Samarjit Das
Director and Chief Scientist, AI Research
Bosch Research and Technology Center and Bosch Center for AI (BCAI)

Decoding the Language Of "Things": From Learning Physics Grammar To "AI-Augmented Super-Sensors"

11:15 am - 11:40 am
Pierre-Marie Visse
Pierre-Marie Visse
Senior Technology and Market Analyst
Yole Group

Renewed Growth in the MEMS Industry: Market Drivers and Consolidation Strategies

11:40 am - 12:05 pm
Marc Coldiron, SEMI
Marc Coldiron
Director, Global Public Policy & Advocacy
SEMI

U.S. Government Policy and its Impact on the Semiconductor Industry

12:05 pm - 1:30 pm

Lunch & Visit Tabletops

Teledyne MEMS Logo 170x65

Session 3—The Transformation of Sensor Manufacturing

1:30 pm - 1:35 pm
Tim Brosnihan
Tim Brosnihan, PhD
Business Development
Silex Microsystems

Session Overview

Inficon Logo 170x65
1:35 pm - 2:00 pm
Edvard Kälvesten,
Edvard Kälvesten, PhD
CEO and Founder
Silex Microsystems

The Next Decade of MEMS Manufacturing Evolution – A View from The World’s Largest Pure-Play MEMS Foundry

2:00 pm - 2:25 pm
John Behnke, INFICON
John Behnke
GM Smart Manufacturing
INFICON

Automation, Intelligence, and the Path to Autonomous MEMS Manufacturing

2:25 pm - 2:50 pm
Stefan Majoni, Robert Bosch
Stefan Majoni, PhD
Head of MEMS Foundry
Robert Bosch GmbH

Changes in MEMS Foundry Set Up for AI and Other Upcoming Challenges

2:50 pm - 3:15 pm
Seena Partokia
Seena Partokia
Founder and CEO
Cenfire

Substrate Engineering as the Enabler of CMOS and More than Moore at Scale

3:15 pm - 4:00 pm

Networking Break

Session 4—Leadership Roundtable: Navigating the Next Decade

4:00 pm - 4:05 pm
Marcellino Gemelli, Robert Bosch LLC
Marcellino Gemelli
Sr. Director, Marketing and Business Development
Bosch Sensortec

Moderator Welcome

4:05 pm - 5:25 pm
Stefan Finkbeiner
Stefan Finkbeiner
General Manager and CEO
Bosch Sensortec GmbH

Roundtable Discussion

Bernhard Straub_Infineon
Bernhard Straub
Vice President and Head of the Product Line MEMS Acoustics
Infineon Technologies
Jessica Gomez
Jessica Gomez
Founder and CEO
Rogue Valley Microdevices
Francesco Doddo Headshot
Francesco Doddo
IoT Sensors Applications Director
STMicroelectronics
6:00 pm - 8:00 pm

MSIG Awards Ceremony & Dinner

THURSDAY, APRIL 2, 2026

7:00 am - 8:00 am

Registration & Breakfast

8:00 am - 8:05 am
Paul Carey, SEMI
Paul Carey
Director
SEMI MSIG

Welcome Remarks

Session 5—Investment Trends and Venture Session

8:05 am - 8:10 am
Paul Pickering, Silicon Catalyst
Paul Pickering
Managing Partner
Silicon Catalyst

Session Overview

Discover the future of MEMS and sensors through rapid-fire startup pitches and strategic insights from leading venture capitalists. This session highlights breakthrough technologies and explores where smart capital is flowing. Gain a high-level view of emerging trends, market opportunities, and investment strategies shaping the next wave of innovation.

8:10 am - 8:35 am
Behrooz Abdi
Behrooz Abdi
CEO
Zadar Labs

Investing in Next Generation Sensors

8:35 am - 8:50 am
Skanda Visvanathan
Skanda Visvanathan
Vice President, Business Development
MagikEye

Edge AI Based 3D Perception

8:55 am - 9:10 am
Zhenyun Qian, Zepsor Technologies
Zhenyun Qian, PhD
Co-Founder and CTO
Zepsor Technologies

Sensing Without Power — Enabling the Next Wave of Human–Machine Interfaces

9:10 am - 9:25 am
Austin Fikes, HEPT Lab
Austin Fikes, PhD
Chief Technology Officer
HEPT Lab

HEPT Lab: 3D Sensor for Harsh Environments

Adam Jackson
Adam Jackson
Partner
Bosch Ventures

Venture Capital Panel

Charles Beyrouthy Headshot
Charles Beyrouthy
Founder & Managing Partner
Forma Prime VC
Dante Zakhidov
Dante Zakhidov, PhD
Investment Analyst
TDK Ventures
9:25 am - 9:30 am

Closing Remarks & Introduction to the Startup Demos

9:30 am - 10:15 am

Networking Break—Startup Demos

Session 6—Advancements in Positioning, Navigation, and Timing

10:15 am - 10:25 am

Venture Audience Polling

10:25 am - 10:30 am
Mary Ann Maher, SoftMEMS
Mary Ann Maher
CEO
SoftMEMS

Session Overview

10:30 am - 10:50 am
Kelly Backes
Kelly Backes, PhD
Lead Quantum Physicist
MITRE

Quantum Sensors for Complimentary PNT and Resilient Communications

10:50 am - 11:10 am
Gaurav Vohra, Analog Devices
Gaurav Vohra
Director, MEMS Sensors Design
Analog Devices

The Next Decade of MEMS-Driven PNT: Precision, Reliability, and Autonomy

11:10 am - 11:30 am
Lia Li,  Zero Point Motion
Lia Li, PhD
CEO
Zero Point Motion

Inertial Sensing as the Start of a New Semiconductor Platform

Session 7—MSEC 2026 Closing Keynotes

11:30 am - 12:00 pm
Kieran Harney, CEO, sensiBel
Kieran Harney
CEO
sensiBel

Closing Keynote: Optical MEMS Mics: Unlock Acoustic Quality in Audio and Sound Acquisition Apps

12:00 pm - 12:10 pm
Paul Carey, SEMI
Paul Carey
Director
SEMI MSIG

Closing Remarks

- MSIG

 

 

 

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