Defect Inspection
Chairs: Alexa Greer, KLA; Israel Ne’eman, Applied Materials; Alex Varghese, IBM Research; Abhishek Vikram, Anchor Semiconductor; Shravan Matham, IBM Research; Oliver Patterson, Hermes Micro-Vision; Qintao Zhang, Applied Materials
Session 3 - Defect Inspection I
3.1 Creative Use of Vector Scan for Efficient SRAM Inspection
Oliver D. Patterson, Hsiao-Chi Peng, Haokun Hu, Hermes Microvision (An ASML company); Chih-Chung Huang, Paneer S. Venkatachalam, GLOBALFOUNDRIES
3.2 Analysis of Systematic Weak Point Structures using Design Based Automatic Defect Classification and Defect Review SEM Platform
Teresa A. Esposito, Felix Levitov, Applied Materials; Shi-Hui Jen, Qian Xie, Danda Acharya, Julie Lee, GLOBALFOUNDRIES
3.3 Electron Beam Inspection: Voltage Contrast Inspection to Characterize Contact Isolation
Richard F. Hafer, Andrew Stamper, GLOBALFOUNDRIES; Jerry Hsieh, Hermes Microvision Inc.
3.4 Double Feature Extraction Method for Wafer Map Classification Based on Convolution Neural Network
Yuan-Fu Yang, Min Sun, National Tsing Hua University (Student)
3.5 Generative Adversarial Networks for Synthetic Defect Generation in Assembly and Test Manufacturing
Rajhans Singh, Arizona State University and Intel; Ravi Garg, Nital S. Patel, Martin W. Braun, Intel Corporation
Session 8 - Defect Inspection II
8.1 Automated Wafer Defect Classification Using a Convolutional Neural Network Augmented with Distributed Computing
Hairong Lei, Cho Teh, Hetong Li, Po-Hsuan Lee, Wei Fang, Hermes Microvision (An ASML company)
8.2 Advanced Inspection Methodology for the Maximum Extension of Nitride Test Wafer Recycling
Yu-Yuan Ke, Kuang-Hsiu Chen, Shin-Ru Chen, Guan-Wei Huang, Wesley Yu, Po-Jen Chuang, Chun-Li Lin, Chih-Wei Huang, Jun-Ming Chen, United Microelectronics Corporation; Nachiketa Janardan, Tung-Ying Lee, Ethan Chen, Chao-Yu Cheng, Shao-Ju Chang, KLA
8.3 Laser-Based Hair Crack Detection on Wafers
Alexander Fuchs, Franz Pernkopf, Graz University of Technology; Robin Priewald, Bright Red Systems (Student)
8.4 Real-Time Tool Health Monitoring and Defect Inspection During Epoxy Dispense Process
Chris Edwards, Meghana Narayana Swamy, Ravi Garg, Tim Karaniuk, Cody L. Morgan, Debashis Panda, Intel Corporation
Session 5 - Posters
5.16 In-line Photoresist Defect Reduction Through Failure Mode and Root-Cause Analysis
S. Goswami, S. Hall, W. Wyko, J.T. Elson, J. Galea, J. Kretchmer, General Electric Global Research Center
5.19 NextGen Calibration Utility for Tool Setup and Matching in Real-Time Automated Visual Inspection Systems
Chris Edwards, Cody L. Morgan, John Rudolph, Danniel Slinker, Debashis Panda, Intel Corporation
5.20 Particle Improvement for Low-K Process in Diffusion Furnace
Viboth Houy, Janice Lam, Halima Ali, Samsung Austin
5.30 Systematic Missing Pattern Defects Introduced by Topcoat Change at PC Lithography: A Case Study in the Tandem Usage of Inspection Methods
M. Fields, R. VanRoijen, M. Lucksinger, GLOBALFOUNDRIES