Brooks Instrument Launches Ultra-Compact, High-Performance Mass Flow Controller

HATFIELD, Pa. (USA), June 18, 2026 — Brooks Instrument, a world leader in precision fluid measurement and control technology, announced the global launch of its new ultra-compact AMF Series™ Advanced Mass Flow Controller. About the size of a standard Post-it® Note pad, it has the smallest footprint of any mass flow controller (MFC) in its performance class.

Combining precise gas flow control, fast response, industry-leading 1000:1 turndown capability and advanced diagnostics, the AMF Series offers equipment manufacturers and end users more operating flexibility and improved reliability and process control without the limitations of traditional compact MFCs.

“Equipment designers historically have had to choose between compact dimensions and advanced capabilities,” said Steve Kannengieszer, Global Marketing Director. “With the AMF Series, we’re changing that trade-off. Customers can now integrate high-performance flow control and predictive diagnostics into the most space-constrained systems without sacrificing accuracy, reliability or process insight.”

Advanced Features in a Compact Footprint

As equipment size across industries continues to shrink while growing in complexity and throughput, maintaining stable and precise gas flow becomes increasingly critical. The AMF Series was developed specifically to address these challenges.

With a 1-inch x 3-inch x 3-inch footprint, the MFC fits easily inside compact gas cabinets. Despite its small size, the highly accurate AMF Series features advanced capabilities, including integrated EtherNet/IP™ digital communications and onboard diagnostics for predictive maintenance.

By providing actionable diagnostic data alongside accurate flow measurement and control, the AMF Series helps users identify potential issues before they impact production, reducing unplanned downtime and improving overall equipment effectiveness.

Easier Operation and More Uptime

In addition, the AMF Series was designed to maximize uptime and simplify operation with a universal USB-C service port and embedded web-based interface that streamlines in-situ commissioning and troubleshooting. Industry-leading long-term sensor stability helps reduce maintenance requirements and eliminate periodic recipe adjustments and recalibrations.

The AMF Series also supports multi-gas configurability and simplified ordering bundles, helping OEMs reduce system complexity while streamlining product selection and integration.

Wide Range of Use

The AMF Series is especially suitable for pilot-scale applications where precise low-flow gas control and equipment miniaturization are critical, including:
• Bioprocessing and laboratory-scale bioreactors
• Thin film coating and vacuum deposition systems
• Carbon capture, utilization, and storage (CCUS)
• Hydrogen and energy transition technologies
• Analytical instrumentation
• University and research laboratories
• Industrial gas processing

Demand for Smaller Instrumentation

“Across biotechnology, we’re seeing a shift toward smaller-scale development platforms that demand greater flexibility and precision from process instrumentation,” said Joe Sipka, Business Development Director, Biotechnology. “The AMF Series was developed for micro-dosing and pilot-scale systems and delivers a wealth of digital insights—including health indicators, reliability metrics and pedigree—that enable greater automation and support a path to prescriptive maintenance. Many of these same trends are emerging in adjacent applications, such as industrial coatings, where engineers are being asked to do more with increasingly compact systems. Developed directly from conversations with our customers, the AMF Series delivers the precise low-flow control, wide operating range and reliability needed to accelerate innovation while maximizing valuable equipment space.”

For more information about the AMF Series Advanced Mass Flow Controller, visit www.BrooksInstrument.com/product/AMF.

About Brooks Instrument:
Since 1946, Brooks Instrument has been a leader in precision fluid measurement and control technology. Providing instrumentation for flow, pressure and vapor delivery, the company serves customers in semiconductor and high-tech manufacturing, laboratories and other processes and industries. With manufacturing, sales and service locations in the Americas, Europe and Asia, Brooks Instrument has the world’s largest installed base of mass flow controllers.

For more information, please visit www.BrooksInstrument.com. The company is also on LinkedIn (www.linkedin.com/company/Brooks-Instrument) and YouTube (www.youtube.com/user/Brooks407).

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RENA Technologies GmbH, a long-standing and experienced manufacturer of wet processing solutions for the semiconductor, advanced packaging, and solar industries, has been awarded a multi-million Euro order by a leading European semiconductor manufacturer for a specialized cleaning application designed for advanced substrates.

The solution is based on a high-performance batch wet processing platform and has been specifically engineered to deliver ultra-clean and highly efficient processing of demanding substrates. By combining advanced process control with a scalable batch architecture, the system ensures outstanding process stability, repeatability, and optimized throughput.

The customer’s decision underscores the technological strength and competitiveness of RENA’s wet processing solutions. Particularly when handling complex substrate materials, the application provides significant advantages in quality assurance, process control, and overall production efficiency. The mature cleanroom capabilities, excellent process control, and high- volume automation solutions of RENA add up to the perfect fit for the customer’s needs.

With this order, RENA further strengthens its position in the European semiconductor market and reinforces its commitment to delivering innovative, locally supported solutions to key industry players.

“Our success in securing this project highlights the growing demand for advanced wet processing technologies in Europe,” said Peter Schneidewind, CEO of RENA Technologies GmbH. “With more than 80 glass treatment tools in production worldwide - including cutting etch TGV/advanced packaging applications - RENA´s sophisticated technological solutions prove again in this new application for specialized semiconductor substrates.”

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Date: May 8, 2026

Location: Drammen, Norway

Board-level and semiconductor test data are often analyzed separately, limiting correlation across the product lifecycle. Linking PCB assembly (PCBA) test results, including in-circuit and functional test, with upstream wafer, sort, and final test data remains difficult, particularly in photonics, advanced packaging, and high-density integration environments. yieldWerx and WATS announce a partnership to bridge this gap in the PCB test and semiconductor manufacturing workflows.

WATS is a test data management platform purpose-built for electronics manufacturers. It captures, standardizes, and analyzes high-volume test data from PCBA (printed circuit board assembly) production environments, including in-circuit test (ICT), functional test, and final test, giving engineers real-time visibility into board-level yield, anomalies, and quality metrics across the production line.

yieldWerx operates at the semiconductor level, connecting data across wafer fabrication, wafer sort, die, and packaged device test. Its enterprise analytics platform enables advanced yield analysis, traceability, and root cause investigation from design through silicon manufacturing.

Together, the platforms address the full product stack. This allows manufacturers to correlate PCBA-level signals with silicon quality data, improving visibility across test stages and enabling more effective analysis of yield and reliability issues.

Customer and industry benefits include:

Real-time PCBA test visibility for faster identification of yield and quality issues

Improved correlation between board-level test results and upstream chip or wafer data

Reduced time spent reconciling data across disconnected systems

Earlier detection of cross-stage patterns impacting yield and reliability

Faster root cause analysis spanning silicon, assembly, and board-level test

Better alignment between electronics manufacturing and semiconductor supply chain

The combined solution supports open architectures, APIs, and flexible deployment models, enabling integration without large-scale system changes.

About yieldWerx

yieldWerx is an enterprise analytics platform connecting data across the semiconductor product lifecycle, from design and wafer fabrication through wafer sort, die, and packaged device test, enabling advanced yield analysis, traceability, and data-driven decision-making across cloud, on-premises, and hybrid environments.

About WATS

WATS is a test data management and analytics platform developed by Virinco, built to collect, standardize, and analyze data from electronics manufacturing test systems. It provides real-time visibility into board-level performance across ICT, functional test, and final test operations, helping engineers monitor yield, detect anomalies, and improve quality at high volume.

Statements from Leadership
"We are excited to partner with yieldWerx. Our customers manufacture complex electronics where board-level test data alone only tells part of the story. By connecting PCBA production test data with yieldWerx's upstream semiconductor intelligence, we can give them a more complete picture of their product quality and yield." -- Tom Lomsdalen, CEO, Wats

“Our customers have been asking for a unified view that links semiconductor yield data with downstream electronics test results, and this partnership delivers exactly that. Together, yieldWerx and WATS empower engineering teams to move faster on root cause analysis, reduce escapes, and make smarter decisions across the entire product lifecycle.” -- Aftkhar Aslam, CEO, yieldWerx

For further information, please visit https://www.yieldWerx.com or https://www.Wats.com/.

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Semiconductor industry leader takes the helm to accelerate Beneq’s next phase of growth in atomic layer deposition

Espoo, Finland, 8 May, 2026 – Beneq Oy, the home of atomic layer deposition (ALD), today announced the appointment of Dr. Jason Harrison as Chief Executive Officer. Dr. Harrison succeeds Dr. Tommi Vainio and will lead Beneq into its next phase of growth across semiconductor, optical, and emerging technology markets.

A Strategic Leadership Transition
Beneq enters its next phase of growth from a position of strong commercial momentum. Recent milestones include the qualification of the Beneq Transform® cluster tool for volume production of GaN power and RF filter devices; the introduction of Beneq Transmute™ and Beneq Transform® XP, both engineered for high-volume manufacturing (HVM) of specialty semiconductors; growing adoption of the P-Series for coating critical chamber parts in advanced node devices; and selection of the C2R™ for AR waveguide production in next-generation XR optics.

Against this backdrop, the Board of Directors has determined that the time is right to align executive leadership with the company's evolving strategic priorities. As part of this transition, Dr. Tommi Vainio has decided to step down as CEO to pursue other opportunities. The Board of Directors extends its sincere thanks to Tommi, whose leadership advanced Beneq's technology platform, strengthened its market position in thin film deposition, and guided the company through important stages of its development.

A Proven Leader for a Scaling ALD Business
Dr. Harrison brings extensive global experience across the semiconductor and advanced technology sectors. He holds a Ph.D. in Quantum Chemistry and has built a distinguished career spanning device manufacturing, process development, and equipment solutions, with senior leadership roles at Intel, Lam Research, Veeco, and Applied Materials covering research and development, new product introduction, global account management, and business unit leadership. This combination of technical depth and commercial acumen positions him to scale Beneq’s commercial execution and growth across its global customer base.

Looking Ahead
Under Jason’s leadership, Beneq will accelerate strategic execution across its expanding portfolio, deepen customer engagement across North America, Asia, and Europe, and continue investing in innovative ALD solutions from R&D to HVM to deliver long-term value to customers, employees, and stakeholders.

Dr. Patrick Rabinzohn, Member of the Board of Directors, Beneq, said: “Jason brings the technical depth, the business and account management experience, and the global perspective Beneq needs at this stage of its growth. His academic background and compelling track record across the semiconductor industry positions Jason to build on the momentum the company generated especially.”

Dr. Jason Harrison, Chief Executive Officer, Beneq, added: “Beneq has a strong technology foundation, a talented team, and a growing pipeline of customers in some of the most important markets in semiconductors and optics. I look forward to working with the team to accelerate execution and deliver on the trust our customers place in us.”

About Beneq
Beneq pioneered industrial production of Atomic Layer Deposition (ALD) with the introduction of the first commercial ALD equipment in 1984. Today, Beneq advances ALD adoption and validation with a portfolio that includes the Beneq Transform®, Transform XP, Transform 300, and Transmute™ for specialty semiconductor device fabrication; TFS 200 and TFS 500 for R&D; the P400A, P800, and P1500 batch systems for coating critical semiconductor chamber components and complex part geometries; and spatial ALD platforms such as the C2R™ and roll-to-roll processing equipment. Headquartered in Espoo, Finland, Beneq enables ALD integration from lab to fab for semiconductors, optics, and functional coatings.

Press Contacts
Lie Luo
Head of Marketing
[email protected]

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ROSENHEIM, Germany / KUALA LUMPUR, 5 May 2026 — esmo group (esmo), a leading global full-service systems integrator, developer, and supplier of advanced automation solutions for the semiconductor test industry, today announces the debut of its X-change Cart. A dedicated, semi-automated Device Interface Board (DIB) exchange system that enables a complete load board changeover by a single operator in under one minute, the X-change Cart addresses the safety, efficiency, and reliability challenges associated with manual board handling on the semiconductor test floor.

In high-mix semiconductor test environments, load board changeovers are a frequent and operationally significant activity. The reliance on manual handling has long presented challenges around changeover time, operator safety, and the risk of damage to high-value boards.

“Across test floors, we kept seeing the same pattern,” said Josef Weinberger, Head of Business Unit, esmo semicon. “Board changeovers were slow, physically demanding, and too dependent on individual technique. In tight spaces, that's where mistakes happen and time is lost. That observation drove us to build a dedicated solution that makes changeovers fast, repeatable, and manageable by a single operator in under a minute.”

Engineered for the Modern Test Floor

The X-change Cart removes the physical demands and variability of manual board handling from the equation entirely. Through a structured, HMI-controlled process, a single operator can lock, rotate, and transfer a board to the tester within a minute. The ability to carry two boards in a single trip makes that timescale achievable in practice. Thoughtful design details, including a ±180° rotation at the locking mechanism and a ±90° tower swivel, address the real-world constraints of a busy test floor.

Broad compatibility with leading ATE platforms (e.g. Teradyne, Advantest, SPEA and more) facilitates integration into existing multi-vendor environments without reconfiguration, allowing OSATs and IDMs to realise multiple benefits without disruption to their current setup.

For facilities with longer-term automation objectives, an optional configuration allows the interface tower to be mounted onto a customized AGV or AMR, providing a practical upgrade path toward autonomous test floor operations. The modular design further allows additional features to be incorporated as operational requirements evolve.

Weinberger added, “Reliability in production comes down to the details. The gripper head is engineered to perform consistently under real production conditions, with ESD-safe construction ensuring the board is protected at every point of contact. That level of engineering discipline is what makes the difference on a real production floor.”

X-change Cart Key Features

• Modular DIB exchange system for reliable, error-free board loading and unloading
• One-person operation — complete board change in under one minute
• Transports two load boards simultaneously for rapid exchange
• Full multi-axis rotation: ±180° at locking mechanism | ±180° Y-axis | ±90° Z-axis
• Compatible with leading ATE platforms — Teradyne, Advantest, SPEA and more
• Interfaces with test head, prober, DIB-loader, storage rack, and maintenance workbench
• Tower swivels ±90° for use in narrow corridors and constrained test floor layouts
• Integrated Human-Machine Interface (HMI), sensor detection, safety hand-brake, and modular battery
• Optional: fully automated configuration mountable on AGV or AMR

The X-change Cart will be available for live demonstration at the esmo booth throughout SEMICON Southeast Asia 2026. Visit esmo at Booth 2145, Hall 8, Level 2, MITEC Kuala Lumpur from 5–7 May 2026, or contact [email protected] to arrange a meeting or request further information.

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