Test Vision Symposium Best ATE Paper Award
To spotlight advances in ATE TestVision and the Test Technology Technical Council (TTTC) created the Best ATE Paper Award. The purpose of this award is to single out and publicize the most influential ATE paper of the year to stimulate innovation in the ATE industry. The winner is announced at Test Vision at SEMICON West.
2026 Award Recipients for Best ATE Paper of 2025
The recipient(s) of the Best ATE Paper of 2024 award will be announced at the Test Vision Symposium at SEMICON West 2026.
Please vote for your top choice to receive top honors for the Best ATE Test Paper for 2025.
Voting closes on July 3rd, 2026. Link to Survey
Best ATE Paper Award - 2025 Finalists
The finalists for the "Best ATE Paper of 2025" are:
From 2025 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT)
“A Multi-Modal Attention-Based Framework for Good Die in Bad Neighborhood Methodology”
Authors:
Mohammad Ershad and Shaik, Nur A. Touba from Dept. of Electrical and Computer Engineering, The University of Texas at Austin, Austin
Abhishek Mishra and Nagarajan Kandasamy from Electrical and Computer Engineering Department, Drexel University, Philadelphia, PA
From 2025 IEEE International Test Conference (ITC)
“Eclipse Dynamic Probe Card: A Novel Approach for Wafer-Level Photonic Testing with Automated Fiber Array Unit Alignment”
Authors:
Riccardo Vettori and Alessia Galli from Technoprobe, Cernusco Lombardone, Italy
From 2025 IEEE European Test Symposium (ETS)
“Extendable E2I-TEST for Chiplet-based Inter-die Interconnects”
Authors:
Po-Yao Chuang from IMEC, Leuven, Belgium and National Tsing Hua University, Hsinchu, Taiwan
Erik Jan Marinissen from Leuven, Belgium and TU Eindhoven, Eindhoven the Netherlands
The Best ATE Paper Award Selection Committee appreciates and relies upon inputs from the technical community when naming the Best ATE Paper.
Please vote for your top choice to receive top honors for the Best ATE Test Paper for 2025.
Voting closes on July 3rd, 2026. Link to Survey
Past Award Recipients:
- 2025: Semiconductor Wafer Test Workshop (SWTest) Asia - “From Lab to Line: Enabling Efficient PIC Testing for Mass Production”, Andrew Yick (Marvell USA), Calvin Yang (Marvell USA), Supreet Khanapet (Marvell USA), Andy Chang (Marvell USA), Christian Karras (Jenoptik –Germany), Tobias Gnausch (Jenoptik Germany)
- 2024: Semiconductor Wafer Test Workshop (SWTest) - “New Algorithm for Fast and Accurate Linearity Testing of High-Resolution SAR ADCs”, Xin Reng Foo, Chee Hoe Lin (AMD Singapore) and Raffaele Vallauri , Alberto Berizzi (Technoprobe Italy)
- 2023: TestConX - “A Handler based Solution for 60 GHz AiP DUT Testing (and an early look at test results)”, Brian C. Wadell and Jonathan Williams (Teradyne Innovation Labs)
- 2022: Semiconductor Engineering - "HSIO Loopback - The Challenges and Obstacles of Testing at 112 Gbps", Dave Armstrong (Advantest) and Don Thompson (R&D Altanova)
- 2021: TestConX2020 - "Socket Design and Handler Integration Challenges in Over the Air Testing for 5G Applications," Natsuki Shiota, Aritomo Kikuchi, Hiroyuki Mineo, Jose Moreira and Hiromitsu Takasu (Advantest)
- 2019: BiTS 2018 - "Innovative Approach to MEMS Contactor," Norihiro Ohta (Nidec-Read) and Pete Rogan (Nidec SV TCL)
- 2018: ITC 2017 - "Low Cost Dynamic Error Detection in Linearity Testing of SAR ADCs," Nimit Jain et al.
- 2017: ETS 2016 - "Test-station For Flexible Semi-Automatic Wafer-Level Silicon Photonics Testing," Jeroen De Coster et al.
- 2016: BiTS 2015 - "Designing Sockets for Ludicrous Speed (80 GHz)," Don Thompson and Jose Moreira. The authors showed how they constructed an interface for ATE capable of testing 80 GHz signals.
- 2015: ITC 2014 - "3A Novel RF Self TEst for a Combo SoC on Digital ATE with Multi-Site Applications," CH Peng, et al. The team showed how they used low cost ATE to test an extremely cost sensitive RFIC, while achieving the same bin results as a full performance, high cost ATE System.
- 2014: ITC 2013 - "30-Gb/s Optical and electrical Test Solution for High-Volume Testing," Daisuke Watanabe et al. The first paper presenting an optical-electrical test system suitable for production testing.
- 2012: I²MTC 2011 - "Reducing THD in an Audio Test Instrument," Sol Max & Richard Liggiero. Awarded for its originality, innovation, intrinsic merit, and effective communication to the audience.
- 2011: ITC 2010 - "A High Desnity Small Size RF Test Module for High Throughput Multiple Resource Testing" (slides) the authors did an excellent job of integrating RF test instrumentation to achieve small packaging. The paper clearly explains the challenges faced, the approaches taken, and the results achieved. Any ATE engineer interested in building RF instrumentation will find this paper fascinating.
Award Selection Committee
- Paul Berndt (Chair), NW Test Engineering, LLC
- Dave Armstrong, ISE Labs | ASE
- Davide Appello, Technoprobe
- Adrian Carleton, NXP
- Ken Lanier, Teradyne
- Gordon Roberts, PhD, McGill University
- Michael Peters, Elmos
- Brent Bullock, Advantest
- Rich Dumene, Renesas
The recipient(s) of the Best ATE Paper of 2025 award will be announced at the Test Vision Symposium at SEMICON West 2026.