Test Vision Symposium Best ATE Paper Award
To spotlight advances in ATE TestVision and the Test Technology Technical Council (TTTC) created the Best ATE Paper Award. The purpose of this award is to single out and publicize the most influential ATE paper of the year to stimulate innovation in the ATE industry. The winner is announced at Test Vision at SEMICON West.
2019 Award Finalists
Below are the finalists for the Best ATE Paper of 2019:
- From ITC-Asia: “Accurate and Fast Testing Technique of Operational Amplifier DC Offset Voltage in μV-order by DC-AC Conversion”
- Authors: Yuto Sasaki ,Kosuke Machida, Riho Aoki, Shogo Katayama, Takayuki Nakatani, Jianlong Wang, Anna Kuwana, Kazumi Hatayama, Haruo Kobayashi from Division of Electronics and Informatics, Faculty of Science and Technology, Gunma University and Keno Sato, Takashi Ishida, Toshiyuki Okamoto, Tamotsu Ichikawa from ROHM Semiconductor.
- From SW Test: “5G Wafer Test and the New Age of Parallelism”
- Authors: Daniel Bock, Ph.D. and Choon Beng Sia, Ph.D. from FormFactor, Inc.
- From ITC: “Effectively Using Machine Learning to Expedite System Level Test Failure Debug”
- Authors: Luis D. Rjas, Kevin Hess, and Christina Carter-Brown from Intel Corporation.
The Best ATE Paper Award Selection Committee appreciates and relies upon inputs from the technical community when naming the Best ATE Paper.
Test Vision Symposium will be held on July 21-23 in conjunction with the SEMICON West 2020 Virtual Event . The recipient(s) of the Best ATE Paper of 2019 award will be announced on the first day of the symposium.
2019 Award Recipients for Best ATE Paper of 2018:
Norihiro Ohta (Nidec-Read) and Pete Rogan (Nidec SV TCL)
"Innovative Approach to MEMS Contactor"
Presented at the 2018 BiTS Workshop; Mesa, Arizona; March 2018
Past Award Recipients:
- 2018: ITC 2017 - "Low Cost Dynamic Error Detection in Linearity Testing of SAR ADCs," Nimit Jain et al.
- 2017: ETS 2016 - "Test-station For Flexible Semi-Automatic Wafer-Level Silicon Photonics Testing," Jeroen De Coster et al.
- 2016: BiTS 2015 - "Designing Sockets for Ludicrous Speed (80 GHz)," Don Thompson and Jose Moreira. The authors showed how they constructed an interface for ATE capable of testing 80 GHz signals.
- 2015: ITC 2014 - "3A Novel RF Self TEst for a Combo SoC on Digital ATE with Multi-Site Applications," CH Peng, et al. The team showed how they used low cost ATE to test an extremely cost sensitive RFIC, while achieving the same bin results as a full performance, high cost ATE System.
- 2014: ITC 2013 - "30-Gb/s Optical and electrical Test Solution for High-Volume Testing," Daisuke Watanabe et al. The first paper presenting an optical-electrical test system suitable for production testing.
- 2012: I²MTC 2011 - "Reducing THD in an Audio Test Instrument," Sol Max & Richard Liggiero. Awarded for its originality, innovation, intrinsic merit, and effective communication to the audience.
- 2011: ITC 2010 - "A High Desnity Small Size RF Test Module for High Throughput Multiple Resource Testing" (slides) the authors did an excellent job of integrating RF test instrumentation to achieve small packaging. The paper clearly explains the challenges faced, the approaches taken, and the results achieved. Any ATE engineer interested in building RF instrumentation will find this paper fascinating.
Award Selection Committee
Paul Berndt (Chair), Microsoft
Dave Armstrong, Advantest
Dr. Erik Larsson, Lund University
Dieu Van Dinh, NXP
Ken Lanier, Teradyne
Professor Gordon Roberts, McGill University
Michael Peters, Elmos
The recipient(s) of the Best ATE Paper of 2019 award will be announced at the Test Vision Symposium @ SEMICON West 2020.