downloadGroupGroupnoun_press release_995423_000000 copyGroupnoun_Feed_96767_000000Group 19noun_pictures_1817522_000000Group 19Group 19noun_Photo_2085192_000000 Copynoun_presentation_2096081_000000Group 19Group Copy 7noun_webinar_692730_000000Path
Skip to main content

Advanced Metrology  Sponsored by Nova Measuring Instruments

Chairs: Vivek Jain, ASML; Delphine Le Cunff, STMicroelectronics; Felix Levitov, Applied Materials; Alok Vaid, GLOBALFOUNDRIES; Ronny Haupt, NOVA; Sean Teehan, IBM Research; Padraig Timoney, GLOBALFOUNDRIES; Franz Heider, Infineon Technologies Austria; Jay Mody, GLOBALFOUNDRIES; Brett Williams, ON Semiconductor 

Session 2 - Optical Metrology & Machine Learning

2.1   Development of SiGe Indentation Process Control to Enable Stacked Nanosheet FET Technology
Dexin Kong, Daniel Schmidt, Mary Breton, Abraham Arceo de la pena, Julien Frougier, Andrew Green, Jingyun Zhang, Veeraraghavan Basker, Nicolas Loubet, Ishtiaq Ahsan, IBM Research; Aron Cepler, Mark Klare, Roy Koret, Igor Turovets, Marjorie Cheng, NOVA Measuring Instruments

2.2   The Adoption of Machine Learning in the Measurement of Copper Contact on the Main Chip in Advanced 3D NAND Technology Nodes 
Michael Meng, Albert Li, Andrew Zhang, Leeming Tu, Haydn Zhou, Jian Mi, Yangtze Memory Technologies Co.; Xi Zou, Nanometrics 

2.5     Spectroscopic Ellipsometry Imaging for Process Deviation Detection via Deep Learning Approach (student)
Thomas Alcaire, Delphine Le Cunff, Victor Gredy, STMicroelectronics; Jean-Hervé Tortai Univ. Grenoble Alpe, CNRS, CEA-LETI

2.4   Characterization of Sub Micron Metal Line Arrays Using Picosecond Ultrasonics 
M. Mehendale, M Kotelyanskii, R. Mair, P. Mukundhan, Onto Innovation; J. Bogdanowicz, L. Teugels, A.-L. Charley, P. Kuszewski, imec 

2.5   Spectroscopic Ellipsometry Imaging for Process Deviation Detection via Deep Learning Approach (student)
T. Alcaire, D. Le Cunff, V. Gredy, STMicroelectronics, J.H. Tortai, University Grenoble Alpes; CEA-Leti

Session 11 - Patterning and 3D

11.1   Overlay Improvement for Semiconductor Manufacturing Using Moiré Effect 
Yoshinori Hagio, Kentaro Kasa, Sho Kawadahara, Manabu Takakuwa, KIOXIA Corporation; Yosuke Takahata, Katsuya Kato, Akihiro Nakae, Western Digital Corporation 

11.2   Improved Duplicate Photomask Matching using AIMS™ Metrology for 14nm and Smaller 
Jean Raymond Fakhoury, Mark Lawliss, Tom Faure, Amy Zweber, Yurong Ying, Chris Magg, Bradley Morgenfeld, GLOBALFOUNDRIES 

11.3   SEM Image Denoising and Contour Image Estimation using Deep Learning 
Narendra Chaudhary, Serap A. Savariy, Texas A&M University; Varvara Brackmannz, Michael Friedrich, Fraunhofer Institute for Photonic Microsystems 

11.4   Computational Process Control Compatible Dimensional Metrology Tool: Through-focus Scanning Optical Microscopy  
Ravi Kiran Attota, National Institute of Standards and Technology 
 

Session 15 - Novel Metrology Techniques

15.1   Dimensional Control of line Gratings by Small Angle X-ray Scattering: Shape and Roughness Extraction 
Jérôme Reche, Patrice Gergaud, Yoann Blancquaert, University Grenoble Alpes, CEA, LETI, Maxime Besacier, University Grenoble Alpes, Guillaume Freychet, NSLS II, Brookhaven 

15.2   Advanced Wafer Backside Bevel Characterization Using Geometry Measurement System 
André Striegler, Thomas Lindner, GLOBALFOUNDRIES Module One LLC & Co. KG; Florian Flach, Priyank Jain, Madhan Kanniyappan, Chiou Shoei Chee,KLA 

15.4   Ultra Large Pitch and Depth Structures Metrology Using Spectral Reflectometry in Combination with RCWA Based Model and TLM Algorithm 
Annalisa Del Vito, ST Microelectronics; Ilya Osherov, Adam Michal Urbanowicz, Yinon Katz, Kobi Barkan, Igor Turovets, Ronny Haupt, NOVA Measuring Instruments

15.4   Investigation of Photoluminescence Voltage PL-V Measurement: Correlation to Capacitance Voltage C-V for Si/dielectric Interface Characterization 
T. Nassiet, J. M. Bluet, G. Bremond, Université de Lyon; R. Duru, D. Le Cunff, Arthur Arnaud, STMicroelectronics (Student)  

Session 5 - Posters

5.5   Data Set Preparation using Clustering Applied to Colored Resists Coating Striation Detection (Student)
M. Kessar, University Grenoble Alpes, P. Lemaire, B. Le-Gratiet, V. Gredy, STMicroelectronics

5.23  Roughness and Nanotopography Measurement of a Silicon Wafer using Wave Front Phase Imaging
J.M. Trujillo-Sevilla, J.M. Ramos-Rodríguez, Juan Trujillo, Jan Olaf Gaudestad, Wooptix

5.32  Tilt Angle and Dose Rate Monitoring of Low Energy Ion Implantation Processes with Photomodulated Reflectance Measurement  
 A. Pongracz, J. Szívós, F. Ujhelyi, Zs. Zolnai, Ö. Sepsi, Á. Kun, Gy. Nádudvari, J. Byrnes, Semilab; Leonard M. Rubin, Edward D. Moore, Axcelis Technologies

Go back to ASMC