Showing 7669 - 7680 of 11449
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Virtual ASMC 2020 Track - Advanced Metal Structures
Advanced Metal Structures
Chairs: Marc Bergendahl, IBM Research; Goswami, Shubhodeep, GE Global Research; Rob Pearson, Rochester Institute of Technology
Session...
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Virtual ASMC 2020 Track - Smart Manufacturing
Smart Manufacturing – sponsored by Inficon
Chairs: Eric Eisenbraun, SUNY Polytechnic Institute; Jan Rothe, GLOBALFOUNDRIES; Satyajit Shinde, Samsung Austin...
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Virtual ASMC 2020 Track - Factory Optimization
Factory Optimization
Chairs: Thomas Beeg, Wolfspeed; Jagdish Prasad, Silfex (Lam Research); Stefan Radloff, Intel Corporation; Dave...
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Virtual ASMC 2020 Track - Advanced Process Control
Advanced Process Control
Chairs: John Jensen, Lam Research; Agnes Roussy, École des Mines de Saint-Étienne; Raymond van Roijen, GLOBALFOUNDRIES
Session 6
6.1 Towards...
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Virtual ASMC 2020 Track - Advanced Equipment Processes and Materials
Advanced Equipment Processes and Materials – sponsored by IBM Research
Chairs: Thirumalesh Bannuru, Applied Materials; Katie Lutker, TEL; Jean Wynne, IBM...
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Virtual ASMC 2020 Track - Defect Inspection
Defect Inspection
Chairs: Alexa Greer, KLA; Israel Ne’eman, Applied Materials; Alex Varghese, IBM Research; Abhishek Vikram, Anchor Semiconductor; Shravan Matham, IBM...
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Virtual ASMC 2020 Track - Advanced Metrology
Advanced Metrology – Sponsored by Nova Measuring Instruments
Chairs: Vivek Jain, ASML; Delphine Le Cunff, STMicroelectronics; Felix Levitov, Applied Materials; Alok Vaid,...
Event
FPD Metrology Korea TC Chapter Meeting
FPD Metrology TC Chapter meeting
Friday, June 12, 2020
17:00-18:00
SEMI Korea office, Seoul, Korea
Agenda_FPDM_June12_2020.pdf
Standards...
SEMI Press Release
SEMI Announces Support of CHIPS for America Act to Increase Semiconductor Manufacturing in the U.S.
MILPITAS, Calif. – June 12, 2020 – Facing a 50 percent decline in the U.S. share of global semiconductor manufacturing capacity over the past 20 years, Congress has introduced the Creating...
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Virtual ASMC 2020 Track - Yield Enhancement/Yield Methodologies
Yield Enhancement / Yield Methodologies
Chairs: Ishtiaq Ahsan, IBM Research; Janay Camp, KLA; Gary Green, Green Technology Consulting; Dieter Rathei, D R...
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Current Standardization Activity for 300 mm Tape Frame FOUP
Current Standardization Activity for 300 mm Tape Frame FOUP and the Physical Interfaces
By Hayato Iwamoto, Sony Semiconductor Solutions
Co-leader of 300 mm Tape...