Ravi Bhagat is Sr. Director leading IT Infrastructure and Security services for KLA Corporation. Over 20+ years of Experience leading global infrastructure teams and services. Has held various executive and senior level IT positions at KLA, including client services, architecture, managed service operations and product system support. Before joining KLA, Ravi held various senior roles at PCL and managed a country wide LAN/WAN and system deployment initiatives. He earned his MBA in US and his bachelor's degree in Computer Science from Nagpur University in India. He is an avid reader and travel enthusiast who loves to go around the world with his family.

Brian Christian is the Founder CEO/CTO of Flying Cloud Technologies, an IP security and protection company, and has been a luminary in the computer security industry for over 20 years. His roles have focused on enterprise security, software security and protection of corporate digital assets. Prior to Flying Cloud Technologies, Brian co-founded SPI Dynamics, the leading expert and industry thought leader in Web application security assessment and testing. SPI was purchased by Hewlett-Packard.

Biography

Biography

Biography

Biography

Discussion includes Pratik Joshi, Ph.D. Samsung Austin Semiconductor
Biography

Dr. Bottoms received a B.S. degree in Physics from Huntington College in Montgomery, Alabama in 1965, and a Ph.D in Solid State from Tulane University in New Orleans in 1969 and is currently Chairman of Third Millennium Test Solutions. He has worked as a faculty member in the department of electrical engineering at Princeton University, manager of Research and Development at Varian Associates, founding President of the Semiconductor Equipment Group of Varian Associates and general Partner of Patricof & Co. Ventures. He has served as Chairman and CEO of many companies both public and private.

Dr. Bottoms has also served in a number of Government Advisory positions including Chairman of the Board on Assessment for NIST and a member of the Technical Advisory Committee on export controls for the US Commerce Department.

Dr. Bottoms has participated in the start up and growth of many companies through his venture capital activity and through his own work as an entrepreneur. These include companies in a wide range of industries.

Emeritus Member of the Board of Tulane University
Co-Chair of the Heterogeneous Integration Roadmap
Chairman of the SEMI’s Awards Committee
Chairman of the Packaging and Package Substrates Technical Working Group for INEMI
Member of the Board of MIT’s Microphotonic Center
Chairman of Fluence Analytics
Chairman of Third Millennium Test Solutions

Dr. Gambino received the B.S. degree in materials science from Cornell University, Ithaca, NY, in 1979, and the PhD degree in materials science from the Massachusetts Institute of Technology, Cambridge, MA, in 1984.

He joined IBM, Hopewell Junction, NY, in 1984, where he worked on silicide processes for Bipolar and CMOS devices. In 1992, he joined the DRAM development alliance at IBM's Advanced Semiconductor Technology Center, Hopewell Junction, NY. While there, he developed contact and interconnect processes for 0.25-, 0.175-, and 0.15-um DRAM products. In 1999, he joined IBM's manufacturing organization in Essex Junction, VT, where he worked on copper interconnects, CMOS image sensors, RF devices, and 3D integration.

He joined ON Semiconductor, Gresham, OR, in 2015. He is currently working on CMOS image sensors and high voltage semiconductors. He has published over 200 technical papers and holds over 500 patents.

As Project Development Director at Yole Développement (Yole), Jérôme Azémar is supporting the development of strategic projects, following leading customers of the company within the semiconductor industry, from manufacturing to packaging. His mission is to develop Yole’s business and technical knowledge in the industry, maintain long term relationships with its accounts and meet their expectations.

Jérôme is a member of Yole since 2013 and worked as a senior analyst, managing the day to day production of technology & market reports as well as custom consulting projects. He also deeply contributed to the business development of the Advanced Packaging & Semiconductor Manufacturing activities.

Jérôme is the author of numerous analysis and international publications covering advanced packaging, power electronics and semiconductor manufacturing. He is also regularly involved in international conferences, giving presentations, delivering keynotes, as well as organizing committees.

Along his career, Jérôme has developed a large network in the industry, being in touch with CEOs, CTOs, Marketing Managers, Business Development Managers…

Prior to this and upon graduating from INSA Toulouse (France) with a Master’s in Microelectronics and Applied Physics, Jérôme joined ASML and worked in Veldhoven (The Netherlands) for three years as an Application Support Engineer specializing in immersion scanners. During this time, he acquired Photolithography skills which he then honed over a two-year stint as a Process Engineer at STMicroelectronics (France).