Advanced Metrology – Sponsored by Nova Measuring Instruments
Chairs: Vivek Jain, ASML; Delphine Le Cunff, STMicroelectronics; Felix Levitov, Applied Materials; Alok Vaid, GLOBALFOUNDRIES; Ronny Haupt, NOVA; Sean Teehan, IBM Research; Padraig Timoney, GLOBALFOUNDRIES; Franz Heider, Infineon Technologies Austria; Jay Mody, GLOBALFOUNDRIES; Brett Williams, ON Semiconductor
Session 2 - Optical Metrology & Machine Learning
2.1 Development of SiGe Indentation Process Control to Enable Stacked Nanosheet FET Technology
Dexin Kong, Daniel Schmidt, Mary Breton, Abraham Arceo de la pena, Julien Frougier, Andrew Green, Jingyun Zhang, Veeraraghavan Basker, Nicolas Loubet, Ishtiaq Ahsan, IBM Research; Aron Cepler, Mark Klare, Roy Koret, Igor Turovets, Marjorie Cheng, NOVA Measuring Instruments
2.2 The Adoption of Machine Learning in the Measurement of Copper Contact on the Main Chip in Advanced 3D NAND Technology Nodes
Michael Meng, Albert Li, Andrew Zhang, Leeming Tu, Haydn Zhou, Jian Mi, Yangtze Memory Technologies Co.; Xi Zou, Nanometrics
2.5 Spectroscopic Ellipsometry Imaging for Process Deviation Detection via Deep Learning Approach (student)
Thomas Alcaire, Delphine Le Cunff, Victor Gredy, STMicroelectronics; Jean-Hervé Tortai Univ. Grenoble Alpe, CNRS, CEA-LETI
2.4 Characterization of Sub Micron Metal Line Arrays Using Picosecond Ultrasonics
M. Mehendale, M Kotelyanskii, R. Mair, P. Mukundhan, Onto Innovation; J. Bogdanowicz, L. Teugels, A.-L. Charley, P. Kuszewski, imec
2.5 Spectroscopic Ellipsometry Imaging for Process Deviation Detection via Deep Learning Approach (student)
T. Alcaire, D. Le Cunff, V. Gredy, STMicroelectronics, J.H. Tortai, University Grenoble Alpes; CEA-Leti
Session 11 - Patterning and 3D
11.1 Overlay Improvement for Semiconductor Manufacturing Using Moiré Effect
Yoshinori Hagio, Kentaro Kasa, Sho Kawadahara, Manabu Takakuwa, KIOXIA Corporation; Yosuke Takahata, Katsuya Kato, Akihiro Nakae, Western Digital Corporation
11.2 Improved Duplicate Photomask Matching using AIMS™ Metrology for 14nm and Smaller
Jean Raymond Fakhoury, Mark Lawliss, Tom Faure, Amy Zweber, Yurong Ying, Chris Magg, Bradley Morgenfeld, GLOBALFOUNDRIES
11.3 SEM Image Denoising and Contour Image Estimation using Deep Learning
Narendra Chaudhary, Serap A. Savari, Texas A&M University; Varvara Brackmann, Michael Friedrich, Fraunhofer Institute for Photonic Microsystems
11.4 Computational Process Control Compatible Dimensional Metrology Tool: Through-focus Scanning Optical Microscopy
Ravi Kiran Attota, National Institute of Standards and Technology
Session 15 - Novel Metrology Techniques
15.1 Dimensional Control of line Gratings by Small Angle X-ray Scattering: Shape and Roughness Extraction
Jérôme Reche, Patrice Gergaud, Yoann Blancquaert, University Grenoble Alpes, CEA, LETI, Maxime Besacier, University Grenoble Alpes, Guillaume Freychet, NSLS II, Brookhaven
15.2 Advanced Wafer Backside Bevel Characterization Using Geometry Measurement System
André Striegler, Thomas Lindner, GLOBALFOUNDRIES Module One LLC & Co. KG; Florian Flach, Priyank Jain, Madhan Kanniyappan, Chiou Shoei Chee,KLA
15.4 Ultra Large Pitch and Depth Structures Metrology Using Spectral Reflectometry in Combination with RCWA Based Model and TLM Algorithm
Annalisa Del Vito, ST Microelectronics; Ilya Osherov, Adam Michal Urbanowicz, Yinon Katz, Kobi Barkan, Igor Turovets, Ronny Haupt, NOVA Measuring Instruments
15.4 Investigation of Photoluminescence Voltage PL-V Measurement: Correlation to Capacitance Voltage C-V for Si/dielectric Interface Characterization
T. Nassiet, J. M. Bluet, G. Bremond, Université de Lyon; R. Duru, D. Le Cunff, Arthur Arnaud, STMicroelectronics (Student)
Session 5 - Posters
5.5 Data Set Preparation using Clustering Applied to Colored Resists Coating Striation Detection (Student)
M. Kessar, University Grenoble Alpes, P. Lemaire, B. Le-Gratiet, V. Gredy, STMicroelectronics
5.23 Roughness and Nanotopography Measurement of a Silicon Wafer using Wave Front Phase Imaging
J.M. Trujillo-Sevilla, J.M. Ramos-Rodríguez, Juan Trujillo, Jan Olaf Gaudestad, Wooptix
5.32 Tilt Angle and Dose Rate Monitoring of Low Energy Ion Implantation Processes with Photomodulated Reflectance Measurement
A. Pongracz, J. Szívós, F. Ujhelyi, Zs. Zolnai, Ö. Sepsi, Á. Kun, Gy. Nádudvari, J. Byrnes, Semilab; Leonard M. Rubin, Edward D. Moore, Axcelis Technologies