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Advanced Metal Structures  

Chairs: Marc Bergendahl, IBM Research; Goswami, Shubhodeep, GE Global Research; Rob Pearson, Rochester Institute of Technology 

Session 12

12.1  Nano Ni/Cu-TSVs With an Improved Reliability for 3D-IC Integration Application 
M. Murugesan, K. Mori, H. Hashimoto, J.C. Bea, T. Kojima, T. Fukushima, and M. Koyanagi, Global INTegration Initiative (GINTI), NICHe, Tohoku University 

12.2  Polysilicon Fuse Electrical Voiding Mechanism 
Gang Liu, Rommel Relos, Bohumil Janik, Robert Davis, Tracy Myers, Derryl Allman, Jeff Hall, Steven Vandeweghe, Santosh Menon, Ed Flanigan, ON Semiconductor 

12.3  Aluminum Voiding and Delamination Induced by High Intrinsic Stress 
Cindy Daigle, Michelle Beauchemin, Thomas Moutinho, Christopher Qualey, Texas Instruments 

12.4  Bondpad Design Structural vs. Electrical Tradeoffs  
Brett Williams, Robert Davis, Justin Yerger, Derryl Allman, Bruce Greenwood, Troy Ruud, ON Semiconductor 

 

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